Renesas YCONNECT-IT-RZN2L User manual

© 2023 Renesas Electronics Corporation. All rights reserved.
RZ/N2L Industrial Network
SOM Kit
YCONNECT-IT-RZN2L
User’s
Manual
RENESAS MPU
RZ
/N2L
Rev .1.
0
March 30, 2023
User’sManual
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
www.renesas.com

© 2023 Renesas Electronics Corporation. All rights reserved.
Notice
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your
product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of
these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or
other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this
document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any
and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.
5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for
each Renesas Electronics product depends on the product’s quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home
electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key
financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to
human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system;
undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims
any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is
inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.
6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for
Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by
Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas
Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such
specified ranges.
7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific
characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products
are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury,
injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety
design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging
degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are
responsible for evaluating the safety of the final products or systems manufactured by you.
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12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
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(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled
subsidiaries.
(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
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Contact information
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Corporation. All trademarks and registered trademarks are the property
of their respective owners.

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General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit
Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products
covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1. Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and
measurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor
devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
2. Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of
register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset
pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins
in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the
level at which resetting is specified.
3. Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal
elements. Follow the guideline for input signal during power-off state as described in your product documentation.
4. Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.
5. Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal
produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
6. Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL
(Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the
input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).
7. Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these
addresses as the correct operation of the LSI is not guaranteed.
8. Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in terms
of internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system-
evaluation test for the given product.

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List of Abbreviations and Acronyms
Abbreviation
Full Form
CPU
Central Processing Unit
EEPROM
Electronically Erasable Programmable Read Only Memory
ESC
EtherCAT Slave Controller
EtherCAT
Ethernet for Control Automation Technology
Hi-Z
High Impedance
I/O
Input / Output
I2C (IIC)
Philips™ Inter-Integrated Circuit Connection Bus
IRQ
Interrupt Request
J-Link®
SEGGER debug probe (Emulator)
MCU
Micro controller Unit
MPU
Micro Processor Unit
OTG
On The Go
PCB
Printed Circuit Board
PMIC
Power Management Integrated Circuit
PMOD
Peripheral module interface
QSPI
Quad Serial Peripheral Interface
SPI
Serial Peripheral Interface
NVM
Non Volatile Memory

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Table of Contents
1. Introduction..............................................................................................................................8
1.1 Scope of this document ........................................................................................................................... 8
1.2 Overview.................................................................................................................................................. 8
1.3 Features .................................................................................................................................................. 8
1.4 Appearance ............................................................................................................................................. 9
1.5 Components Arrangement .................................................................................................................... 10
1.5.1 Carrier Board ....................................................................................................................................... 10
1.5.2 Stamp Module ..................................................................................................................................... 11
2. Power Supply ........................................................................................................................12
3. Interface ................................................................................................................................13
3.1 Jumper Settings..................................................................................................................................... 13
3.1.1 SDRAM Setting ................................................................................................................................... 13
3.1.2 EtherCAT Setting................................................................................................................................. 13
3.1.3 HSPI Setting ........................................................................................................................................ 13
3.1.4 Pmod Settings ..................................................................................................................................... 13
3.2 Gigabit Ethernet Interfaces.................................................................................................................... 14
3.2.1 Overview.............................................................................................................................................. 14
3.2.2 Hardware Specification ....................................................................................................................... 14
3.2.3 LED Status Specification..................................................................................................................... 15
3.2.4 Ethernet PHY....................................................................................................................................... 15
3.2.5 EtherCAT............................................................................................................................................. 17
3.3 USB Interface ........................................................................................................................................ 17
3.4 Debug Interface ..................................................................................................................................... 18
3.4.1 USB Debug Interface .......................................................................................................................... 18
3.4.2 External Debugger Interface ............................................................................................................... 18
3.5 High Speed CAN Interface .................................................................................................................... 18
3.6 Arduino Interface ................................................................................................................................... 19
3.7 PMOD Interfaces ................................................................................................................................... 22
3.7.1 SPI/I2C Interfaces ............................................................................................................................... 22
3.7.2 UART/I2C Interfaces ........................................................................................................................... 23
3.8 General IO Interfaces ............................................................................................................................ 24
3.8.1 Output Optical Configuration ............................................................................................................... 25
3.8.2 Input State Selector ............................................................................................................................. 26
3.8.3 General IO connector .......................................................................................................................... 27
3.9 HSPI Interface ....................................................................................................................................... 29
4. Stamp Module .......................................................................................................................30

