Parsytec MultiCluster-3 Guide
.\
MultiCluster-3
MultiCluster-3 DE
Technical Documentation
August 1992
Copyright, Parsytec GmbH
I .
Parsytec reserves the right
to
make changes in specifications at any time and without notice. The
information furnished by Parsytec in this publication
is
believed
to
be accurate, however no
responsibility
is
assumed for its use, nor for any infringement
of
patents or rights
of
third parties
resulting from its use. No licence
is
granted under any patents, trademarks or other rights
of
Parsytec.
Authors: Jiirgen LOwenhag, Rainer Tekotte, Jacqueline Luerken
This manual
is
Copyright ©1992 by Parsytec GmbH
All rights reserved. This document may not, in whole or in part, be copied, photocopied, reprodu-
ced or reduced
to
any electronic medium or machine readable form without prior consent, in
writing, from Parsytec GmbH,
0-5100
Aachen, Juelicher Strasse 338, Germany.
MS-DOS
is
aregistered trademark
of
Microsoft Corp.
mM,
peAT
are trademarks
of
International Business Machines Corp.
inmos and occam are trademarks
of
the !NMOS Group
of
Companies
The use
of
registered names, trademarks, etc. in this publication does not imply, even in the
absence
of
aspecific statement, that such names are exempt from the relevant protective laws and
regulations and therefore free for general use.
Contents
1.
Genera.l
Informa.tion
1
-.
1
1.1 Features
of
the MC-3 system family
~
1 - 1
1.2 Performance Data 1 - 1
1.3 Various Applications 1 - 2
1.4 Available Hardware 1 - 2
1.5 Available Software 1 - 3
2. Hardware Description 2 . 1
2.1 General Overview: the MC-3 and the MC-3
DE
2 - 1
2.2 Installation
of
Transputer Modules 2 - 5
2.3 Connectors
..
2 - 7
2.3.1
AC
Power Connection 2 - 7
2.3.2 ExternalLinkage 2 - 8
3.
Hardware
Config-uration
3 . 1
3.1 Opening the Rear Panel...... 3·- 1
3.2 The Rear Panel 3 - 2
3.2.1 ExternalLink I/O Module 3 - 2
3.2.2 Connection-Module 3 - 3
3.2.3 Linkage Example 3 - 4
3.2.4 System Linkspeed 3 - 5
3.3 The Backplane 3 - 6
3.3.1 Slot-Segtnents
of
the MC-3 3 - 8
3.3.2 Slot-Segments
of
the MC-3 DE 3 - 9
3.3.3 Configuration
of
the RTSC Channels 3 - 10
3.4 General Configuration 3 -
11
3.5 Configuration without Connection Module 3 - 14
3.6 MC-3
DE
Matrix Module 3 -
15
3.7 Configuration Example for MC-3 system family 3 - 16
Appendix A: System Insta.llation
A-I
A.l
Delivery Items A - 1
A2
Unpacking A - 1
A.3 Placing A - 2
A.4 Power Requirements ; A
--
2
A.S
Environmental Requirements A - 3
A.6 Further Physical Parameters A - 4
A.7 Installation A - 6
A.7.1 Starting aMC-3 system A - 6
A.7.2 Connecting
to
aBootstation A - 7
A.7.3 Booting the MC-3 system A - 7
Appendix:
B:
General Maintenance
B-1
B.l
Checking the Fans
B-1
B.2 Replacing the Air Filter
B-2
B.3 Replacing Fuses
B-3
Glossary G - 1
Index I - 1
Figure 2 -
1:
MC-3 2 - 1
Figure 2 -
2:
Construction
of
aMC-3 2 - 2
Figure 2 -
3:
Front view
of
the MC -3/14 2 - 3
Figure 2 -
4:
Rear view
of
the MC-3/14 2 - 4
Figure 2 -
5:
Right side
of
the MC-3/14....................................................... 2 - 4
Figure 2 -
6:
Different size
of
Transputer Modules
..
2 - 5
Figure 2 -
7:
MC-3 rack with 14 UniLink and T9000 boards, top view 2 - 6
Figure 2 -
8:
Push the boards into the slots until the backplane connector
snaps in and fix it with the screws. 2 - 6
Figure 2 -
9:
To eject aboard push the ejector at the bottom down.
..
