Samsung SCX-5315F User manual

DIGITAL LASER MFP
SCX-5315F Series
SCX-5315F
SCX-5115
1. Precautions
2. Specifications
3. Disassembly
4.Troubleshooting
5. ExplodedViews and Parts List
6. Block Diagram
7. Connection Diagram
DIGITAL LASER MFP CONTENTS
SERVICE
MANUAL

ELECTRONICS
This service manual is also provided on the web,
the ITSELF system Samsung Electronics Co., Ltd.
“http://itself.sec.samsung.co.kr”
© Samsung Electronics Co.,Ltd. JULY 2003
Printed in Korea.
VERSION NO. : 1.00 CODE : JC-0086A
This Service Manual is a property of Samsung Electronics
Co.,Ltd. Any unauthorized use of Manual can be punished
under applicable International and/or domestic law.

2003. 07

Precautions
Samsung Electronics 1-1
1. Precautions
Follow these safety, ESD, and servicing precautions to prevent personal injury and equipment damage.
1-1 Safety Precautions
1. Be sure that all built-in protective devices are in
place.Replace any missing protective shields.
2. Make sure there are no cabinet openings
through which people-particularly children- might
insert fingers or objects and contact dangerous
voltages.
3. When re-installing chassis and assemblies be
sure to replace all protective devices including
control knobs and compartment covers.
4. Design Alteration Warning:Never alter or add to
the mechanical or electrical design of this equip-
ment, such as auxiliary connectors, etc. Such
alterations and modifications will void the manu-
facturer’s warranty.
5. Components, parts, and wiring that appear to
have overheated or are otherwise damaged
should be replaced with parts which meet the
original specifications. Always determine the
cause of damage or overheating, and correct any
potential hazards.
6. Observe the original lead routing, especially near
sharp edges, AC, and high voltage power sup-
plies. Always inspect for pinched, out-of-place,
or frayed wiring. Do not change the spacing
between components and the printed circuit
board.
7. Product Safety Notice:Some electrical and
mechanical parts have special safety-related
characteristics which might not be obvious from
visual inspection. These safety features and the
protection they provide could be lost if a replace-
ment component differs from the original. This
holds true, even though the replacement may be
rated for higher voltage, wattage, etc.
8. Components critical for safety are indicated in
the parts list with symbols .
Use only replacement components that have the
same ratings, especially for flame resistance and
dielectric specifications. A replacement part that
does not have the same safety characteristics as
the original may create shock, fire, or other
safety hazards.
1-2 Precautions on Disassembly and Reassembly
Take great care when replacing parts. Before remov-
ing a part take careful note of its orientation and any
wiring routing. Ensure that all parts removed are cor-
rectly replaced in their original positions and all wir-
ing is routed as it was originally manufactured.
Changing wiring routes can cause electrical interfer-
ence or degradation in set performance.
Please do the following before disassembling for a
repair or replacement of parts.
1. Remove the paper cassette and toner cartridge.
Take great care to ensure that the developer
drum surface is not scratched or damaged by
exposure to light.
2.Turn the power switch off.
3.Take out the power plug and disconnect the printer
cable from the printer.
4. Use only the same type of part as originally fitted
when replacing parts.
5. Take care when dismantling plastic components
and covers. Ensure covers are not damaged. Do
not force plastic components apart they may
break.
6. Be careful that small parts such as screws do not
get lost inside the printer.
7.When disassembling take note of the placement of
small parts. Ensure all small parts are properly
reassembled.
8. If is is necessary to turn the printer upside down
protect the LSU window with clean paper so that
no loose toner particles contaminate the glass.
Releasing Plastic Latches
Many of parts are held in
place with plastic latches.
The latches break easily :
release them carefully.
To remove such parts,
press the hook end of the
latch away from the part to
which it is latched.