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4.1 Block diagram........................................................................................................................................ 30
4.2 Module Pads.......................................................................................................................................... 32
5. Electrical Characteristics .......................................................................................................37
5.1 Absolute Maximum Ratings................................................................................................................... 37
5.2 Operating Conditions............................................................................................................................. 37
5.2.1 Power Supply ...................................................................................................................................... 37
5.2.2 DC Characteristics .............................................................................................................................. 37
5.2.3PMIC.................................................................................................................................................... 38
5.2.4 Debug interface ................................................................................................................................... 38
5.2.5 I2C Specification.................................................................................................................................. 38
5.2.6SPI Specification ................................................................................................................................. 39
References .....................................................................................................................................1
Revision History ..............................................................................................................................1
Table of Figures
Figure 1-1 Appearance of RZ/N2L Industrial Network SOM Kit (Carrier Board + Stamp Module) ................... 9
Figure 1-2 Appearance of Stamp Module.......................................................................................................... 9
Figure 1-3 Carrier Board component placement ............................................................................................. 10
Figure 1-4 Stamp Module Key Components ................................................................................................... 11
Figure 2-1 Power supply connector................................................................................................................. 12
Figure 2-2 Connection to Carrier board.......................................................................................................... 12
Figure 3-1 Ethernet Port Drawings (2 Ports) ................................................................................................... 14
Figure 3-2 Ethernet Port (2 Ports) ................................................................................................................... 15
Figure 3-3 Link and Activity LEDs ................................................................................................................... 15
Figure 3-4 Implementation of CAN Interface ................................................................................................... 19
Figure 3-5 General Arduino UNO Interface ..................................................................................................... 20
Figure 3-6 SLG46537V (IC11) output schematic ............................................................................................ 25
Figure 3-7 SLG46537V (IC11) output internal configuration ........................................................................... 25
Figure 3-8 SLG46537V (IC12) input schematic .............................................................................................. 26
Figure 3-9 SLG46537V (IC12) input internal configuration. ............................................................................ 27
Figure 3-10 SLG46537V (IC13) input and output schematic .......................................................................... 28
Figure 3-11 SLG46537V (IC13) input and output internal configuration. ........................................................ 29
Figure 3-12 Serial Host Interface connector (J15) .......................................................................................... 29
Figure 4-1 Stamp Module Block Diagram........................................................................................................ 30
Figure 4-2 Land pattern (Top View)................................................................................................................. 31
Figure 5-1 PMIC Power-Up sequence............................................................................................................. 38

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Index of Tables
Table 3-1 SDRAM Jumper Setting .................................................................................................................. 13
Table 3-2 EtherCAT Jumper Settings.............................................................................................................. 13
Table 3-3 HSPI Jumper Setting ....................................................................................................................... 13
Table 3-4 Pmod Jumper Settings .................................................................................................................... 13
Table 3-5 Ethernet Port Pin Assignment ......................................................................................................... 14
Table 3-6 Ethernet PHY Address Settings ...................................................................................................... 16
Table 3-7 Ethernet Connections (Port 0)......................................................................................................... 16
Table 3-8 Ethernet Connections (Port 1)......................................................................................................... 16
Table 3-9 EtherCAT Connections.................................................................................................................... 17
Table 3-10 USB Interface Pin Assignment (microUSB connector: J10) ......................................................... 17
Table 3-11 Debug Interface Pin Assignment (10-pin SWD connector: J2) ..................................................... 18
Table 3-12 CAN Interface Pin Assignment (Connector: J9)............................................................................ 19
Table 3-13 Arduino Interface Pin Assignment (Connector: J9) ....................................................................... 20
Table 3-14 Pmod SPI/I2C Interface register soldering for Connector J13 ...................................................... 22
Table 3-15 Pmod SPI/I2C Interface Pin Assignment (Connector: J13 – Type 2A (Extended SPI)) ............... 22
Table 3-16 Pmod SPI/I2C Interface Pin Assignment (Connector: J13 – Type 6A (Extended I2C))................ 22
Table 3-17 Pmod UART/I2C Interface register soldering for Connector J14 .................................................. 23
Table 3-18 Pmod UART/I2C Interface Pin Assignment (Connector: J14 – Type 3A (Extended UART)) ....... 23
Table 3-19 Pmod UART/I2C Interface Pin Assignment (Connector: J14 – Type 6A (Extended I2C))............ 24
Table 3-20 General IO Connector pin (J8) information ................................................................................... 28
Table 3-21 HSPI Interface Pin Assignment (Connector: J15) ......................................................................... 30
Table 4-1 Stamp Module Pad Description....................................................................................................... 32
Table 5-1 Absolute Maximum Ratings............................................................................................................. 37
Table 5-2 Power Supply .................................................................................................................................. 37
Table 5-2 DC Characteristics .......................................................................................................................... 37
Table 5-3 Debug Interface Signal Description................................................................................................. 38
Table 5-4 I2C Signal Description..................................................................................................................... 38
Table 5-5 SPI Signal Description..................................................................................................................... 39

