RF-Star SimpleLink RF-BM-2652P3 User manual

RF-BM-2652P3
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RF-BM-2652P3 SimpleLink™ Multiprotocol BLE5.1 &
ZigBee Wireless Module with Integrated Power
Amplifier and Flash
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Feb. 02nd, 2021

RF-BM-2652P3
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TI CC26XX BLE Module List
Chipset
Core
Flash
(KB)
RAM
(KB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(M)
Photo
CC2640
R2FRSM
M3
128
28
2
RF-BM-4044B2
PCB
11.2 16.6
300
RF-BM-4044B3
IPEX
11.2 15.2
500
RF-BM-4044B4
CHIP
8 8
150
CC2640
R2FRGZ
M3
128
28
5
RF-BM-4077B1
PCB
17 23.5
500
CC2640
R2FRGZ –
Q1
RF-BM-4077B2
PCB
17 23.5
500
CC2642R
M4F
352
80
5
RF-BM-2642B1
PCB
17 23.5
500
CC2652R
M4F
352
80
5
RF-BM-2652B1
PCB
17 23.5
BLE:
500
ZigBee:
300
CC2652P
M4F
352
80
20
RF-BM-2652P1
Half-hole
16.4 25
BLE 1M:
350
BLE Long
Range:
2200
ZigBee:
1100
M4F
352
80
20
RF-BM-2652P2
PCB /
IPEX /
16.4 30
BLE 1M:
350

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Half-hole
BLE Long
Range:
2200
ZigBee:
1100
CC1352R
M4F
352
80
5 / 14
RF-TI1352B1
IPEX
16.8 26.5
BLE:
500
ZigBee:
300
868 MHz:
1000
CC1352P
M4F
352
80
20
RF-TI1352P1
Half-hole
16.4 25
BLE 1M:
350
BLE Long
Range:
2200
ZigBee:
1100
868 MHz:
2500
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

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1 Device Overview
1.1 Description
RF-BM-2652P3 is an RF module based on TI lower-power CC2652P SoC, which is a multiprotocol 2.4 GHz wireless
module supporting Thread, Zigbee®, Bluetooth®5.1 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects
(6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a
Dynamic Multiprotocol Manager (DMM) driver. It integrates a 48 MHz crystal and a 32.768 kHz crystal, 352 KB of
in-system Programmable Flash and an external flash of 1 MB, 256 KB ROM, 8 KB of Cache SRAM, 80 KB of ultra-low
leakage SRAM. Its ARM®Cortex®-M4F core application processor can operate at an extremely low current at flexible
power modes. And the module enables long-range and low-power applications using integrated +20 dBm high-power
amplifier with best-in-class transmit current consumption at 85 mA. It features small size, robust connection distance,
and rigid reliability.
1.2 Key Features
•RF Section
- 2.4GHz RF transceiver compatible with Bluetooth
5.1 Low Energy and earlier LE specifications and
IEEE 802.15.4 PHY and MAC
- Excellent receiver sensitivity
-100 dBm for 802.15.4 (2.4 GHz)
-105 dBm for Bluetooth 125 kbps (LE coded
PHY)
- Output power up to +20 dBm with temperature
compensation
- Suitable for systems targeting compliance with
worldwide radio frequency regulations
•Wireless Protocols
- Thread, ZigBee®,Bluetooth® 5.1 Low Energy, IEEE
802.15.4, IPv6-nabld smart objects (6LoWPAN),
Wi-SUN®, Proprietary systems, SimpleLinkTM
TI15.4-Stack (2.4 GHz), and Dynamic Multiprotocol
Manager (DDM) driver
•Microcontroller
- Powerful 48 MHz ARM®Cortex®-M4F processor
- EEBMC CoreMark®score: 148
- 352 KB of in-system programmable flash + 1
MB flash
- 256 KB of ROM for protocols and library
functions
- 8 KB of cache SRAM (Alternatively available as
general-purpose RAM)
- 80 KB of ultra-low leakage SRAM. The SRAM is
protected by parity to ensure high reliability of
operation.
- 2-pin cJTAG and JTAG debugging
- Support OTA upgrade
•Ultra-low power sensor controller with 4 KB of
SRAM
- Sample, store, and process sensor data
- Operation independent from system CPU
- Fast wake-up for low-power operation
•Peripherals
- Digital peripheral pins can be routed to 23
GPIOs
- 4 ×32-bit or 8 ×16-bit general-purpose timers
- 12-bit ADC, 200 ksamples/s, 8 channels
- 2 ×comparators with internal reference DAC (1
×continuous time, 1 ×ultra-low power)
- Programmable current source
- 2 ×UART
- 2 ×SSI (SPI, Microwave, TI)
- I2C

