Samsung Suede R710 User manual

1-1
1. Precautions
1) General After-Sales Service Precautions
(1) Do not let customers repair the product themselves.
☞There is adanger of injury and the product life time may be shortened.
(2) Make sure to disconnect the power cord from the wall outlet before repairing the product.
(especially for after-sales service of electric parts)
☞There is adanger of electric shock.
(3) Do not let customers plug several electric home appliances into asingle wall outlet at the same
time.
☞There is adanger of fire due to overheating.
(4) Check if the power plug or wall outlet are damaged in any way.
☞If adefect is found, repair or replace it immediately.(
There is adanger of electric shock or fire)
(5) Make sure that it is properly grounded.(
Check the ground of the wall outlet)
☞Electricity leakage may cause electric shock.
(6) Do not spray water on to the product to clean it.
☞There is adanger of electric shock or fire and it may shorten the lifetime of the product.
(7) Check the assembly status of the product after the after-sales service.
☞Make sure the product is re-assembled correctly before returning to customer
(8) Unplug the power cord holding the power plug (and not the cord).
☞If the cord is disconnected, it may cause electric shock or fire.
(9) Repair the product using only authorized parts.
(10) Keep the product away from heating devices such as heaters.
☞Exposure to heaters may cause deformation of the product or fire.
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1-2
1. Precautions
2) Safety Precautions
(1) EMI
This device has been registered regarding EMI for residential use. It can be used in all areas.
(2) Circuit Test (Logic Test) Precautions
The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or
CMOS. Since these types of devices are highly susceptible to static electricity or current leakage, an
isolation break may be caused. Therefore read and follow the instructions below.
1. When handling an LSI or MSI,make sure your body is grounded through afew mega-ohms
of resistance.In addition,wear gloves and ajacket made of cotton and not of synthetic fibers
that easily generate static electricity.
2. When repairing the product, place aconductive material (e.g. aluminum foil) grounded to the
earth on the worktable.
3. You must use asoldering iron without aleakage current.
4. Do not touch the pin of an IC and carefully insert the IC into the black plastic package.
5. When inserting an IC into aPCB,be careful with the direction of the IC. When installing an
IC in the wrong direction, it might become damaged.
6. When carrying an IC,package the IC with conducting material such as aluminum foil or
conducting sponge so as to keep the voltage level of each of the terminals the same.
7. Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room
temperature, if possible.
8. When installing or removing adevice from aPCB or installing or removing aboard, you
must disconnect the power before taking any action.
9. When soldering an IC,solder it in as short atime as possible so that unnecessary heat is
not applied to the device.
10. Avoid leaving excessive amounts of flux within acustom IC or between the pins when soldering
ac
ustom IC.
11. Take care to not damage the board when installing or separating an Option Board.
12. Take care to not break the printed circuit pattern on the PCB when separate an IC.
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1-3
1. Precautions
3) Ground
The product must be grounded to protect it from static electricity and other dangers.When using a
multitap,please use amultitap with aground terminal only.
If you use a220Vwall outlet with aground terminal, you do not need to ground it additionally.Avoid
using wall outlets if they are not grounded even if they have aground terminal.
To ground the product, connect the ground to an exclusive ground terminal or metal water pipe.
Connect the ground cable to the ground terminal at the rear of the main body. To ground the product,
connect the ground terminal of the product to ametal water pipe,wall outlet or exclusive ground terminal
with an electric wire equal to or thicker than #18.
Never ground the product to aPVC water pipe,phone line,TV, radio antenna,aluminum window or
gas pipe, because this does not actually ground the product and may be dangerous.
4) Static Electricity Precautions
Many parts of the system are susceptible to static electricity.Using an electrostatic discharge (ESD)
device is very important for the safety of the user and the user's surroundings.Using an ESD device
increases the probability of asuccessful repair and lowers the expenses for damaged parts.
To prevent static electricity, follow the instructions below.
(1) Perform the repair in alocation without static electricity.
(2) Touch your hands to ametal water pipe or some metal object connected to the ground to
discharge any static electricity from your body before handling the parts.
(3) Touch only the edges of the board,if possible.
(4) Do not touch any parts unless absolutely necessary
(5) Disassemblethe parts on the anti-static-electricity pad.
(6) When aboard is not installed in the system,package the board with an anti-static-electricity
packaging.
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SAMSUNG R710 FEATURES
SERVICEManual
U:43
JHQHYD5
QS0U:43{{{{2{{{
1. Simple & Essential Note PC
-. New Intel Mentavina technology.
-. Internal 1.3M Camera
-. 17'' WXGA+ 200nit Glare LCD
-. Windows Vista Home/Premium
Supportable.
2. High Performance
-. Intel Core™2 Duo processor
-. Powerful connectivity.
-. Convenient Multi-media.