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1. Introduction
1.1 Scope of this document
RZ/N2L Industrial Network SOM Kit (YCONNECT-IT-RZN2L) is described in this manual, including an
overview of the functional principle, components, and connections in system.
1.2 Overview
The purpose of RZ/N2L Industrial Network SOM Kit is a reference design for SoM (system-on-module) and
carrier board for industrial Ethernet solution. This reference design targets industrial application with network
card having industrial Ethernet function.
This SOM Kit consist of two boards as follows. SoM module is soldered on Carrier Board as if it’s ‘stamp’. SoM
module is called ‘stamp module’ in this document. Components for fundamental functions like memory and
Ethernet PHY are implemented on stamp module, and components for additional functions depending on use
case are on carrier board.
The reference design can reduce time-to-market, development, and their risk. The following listed industrial
protocols are (or are to be) supported.
•PROFINET
•EtherNet/IP
•EtherCAT
•Modbus TCP
•OPC UA
1.3 Features
Features for stamp module and carrier board are shown as follows.
1. Stamp Module (EU140SOMSTAMPPOC1Z):
•128Mbit QSPI flash, 256Mbit SDRAM and 16kbit EEPROM
•Power Management IC (PMIC)
•2x Ethernet Gbit PHY
•120 castellated pads for connecting Carrier Board
•Small footprint
2. Carrier Board (EU140CARRIERPOC1Z):
•Power Supply from either 24VDC connector, USB, or Arduino Host Board
•RJ45 connector for dual port
•2x PMOD female connectors assuming to use Quick Connect IoT Sensors
•Arduino dual use:
oHost to carry Arduino Shield via female pins
oShield via male connectors
•USB 2.0 host/function with micro type-AB connector
•Debug interface: USB micro type-B connector for Segger J-Link OB, or 10-pin half pitch
connector for connecting external emulator
•Serial Host Interface (HSPI) pins, and option pins for standard Industrial Ethernet synchronous
use
•15 LEDs and 16 dip switches controlled by I2C

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1.4 Appearance
Figure 1-1 Appearance of RZ/N2L Industrial Network SOM Kit (Carrier Board + Stamp Module)
Figure 1-2 Appearance of Stamp Module

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1.5 Components Arrangement
1.5.1 Carrier Board
Figure 1-3 Carrier Board component placement
1) 24V Terminal Connector (J1)
2) Stamp Module
3) Host/Shield Arduino power switch slider
(SW1)
4) USB micro type-AB Connector (J10)
5) Reset Button
6) JTAG Debug Connector (J2)
7) Integrated Segger J-Link Needle Adapter
8) Debug USB micro type-B Connector (J5)
9) PMOD SPI/I2C Renesas Connector (J13)
10) PMOD UART/I2C Renesas Connector (J14)
11) 2 x ESC LEDs or PMOD Pins Selector (J18,
J19)
12) 7-Pin ESC Interface Connector (J12)
13) 2 x 8 - User Switch Slider (J6, J7)
14) Arduino Connector with both options:
Female on top side (used as host)
Male on bottom side (used as shield)
15) 2 x Gigabit Ethernet Connectors (J11)
16) 15 x User LEDs
17) 20-pins User Connector (J8)
18) 10-pins HSPI Interface Connector (J15)
1
2
3
4
5
6
7
8
9
11
12
10
13
14
15
14
16

