Quectel L50 Supplement

L50 Hardware Design
L50
Quectel GPS Engine
Hardware Design
L50_HD_V1.0

L50 Hardware Design
L50_HD_V1.0 -1 -
Document Title
L50 Hardware Design
Revision
1.0
Date
2011-7-25
Status
Preliminary
Document Control ID
L50_HD_V1.0
General Notes
Quectel offers this information as a service to its customers, to support application and
engineering efforts that use the products designed by Quectel. The information provided is
based upon requirements specifically provided for customers of Quectel. Quectel has not
undertaken any independent search for additional information, relevant to any information that
may be in the customer’s possession. Furthermore, system validation of this product designed
by Quectel within a larger electronic system remains the responsibility of the customer or the
customer’s system integrator. All specifications supplied herein are subject to change.
Copyright
This document contains proprietary technical information of Quectel Co., Ltd. Copying of this
document, distribution to others and communication of the contents thereof, are forbidden
without permission. Offenders are liable to the payment of damages. All rights are reserved in
the event of a patent grant or registration of a utility model or design. All specification supplied
herein are subject to change without notice at any time.
Copyright © Quectel Wireless Solutions Co., Ltd. 2011
Quectel
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L50_HD_V1.0 -2 -
Contents
Contents ............................................................................................................................................2
Table Index........................................................................................................................................4
Figure Index......................................................................................................................................5
0. Revision History ...........................................................................................................................6
1. Introduction...................................................................................................................................7
1.1 Related Documents .................................................................................................................7
1.2 Terms and Abbreviations.........................................................................................................7
2. Product Concept............................................................................................................................9
2.1 Key Features............................................................................................................................9
2.2 Functional Diagram...............................................................................................................11
2.3 Evaluation Board...................................................................................................................11
2.4 Protocol.................................................................................................................................11
3. Application..................................................................................................................................12
3.1 Pin Assignment of the Module..............................................................................................12
3.2 Pin Description......................................................................................................................13
3.3 Operating Modes...................................................................................................................16
3.4 Power Management...............................................................................................................16
3.4.1 VCC Power..................................................................................................................16
3.4.2 VIO/RTC Power..........................................................................................................16
3.4.3 Energy Saving Mode...................................................................................................17
3.5 Power Supply........................................................................................................................18
3.5.1 Power Reference Design .............................................................................................18
3.5.2 Battery.........................................................................................................................19
3.6 Timing Sequence...................................................................................................................20
3.7 Communication Interface......................................................................................................22
3.7.1 UART Interface...........................................................................................................22
3.7.2 I2C Interface................................................................................................................23
3.7.3 SPI Interface................................................................................................................25
3.8 Assisted GPS.........................................................................................................................25
4. Radio Frequency.........................................................................................................................27
4.1 Antenna .................................................................................................................................27
4.2 Design notice.........................................................................................................................28
5. Electrical, Reliability and Radio Characteristics.........................................................................30
5.1 Absolute Maximum Ratings..................................................................................................30
5.2 Operating Conditions ............................................................................................................30
5.3 Current Consumption............................................................................................................31
5.4 Electro-Static Discharge........................................................................................................31
