PEP VSBC-32 User manual

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VSBC-32
Combined VMEbus System Controller and
Serial Communications Controller Board
Manual ID 21168, Rev. Index 04
Jul 00
The product described in this manual is
in compliance with all applied CE stan-
dards.
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General VSBC-32
ID 21168, Rev. 04Page ii © 2000 PEP Modular Computers GmbH
Revision History
Imprint
Copyright © 2000 PEP Modular Computers GmbH. All rights
reserved. This manual may not be copied, photocopied, repro-
duced, translated or converted to any electronic or machine-
readable form in whole or in part without prior written approval of
PEP Modular Computers GmbH.
This manual was realized by: TPD/Engineering, PEP Modular Computers GmbH.
Manual/Product Title: VSBC-32
Manual ID Number: 21168
Rev.
Index Brief Description of Changes Board Index Date of Issue
0100 Initial Issue 00/1 Aug 95
0200 General corrections 00/2 Dec 95
0201 J9 default setting changed 00/2 Nov 96
0300 General corrections and new manual structure 01 Dec 96
0301 New Preface 01 Aug 98
0311 Improvement to Fig. 2.1.3. In Appendices, correc-
tions to flash addresses on pages MEM-2 to
MEM-4, page MEM-5 replaced.
01 Sept 98
04 Information of Errata Sheets 0100_1/2 integrated,
adequate manual structure, new memory piggy-
backs mentioned, description of combined system
and communications controller fucntionality,
function-related board diagrams, coherent termi-
nology (e.g. processor and board variant names)
etc. Appendices modified, updated, reduced.
01 July 00
Disclaimer:
PEP Modular Computers GmbH rejects any liability for the cor-
rectnesss and completeness of this manual as well as its suitabil-
ity for any particular purpose.
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VSBC-32 Contents
ID 21168, Rev. 04 Page iii© PEP Modular Computers GmbH
Contents
Preface
Preface ..................................................................................................................... ix
Proprietary Note ....................................................................................................... ix
Trademarks .............................................................................................................. ix
Explanation of Symbols ............................................................................................ x
For Your Safety ........................................................................................................ xi
High Voltage Safety Instructions .............................................................................. xi
Special Handling and Unpacking Instructions .......................................................... xi
General Instructions on Usage ............................................................................... xii
Two Year Warranty ................................................................................................ xiii
Chapt 1
Chapter
1
1. Introduction ................................................................................................. 1 - 3
1.1 System Overview ....................................................................................... 1 - 3
1.2 Board Overview ......................................................................................... 1 - 4
1.2.1 Board-Specific Information ................................................................. 1 - 4
1.2.2 Board Variants ................................................................................... 1 - 4
1.2.3 Board Connectivity and Interface Expandibility .................................. 1 - 5
1.2.4 Memory Piggybacks ........................................................................... 1 - 6
1.2.5 System-Relevant Information ............................................................. 1 - 6
1.3 Board Diagrams ......................................................................................... 1 - 8
1.3.1 System-Level Functional Block Diagram ........................................... 1 - 8
1.3.2 Frontpanels ........................................................................................ 1 - 9
1.3.3 Board Layouts .................................................................................. 1 - 10
1.4 Technical Specifications .......................................................................... 1 - 12
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VSBC-32 Contents
ID 21168, Rev. 04Page iv © PEP Modular Computers GmbH
1.5 Applied Standards .................................................................................... 1 - 14
1.5.1 CE Compliance ................................................................................. 1 - 14
1.5.2 Mechanical Compliance ................................................................... 1 - 14
1.5.3 Environmental Tests ......................................................................... 1 - 14
1.6 Related Publications ................................................................................ 1 - 15
1.6.1 VMEbus/CXC Systems/Boards ........................................................ 1 - 15
1.6.2 Manufacturers’ Component Documentation ..................................... 1 - 15
Chapter
2
2. Functional Description ................................................................................ 2 - 3
2.1 General Information ................................................................................... 2 - 3
2.2 Specifics ..................................................................................................... 2 - 4
2.2.1 System Control Functionality .............................................................. 2 - 4
2.2.2 Memory Configurations ...................................................................... 2 - 5
2.2.3 DMA Channels ................................................................................... 2 - 6
2.2.4 Serial Communications Control .......................................................... 2 - 7
2.3 Functional Block Diagram ........................................................................ 2 - 10
2.4 Board Interfaces ....................................................................................... 2 - 11
