Parsytec MultiCluster-3 Guide

.\
MultiCluster-3
MultiCluster-3 DE
Technical Documentation
August 1992
Copyright, Parsytec GmbH
I .

Parsytec reserves the right to make changes in specifications at any time and without notice. The
information furnished by Parsytec in this publication
is believed to be accurate, however no
responsibility
is assumed for its use, nor for any infringement of patents or rights of third parties
resulting from its use. No licence
is granted under any patents, trademarks or other rights of
Parsytec.
Authors: Jiirgen LOwenhag, Rainer Tekotte, Jacqueline Luerken
This manual
is Copyright ©1992 by Parsytec GmbH
All rights reserved. This document may not, in whole or in part, be copied, photocopied, reprodu-
ced or reduced
to any electronic medium or machine readable form without prior consent, in
writing, from Parsytec GmbH,
0-5100 Aachen, Juelicher Strasse 338, Germany.
MS-DOS
is aregistered trademark of Microsoft Corp.
mM, peAT are trademarks of International Business Machines Corp.
inmos and occam are trademarks
of the !NMOS Group of Companies
The use
of registered names, trademarks, etc. in this publication does not imply, even in the
absence
of aspecific statement, that such names are exempt from the relevant protective laws and
regulations and therefore free for general use.

Contents
1. Genera.l Informa.tion 1 -. 1
1.1 Features of the MC-3 system family ~ 1 - 1
1.2 Performance Data 1 - 1
1.3 Various Applications 1 - 2
1.4 Available Hardware 1 - 2
1.5 Available Software 1 - 3
2. Hardware Description 2 . 1
2.1 General Overview: the MC-3 and the MC-3 DE 2 - 1
2.2 Installation
of Transputer Modules 2 - 5
2.3 Connectors
.. 2 - 7
2.3.1
AC Power Connection 2 - 7
2.3.2 ExternalLinkage 2 - 8
3. Hardware Config-uration 3 . 1
3.1 Opening the Rear Panel...... 3·- 1
3.2 The Rear Panel 3 - 2
3.2.1 ExternalLink I/O Module 3 - 2
3.2.2 Connection-Module 3 - 3
3.2.3 Linkage Example 3 - 4
3.2.4 System Linkspeed 3 - 5
3.3 The Backplane 3 - 6
3.3.1 Slot-Segtnents
of the MC-3 3 - 8
3.3.2 Slot-Segments
of the MC-3 DE 3 - 9
3.3.3 Configuration
of the RTSC Channels 3 - 10
3.4 General Configuration 3 -
11
3.5 Configuration without Connection Module 3 - 14
3.6 MC-3
DE Matrix Module 3 - 15
3.7 Configuration Example for MC-3 system family 3 - 16

Appendix A: System Insta.llation A-I
A.l Delivery Items A - 1
A2 Unpacking A - 1
A.3 Placing A - 2
A.4 Power Requirements ; A
-- 2
A.S Environmental Requirements A - 3
A.6 Further Physical Parameters A - 4
A.7 Installation A - 6
A.7.1 Starting aMC-3 system A - 6
A.7.2 Connecting to aBootstation A - 7
A.7.3 Booting the MC-3 system A - 7
Appendix: B: General Maintenance B-1
B.l Checking the Fans B-1
B.2 Replacing the Air Filter B-2
B.3 Replacing Fuses B-3
Glossary G - 1
Index I - 1

Figure 2 - 1: MC-3 2 - 1
Figure 2 -
2: Construction of aMC-3 2 - 2
Figure 2 -
3: Front view of the MC -3/14 2 - 3
Figure 2 -
4: Rear view of the MC-3/14 2 - 4
Figure 2 -
5: Right side of the MC-3/14....................................................... 2 - 4
Figure 2 -
6: Different size of Transputer Modules .. 2 - 5
Figure 2 -
7: MC-3 rack with 14 UniLink and T9000 boards, top view 2 - 6
Figure 2 -
8: Push the boards into the slots until the backplane connector
snaps in and fix it with the screws. 2 - 6
Figure 2 -
9: To eject aboard push the ejector at the bottom down. .. 2 - 6
Figure 2 - 10: Connectors on the rear panel
of the MC-3 2 - 7
Figure 2 - 11: Device Routing 2 - 8
Figure 3 -
1: Placement of the screws holding the rear panel.... 3 - 1
Figure 3 -
2: Interior View of the rear panel 3 - 2
Figure 3 -
3: Rearside of the I/O Module 3 - 2
Figure 3 -
4: Assignment of the Connection Module .. 3 - 3
Figure 3 -
5: Linkage on the Connection Module 3 - 4
Figure 3 -
6: Link Speed setting 3 - 5
Figure 3 -
7: One half of the Backplane 3 - 6
Figure 3 -
8: Assignment of the slot segments 3 - 7
Figure 3 -
9: General Slot Assignment 3 - 8
Figure 3 - 10: Matrix Module in aMC-3 DE 3 - 9
Figure 3 - 11: Jumpers
of the board adaptor MC-3-AD1 3 - 10
Figure 3 -
12: Routing by MT2-cables 3 - 10
Figure 3 - 13: The way from the Transputer Links to the MC-3 I/O Module,
using MT4-cables 3 -
11
Figure 3 - 14: The way from the Transputer Links 0and 1 to the MC-3 I/O
Module, using the MT2-cables 3 - 12
Figure 3 - 15: The way from the Transputer Links 2and 3
to the MC3-1/0
Module, using MT2-cables 3 -
13
Figure 3 - 16: Direct connection for simple structures 3 - 14
Figure 3 - 17: Matrix Module
of the MC - 3 DE 3 - 15
Figure 3 - 18: AThree Processor Ring 3 - 16
Figure 3 -
19: Connections for the Ring Example 3 - 17
Figure A -
1: Dimensions and required space A - 5
Figure
B-1: Right side of the MC-3 B-2
Figure B-2: Air Filter Tray.. B-2