5.5 Reliability Test ......................................................................................................................32
6. Mechanical Dimensions..............................................................................................................33
6.1 Mechanical Dimensions of the Module.................................................................................33
6.2 Recommended Footprint.......................................................................................................34
6.3 Top View of the Module.......................................................................................................35
6.4 Bottom View of the Module..................................................................................................35
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7. Manufacturing.............................................................................................................................36
7.1 Assembly and Soldering........................................................................................................36
7.2 Moisture Sensitivity ..............................................................................................................36
7.3 ESD Safe...............................................................................................................................37
7.4 Tape and Reel........................................................................................................................37
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Table Index
TABLE 2: TERMS AND ABBREVIATIONS .........................................................................................7
TABLE 3: MODULE KEY FEATURES..................................................................................................9
TABLE 4: THE MODULE SUPPORTS PROTOCOLS........................................................................11
TABLE 5: PIN DESCRIPTION.............................................................................................................13
TABLE 6: OVERVIEW OF OPERATING MODES..............................................................................16
TABLE 7: PIN DEFINITION OF THE VCC PIN .................................................................................16
TABLE 8: PIN DEFINITION OF THE VIO/RTC PIN..........................................................................17
TABLE 9: MULTIPLEXED FUNCTION PINS FOR COMMUNICATION INTERFACE..................22
TABLE 10: RECOMMENDED EEPROMS..........................................................................................25
TABLE 11: PIN DEFINITION OF THE DR_I2C INTERFACES.........................................................25
TABLE 12: ANTENNA SPECIFICATION FOR L50 MODULE..........................................................27
TABLE 14: RECOMMENDED OPERATING CONDITIONS.............................................................30
TABLE 15: THE MODULE CURRENT CONSUMPTION..................................................................31
TABLE 16: THE ESD ENDURANCE TABLE (TEMPERATURE: 25°C , HUMIDITY: 45 %)...........31
TABLE 17: RELIABILITY TEST .........................................................................................................32
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM FOR L50...............................................................................11
FIGURE 2: ATP TIMING SEQUENCE.................................................................................................17
FIGURE 3: PTF TIMING SEQUENCE.................................................................................................18
FIGURE 4: POWER DESIGN REFERENCE FOR L50 MODULE.....................................................19
FIGURE 5: REFERENCE CHARGING CIRCUIT FOR CHARGEABLE BATTERY.......................19
FIGURE 6: SEIKO XH414 CHARGING AND DISCHARGING CHARACTERISTICS ...................20
FIGURE 7: TURN ON TIMING SEQUENCE OF MODULE..............................................................21
FIGURE 8: STATE CONVERSION OF MODULE..............................................................................21
FIGURE 9: UART DESIGN REFERENCE FOR L50 MODULE.........................................................22
FIGURE 10: RS-232 LEVEL SHIFT CIRCUIT....................................................................................23
FIGURE 11: I2C TIMING SEQUENCE................................................................................................24
FIGURE 12: I2C DESIGN REFERENCE FOR L50 MODULE...........................................................25
FIGURE 13: REFERENCE DESIGN FOR CGEE FUNCTION...........................................................26
FIGURE 14: PATCH ANTENNA TEST RESULT.................................................................................28
FIGURE 15: EVB OF L50.....................................................................................................................29
FIGURE 16: L50 TOP VIEWAND SIDE VIEW（UNIT:MM）.........................................................33
FIGURE 17: L50 BOTTOM VIEW（UNIT:MM）..............................................................................33
FIGURE 18: RECOMMENDED FOOTPRINT （UNIT:MM）.........................................................34
FIGURE 19: TOP VIEW OF MODULE................................................................................................35
FIGURE 20: BOTTOM VIEW OF MODULE ......................................................................................35
FIGURE 21: RAMP-SOAK-SPIKE-REFLOW OF FURNACE TEMPERATURE..............................36
FIGURE 22: TAPE AND REEL SPECIFICATION...............................................................................37
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L50_HD_V1.0 -6 -
0. Revision History
Revision
Date
Author
Description of change
1.0
2011-07-25
Baly BAO/Harry LIU
Initial
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L50_HD_V1.0 -7-
1. Introduction
This document defines and specifies L50 GPS module. It describes L50 hardware interface and its
external application reference circuits, mechanical size and air interface.
This document can help customer quickly understand module interface specifications, electrical and
mechanical characteristics. With the help of this document and other application notes, customers can
use L50 module to design and set up application quickly.