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1.5.2 Stamp Module
Figure 1-4 Stamp Module Key Components
1) 2x Gigabit Ethernet PHYs (VSC8531XMW-01)
2) 128Mbit NOR Flash (AT25SF128A-MHB-T)
3) 16Kbit Serial EEPROM (R1EX24016ATAS0I#S0)
4) RZ/N2L (R9A07G084M04GBG) - 1 Core 32-Bit 400MHz ARM® Cortex®-R52 Ethernet
communication MPU
5) High Current, Highly Configurable System PMIC (DA9083)
6) 256Mbit SDRAM (W9825G6JB)
7) Selection header for pin P14_5 between HSPI and SDRAM (J2)
8) 25MHz HCMOS Oscillator (XLH336025.000000I)
1
2
3
4
5
6
7
8

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2. Power Supply
•Three Power Source for RZ/N2L Industrial Network SOM Kit:
oOperation from 24V via screw terminal (J1)
oOperation from 5V USB connectors (J5)
oOperation from 5V USB connectors (J10)
oOperation from 3.3V Arduino pins *1 (see Table 3-9 Arduino Interface Pin Assignment
(Connector: J9))
*1 SW1 OFF setting is required when power is supplied from Arduino Host.
Figure 2-1 Power supply connector
The following figure shows how power supply to Stamp Module from Carrier board.
Figure 2-2 Connection to Carrier board
J5
J10
J1
SW1

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3. Interface
3.1 Jumper Settings
3.1.1 SDRAM Setting
The following jumper settings are required to use SDRAM.
Table 3-1 SDRAM Jumper Setting
Jumper
Pin number
Configuration
Description
J2
1-2
OPEN
Enable BSC_CS3# signal
2-3
SHORT
3.1.2 EtherCAT Setting
The following jumper settings are required to use EtherCAT.
Table 3-2 EtherCAT Jumper Settings
Jumper
Pin number
Configuration
Description
J18
1-2
SHORT
Enable EtherCAT Run LED
2-3
OPEN
J19
1-2
SHORT
Enable EtherCAT Error LED
2-3
OPEN
3.1.3 HSPI Setting
The following jumper settings are required to use HSPI interfaces.
Table 3-3 HSPI Jumper Setting
Jumper
Pin number
Configuration
Description
J2
1-2
SHORT
Enable HSPI_INT# signal
2-3
OPEN
3.1.4 Pmod Settings
The following jumper settings are required to use Pmod (J14) interfaces.
Table 3-4 Pmod Jumper Settings
Jumper
Pin number
Configuration
Description
J18
1-2
OPEN
Enable Pmod (J14) Pin 9 connection
2-3
SHORT
J19
1-2
OPEN
Enable Pmod (J14) Pin 10 connection
2-3
SHORT

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3.2 Gigabit Ethernet Interfaces
3.2.1 Overview
With two RJ45 network connectors, the Carrier Board is ready for external connection in several network
topologies. The internal PHY layers in the Stamp Module can handle different industrial communication
protocols and support 10/100/1000BASE-T.
3.2.2 Hardware Specification
The Ethernet ports have the following pin assignment:
Table 3-5 Ethernet Port Pin Assignment
Pin
Signal
I/O
Description
1
MDI0-
I/O
Tx/Rx channel A negative signal
2
MDI0+
I/O
Tx/Rx channel A negative signal
3
MDI1-
I/O
Tx/Rx channel B negative signal
4
MDI1+
I/O
Tx/Rx channel B negative signal
5
MDI2-
I/O
Tx/Rx channel C negative signal
6
MDI2+
I/O
Tx/Rx channel C negative signal
7
MDI3-
I/O
Tx/Rx channel D negative signal
8
MDI3+
I/O
Tx/Rx channel D negative signal
The Ethernet ports support 1000 Mbits/s with auto negotiation.
Figure 3-1 Ethernet Port Drawings (2 Ports)

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Figure 3-2 Ethernet Port (2 Ports)
3.2.3 LED Status Specification
The Carrier Board has two RJ45 Ethernet ports and requires two LEDs per RJ45 jack, as follows:
•Module Status Indicator
•Network Status Indicator
Both indicators must be implemented separately from the RZ/N2L MPU and controlled by the application.
Figure 3-3 Link and Activity LEDs
3.2.4 Ethernet PHY
ETH0
ETH1