2 - 6
Figure 2 - 10: Connectors on the rear panel
of
the MC-3 2 - 7
Figure 2 - 11: Device Routing 2 - 8
Figure 3 -
1:
Placement
of
the screws holding the rear
panel....
3 - 1
Figure 3 -
2:
Interior View
of
the rear panel 3 - 2
Figure 3 -
3:
Rearside
of
the I/O Module 3 - 2
Figure 3 -
4:
Assignment
of
the Connection Module
..
3 - 3
Figure 3 -
5:
Linkage on the Connection Module 3 - 4
Figure 3 -
6:
Link Speed setting 3 - 5
Figure 3 -
7:
One half
of
the Backplane 3 - 6
Figure 3 -
8:
Assignment
of
the slot segments 3 - 7
Figure 3 -
9:
General Slot Assignment 3 - 8
Figure 3 - 10: Matrix Module in aMC-3 DE 3 - 9
Figure 3 - 11: Jumpers
of
the board adaptor MC-3-AD1 3 - 10
Figure 3 -
12:
Routing by MT2-cables 3 - 10
Figure 3 - 13: The way from the Transputer Links to the MC-3 I/O Module,
using MT4-cables 3 -
11
Figure 3 - 14: The way from the Transputer Links 0and 1
to
the MC-3 I/O
Module, using the MT2-cables 3 - 12
Figure 3 - 15: The way from the Transputer Links 2and 3
to
the MC3-1/0
Module, using MT2-cables 3 -
13
Figure 3 - 16: Direct connection for simple structures 3 - 14
Figure 3 - 17: Matrix Module
of
the MC - 3 DE 3 -
15
Figure 3 - 18: AThree Processor Ring 3 - 16
Figure 3 -
19:
Connections for the Ring Example 3 - 17
Figure A -
1:
Dimensions and required space A - 5
Figure
B-1:
Right side
of
the MC-3
B-2
Figure
B-2:
Air Filter
Tray..
B-2
(--',
1. General InforDlation 1 . 1
1.1 Features
of
the MC-3 system family 1 - 2
1.2 Performance Data 1 - 2
1.3 Various Applications 1 - 2
1.4 Available Hardware 1 - 2
1.5 Available Software 1 - 3
..
~
~1.1Features
of,;ttle,MC·3 system family
I,
"I
I
I I
The Parsytec
MG-3
,~ystem
~ly
offers
except~onally
high performance
in
automation and imagc,processing:
D1Pdul~r
c;ompoQents
for I/O, data acquisition
and image processing'can easily be configured
to
create tailored solutions to any
problem.
Apart from thesttln4ard
:T805,
the
.FaJl$ytec
MQ
or
3system family
is
able to
incorporate
the
~w.:lgeneration
of
tr~puter.
aqd thus provide amaximum
performance
of
25
MFLQPS and
200MIP$per
p~c~or.
Thanks to the inclusion
of
the T9000, theinwestment in the Pal'Sytec
¥C-3.
system family ensures a
,-,
state-of-the-art
syste,m.
for years to come. '
ohigh performance in automation
ohigh performance.
in,
hn~gep~ing
oscalable
performm~i'over
several orders
of
masnitude
'Ll
ointegration
of
all
UmLink!
modules
ointegration
of
T9000 based modules
i
obuilt-in redundancy. alid 'automatic error recognition;
1.2 Performance Data
The range
of
MC-3 system family hardware sets new standards
in
performance,
expandability, reliability and communications capability. It allows awell defined
and almost unlimited increase in performancethroiIgh the addition
of
processor
modules.
With up to 48 processors it can deliver aperformance
of
up
to
1200 MFLOPS,
double precision, peak performance.
ParsytecMC-3 I
MC-3
DE
G~neral
Information
,,1-
1
4C
1.3 Various Applications
The Parsytec MC-3 product line offers three different systems according
to
various applications:
Parsytec MC-3 is designed primarily for applications involving process
monitoring and control, pattern recognition, quality assurance and data
acquisition under real time constraints. It makes the entire range
of
UniLink
modules available for automation and data aquisition. Boards exist for
AID
and
D/A
conversion, digital I/O, high resolution graphics, signal analysis, etc.