1.1 Related Documents
Table 1: Related documents
SN
Document name
Remark
[1]
L50_EVB _UGD
L50 EVB User Guide
[2]
L50_GPS_Protocol
L50 GPS Protocol Specification
[3]
SIRF_AGPS_AN
SIRF Platform A-GPS Application Note
1.2 Terms and Abbreviations
Table 2: Terms and abbreviations
Abbreviation
Description
CGEE
Client Generated Extended Ephemeris
EMC
Electromagnetic Compatibility
ESD
Electrostatic Discharge
EGNOS
European Geostationary Navigation Overlay Service
GPS
Global Positioning System
GNSS
Global Navigation Satellite System
GGA
GPS Fix Data
GLL
Geographic Position –Latitude/ L ongitude
GSA
GNSS DOP and Active Satellites
GSV
GNSS Satellites in View
HDOP
Horizontal Dilution of Precision
IC
Integrated Circuit
I/O
Input/Output
Kbps
Kilo Bits Per Second
LNA
Low Noise Amplifier
MSAS
Multi-Functional Satellite Augmentation System
NMEA
National Marine Electronics Association
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OSP
One Socket Protocol
PDOP
Position Dilution of Precision
RMC
Recom mended Minimum Specific GNSS Data
SBAS
Satellite-based Augmentation System
SUPL
Secure User Plane Location
SAW
Surface Acoustic Wave
TBD
To Be Determined
TTFF
Time-To-First-Fix
UART
Universal Asynchronous Receiver & Transmitter
VDOP
Vertical Dilution of Precision
VTG
Course over Ground and Ground Speed, Horizontal Course and Horizontal
Velocity
WAAS
Wide Area Augmentation System
ZDA
Time & Date
Inom
Nominal Current
Imax
Maximum Load Current
Vmax
Maximum Voltage Value
Vnom
Nominal Voltage Value
Vmin
Minimum Voltage Value
VIHmax
Maximum Input High Level Voltage Value
VIHmin
Minimum Input High Level Voltage Value
VILmax
Maximum Input Low Level Voltage Value
VILmin
Minimum Input Low Level Voltage Value
VImax
Absolute Maximum Input Voltage Value
VImin
Absolute Minimum Input Voltage Value
VOHmax
Maximum Output High Level Voltage Value
VOHmin
Minimum Output High Level Voltage Value
VOLmax
Maximum Output Low Level Voltage Value
VOLmin
Minimum Output Low Level Voltage Value
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2. Product Concept
L50 is a GPS ROM-based module with embedded GPS patch antenna and features fast acquisition
and tracking with the latest SiRF Star IV technology. This module provides outstanding GPS
performance in a slim package. Based on an external optional EEPROM which provides capability of
storing ephemeris and downloading patch codes through UART, L50 can support Standalone and
A-GPS (CGEE function). Advanced jamming suppression mechanism and innovative RF architecture,
L50 provides a higher level of anti-jamming and ensures maximum GPS performance. The module
supports location, navigation and industrial applications including autonomous GPS C/A, SBAS
(WAAS or EGNOS) and A-GPS. Furthermore, a patch antenna has been designed into the L50
module. This will reduce customers’design complexity greatly.
L50, in SMD type, can be embedded in customer applications via the 24-pin pads with the slim
16 x 28 x 3mm package. It provides all hardware interfaces between the module and host board.
The multiplexed communication interface: UART/I2C/SPI interface.
The Dead Reckoning I2C interface up to 400Kbps can be used to connect with an external
EEPROM to save ephemeris data for CGEE function and to store patch codes.
The module is RoHS compliant to EU regulation.
2.1 Key Features
Table 3: Module key features
Feature
Implementation
Power supply
supply voltage: 1.71V –1.89V typical : 1.8V
Power consumption
Acquisition 45 mA @ -130dBm
Tracking 35 mA @ -130dBm
Hibernate 20uA
Receiver Type
GPS L1 1575.42MHz C/A Code
48 search channels
Sensitivity¹
Cold Start (Autonomous) -148 dBm
Reacquisition -160dBm
Hot Start -160 dBm
Tracking -163 dBm
Navigation -160 dBm
Time-To-First-Fix¹
Cold Start (Autonomous) <33s
Warm Start (Autonomous) <33s
Warm Start (With CGEE) 10s typ.
Hot Start (Autonomous) <1s
Horizontal Position Accuracy
<2.5 m CEP
Max Update Rate
1Hz
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Accuracy of 1PPS Signal
Typical accuracy 61 ns
Time pulse 200ms
Velocity Accuracy
Without aid 0.01 m/s
Acceleration Accuracy
Without aid 0.1 m/s²
Dynamic Performance
Maximum altitude 18288m
Maximum velocity 514m/s
Acceleration 4 G
Dead Reckoning I2C
Interface
CGEE
Open drain output
MEMS support (TBD devices)
Standard I2C bus maximum data rate 400kbps
Minimum data rate 100kbps
Communication interface
Support multiplexed UART/I2C interface
The output is CMOS 1.8V compatible and the input is 3.6V
tolerant
Temperature range
Normal operation: -40°C ~ +85°C
Storage temperature: -45°C ~ +125°C
Physical Characteristics
Size:
16±0.15 mm x 28±0.15 mm x 3±0.2mm
Weight: Approx. 4 g
¹Measured in conducted method by 8-star GPS simulator
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2.2 Functional Diagram
The block diagram of L50 is shown in the Figure 1.