-CONTENTS -
1. Precautions
1) General After-Sales Service Precautions.............................................................................................1-1
2) Safety Precautions.................................................................................................................................1-2
3) Ground....................................................................................................................................................1-3
4) Static Electricity Precautions.................................................................................................................1-3
2. Introduction and Specification
1) Introduction.............................................................................................................................................2-1
2) Specification...........................................................................................................................................2-2
3) Key Feature...........................................................................................................................................2-8
4) Option Part list......................................................................................................................................2-9
5) Product Feature....................................................................................................................................2-11
6) New Function........................................................................................................................................2-17
7) Software List.........................................................................................................................................2-22
8) System Setup (BIOS Setup)...............................................................................................................2-23
9) Description of Main board...................................................................................................................2-30
3. Disassembly and Reassembling
1) Disassembly and Reassembly of R710...............................................................................................3-1
4. Troubleshooting
1) General..................................................................................................................................................4-1
2) Debugging Flow Chart..........................................................................................................................4-2
3) System Diagnosis..................................................................................................................................4-5
4) Use of diagnostic program...................................................................................................................4-9
5) Hardware Troubleshooting...................................................................................................................4-14
6) CPU Fan Control...................................................................................................................4-14
7) Device Settings Related Software Diagnosis.....................................................................................4-24
8) Battery Use Time.................................................................................................................................4-30
9) Etc.........................................................................................................................................................4-35
10) Memory addition method.....................................................................................................................4-37
5. Exploded view
1) Exploded view of R710........................................................................................................................5-1
6. BOM
1) Main System.........................................................................................................................................6-1
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-CONTENTS -
7. System Wire Diagram
1) Top..........................................................................................................................................................7-1
2) Bottom.....................................................................................................................................................7-2
3) LCD.........................................................................................................................................................7-3
8. Schematic
1) Schematic...............................................................................................................................................8-1.
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2 - 1
1) Introduction
(1) High Performance PC
-Intel®Core™2Duo Processor and DDR III Memory
-nVIDIA Geforce 9600 G/9300 G PCI-Express Graphic
-Intel Montevina Platform
-Wireless LAN (option), Bluetooth (option)
(2) Convenient feature
-Internal Camera (Option) for easily video and photo capture
(3) Prudent Design for easy use
-Price competitive power preservation
-Variant Multi-media card support
-Good feeling with free type touchpad, advanced design appearance.
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2. Introduction and Specification

2 - 2
2) Specification
Processor and Motherboard Description
CPU Intel®Core™2Duo Processor
Speed
Intel®Core™2Duo Processor
T9600 2.8G, T9400 2.53G
P9500 2.53G P8600 2.4G
P7350 2.0G P8400 2.26G
Cache 6MB/3M
Chipset Intel PM/GM45+ ICH9M
BIOS 16 Mbit, Flash upgradable
Thermal Design Performance MAX. 35W
Memory
Memory /Max. Memory 1GB ~4
GB
Memory type PC2-8400(1066MHz) DDR3 SODIMM
Memory Modules 1GB,2GB,SODIMM
Sockets 2-slot SODIMM's
Display and Graphics
LCD 17" WXGA+ /WUXGA Glare
LCD Vendor Samsung AMLCD (LTN170X2-L02)
CMO LCD (N170C2-L02)
17" WXGA+Samsung AMLCD (LTN170X2-L02)
LCD Viewable Area 367.20 x 229.50mm (H x V)
LCD Resolution 1440 x 900 x 262,144 color
Dot Pitch 0.255 x 0.255mm (H x V)
Viewing angle Left 45°/ Right 45° / Up 20° / Down 25°
Contrast Ratio Typical 300 CR
Brightness Typical 200 cd/m2
Response time Typical 16 ms /max. 25 ms
Glare pole Glare pole with Anti-Reflexion-Coat
Weight Max. 700 g
17" WXGA+CMO LCD (N170C2-L02)
LCD Viewable Area 367.20 x 229.50mm (H x V)
LCD Resolution 1440 x 900 x 262,144 color
Dot Pitch 0.255 x 0.255mm (H x V)
Viewing angle Left 45°/ Right 45° / Up 15° / Down 35°
Contrast Ratio Typical 300 CR
Brightness Typical 200 cd/m2
Response time Typical 10 ms /max.20 ms
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2. Introduction and Specification