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Two Ethernet controller ICs (Ethernet PHYs: VSC8531XMW-01) are fitted to the Stamp Module and are
connected to the MPU Ethernet peripherals.
Table 3-6 Ethernet PHY Address Settings
Port
Part
PHY address setting
ETH0
IC5
0
ETH1
IC7
1
Table 3-7 Ethernet Connections (Port 0)
MPU on Stamp Module
IC5
Pin
Port
Ethernet signal
Pin
M7
P09_6
ETH0_TXD0
TXD0
N7
P09_5
ETH0_TXD1
TXD1
M6
P09_4
ETH0_TXD2
TXD2
R4
P09_3
ETH0_TXD3
TXD3
L7
P09_7
ETH0_TXCLK
TX_CLK
N8
P10_0
ETH0_TXEN
TX_CTL
M8
P10_1
ETH0_RXD0
RXD0
L8
P10_2
ETH0_RXD1
RXD1
L9
P10_3
ETH0_RXD2
RXD2
N4
P08_4
ETH0_RXD3
RXD3
M5
P08_6
ETH0_RXCLK
RX_CLK
P3
P08_5
ETH0_RXDV
RX_CTL
R3
P09_1
ETH0_REFCLK
XTAL1
N5
P08_7
GMAC_MDC
GMAC_MDC
P4
P09_0
GMAC_MDIO
GMAC_MDIO
B2
P01_2
ETH0_MDINT
MDINT
L12
P13_4
ETH_RESET#
NRESET
Table 3-8 Ethernet Connections (Port 1)
MPU on Stamp Module
IC7
Pin
Port
Ethernet signal
Pin
K4
P06_3
ETH1_TXD0
TXD0
M2
P06_2
ETH1_TXD1
TXD1
M1
P05_7
ETH1_TXD2
TXD2
L2
P06_0
ETH1_TXD3
TXD3
N1
P06_4
ETH1_TXCLK
TX_CLK
N2
P06_5
ETH1_TXEN
TX_CTL
L4
P06_6
ETH1_RXD0
RXD0
M3
P06_7
ETH1_RXD1
RXD1
P1
P07_0
ETH1_RXD2
RXD2
N3
P07_1
ETH1_RXD3
RXD3
M4
P07_3
ETH1_RXCLK
RX_CLK

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P2
P07_2
ETH1_RXDV
RX_CTL
L3
P06_1
ETH1_REFCLK
XTAL1
N5
P08_7
GMAC_MDC
GMAC_MDC
P4
P09_0
GMAC_MDIO
GMAC_MDIO
C15
P18_6
ETH1_MDINT
MDINT
L12
P13_4
ETH_RESET#
NRESET
3.2.5 EtherCAT
RZ/N2L has EtherCAT Slave Controller (ESC) and EtherCAT communication can be used on this SOM Kit.
Some EtherCAT signals are available on the connector J12.
Table 3-9 EtherCAT Connections
MPU on Stamp Module
Connect to
Pin
Port
Ethernet signal
P4
P09_0
ESC_MDIO
Ethernet PHY
N5
P08_7
ESC_MDC
Ethernet PHY
D8
P20_2
ESC_LEDRUN
Run LED
D9
P20_4
ESC_LEDERR
Error LED
J13
P14_4
ESC_IRQ
Connector J12-4
D1
P02_1
ESC_SYNC0
Connector J12-1
M13
P13_6
ESC_SYNC1
Connector J12-2
D2
P01_6
ESC_LATCH0
Connector J12-6
M11
P13_7
ESC_LATCH1
Connector J12-5
L12
P13_4
ESC_RESETOUT#
Ethernet PHY
L10
P13_2
ESC_I2CCLK
EEPROM
N12
P13_3
ESC_I2CDATA
EEPROM
M9
P10_4
ESC_PHYLINK0
Ethernet PHY
K2
P05_5
ESC_PHYLINK1
Ethernet PHY
3.3 USB Interface
The Carrier Board features a USB2.0 interface, available on the microUSB connector J10.
Table 3-10 USB Interface Pin Assignment (microUSB connector: J10)
MPU on Stamp Module
J10
Pin
Port
Signal
Pin
Signal