RF F r on t -
E nd W it h
In t e g r a t e d L NA
Fractional-N
Synthesizer
GPS
Engine
ROM
Saw
Filter Power
Management
ARM7
Processor Peripheral
Controller
RTC
VCC
VIO/RTC
UART/I2C
RESET
EINT0
1PPS
ON/OFF
Optional
EEPROM
For CGEE
DR_I2C
Match
Network
RAM
LNA
PATCH
ANTENNA
Figure 1: Functional diagram for L50
2.3 Evaluation Board
In order to help customers to develop applications with L50, Quectel offers an Evaluation Board (EVB)
with appropriate power supply, RS-232 serial port and EEPROM.
Note: For more details, please refer to the document [1].
2.4 Protocol
L50 supports standard NMEA-0183 protocol and the One Socket Protocol (OSP), which is the binary
protocol interface that enables customers’host device to access all SiRF GPS chip products of the
SiRF Star IV family and beyond. The module is capable of supporting the following NMEA formats:
GGA, GSA, GLL, GSV, RMC, and VTG..
Table 4: The module supports protocols
Protocol
Type
NMEA
Input/output, ASCII, 0183, 3.01
OSP
Input/output, OSP protocol
Note: Please refer to document [2] about NMEAstandard protocol and SiRF private protocol.
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3. Application
L50 is a 24-pin surface mounted device (SMD) which could be embedded into customers’application
conveniently. Sub-interfaces included in these pins are described in detail in the following chapters:
Power management (refer to Chapter 3.4)
Power supply (refer to Chapter 3.5)
Timing sequence (refer to Chapter 3.6)
Communication interface (refer to Chapter 3.7)
Assisted GPS (refer to Chapter 3.8)
Electrical and mechanical characteristics of the SMD pad are specified in Chapter 5 & Chapter 6.
3.1 Pin Assignment of the Module
1
2
3
4
5
6
18
17
16
15
14
13
7
VCC
VIO/RTC
1PPS
ON_OFF
EINT0
GND TXD/MISO/SCL
RXD/MOSI/SDA
DR_I2C_DIO
RESET
GND
8
9
11
12
10
20
19
21
22
23
24
GND
RESERVED
GND
GND
GND
GND GND
GND
GND
RESERVED
CFG1/SCS
DR_I2C_CLK
CFG0/SCK
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3.2 Pin Description
Table 5: Pin description
Power Supply
PIN
NAME
PIN
NO.
I/
O
DESCRIPTIO
N
DC
CHARACTERISTICS
COMMENT
VCC
2
I
Supply voltage
Vmax= 1.89V
Vmin=1.71V
Vnom=1.8V
Supply current should be
no less than 100mA.
VIO/RTC
1
I
RTC and CMOS
I/O voltage
supply
Vmax=1.89V
Vmin=1.71V
Vnom=1.8V
IVIO/RTC=15uA@
Hibernate mode
Power supply for RTC
and CMOS I/O. In the full
on mode, make sure both
VIO/RTC and VCC
simultaneously power on.
In the hibernate mode,
make sure VIO/RTC
powers on to keep the
data lossless.
General purpose input/output
PIN
NAME
PIN
NO.
I/
O
DESCRIPTIO
N
DC
CHARACTERISTICS
COMMENT
RESET
23
I
External reset
input, active low
VILmin=-0.4V
VILmax=0.45V
VIHmin=0.7*
VIO/RTC
VIHmax=3.6V
The system reset is
provided by the RTC
monitor circuit and it is
active low and must have
an external pull up
resistor to keep the signal
stable when it works. If
unused, leave this pin
unconnected.
EINT0
5
I
External
interrupt input
pin, which is
only a level
triggered
interrupt.