Parsytec MC-3 DE serves as alocal development station for super
massively parallel algorithms. So it allows applications to
be
developed,
tested and optimized before being loaded onto a"production" machine. The
Parsytec MC-3
DE
also acts
as
astandalone system for computationally
intensive applications and becomes aworkstation accelerator for special
applications: as solid state wind channel, as workstation for drug design
or
as
platform for real time animation.
Parsytec MC-3 Mserves
as
amobil station. It is asystem that can be used
as well in laboratories as
in
vehicles. Therefore the backplane provides
connectors for 220 V(AC) and for 12/24 V(DC). For system monitoring the
Parsytec MC-3 Mhas asophisticated error supervision. This two stage error
supervision gives an optic and audible alarm first and then switches the
machine
off
before any serious damage takes place.
1.4 Available Hardware
Parsytec provides several modules for different applications:
for automation:
TPM-ADC, TPM-DAC, TPM-DIO, DBI-1 to DBI-5
for pattern recognition:
TIP-MFG,
TIP-
VPU,
TIP-CGD
»1 - 2 «General Information Parsytec MC-3 1MC-3 DE
1.5 Available Software
The Parsytec MC-3 system family can
be
supplied complete with system software:
RTSM -the Real Time System Manager -supports the user
in
the development
and execution
of
real time applications. Firmware allows access
to
all
board~
via
standardized protocols:
it
synchronizes and controls communication. A
communication core allows fast and automatic routing, precedence ratings during
communication setup and error tolerance. The latter includes recognition
of
failed
links and even automatic bridging,
if
the topology allows it. The components
defined by RTSM respond
to
Toolset or Belios Interfaces. Application software
and libraries will also be made available on the Parsytec MC-3 system family.
The versions
of
the software environment PARIX run on purely T8 based systems.
On delivery
of
the next chip generation, PARIX will be provided
in
aT9 based
100% compatible version. You can benefit immediately from the performance
leap
to
the processor.
For the MC-3 DE, the same tools are available
as
have been developed for
Parsytec GC: user interfaces such as X, debugging tools, performance monitors,
graphics libraries continue to
be
developed and where possible, conform
to
existing and emerging industry standards.
Parsytec
MC-3
I
MC-3
DE
General Information
»1·3«
.--..,
2. Hardware Description 2 . 1
2.1 General Overview: the MC-3 and the MC-3 DE 2 - 1
2.2 Installation
of
Transputer Modules 2 - 5
2.3 Connectors 2 - 7
2.3.1 AC Power Connection 2 - 7
2.3.2 External Linkage 2 - 8
For the
FIRST
instalJationofthe Parsyteo MC
...
3system please refer to AppendIx
Awhere you .find 8idetailed description
of
unpacking, achecklist indicating
delivered items.and important notes for the placing. i
2.1. General Overview: the MC-3 and the MC-3
DE
oMC-3/14
is
aMC-3 cabinet with one rack for up to
14
transputer modules.
oMC-3/28 is designed with two racks to integrate
up
to
28 T8 or T9 based
processor modules.
Figure 2 • 1: MC-3
MC-3/14
MC-3/28
III
oMC-3/14
DE
stands for local development environment. The processors form a
matrix and can be connected with other Parsytec modules for I/O, mass storage
and networking.
oMC-3/28
DE
is adouble MC-3/14 DE system for
up
to
28 processor modules.
Parsytec
Me-3/
Me-3
DE
.;
.•
Hardware Description »2 - 1 «
Figure 2 - 2 shows the construction
of
the Parsytee MC-3 system family.
The systems are housed
in
stackable 19" cabinets which can hold 14 or 28 boards.
The heart
of
each system is the rack, which contains the power supply and up to
14 boards. The universal backplane system allows awide range
of
connection
structures and the integration
of
boards with different depth. The Parsytec MC-3
system family can be connected to workstations
vi~
S-Bus or VME-Bus, whilst the
difficulties
of
harsh industrial conditions are overcome by using fibre optic cables.
The modular design
of
Parsytec hardware components and strict adherence to
industrial standards allows Parsytec systems to be integrated in complex and
heterogeneous environments.
Figure 2 •
2:
Construction
of
aMC-3
Ta05
T9000
HTRAMs
TIP
(T900O!TBOS)
»2 - 2 «Hardware Description Parsytec MC-3 IMC-3 DE
On the right hand side, the front panel
of
the
PalSYtec
MC-3 system shows
.(our
green LEDs for 5and 12 Volt power supply, and one red LED which indicates a
malfunction. It lights
'up
only in the case
of
afan failure.