2.4.1 Serial I/O Interfaces .......................................................................... 2 - 11
2.4.2 Piggyback Interface Connectors for Serial Interface Piggybacks ..... 2 - 12
2.4.3 Memory Piggyback Interface Connectors ......................................... 2 - 12
2.4.4 EPROM DIP Sockets ........................................................................ 2 - 12
2.4.5 Background Debug Mode Interface Connector ................................ 2 - 13
2.4.6 VMEbus Backplane Interface ........................................................... 2 - 13
2.4.7 CXC Mezzanine Interface ................................................................. 2 - 14
2.5 VSBC-to-VSBC-32 System Upgrading .................................................... 2 - 15
2.6 Special Board Functions .......................................................................... 2 - 18
2.6.1 Real-Time Clock ............................................................................... 2 - 18
2.6.2 EEPROM .......................................................................................... 2 - 18
2.6.3 PLL Operation Mode ........................................................................ 2 - 18
2.6.4 Tick Generator .................................................................................. 2 - 18
2.6.5 Bus Error Timers .............................................................................. 2 - 19
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VSBC-32 Contents
ID 21168, Rev. 04 Page v© PEP Modular Computers GmbH
2.6.6 Watchdog Timer ............................................................................... 2 - 20
2.6.7 Reset Sources ................................................................................. 2 - 20
2.6.8 “Slot 1” Detection ............................................................................. 2 - 20
2.7 Frontpanel Functions ............................................................................... 2 - 21
2.8 RTC and SRAM Data Retention .............................................................. 2 - 21
2.9 Address Decoder ..................................................................................... 2 - 23
2.9.1 Basic Structure ................................................................................. 2 - 23
2.9.2 Boot Decoding ................................................................................. 2 - 23
Chapter
3
3. Installation .................................................................................................. 3 - 3
3.1 Hardware Installation ................................................................................. 3 - 3
3.1.1 External Serial Interface Module ........................................................ 3 - 4
3.2 Software Installation .................................................................................. 3 - 4
Chapter
4
4. Configuration .............................................................................................. 4 - 3
4.1 Hardware Configuration ............................................................................. 4 - 3
4.1.1 Wire Jumpers ..................................................................................... 4 - 3
4.1.2 Solder Jumpers .................................................................................. 4 - 4
4.2 Software Configuration .............................................................................. 4 - 5
4.2.1 Address Map ...................................................................................... 4 - 5
4.2.2 Board Control/Status Register ........................................................... 4 - 6
4.2.3 VMEbus Control/Status Register ..................................................... 4 - 7
4.2.4 VMEbus Interrupt Mask Register ....................................................... 4 - 8
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VSBC-32 Contents
ID 21168, Rev. 04Page vi © PEP Modular Computers GmbH
Appx.
A
A. Memory Piggybacks ................................................................................... A - 3
A.1 General ..................................................................................................... A - 3
A.2 DM600 ...................................................................................................... A - 4
A.2.1 Board Layout and Jumper Location ................................................... A - 4
A.2.2 Jumper Description and Flash Addresses ......................................... A - 4
A.3 DM601 ...................................................................................................... A - 5
A.3.1 Board Layout and Jumper Location ................................................... A - 5
A.3.2 Jumper Description and Flash Addresses ......................................... A - 5
A.4 DM602 ...................................................................................................... A - 6
A.4.1 Board Layout and Jumper Location ................................................... A - 6
A.4.2 Jumper Description and Flash Addresses ......................................... A - 6
A.5 DM603 ...................................................................................................... A - 7
A.5.1 Board Layout and Jumper Location ................................................... A - 7
A.5.2 Jumper Description and Flash Addresses ......................................... A - 7
A.6 DM604 ...................................................................................................... A - 8
A.6.1 Board Layout and Jumper Location ................................................... A - 8
A.6.2 Jumper Description and Flash Addresses ......................................... A - 8
A.7 DM605 ...................................................................................................... A - 9
A.7.1 Board Layout and Jumper Location ................................................... A - 9
A.7.2 Jumper Description and Flash Addresses ......................................... A - 9
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VSBC-32 Contents
ID 21168, Rev. 04 Page vii© PEP Modular Computers GmbH
Appx.