2 - 3
Glare pole Glare pole with Anti-Reflexion-Coat
Weight Max.670g
17" WUXGA 17" WUXGA Gloss
LCD Viewable Area 367.20 x 229.50mm (H x V)
LCD Resolution 1,920 x 1,200 pixel
Dot Pitch 0.19125 x 0.19125 mm (Horizontal xVertical)
Viewing angle Left 25°/ Right 25° / Up 35° / Down 25°
Contrast Ratio Typical 500 CR
Brightness Typical 260 cd/m2
Response time Typical 16 ms /max. 25 ms
Weight Max. 715 g
Graphics Controller Factory option
NB9M-GS, NB9P-GS, Intel GM45
Video Memory Ext. :512
MB GDDR3/256 MB GDDR3
Int. :Shared Memory 64MB ~Max 128MB
Max.Resolution for LFP LVDS 1920 x 1440 x 32Bits color (WUXGA)
Max.Resolution for External
Monitor
Upto 1,920x1,440 :32- bit true color
EDID Support (Extended Display Identity Data)
Nvidia External GFX NVIDIA GeForce 9600M
Video Memory 512 MB GDDR3
Max.Resolution for LFP LVDS 2048 x 1536 x 32Bits color (QXGA)
Max.Resolution for External
Monitor 2048 x 1536 @85HZ (CRT)
Nvidia External GFX NVIDIA GeForce 9300M
Video Memory 256 MB GDDR3
Max.Resolution for LFP LVDS 2048 x 1536 x 32Bits color (QXGA)
Max.Resolution for External
Monitor 2048 x 1536 @85HZ (CRT)
Intel Internal GFX Intel GMA X4500(GM45)
Video Memory DVMT 5.0
Max.Resolution for LFP LVDS 2048 x 1536 x 32Bits color (WUXGA)
Max.Resolution for External
Monitor 2048 x 1536 @60HZ (CRT)
Audio
Sound High Definition Audio
Controller HD Audio Codec, ALC262
Conversion Built-in high performance 20-bit ADC &24- bit DAC
Internal Interfaces Embedded 2stereo speakers, Internal microphone
Speaker Power Rating 2Speakers x2Watt with enclosure each
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2. Introduction and Specification

2 - 4
External Interfaces Microphone, Headphone, S/PDIF
Controls Keyboard volume control
Microphone Mono Microphone
Microphone Mono
Sensitivity -44dB
Output Impedance 2.2KΩ
Storage
 Disk Drive 9.5mmH 2.5" HDD, Removable
Supports SATA II 3.0Gbit/s PHY, with backward compatibility
Average Access Time Read max. 14 ms, write max. 15 ms
Speed 4200rpm ~7200
rpm,SATA
Capacity
80GB/100GB/120GB/160G/200GB/250G/300G/320G(12.5mmH):
HGST, Hitachi, Fujitsu, Samsung
-80~320GB SATA 5400rpm
-120~320GB SATA 7200rpm
-120~160
GB SATA 5400rpm, Hybride +256 MB
Optical Disk Drive SATA 12.7mm ODD Super Multi (Dual Layer) &w/LightScribe /
COMBO, DVD-ROM, Blu-ray
Type Fixed type (Factory Option)
S/W supplied Cyberlink DVD Solution
Security RPC-II Regional Encoding
Optical Driver Modules
DVD/CD-RW Combo Drive 1TS-L463A
Module type Fixed 12.7mm Slim
Speed 8xDVD-ROM, 24 x RW, 24 x CD-R, 24 x CD
Average Access Time DVD 130 ms typ, CD 130 ms typ.
Weight 180g or less
S/W Supplied CyberLink DVD Suite
Security RPC-II Regional Encoding
DVD/CD-RW Combo Drive 2DW-224S-V
Module type Fixed 12.7mm Slim
Speed 8x DVD-ROM, 24x RW, 24x CD-R, 24x CD
Average Access Time DVD 110ms Typ., CD 90ms Typ.
Weight 190g or less
S/W supplied CyberLink DVD Suite
Security RPC-II Regional Encoding
Super Multi dual layer 1TS-L633A
Module type Fixed 12.7mm Slim
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2. Introduction and Specification