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-
-
-
1
VCC
P13
-
USB DM
2
D-
R13
-
USB DP
3
D+
E3
P02_0
USB_OTGID
4
ID
-
-
-
5
GND
IMPORTANT:
In default, this board assume to connect non-standard USB cable which ID pin has not GND for OTG
use. To allow RZ/N2L to be OTG Host in that condition, USB_OTGID signal has pull-down resistor R87.
If use standard OTG cable and OTG Device, remove resistor R87 and configure port P02_0 with internal
pull-up. If don’t use OTG, nothing to do because ID pin can be ignored.
3.4 Debug Interface
There are two options for debug interface, J-Link OB via USB or external emulator via 10-pin connector.
3.4.1 USB Debug Interface
The Carrier Board features an on-board Segger JLink debugger circuit, implemented on a S124 Synergy MCU,
used for debugging of the main RZ/N2L MPU on the Stamp Module.
Access to the debug interface is done through the microUSB connector J5.
3.4.2 External Debugger Interface
The Carrier Board also features a standard 10-pin SWD connector (J2), which enables the user to use an
external debug tool. The two debug interfaces cannot be used at the same time.
Table 3-11 Debug Interface Pin Assignment (10-pin SWD connector: J2)
MPU
J2
Pin
Port
Signal
Pin
Signal
-
-
1
VTref
F5
P02_6
TMS
2
SWDIO/TMS
-
-
3
GND
F1
P02_7
TCK
4
SWCLK/TDO
-
-
5
GND
-
-
6
SWO/TDO
- - 7 -
- - 8 TDI
- - 9 NC
P6
-
RES#
10
nRESET
3.5 High Speed CAN Interface
The Carrier Board features a CAN-FD interface that complies with ISO 11898-1 (2015) Standards. CANFD
transmits and receives both formats of messages, namely the standard identifier (11 bits) (identifier is hereafter
referred to as ID) and extended ID (29 bits).

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The CAN-FD pins are shared with Arduino connector (J9), pins 26 and 28.
Figure 3-4 Implementation of CAN Interface
Table 3-12 CAN Interface Pin Assignment (Connector: J9)
MPU on Stamp Module
J9
Pin
Port
Signal
Pin
Signal
C1
P02_2
P02_2/SPI_MOSI3/CAN TX0
26
CAN TX0
F3
P01_7
P01_7/SPI_RSPCK3/CAN RX0
28
CAN RX0
3.6 Arduino Interface
Another interface with the external boards is the Arduino UNO hardware compatibility pins, with dual
functionality:
•Host mode via female connectors on the top side for carrying standard Arduino shields.
oAnalog, I2C, SPI master, UART, PWM, GPIO, Power (3.3V output)
oConfigure SW1 = ON
•Shield mode via male connectors on the bottom side where the stamp and baseboard can behave like
a shield.
oI2C, GPIO. Power (3.3V input)
oConfigure SW1 = OFF
IMPORTANT:
For this connection the user should select the power source using switch slider (SW1) in correlation
with the used mode. If no Arduino compatible board is connected, the SW1 must be in HOST mode.

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Figure 3-5 General Arduino UNO Interface
Table 3-13 Arduino Interface Pin Assignment (Connector: J9)
MPU J9
Pin Port Signal Pin Signal
- - - NC NC
- - - IOREF NC
P6 - RESET# RESET RST_IN#
- - - 3V3 -
- - - 5V NC
- - - GND -
- - - GND -
- - - VIN NC
B13 - AN000 A0 ARD_AN000
C12 - AN001 A1 ARD_AN001
B14 - AN002 A2 ARD_AN002
C13 - AN003- A3 ARD_AN003
B12 - AN100 A4 ARD_AN100
A14 - AN101 A5 ARD_AN101
G11 P16_6 RXD0/SCL0/MISO0 SCL RXD0/SCL0/MISO0
H15 P16_5 TXD0/SDA0/MOSI0 SDA TXD0/SDA0/MOSI0
- - - AREF NC
- - - GND -
C1 P01_7 P01_7/SPI_RSPCK3/CANRX0 13 P01_7/SPI_RSPCK3/CANRX0
H11 P16_1 P16_1/SPI_MISO3 12 P16_1/SPI_MISO3
F3 P02_2 P02_2/SPI_MOSI3/CANTX0 ~11 P02_2/SPI_MOSI3/CANTX0
F14 P17_3 P17_3/SPI_SSL31 ~10 P17_3/SPI_SSL31
K11 P15_3 P15_3/MTIOC8C ~9 P15_3/MTIOC8C
A4 P00_4 P00_4/GTIOC0_A 8 P00_4/GTIOC0_A
M13 P13_6 P13_6/ESC_SYNC1/ETHSW_PTPOUT0 7 P13_6/ESC_SYNC1/ETHSW_PTPOUT0