B
B. Serial Interface Piggybacks ........................................................................ B - 3
B.1 General ...................................................................................................... B - 3
B.2 SI-10B2 ..................................................................................................... B - 4
B.2.1 Specifications ..................................................................................... B - 4
B.2.2 Front Panel View ................................................................................ B - 4
B.3 SI-10B5 ..................................................................................................... B - 5
B.3.1 Specifications ..................................................................................... B - 5
B.3.2 Front Panel View and Pinout ............................................................. B - 5
B.4 SI-10BT ..................................................................................................... B - 6
B.4.1 Specifications ..................................................................................... B - 6
B.4.2 Front Panel View, Jumper Layout, and Pinouts ................................. B - 6
4.2.1 SI-10BT Jumper Settings ................................................................... B - 7
B.5 SI-PB232 ................................................................................................... B - 8
B.5.1 Front Panel View and Pinout ............................................................. B - 8
B.6 SI-PB485-ISO ............................................................................................ B - 9
B.6.1 Specifications ..................................................................................... B - 9
B.6.2 Front Panel View, Jumper Layout, and Pinout ................................... B - 9
B.6.3 SI-PB485-ISO Jumper Settings ....................................................... B - 10
Appx.
C
C. CXC ............................................................................................................ C - 3
C.1 CXC Address Ranges ............................................................................... C - 3
C.2 CXC Generic Pinouts ................................................................................ C - 5
C.3 CPU Pinout Cross Reference .................................................................... C - 6
C.4 Timing ........................................................................................................ C - 7
C.5 CXC Backplanes ....................................................................................... C - 8
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VSBC-32 Contents
ID 21168, Rev. 04Page viii © PEP Modular Computers GmbH
Appx.
D
D. OS-9 Cabling ............................................................................................. D - 3
D.1 OS-9 System – Terminal ........................................................................... D - 3
D.1.1 Software (XON/XOFF) or No Handshake .......................................... D - 3
D.1.2 Hardware Handshake (Set Terminal to CTS/DTR Handshake) ........ D - 4
D.2 OS-9 System – PC .................................................................................... D - 5
D.2.1 Software (XON/XOFF) or No Handshake .......................................... D - 5
D.2.2 Hardware Handshake (Select RTS/CTS Handshake on the PC Side) D - 7
D.3 OS-9 System – Modem ............................................................................. D - 9
D.4 OS-9 System – OS-9 System ................................................................. D - 10
D.4.1 Software (XON/XOFF) or No Handshake ........................................ D - 10
D.4.2 Hardware Handshake ...................................................................... D - 11
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VSBC-32 Preface
Preface
ID 21168, Rev. 04 Page vii© PEP Modular Computers GmbH
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VSBC-32 Preface
ID 21168, Rev. 04 Page ix© PEP Modular Computers GmbH
Preface
Proprietary Note
This document contains information proprietary to PEP Modular Computers . It may not be
copied or transmitted by any means, disclosed to others or stored in any retrieval system or
media, without the prior written consent of
PEP Modular Computers GmbH or one of its autho-
rized agents.
The information contained in this document is, to the best of our knowledge, entirely correct.
However,
PEP Modular Computers cannot accept liability for any inaccuracies, or the conse-
quences thereof, nor for any liability arising from the use or application of any circuit, product,
or example shown in this document.
PEP Modular Computers reserve the right to change, modify, or improve this document or the
product described herein, as seen fit by
PEP Modular Computers without further notice.
Trademarks
PEP Modular Computers , the PEP logo and, if occurring in this manual, “CXM” are trade
marks owned by
PEP Modular Computers GmbH , Kaufbeuren (Germany). In addition, this
document may include names, company logos and trademarks, which are registered trade-
marks and, therefore, proprietary to their respective owners.
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VSBC-32 Preface
ID 21168, Rev. 04Page x © PEP Modular Computers GmbH
Explanation of Symbols
CE Conformity
This symbol indicates that the product described in this manual
is in compliance with all applied CE standards. Please refer
also to the section “Applied Standards” in this manual.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks
(> 60V) when touching products or parts of them. Failure to
observe the precautions indicated and/or prescribed by the law
may endanger your life/health and/or result in damage to your
material.