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- I2S
- Real-time clock (RTC)
- AES 128 and 256 bit Crypto accelerator
- ECC and RSA public key hardware accelerator
- SHA2 accelerator (full suite up to SHA-512)
- True random number generator (TRNG)
- Capacitive sensing, up to 8 channels
- Integrated temperature and battery monitor
•External system
- On-chip buck DC/DC converter
•Low Power
- Wide supply voltage range: 1.8 V ~ 3.8 V
- Active-mode RX: 6.9 mA
- Active-mode TX at 0 dBm: 7.3 mA
- Active-mode TX at +5 dBm: 9.6 mA
- Active-mode TX at +10 dBm: 22 mA
- Active-mode TX at +20 dBm: 85 mA
- Active-mode MCU 48 MHz (CoreMark): 3.4 mA (71
μA/MHz)
- Sensor controller, low power-mode, 2 MHz, running
infinite loop: 30.1 μA
- Sensor controller, active-mode, 24 MHz, running
infinite loop: 808 μA
- Standby: 0.94 µA (RTC on, 80 KB RAM and CPU
retention)
- Shutdown: 150 nA (wakeup on external events)
1.3 Applications
•2400 to 2480 MH ISM and SRD systems with
down to 4 kHz of receive bandwidth
•Home and building automation
•Building security system
•HVAC system
•Gateway
•IP network camera
•Fire safety system
•Smart grid
•Automatic meter reading
•Industrial transport
•Wireless sensor networks
•Factory automation and control
•Wireless healthcare applications
•Energy harvesting applications
•Asset tracking and management
•Electronic Shelf Label (ESL)
•Wired networking
•Small business router
•Portable electronics
•Set-top box
•Connected peripherals
•Keyboard and keypads
•Home theater & entertainment
•Electronic and robotic toys
•Wearables

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-2652P3
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-2652P3 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-2652P3
CC2652P
GPIOs
Jtag
48.0 MHz
32.768 KHz
Reset
Balun Filter
Balun Filter
Power Supply
1.8 V ~ 3.8 V
Antenna
Matching
Switch
PCB
Antenna
8 Mb
Flash
LPF
LPF
RF Part
RF
BM
2652
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset
TI CC2652P
-
-
P3
Module Version
The Third PA Version

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Table of Contents
TI CC26XX BLE Module List.......................................................................................................................................... 2
1 Device Overview............................................................................................................................................................. 4
1.1 Description............................................................................................................................................................ 4
1.2 Key Features....................................................................................................................................................... 4
1.3 Applications.......................................................................................................................................................... 5
1.4 Functional Block Diagram .............................................................................................................................. 6
1.5 Part Number Conventions.............................................................................................................................. 6
Table of Contents................................................................................................................................................................ 7
Table of Figures................................................................................................................................................................... 8
Table of Tables..................................................................................................................................................................... 8
2 Module Configuration and Functions...................................................................................................................... 9
2.1 Module Parameters........................................................................................................................................... 9
2.2 Module Pin Diagram.......................................................................................................................................10
2.3 Pin Functions.....................................................................................................................................................10
3 Specifications.................................................................................................................................................................12
3.1 Recommended Operating Conditions.....................................................................................................12
3.2 Handling Ratings..............................................................................................................................................12
4 Application, Implementation, and Layout.............................................................................................................13
4.1 Module Photos..................................................................................................................................................13
4.2 Recommended PCB Footprint....................................................................................................................13
4.3 Schematic Diagram.........................................................................................................................................14
4.4 Basic Operation of Hardware Design ......................................................................................................14
4.5 Trouble Shooting..............................................................................................................................................16
4.5.1 Unsatisfactory Transmission Distance........................................................................................16
4.5.2 Vulnerable Module..............................................................................................................................16
4.5.3 High Bit Error Rate.............................................................................................................................16
4.6 Electrostatics Discharge Warnings...........................................................................................................16
4.7 Soldering and Reflow Condition.................................................................................................................17
4.8 Optional Packaging.........................................................................................................................................18
5 Revision History............................................................................................................................................................19

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6 Contact Us.......................................................................................................................................................................20
Table of Figures
Figure 1. Functional Block Diagram of RF-BM-2652P3............................................................................. 6
Figure 2. Part Number Conventions of RF-BM-2652P3............................................................................ 6
Figure 3. Pin Diagram of RF-BM-2652P3......................................................................................................10
Figure 4. Recommendation of Antenna Layout...........................................................................................15
Figure 5. Recommended Reflow for Lead Free Solder............................................................................18
Figure 6. Optional Packaging Mode.................................................................................................................18
Table of Tables
Table 1. Parameters of RF-BM-2652P3........................................................................................................... 9
Table 2. Pin Diagram of RF-BM-2652P3........................................................................................................10
Table 3. Recommended Operating Conditions of RF-BM-2652P3......................................................12
Table 4. Handling Ratings of RF-BM-2652P3..............................................................................................12
Table 5. Temperature Table of Soldering and Reflow................................................................................17