VILmin=-0.4V
VILmax=0.45V
VIHmin=0.7*VCC
VIHmax=3.6V
If unused, pull this pin
down to ground directly.
It is not supported by
SIRF at present.
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ON_OFF
4
I
Power control
pin
VILmin=-0.4V
VILmax=0.45V
VIHmin=0.7*
VIO/RTC
VIHmax=3.6V
A pulse generated on the
ON_OFF pin which lasts
for at least 1ms and
consists of a rising edge
and low level, can switch
operating mode between
hibernate and full-on.
1PPS
3
O
One pulse per
second
VOLmin=-0.3V
VOLmax=0.4V
VOHmin=0.75*VCC
1PPS output provides a
pulse signal for time
purpose. If unused, leave
this pin unconnected.
Serial Interface
PIN
NAME
PIN
NO.
I/
O
DESCRIPTIO
N
DC
CHARACTERISTICS
COMMENT
DR_I2CD
IO
21
I/
O
Dead Reckoning
I2C data (SDA)
VOLmax=0.4V
VOHmin=0.75*VCC
VILmin=-0.4V
VILmax=0.45V
VIHmin=0.7*VCC
VIHmax=3.6V
If unused, leave this pin
unconnected.
DR_I2C_
CLK
22
O
Dead Reckoning
I2C clock(SCL)
VOLmax=0.4V
VOHmin=0.75*VCC
If unused, leave this pin
unconnected.
CFG0/
SCK
17
I
Function
overlay:
SPI_CLK
slave SPI
clock input
(SCK)
Configure
Pin 0
VILmin=-0.4V
VILmax=0.45V
VIHmin=0.7*VCC
VIHmax=3.6V
When serial port is
configured as UART, pull
up to VCC via a 10k
resistor.
CFG1/
SCS
18
I
Function
overlay:
SPI_CS_N
slave SPI
chip select
(SCS)
active low
Configure
Pin 1
VILmin=-0.4V
VILmax=0.45V
VIHmin=0.7*VCC
VIHmax=3.6V
When serial port is
configured as I2C, pull
down to GND via a 10k
resistor.
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RXD/
MOSI/
SDA
20
I/
O
Function
overlay:
SSPI_DI
slave SPI
data input
(MOSI)
UART_RX
UART data
receive
(RXD)
I2C_DIO
I2C data
(SDA)
VOLmax=0.4V
VOHmin=0.75*VCC
VILmin=-0.4V
VILmax=0.45V
VIHmin=0.7*VCC
VIHmax=3.6V
TXD/
MISO/
SCL
19
I/
O
Function
overlay:
SSPI_DO
slave SPI
data output
(MISO)
UART_TX
UART data
transmit
(TXD)
I2C_CLK
I2C clock
(SCL)
VOLmax=0.4V
VOHmin=0.75*VCC
VILmin=-0.4V
VILmax=0.45V
VIHmin=0.7*VCC
VIHmax=3.6V
Others
PIN
NAME
PIN
NO.
I/
O
DESCRIPTIO
N
DC
CHARACTERISTICS
COMMENT
GND
6,7,9,
10,11
,12,
13,14
,15,
24
Ground
Reserved
8,16
Reserved
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3.3 Operating Modes
The table below briefly summarizes the various operating modes in the following chapters.
Table 6: Overview of operating modes
Mode
Function
Acquisition mode
The module starts to search satellites and determine visible satellites，coarse
carrier frequency and code phase of satellite signals. When the acquisition is
completed, it switches to tracking mode automatically.
Tracking mode
The module refines acquisition’s message, as well as keeping tracking and
demodulating the navigation data from the specific satellites.
Hibernate mode
The module can be switched to hibernate mode by applying a pulse which
consists of a rising edge and high level that persists for at least 1ms on the
ON_OFF pin.
3.4 Power Management
There are two power supply pins in L50, VCC and VIO/RTC.
3.4.1 VCC Power
VCC pin supplies power for GPS BB domain and GPS RF domain. The power supply VCC’s current
varies according to the processor load and satellite acquisition. Typical VCC max current is 100 mA.