Please refer also to the section “High Voltage Safety Instruc-
tions” on the following page.
Warning, ESD Sensitive Device!
This symbol and title inform that electronic boards and their
components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of
this product, in order to ensure product integrity at all times.
Please read also the section “Special Handling and Unpacking
Instructions” on the following page.
Warning!
This symbol and title emphasize points which, if not fully under-
stood and taken into consideration by the reader, may endanger
your health and/or result in damage to your material.
Note...
This symbol and title emphasize aspects the reader should read
through carefully for his or her own advantage.
PEP Advantage
This symbol and title emphasize advantages or positive aspects
of a product and/or procedure.
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VSBC-32 Preface
ID 21168, Rev. 04 Page xi© PEP Modular Computers GmbH
For Your Safety
Your new PEP product was developed and tested carefully to provide all features necessary
to ensure the renown electrical safety requirements. It was also designed for a long fault-free
life. However, the life expectancy of your product can be drastically reduced by improper treat-
ment during unpacking and installation. Therefore, in the interests of your own safety and of
the correct operation of your new
PEP product, you are requested to conform with the follow-
ing guidelines.
High Voltage Safety Instructions
Special Handling and Unpacking Instructions
• Do not handle this product out of its protective enclosure while it is not used for operational
purposes, unless it is otherwise protected.
• Whenever possible, unpack or pack this product only at EOS/ESD safe work stations.
Where safe work stations are not guaranteed, it is important for the user to be electri-cally
discharged before touching the product with his/her hands or tools. This is most easily
done by touching a metal part of your system housing.
• It is particularly important to observe standard anti-static precautions when changing piggy-
backs, ROM devices, jumper settings etc. If the product contains batteries for RTC or
memory back-up, ensure that the board is not placed on conductive surfaces, including
anti-static plastics or sponges. They can cause short circuits and damage the batteries or
tracks on the board.
Warning!
All operations on this device must be carried out by sufficiently
skilled personnel only.
Caution, Electric Shock!
However, serious electrical shock hazards exist during all
installation, repair and maintenance operations with this prod-
uct. Therefore, always unplug the power cable to avoid expo-
sure to hazardous voltage.
Before installing your new PEP product into a system always
ensure that your mains power is switched off. This applies also
to the installation of piggybacks.
ESD Sensitive Device!
Electronic boards and their components are sensitive to static
electricity. Therefore, care must be taken during all handling
operations and inspections of this product, in order to ensure
product integrity at all times.
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VSBC-32 Preface
ID 21168, Rev. 04Page xii © PEP Modular Computers GmbH
General Instructions on Usage
• In order to maintain PEP’s product warranty, this product must not be altered or modified in
any way. Changes or modifications to the device, which are not explicitly approved by
PEP
Modular Computers
and described in this manual or received from PEP Technical Support
as a special handling instruction, will void your warranty.
• This device should only be installed in or connected to systems that fulfill all necessary
technical and specific environmental requirements. This applies also to the operational
temperature range of the specific board version, which must not be exceeded. If batteries
are present, their temperature restrictions must be taken into account.
• In performing all necessary installation and application operations, please, follow only the
instructions supplied by the present manual.
• Keep all the original packaging material for future storage or warranty shipments. If it is
necessary to store or ship the board please re-pack it as nearly as possible in the manner
in which it was delivered.
• Special care is necessary when handling or unpacking the product. Please, consult the
special handling and unpacking instruction on the following page of this manual.
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VSBC-32 Preface
ID 21168, Rev. 04 Page xiii© PEP Modular Computers GmbH
Two Year Warranty
PEP Modular Computers grants the original purchaser of PEP products a TWO YEAR LIMITED
HARDWARE
WARRANTY as described in the following. However, no other warranties that may be
granted or implied by anyone on behalf of
PEP are valid unless the consumer has the express
written consent of
PEP Modular Computers .