The left hand side is reserved for 14 slots for transputer modules. These slots are
numbered from right to left (slot #00
to
Slot
#q).:
:
•
NOTE
1be
eight screws
near
the sides
are
holding'
tIM
rack
and
the fans
and
should
not
be
opened
Figure
2·3:
Front
view
of
the Me
-3/14
Are~,fQr:;±tan$puter-MOdules
"
j':
'·!,iil',:: :
'!
____
-------A
.....
-------
(
~
I!I
+.
.,
~
.
.'/
an...
....-.
PawerSupply
Indicators
Fan Malfunction
Indicator
I
i
Parsytec MC-3 IMC-3 DE
HBJldware
Description
»2-
3,~
Figure
2·4:
Rear view
of
the MC-3/14
Exlemal
Unk
Interface Modu
Ie
'\
"
510t for additional
I/O Module(s)
/
System Reset
(push Button)
\
Grip to
."an
Rear
Panel \
Screws
to
be
ramCMlCl
for opening
LD
Ll
••
12
1.3
••
L4
u;
••
66
,/
,/
System
Power
Switch
Main
IFuses AC
~e
Input
The rear view shows several functional elements. You see the
AC
Line Input, the
place
of
the main fuses and the system power switch. The rear panel carries a
white system reset button on the right. The external Link Interface Module with
eight I/O links
(LO
to
L7) and aslot for additional I/O modules are placed on the
left. At the top you find agrip
to
open the rear panel.
NOTE
The four outer screws
at
both sides
of
the
rear
panel should only
be
unfastened
in
the case
of
hardware configuration work.
At the right hand side
of
the MC-3 cabinet you find the Air Filter Tray which you
need in case
of
maintenance work. For detailed description refer to Appendix B.
Figure 2 -
5:
Right side
of
the MC-3/14
Air
FHter
Tray
Screws
to
be
remowd
for opening
»2 • 4 «Hardware Description Parsytec MC-3 IMC-3 DE
2.2 Installation
of
Transputer Modules
-
I'
i.·:';,
dr:
.'!!
The Par&ytec
MC·<i;
sYlit~m
family
can~lDoq~te~arious
processor boards even
in mixed configurations up to
28
1
~$SQI'&
in,.
~.rack.
Supported processors
include T225, T805 and T9000 with memory sizes from
64
KB
SRAM to 8
MB
DRAM.
.
,I
I '
The range
of
hardware allows awell
de1lnedand
:almost unlimited increase in
performance
througbthe
addition
of
processor modUles. Thus asufficiently rapid
reaction to external ¢vents is ensured
and:
fastlask~switching
is
performed. The
system can be tailored to precise' perfermance" demands via simple scalable
expansion path.
The MC-3 system family
is
designed for T9000rnodules (pCB-size 280 mm x100
mm). To enlarge the shorter UniLinkmodules(p'CB.:size 220 mm x100 mm) use
the adaptors MC-3 AD1 to reach
tb.ebackplan~
coqnectors. In this case the
SCL
slots are not used. For4he MC-3
ADt
refer also
to
ooapter 3.3.3.
Figure 2 - 6: Different size
of
Transputer Modules
C>UltIll
~~
o-tb*l1
..
C
n1)
R1'IIpaClIlIll
(11III'
.....
R1'IIpaClIlI1
(lRr1ll')
...
.-M)
lICL.....
...
.-M)
IIlC
ll'l)
~_lM!'
.....
R1'IJNIQIIIIl'IlM!'IlI,)
.
--...
To
install transputer modules remove the according number
of
shields which cover
the 14 slots at the front panel
of
the MC-3 cabinet. Each shield
is
fixed with two
screws (see figures 2 - 2,
2-
8and 2 - 9).
ParsytecMC-3
I'
MC-3, DE
Hardware
Description
»2
..
5
~
•
NOTE
If
the boards installed in the slots #0 to #9 are all equipped with two processors,
the processors installed in the slots #10 to #13 can not be configured via the
Connection Module (see figure 3 - 4). In this case the upgraded system
is
recommended
to
solve this problem.
Figure 2 - 7: MC-3 rack with
14
UniLinlc
and
19000 boards, top view
(I)
If----------=;;....-,..;;:;::jl=l
15
.....