Precautions
Samsung Electronics1-2
1-3 ESD Precautions
1. Certain semiconductor devices can be easily
damaged by static electricity. Such components
are commonly called “Electrostatically Sensitive
(ES) Devices”, or ESDs.Examples of typical
ESDs are: integrated circuits, some field effect
transistors, and semiconductor “chip” compo-
nents.
The techniques outlined below should be fol-
lowed to help reduce the incidence of component
damage caused by static electricity.
CAUTION
:Be sure no power is applied to the chassis
or circuit, and observe all other safety pre-
cautions.
2. Immediately before handling a semiconductor
component or semiconductor-equipped assem-
bly, drain off any electrostatic charge on your
body by touching a known earth ground.Alterna-
tively, employ a commercially available wrist
strap device, which should be removed for your
personal safety reasons prior to applying power
to the unit under test.
3. After removing an electrical assembly equipped
with ESDs, place the assembly on a conductive
surface, such as aluminum or copper foil, or con-
ductive foam, to prevent electrostatic charge
buildup in the vicinity of the assembly.
4. Use only a grounded tip soldering iron to solder
or desolder ESDs.
Use only an “anti-static” solder removal device.
Some solder removal devices not classified as
“anti-static” can generate electrical charges suffi-
cient to damage ESDs.
5. Do not use Freon-propelled chemicals.When
sprayed, these can generate electrical charges
sufficient to damage ESDs.
6. Do not remove a replacement ESD from its pro-
tective packaging until immediately before install-
ing it. Most replacement ESDs are packaged
with all leads shorted together by conductive
foam, aluminum foil, or a comparable conductive
material.
7. Immediately before removing the protective
shorting material from the leads of a replace-
ment ESD, touch the protective material to the
chassis or circuit assembly into which the device
will be installed.
8. Maintain continuous electrical contact between
the ESD and the assembly into which it will be
installed, until completely plugged or soldered
into the circuit.
9. Minimize bodily motions when handling unpack-
aged replacement ESDs.Normal motions, such
as the brushing together of clothing fabric and
lifting one’s foot from a carpeted floor, can gener-
ate static electricity sufficient to damage an ESD.
1-4 Super Capacitor or Lithium Battery Precautions
1. Exercise caution when replacing a super capaci-
tor or Lithium battery.There could be a danger of
explosion and subsequent operator injury and/or
equipment damage if incorrectly installed.
2. Be sure to replace the battery with the same or
equivalent type recommended by the manufac-
turer.
3. Super capacitor or Lithium batteries contain toxic
substances and should not be opened, crushed,
or burned for disposal.
4. Dispose of used batteries according to the manu-
facturer’s instructions.

Precautions
Samsung Electronics 1-3
1-5 Tools forTroubleshooting
The following tools are recommended for safe and smooth troubleshooting described in this service manual.
1
DVM(Digital Volt Meter)
Standard : Indicates more than 3 digits.
3
Driver
Standard : "-" type, "+" type (M3 long, M3 short, M2
long, M2 short).
4
Tweezers
Standard : For general home use, small type.
2
Electronic Scales
Standard : Equipment to check the weight of consum-
ables(toner cartridge) supplied by Samsung
Electronics.(The scales should measure in
grams.)
5
Cotton Swab
Standard : For general home use, for medical service.
6
Cleaning Equipments
Standard : An IPA(Isopropyl Alcohol)dry wipe tissue or
a gentle neutral detergent and lint-free
cloth.
7
Software (Driver) installation CD ROM

Specification
Samsung Electronics 2-1
2. Specification
Specifications are correct at the time of printing. Product specifications are subject to change without notice.
See below for product specifications.
2-1 General Specifications
Item Description
Type of Unit Desktop
Operation System Win95/98/ME/ NT /2000/XP
Duplex Printing Yes(Default)
Interface IEEE1284(ECP)
USB(without HUB mode)
CPU 120 MHz(ARM946ES)
Emulation PCL6
Warming up Time 41 Sec (Stand-By), 25˚C
Absolute Storage Condition Temperature : -20°C ~ 40°C, Humidity : 10% RH ~ 95% RH
Operating Condition Temperature : 10˚C ~ 32˚C, Humidity : 20% RH ~ 80 % RH
Recommended Operating Condition Temperature : 16°C ~ 30°C, Humidity : 30% RH ~ 70% RH
Dimension(W X D X H) 560 X 433 X 459 mm
Weight About 22.5 Kg(with CRU)
Acoustic Noise Less than 56/50 dB(Copy/Printing mode)
Power Rating AC 100VAC ~ 127VAC, 50/60Hz ± 3Hz
AC 220VAC ~ 240VAC , 50/60Hz ± 3Hz
Power Consumption Avg. 350Wh (110V), 320Wh (220V)
Power Save Consumption Avg. 30Wh
Recommended System Requirement Pentium IV 1.2 Ghz, 128 MB RAM, 220MB(Hard Disk)
Minimum System Requirement Pentium II 400Mhz, 64 MB RAM, 120MB(Hard Disk)
LCD 16 characters X 2 lines
Memory 4 Mbyte for flash Memory , 16 Mbyte for SDRAM