PEP Modular Computers warrants their own products, excluding software, to be free from
manufacturing and material defects for a period of 24 consecutive months from the date of
purchase. This warranty is not transferable nor extendible to cover any other users or long-
term storage of the product. It does not cover products which have been modified, altered or
repaired by any other party than
PEP Modular Computers or their authorized agents. Further-
more, any product which has been, or is suspected of being damaged as a result of negli-
gence, improper use, incorrect handling, servicing or maintenance, or which has been
damaged as a result of excessive current/voltage or temperature, or which has had its serial
number(s), any other markings or parts thereof altered, defaced or removed will also be
excluded from this warranty.
If the customer’s eligibility for warranty has not been voided, in the event of any claim, he may
return the product at the earliest possible convenience to the original place of purchase,
together with a copy of the original document of purchase, a full description of the application
the product is used on and a description of the defect. Pack the product in such a way as to
ensure safe transportation (see our safety instructions).
PEP provides for repair or replacement of any part, assembly or sub-assembly at their own
discretion, or to refund the original cost of purchase, if appropriate. In the event of repair,
refunding or replacement of any part, the ownership of the removed or replaced parts reverts
to
PEP Modular Computers , and the remaining part of the original guarantee, or any new
guarantee to cover the repaired or replaced items, will be transferred to cover the new or
repaired items. Any extensions to the original guarantee are considered gestures of goodwill,
and will be defined in the “Repair Report” issued by
PEP with the repaired or replaced item.
PEP Modular Computers will not accept liability for any further claims resulting directly or indi-
rectly from any warranty claim, other than the above specified repair, replacement or refund-
ing. In particular, all claims for damage to any system or process in which the product was
employed, or any loss incurred as a result of the product not functioning at any given time, are
excluded. The extent of
PEP Modular Computers liability to the customer shall not exceed the
original purchase price of the item for which the claim exists.
PEP Modular Computers issues no warranty or representation, either explicit or implicit, with
respect to its products’ reliability, fitness, quality, marketability or ability to fulfil any particular
application or purpose. As a result, the products are sold “as is,” and the responsibility to
ensure their suitability for any given task remains that of the purchaser. In no event will
PEP
be liable for direct, indirect or consequential damages resulting from the use of our hardware
or software products, or documentation, even if PEP were advised of the possibility of such
claims prior to the purchase of the product or during any period since the date of its purchase.
Please remember that no
PEP Modular Computers employee, dealer or agent is authorized to
make any modification or addition to the above specified terms, either verbally or in any other
form, written or electronically transmitted, without the company’s consent.
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ID 21168, Rev. 04Page xiv © PEP Modular Computers GmbH
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VSBC-32 Introduction
Introduction
ID 21168, Rev. 04 Page 1 - 1© PEP Modular Computers GmbH
Chapter
1
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VSBC-32 Introduction
ID 21168, Rev. 04 Page 1 - 3© PEP Modular Computers GmbH
1. Introduction
1.1 System Overview
The PEP Modular Computers product described in this chapter operates with the
VMEbus architecture. In addition, some products also support the CXC and/or
Enhanced CXC (eCXC) local mezzanine interface standards which represent a stream-
lined variant of the VMEbus standard itself. Thus a wide range of I/O functions for indus-
trial applications are supplied. Some of the major advantages of the VMEbus standard
are:
• internationally accepted VITA standards (VMEbus, CXC, eCXC);
• broad range of available VMEbus solutions
• scalable processor performance
In addition, in combination with (e)CXC technology the VMEbus equipment offers the
following advantages:
• lower costs and optimized reliability thanks to reduced design complexity;
• compact I/O sub-systems thanks to easier I/O wiring.
For detailled information concerning the VMEbus and (e)CXC standards, please consult
the VMEbus and CXC Specifications which are available via the
VMEbus International
Trade Association (VITA): http://www.vita.com
.
Many system-relevant features that are specific for VMEbus systems can be found in
the ANSI/VITA VME64 Standard and in the VITA/
PEP CXC MPI Specification which,
despite its name, applies also to VMEbus MPI carriers.
The VME64 Standard includes the following information:
• VMEbus Specification
• Signal Lines, Bus Modules, Typical Operation
• Electrical Specifications
• Mechanical Specifications
The CXC MPI Specification includes the following information:
• Mechanical dimensions
• Electrical specifications
• Interface description
• ID Byte assignment
With reference to the (e)CXC aspects of mixed VMEbus+CXC systems please refer
also to the
PEP CXC Reference Manual.
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