-----------~h
"'jj)
II------------~h
~
t---------...,.-r,...--.;;::;::lF;
Powersupply (AC/DC DC/DC)
The installation
of
the different boards is very easy
as
you can see in the figures
below.
Figure 2 - 8: Push the boards into the slots until the backplane connector snaps in
and
fix
it
with the screws.
•
,••
0
~
0
0
0
0
0
~
••
........
:-
..
;:
Figure
2 • 9: To eject aboardpush the ejector at the bouom down.
•
o •
o
o
»2 • 6
cc
Hardware Description
••
Parsytec MC-3 IMC-3 DE
2.3
Connectors I .
I
2.3.1AC
Power
CQrnwction
-
Please compare
vo!tap
and frequency
ot
thePaIS&,tec MC-3 system and your
local power supply.
A,MC
r3and a
;MC-3
,PE
canb~
run on 187-264V AC, 47-63
Hz.
Then push the power cable into the AC Line Input slot.
The power consumption
of
aMC-3 system depends on the number and types
of
computation and peripheral modules inserted.
Figure 2 - 10:Connectors on the rear
panel
of
the MC-3
,
I"
L I
MaIn Fuses
,,
AC
Une
Input
•••
Ii
,/
,/
~
Pcwer Switch
Slot
for
adclltiDnel
vo
MocIuIe(s)
/
'I
La
L1
.'.
1.2
1.3
••
L4 L5
••
,.,
!
Extem"UD~
;
InterfBCe~;
,
--.
;
I
I
I'
Parsytec Me-3IMC-3.
DE
~r~ware
Description
»2
...
7
cc
2.3.2 External Unkage
The MC-3 system family provides one external Link Interface Module with eight
Lemosa female plugs, numbered
LO
to L7. There
is
also aslot for additional I/O
modules.
Figure 2 -
11
shows the front- and rearside
of
the external Link Interface Module
and the further routing to the Connection Module. The illustration
of
the rearside
of
the I/O module
is
vertically mirrored.
Figure 2 - 11: Device Routing
:i.!!.~.~.
~.:5.~.
»2 - 8
cc
Hardware Description Parsytec MC-3 IMC-3 DE
.~.
3. Hardware Configuration 3 - 1
3.1 Opening the Rear Panel 3 - 1
3.2 The Rear Panel 3 - 2
3.2.1 External Link I/O Module 3 - 2
3.2.2 Connection-Module 3 - 3
3.2.3 Linkage Example 3 - 4
3.2.4 System Linkspeed 3 - 5
3.3 The Backplane 3 - 6
3.3.1 Slot-Segments
of
the MC-3 3 - 8
3.3.2 Slot-Segments
of
the MC-3 DE 3 - 9
3.3.3 Configuration
of
the RTSC Channels 3 - 10
3.4 General Configuration 3 -
11
3.5 Configuration without Connection Module 3 - 14
3.6 MC-3 DE Matrix Module 3 -
15
3.7 Configuration Example for MC-3 system
family 3 - 16
--
I
3.1
Opening the AearPanel,
The MC-3 cabinet should only be opened for the installation
of
new processor-,
peripheral-boards
or
for routine maintenance (see chapter 2.2, Appendix B).
•
NOTE
i
I
Forthe protectkDuJI,iiJotll,the
userQd~e
MC~system,
always switch it off
Bnd
diKonnectJtfrQ.
the tine
beforei
ope
••
1the cabinet. Metallic
parts
dropped
intO
a
rU.ndlj
Me-3
system may
at.~
~rious
damage.
o
o
o
Remove the four scre
...
:~om.
the
~
panel, two
on
each side, as shown in figure
3 - 1, Remember
ro:tiR
au,screwinand
small
pm1I
in asafe place.
::i
' " . ,
"",
'.
, '
~i
'
-;
,: ,
Draw the gripcarefullt:tp,
open
the.rear panel.
,
:'T::
:!.
,:'
.
When closing the rear panel take care that no cableS are stuck and fix the screws
again.
Figure 3 • 1: Placement
of
the screws
/wIding
the rear panel
Grip
lD"'~
Rear Panel
8cnlwslD
be removed
for
opening
, i
II··
•
Parsytec MC-3 I
MC
..
3DE Hardware Configuration
»3·1
cc
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