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Speed 5xDVD-RAM, 8xDVD±R, 2.4 x DVD+R DL, 4xDVD±RW, 24
xCD-R, 16 x CD-RW, 8xDVD, 24 x CD
Average Access Time DVD 130ms Typ., CD 130ms Typ.
Weight 190g or less
S/W supplied CyberLink DVD Suite
Security RPC-II Regional Encoding
Super Multi dual layer 2DV-W28S-R
Module type Fixed 12.7mm Slim
Speed 5xDVD-RAM, 8xDVD±R, 6xDVD±R DL, 8xDVD+RW, 6x
DVD-RW, 24 x CD-R, 24 x CD-RW, 8xDVD, 24 x CD
Average Access Time DVD 130 ms Typ., CD 130 ms Typ.
Weight 180g or less
S/W supplied CyberLink DVD Suite
Security RPC-II Regional Encoding
Super Multi light scribe 1TS-L633L
Module type Fixed 12.7mm
Speed 5xDVD-RAM, 8xDVD±R, 6xDVD±R DL, 8xDVD+RW, 6x
DVD-RW, 24 x CD-R, 24 x CD-RW, 8xDVD, 24 x CD
Average Access Time DVD 180 ms Typ., CD 150 ms Typ.
Weight 180g or less
S/W supplied CyberLink DVD Suite
Security RPC-II regional encoding
Network Tools
Fax/Modem 56Kbps /V.92 Azalia Modem
Chipset SV92A1
Features RJ11 Output
LAN 1G Ethernet
Chipset Marvell 88E8055
Features RJ45 Output
Wireless LAN 1Atheros®802.11
b/g
Type Mini card (Factory Option)
Chipset WLL3141
Antenna Integrated 2Antenna
Wireless LAN 2Intel®802.11
a/g/n
Type Mini card (Factory Option)
Chipset Intel®Wifi Link 5100
Antenna Integrated 2Antenna
Wireless LAN 3Intel®802.11
a/g/n
Type Mini card (Factory Option)
Chipset Intel®Wifi Link 5300
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2. Introduction and Specification

2 - 6
Antenna Integrated 3Antenna(Main, AUX, MIMO)
Bluetooth BCM92045NMD :Factory Option
Type Bluetooth V2.0 +EDR (Enhanced Data Rate)
Chipset Broadcom BCM2045
Interface USB daughter card type with integrated PIFA antenna
I/O Interface
Express Card Slots PCI Express Card Slot (54mm Type)
Type USB Port
I/O Ports
USB Port 4(USB2.0)
Video Port 2(VGA,HDMI)
Audio Jacks Headphone-out, MIC-in
SIO(option) 1
Modem /LAN RJ11, RJ45
Power 1(3Pin)
Security Kensington Lock
Input Devices
Camera 1.3M Pixels Digital Camera (Factory Option)
Key board 100KEY(KOR/RUS/UKR/CHN/SHK), 101KEY(GER/FRA/SPA/UK,ITA)
Touchpad PS/2 Touchpad with 2Buttons, Scroll Area
Buttom Power on
Multi Memory Card Slot
Controller AU6371B51
Type Memory Stick /Memory Stick Pro /SD /SDHC /xD /MMC/ MMC
plus (7-in-1)
Power and Power
Management
Long-life Battery 3UR18650F-3-SDN-3 (9cells, Smart Li-Ion Battery)
Dimension 204 x 67 x 20mm
Weight 480g (max)
Recharge Time Approx. 3.1 hours
Battery Life Typ. 2.7 hours,Max 4hours( Battery mark 4.01)
Details of Cell 9cells (3Parallel 3Serial)
Voltage 11.1Vdc
Battery Capacity 2600mAh/cell
Battery Rating 11.1V / 7800mAh (86.58Wh)
DVD Playing Time 120mins
Charing Time 2hours
Battery 3UR18650F-2-SDN-12 (6cells, Smart Li-Ion Battery)
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2. Introduction and Specification

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Dimension 204x48x20mm
Weight 350g (max)
Recharge Time Approx. 2hours
Battery Life Min. 1.8 hours (DVD play mode) ~Max 3
Details of Cell 6cells (2Parallel 3Serial)
Voltage 11.1Vdc
Battery Capacity 2600mAh/cell
Battery Rating 11.1V / 5200mAh (57.72Wh)
DVD Playing Time 120mins
Charing Time 2hours
AC Adapter 0455A1990
Output Power 90Watts
Dimension 127 X 51 X 30mm
Weight (AC Adapter) 430g(typ)
Worldwide Compatibility Auto-sensing 90 - 264VAC
Line Frequency 47 / 63Hz
Adapter Rating -Input 90V - 264V, 1.4A
Adapter Rating -Output 19.0VDC /4.74A
Power Management Features ACPI 1.0b support, Standby(S3), Hibernate(S4)
System Dimensions
Dimensions (W X D X H) 395x279x29.7~39.8
mm
Weight (Full system w/ 6cell
Battery) 3.18kg
Status :Super-Multi ,6
cell battery, 2.5" 120GB 1platter HDD
Materials LCD back/Bottom :Magnesium Alloy
Top Housing/ Door-HDD :PC-GF, Front /Ant-Cvr/ Other Parts: PC
-ABS
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2. Introduction and Specification