So it is important that the power is clean and stable. Generally, ensure that the VCC supply ripple
voltage meet the requirement: 54 mV(RMS) max @ f = 0~3MHz and 15 mV(RMS) max @ f > 3
MHz.
Table 7: Pin definition of the VCC pin
3.4.2 VIO/RTC Power
The VIO/RTC pin supplies power for all RTC domain and CMOS I/O domain, so VIO/RTC should be
powered all the time when the module is running. It ranges from 1.71V to 1.89V. In order to achieve a
better Time To First Fix (TTFF) after VCC power down, VIO/RTC should be valid all the time. It can
supply power for SRAM memory which contains all the necessary GPS information for quick start-up
and a small amount of user configuration variables.
Name
Pin
Function
VCC
2
power supply for GPS BB and RF part
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Table 8: Pin definition of the VIO/RTC pin
3.4.3 Energy Saving Mode
3.4.3.1 ATP Mode
Adaptive trickle power (ATP): In this mode, L50 cycles three modes internally to optimize power
consumption. These three modes consist of full on mode, CPU only mode and standby mode. The full
on mode lasts about 200~900ms to require new ephemeris to get a valid position, and the other two
modes are partially power off or completely power off to decrease power consumption. The timing
sequence is shown in following figure. This mode is configurable with SiRF binary protocol message
ID151. The following diagram is a default configuration and it is tested in the strong signal
environment. When the signal becomes weak, it will not comply with the following rule. The weaker
the signal is, the longer time the module lasts in full on mode. In the extreme condition, when there is
no signal input, the mode cycles only two modes, which are full on and standby mode.
time
Power
consumption
Full power
state (tracking) Cpu
only
state Standby state
Full power
state
(tracking)
Full power
state
(tracking)
Cpu
only
state Standby state
Cpu
only
state Standby state
Power on
Or reset
540ms
160ms
300ms
Full
power
state
(acqui
ring)
Figure 2: ATP timing sequence
3.4.3.2 PTF Mode
Push to fix (PTF): In this mode, L50 is configured to be waked up periodically, typically every 1800
sec (configurable range 10~7200 sec) for updating position and collecting new ephemeris data from
valid satellites. For the rest of the time, the module stays in Hibernate mode. A position request acts as
a wakeup of the module, which is then able to supply a position within the hot-start time
specification.This mode is configurable with SiRF binary protocol message ID167 and the following
figure is the default configuration. Additionally, when the signal becomes weak, pushing to fix
function is not valid.
Name
Pin
Function
VIO/RTC
1
Power for RTC and CMOS /IO
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time
Power
consumption
Full
power
state(
acqui
ng)Full power
state (tracking)
Full power
state
(tracking)
Full power
state
(tracking)
Hibernate state
Power on
Or reset Position request
Hibernate state Hibernate state
30min 30min 30min
Full
power
state
(acqui
ring)
Figure 3: PTF timing sequence
3.4.3.3 Hibernate Mode
Hibernate mode means low power consumption in this mode. Some power domains are powered off
such as ARM, DSP and RF part, but the RTC domain includes all non-volatile logic, and the RAM,
and GPS BB logic I/O are still active. The module is woken up from Hibernate mode on the next
ON_OFF (at rising edge) using all internal aided information like GPS time, Ephemeris, Last Position
and so on, to carry out a fast TTFF in either Cold or Warm start mode.
3.5 Power Supply
3.5.1 Power Reference Design
The following diagram is one solution of power supply for L50 module. Customers can follow this
reference design to get a short TTFF in either warm start or cold start. One concern of this design is
that the battery will take the place of VCC_3.3 to supply power for RTC and CMOS I/O of the module
when VCC_3.3 is absent. Furthermore, VCC_3.3 will charge the battery when it is active.
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Figure 4: Power design reference for L50 module
3.5.2 Battery
In this part, the charging circuit of battery is introduced and XH414 is chosen as an example, the
following circuit is the reference design.
Figure 5: Reference charging circuit for chargeable battery
Coin-type Rechargeable Capacitor such as XH414H-IV01E from Seiko can be used and Schottky
diode such as RB520S30T1G from ON Semiconductor is recommended for its low voltage drop. The
charging and discharging characteristic of XH414 is shown in the following figure.
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