Depart. Technical support- CM640 PROCEDURE COMPANY RESTRICTED
PHILIPS Consumer
Communications
Centre du Mans
Service Repair Support
VY-V-640-P661
Page : 3 of 70
Langue : EN
Date : 19/09/05
© PHILIPS ELECTRONICS N.V. 1999 VY-V-640-P661
All rights reserved. Reproduction in whole
CONTENTS
1.0 PURPOSE......................................................................................................................................5
2.0 SCOPE............................................................................................................................................5
3.0 REFERENCE...............................................................................................................................5
4.0 GLOSSARY / ACRONYM LIST.........................................................................................5
5.0 TEST EQUIPMENT AND TOOLS.....................................................................................5
6.0 TEST AND INSPECTION PLAN........................................................................................6
6.1 USER INTERFACE TEST ...................................................................................................................6
6.2 RF TEST .........................................................................................................................................6
7.0 BEFORE STARTING...............................................................................................................8
7.1 DESCRIPTION OF THE TRANSCEIVER ..............................................................................................8
7.2 DESCRIPTION OF THE DISPLAY ......................................................................................................9
7.3 USING THE MENU.........................................................................................................................10
7.4 REMOVE THE BATTERY.................................................................................................................11
7.5 INSERTING / REMOVING THE SIM-CARD......................................................................................12
7.6 INSERTING THE BATTERY.............................................................................................................13
7.7 CHARGING THE BATTERY.............................................................................................................14
7.8 INFRARED QUICK PRESENTATION.................................................................................................15
7.9 MMS QUICK PRESENTATION........................................................................................................16
7.10 JAVA QUICK PRESENTATION.........................................................................................................16
7.11 TV SLIDESHOW QUICK PRESENTATION........................................................................................17
8.0 TEST PROCEDURES............................................................................................................18
8.1 INITIAL FUNCTIONAL CHECK FOR PHILIPS XENIUM 9@9 I......................................................18
8.2 RF TEST .......................................................................................................................................23
8.3 BATTERY CHARGING (IGN : IGNITION) / CURRENT CONSUMPTION..............................................29
8.4 W@P TEST PROCEDURE................................................................................................................31
8.5 E-MAIL TEST PROCEDURE.............................................................................................................37
8.6 MMS TEST PROCEDURE...............................................................................................................39
8.7 INFRARED TEST PROCEDURE ........................................................................................................41
8.8 CAMERA TEST PROCEDURE ..........................................................................................................42
9.0 ASSEMBLY / DISMANTLEMENT PROCEDURES ................................................43
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