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3) Key Feature
R700 R710
CPU Intel Core Duo/Merom(FSB800,Penryn
ready) Intel Core2 Duo Processor (FSB1066)
Chipset Intel 965PM +ICH8M Intel Cantiga(GM,PM) +ICH9-M
Memory Dual channel DDR2 667MHz Dual channel DDR3 800/1066
Graphic nVIDIA Geforce 8600M/8400M nVIDIA Geforce 9600M/9300M
LCD 17" WXGA+ Glare 17” WXGA +Glare
HDD SATA 9.5mm SATA 9.5mm
ODD PATA,DVD Combo/Super-Multi SATA only, Combo/Super-Multi/DVD
Port 4USB, VGA, Headphone, MIC, RJ45,
RJ11, Express-Card, 7-in-1, AC-IN,
SIO(Option),HDMI, Kensington Lock
4USB, VGA, Headphone, MIC, RJ45, RJ11,
Express-Card, 7-in-1, AC-IN,
SIO(Option),HDMI, Kensington Lock
Battery 6cell 6cell
SIZE(WxHxD) 3.18Kg
395 x 279 x 29.7~39.8mm
3.18Kg
395x279x29.7~39.8
mm
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2. Introduction and Specification

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4) Option Partlist
MK1246GSX 5400rpm, 120G, SATA, FDB
WD1200BEVS-22UST0 5400rpm, 120G, SATA, FDB
HTS542512K9A300 5400rpm, 120G, SATA, FDB
HM121HI 5400rpm, 120G, SATA, FDB
MK1237GSX 5200rpm, 120G, SATA, FDB
MHY2120BH 5400rpm, 120G, SATA, FDB
MK1646GSX 5400rpm, 160G, SATA, FDB
HM160HI 5400rpm, 160G, SATA, FDB
WD1600BEVS-22RST0 5400rpm, 160G, SATA, FDB
WD1600BEVT-22ZCT0 5400rpm, 160G, SATA, FDB
MHY2160BH 5400rpm, 160G, SATA, FDB
HTS542516K9A300 5400rpm, 160G, SATA, FDB
HTS542520K9A300 5400rpm, 200G, SATA, FDB
MHY2200BH 5400rpm, 200G, SATA, FDB
MHY2250BH 5400rpm, 250G, SATA, FDB
HTS542525K9A300 5400rpm, 250G, SATA, FDB
WD2500BEVS-22UST0 5400rpm, 250G, SATA, FDB
HM250JI 5400rpm, 250G, SATA, FDB
MK2046GSX 5400rpm, 200G, SATA, FDB
MK2546GSX 5400rpm, 250G, SATA, FDB
WDC-WD3200BEVT- 22ZCT0 5400rpm, 250G, SATA, FDB
SAMSUNG AMLCD LTN170X2-L02
CMO LCD N170C2-L02
DDR3 1066MHz, 2GByte, 256Mx64, SO-DIMM,
204P M471B5673DZ1-CF8
DDR3 1066MHz, 1GByte, 128Mx64, SO-DIMM,
204P M471B2874DZ1-CF8
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2. Introduction and Specification

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T9600(Penryn)_2.8G AW80576GH0726M,FSB1066,6M
T9400(Penryn)_2.53G AW80576GH0616M,FSB1066,6M
P9500(Penryn)_2.53G AW80576SH0616M,FSB1066,6M
P8400(Penryn)_2.26G AW80577SH0513M,FSB1066,3M
P8600(Penryn)_2.4G AW80577SH0563M,FSB1066,3M
P7350(Penryn)_2.0G AW80577SH0413M,FSB1066,3M
BT MODULE(FOX) Bluetooth V2.0, T60H928.01, Bluetooth Module
BT MODULE(SEM) Bluetooth V2.0, BTO2P0B2SA, Bluetooth Module,
DVD-ROM(TS-L333A) TS-L333A
DVD-ROM DV-28S-V
DVD-COMBO TS-L463A
DVD-COMBO DW-224S-V
SUPERMULTI TS-L633A
SUPERMULTI DV-W28S-R
SUPERMULTI-SCRIBE TS-L633L
802.11b/g WLL3141
802.11a/g/n 512ANXMMWG
802.11a/g/n 533AN_MMWG
802.11a/g 512AGXMMWG
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2. Introduction and Specification

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5) Product Feature
5)-1 System View
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2. Introduction and Specification

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2. Introduction and Specification

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2. Introduction and Specification

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2. Introduction and Specification