(--',
1. General InforDlation 1 . 1
1.1 Features of the MC-3 system family 1 - 2
1.2 Performance Data 1 - 2
1.3 Various Applications 1 - 2
1.4 Available Hardware 1 - 2
1.5 Available Software 1 - 3

.. ~
~1.1Features of,;ttle,MC·3 system family
I, "I I
I I
The Parsytec MG-3 ,~ystem ~ly offers except~onally high performance in
automation and imagc,processing: D1Pdul~r c;ompoQents for I/O, data acquisition
and image processing'can easily be configured
to create tailored solutions to any
problem.
Apart from thesttln4ard
:T805, the .FaJl$ytec MQ
or
3system family is able to
incorporate the ~w.:lgeneration of tr~puter. aqd thus provide amaximum
performance
of 25 MFLQPS and 200MIP$per p~c~or. Thanks to the inclusion
of the T9000, theinwestment in the Pal'Sytec ¥C-3. system family ensures a
,-, state-of-the-art syste,m. for years to come. '
ohigh performance in automation
ohigh performance. in, hn~gep~ing
oscalable performm~i'over several orders of masnitude
'Ll
ointegration of all UmLink! modules
ointegration of T9000 based modules
i
obuilt-in redundancy. alid 'automatic error recognition;
1.2 Performance Data
The range of MC-3 system family hardware sets new standards in performance,
expandability, reliability and communications capability. It allows awell defined
and almost unlimited increase in performancethroiIgh the addition of processor
modules.
With up to 48 processors it can deliver aperformance
of up to 1200 MFLOPS,
double precision, peak performance.
ParsytecMC-3 I MC-3 DE
G~neral Information ,,1- 1 4C

1.3 Various Applications
The Parsytec MC-3 product line offers three different systems according to
various applications:
Parsytec MC-3 is designed primarily for applications involving process
monitoring and control, pattern recognition, quality assurance and data
acquisition under real time constraints. It makes the entire range
of UniLink
modules available for automation and data aquisition. Boards exist for
AID
and D/A conversion, digital I/O, high resolution graphics, signal analysis, etc.
Parsytec MC-3 DE serves as alocal development station for super
massively parallel algorithms. So it allows applications to
be developed,
tested and optimized before being loaded onto a"production" machine. The
Parsytec MC-3
DE also acts as astandalone system for computationally
intensive applications and becomes aworkstation accelerator for special
applications: as solid state wind channel, as workstation for drug design
or as
platform for real time animation.
Parsytec MC-3 Mserves as amobil station. It is asystem that can be used
as well in laboratories as
in vehicles. Therefore the backplane provides
connectors for 220 V(AC) and for 12/24 V(DC). For system monitoring the
Parsytec MC-3 Mhas asophisticated error supervision. This two stage error
supervision gives an optic and audible alarm first and then switches the
machine
off before any serious damage takes place.
1.4 Available Hardware
Parsytec provides several modules for different applications:
for automation:
TPM-ADC, TPM-DAC, TPM-DIO, DBI-1 to DBI-5
for pattern recognition:
TIP-MFG, TIP- VPU, TIP-CGD
»1 - 2 «General Information Parsytec MC-3 1MC-3 DE

1.5 Available Software
The Parsytec MC-3 system family can be supplied complete with system software:
RTSM -the Real Time System Manager -supports the user in the development
and execution of real time applications. Firmware allows access to all board~ via
standardized protocols: it synchronizes and controls communication. A
communication core allows fast and automatic routing, precedence ratings during
communication setup and error tolerance. The latter includes recognition of failed
links and even automatic bridging, if the topology allows it. The components
defined by RTSM respond to Toolset or Belios Interfaces. Application software
and libraries will also be made available on the Parsytec MC-3 system family.
The versions of the software environment PARIX run on purely T8 based systems.
On delivery of the next chip generation, PARIX will be provided in aT9 based
100% compatible version. You can benefit immediately from the performance
leap to the processor.
For the MC-3 DE, the same tools are available as have been developed for
Parsytec GC: user interfaces such as X, debugging tools, performance monitors,
graphics libraries continue to be developed and where possible, conform to
existing and emerging industry standards.
Parsytec MC-3 I MC-3 DE
General Information »1·3«

.--..,
2. Hardware Description 2 . 1
2.1 General Overview: the MC-3 and the MC-3 DE 2 - 1
2.2 Installation
of Transputer Modules 2 - 5
2.3 Connectors 2 - 7
2.3.1 AC Power Connection 2 - 7
2.3.2 External Linkage 2 - 8