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-2652P3
Chipset
CC2652P
Supply Power Voltage
1.8 V ~ 3.8 V, 3.3 V is recommended
Frequency
2402 MHz ～2480 MHz
Maximum Transmit Power
+20.0 dBm
Receiving Sensitivity
-100 dBm @ 802.15.4 (2.4 GHz)
-105 dBm @ Bluetooth 125 kbps (LE Coded PHY)
GPIO
23
Power Consumption
RX current: 6.9 mA
TX current: 7.3 mA @ 0 dBm
9.6 mA @ 5 dBm
22 mA @ 10 dBm
85 mA @ dBm
MCU 48 MHz (CoreMark):3.4 mA (71 μA/MHz)
Sensor Controller：30.1 μA @ Low Power-Mode, 2 MHz, running infinite loop
808 μA @ Active-Mode, 24 MHz, running infinite loop
Standby: 0.94 µA
Shutdown: 150 nA
Support Protocol
Bluetooth 5.1 Low Energy, ZigBee, Thread, IEEE 802.15.4, 6LoWPAN
Crystal
48 MHz, 32.768 kHz
Package
SMT packaging (Half hole)
Communication Interface
UART, SPI, I2C, I2S
Dimension
24.0 mm ×16.0 mm ×(2.2 ±0.1) mm
Type of Antenna
PCB antenna
Operating Temperature
-40 ℃～+85 ℃
Storage Temperature
-40 ℃～+125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-2652P3
2.3 Pin Functions
Table 2. Pin Diagram of RF-BM-2652P3
Pin
Name
Chip Pin
Function
Description
1
RESET
RESET_N
Reset, active low. No internal pullup resistor
2
ADC
DIO16
Digital
GPIO
3
GPIO04
DIO17
Digital
GPIO
4
GPIO00
DIO24
Digital or Analog
GPIO, analog capability
5
SWO
DIO25
Digital or Analog
GPIO, analog capability
6
PWM3
DIO26
Digital or Analog
GPIO, analog capability
7
PWM1
DIO27
Digital or Analog
GPIO, analog capability
8
VCC
3V3
-
Power supply: 1.8 V ~ 3.8 V, 3.3 V recommended.
9
GND
GND
GND
Ground
10
GPIO2
DIO7
Digital
GPIO, high-drive capability

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11
TMSC
TMSC
Digital
JTAG TMSC, high-drive capability
12
TCKC
TCKC
Digital
JTAG TCKC
13
PWM2
DIO21
Digital
GPIO
14
GPIO3
DIO20
Digital
GPIO
15
RXD
DIO5
Digital
GPIO, high-drive capability
16
TXD
DIO6
Digital
GPIO, high-drive capability

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-2652P3
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
/
1.8
3.3
3.8
V
Operating Temperature
/
-40
+25
+85
℃
Notes: To ensure the RF performance, the ripple wave on the source must be less than ±300 mV.
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-2652P3
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
2
Charged Device Model
±500
V

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 3. Photos of RF-BM-2652P3
4.2 Recommended PCB Footprint
Figure 4. Recommended PCB Footprint of RF-BM-2652P3

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4.3 Schematic Diagram
Figure 5. Schematic Diagram of RF-BM-2652P3
4.4 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module.
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the
margin, which is beneficial to the long-term stable operation of the whole machine. The module should be far away
from the power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic
interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.

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If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top
Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital
part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom
Layer or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly
affect the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example: USB 3.0.
9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
11. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free space electromagnetic radiation. The location and layout of
antenna is a key factor to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is the best to hollow out the antenna position in the following figure so as to ensure that S11 of the module is
minimally affected.
Figure 4. Recommendation of Antenna Layout

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Note: The hollow-out position is based on the antenna used.
4.5 Trouble Shooting
4.5.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The
performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to
the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.
3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the
metal shell.
4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
4.5.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.5.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.6 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3

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precautions below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti- static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.
4.7 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 /
Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃~ 235 ℃
230 ℃~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s

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Figure 5. Recommended Reflow for Lead Free Solder
4.8 Optional Packaging
Figure 6. Optional Packaging Mode
Note: Default tray packaging.

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5 Revision History
Date
Version No.
Description
2021.02.02
V1.0
The initial version is released.
Note:
1. The document will be optimized and updated from time to time. Before using this document, please make sure it is
the latest version.
2. To obtain the latest document, please download it from the official website: www.szrfstar.com.

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6 Contact Us
SHENZHEN RF-STAR TECHNOLOGY CO., LTD.
Shenzhen HQ:
Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China
Tel.: [phone]
Chengdu Branch:
Add.: No. B3-03, Building No.1, Incubation Park, High-Tech District, Chengdu, Sichuan, China, 610000
Tel.: [phone]
Email: [e-mail], [e-mail]
Web.: www.szrfstar.com