Specification
Samsung Electronics2-2
2-2 Printer Specifications
2-3 Facsimile Specification(SCX-5315F Only)
Item Description
Printing Method Laser Scanning Unit + Electro Photography
Speed Single Side : 15 PPM
(A4 Size, 5% Character Pattern), Letter : 16 PPM
Duplex : 9 IPM(Images/Min) (A4 Size, 5% Character Pattern)
Source of Light LSU(Laser Scanning Unit)
Duplex Printing Yes(Default)
Resolution(Horizontal XVertical) True 600 X600 DPI , 1200 DPI Class
Feed Method Cassette Type , By Pass Tray,
ADF(Automatic Document Feeder)
Feed Direction FISO(Front-In Side-Out)
Paper Capacity(Input) Cassette : 550 Sheets
By Pass Tray : 100 Sheets(based on 75g/m
2
≥
, 20lb)
Paper Capacity(Output) Face Down : 250 Sheets
Effective Print Width 208mm for Letter/Legal
202mm for All
Item Description
Standard Recommendation ITU-T Group3(ITU : International Telecommunications Union)
Application Circuit PSTN or behind PABX
(PSTN : Public Switched Telephone Network.
PABX : Private Automatic Branch Exchange)
Data coding(Compression) MH/MR/MMR/JPEG(Transmission)
Modem speed 33600/28800/21600/19200/14400/12000/9600/7200/4800/2400 bps
Transmission Speed Approximately 3 sec(33,600 bps)
Effective Scanning Width 8.2 inches(208 mm)
Halftone 256 Levels
Paper Capacity(Input) ADF(Automatic Document Feeder) :30Sheets(75g/m
2
≥
)
FAX Mode Standard /Fine/Super Fine/Halftone
Memory 4MB

Specification
Samsung Electronics 2-3
2-4 Scanner Specification
2-5 Copy Specification
NOTE :
(1) Speed claims based on the test chart : A4 size.
SDMP : Single Document Multiple Printout
MDSP : Multiple Document Single Printout
Item Description
Type Flatbed(with ADF)
Speed Mono : 1.25 msec/line, Color : 2.5 msec/line
Device Color CCD(Charge Coupled Device) Module
Interface IEEE1284(ECP Support)
USB(without HUB Mode)
Compatibility TWAIN Standard , WIA
Optical Resolution(H X V) 600 X 600 dpi
Interpolation Resolution Max. 4800 dpi
Halftone 256 Levels
Effective Scan width 8.2 inches(208 mm)
Item Description
Mode B/W
Quality Text/Photo/Mixed
Mono Copy Speed
(1)
Platen(SDMP) : 15 cpm
ADF (SDMP) : 15 cpm
ADF (MDSP) :Text/mixed : Approx.8 cpm
: Photo : Approx. 3 cpm
Optical Resolution (H x V) 600 X 600 dpi
Multi Copy 999 pages
Maximum Original Size Legal
Maximum Page Size Legal
Paper Type Selection Plain , Legal , Cardstock , Transparency
Zoom Range Platen : 25 ~ 400%(1% Step)
ADF : 25~100 %(1% Step)

Specification
Samsung Electronics2-4
2-6Telephone Specification(SCX-5315F Only)
2-7 Consumables
Item Description
Speed Dial 80EA
Tone/Pulse Tone only user modeTone/Pulse selectable in tech mode.
Item Description
Type Separate type
(Toner Cartridge / Drum Cartridge)
Life Toner Cartridge 6,000 sheets
( 5% coverage pattern, simplex normal mode )
Drum Cartridge 15,000 sheets
(simplex normal mode )

Disassembly and Reassembly
Samsung Electronics 3-1
3. Disassembly and Reassembly
3-1 General Precautions on Disassembly
When you disassemble and reassemble components, you must use extreme caution.
The close proximity of cables to moving parts makes proper routing a must. If components are removed, any
cables disturbed by the procedure must be restored as close as possible to their original positions.Before
removing any component from the machine, note the cable routing that will be affected.
Whenever servicing the machine, you must carry out the following :
1. Check to verify that documents are not stored in memory.
2. Unplug the power cord.
3. Use a flat and clean surface.
4. Replace only with authorized components.
5. Take care when removing plastic component-do not force.
6. Make sure all components are in their proper position.
3-2 Rear Cover
1. Remove the six screws securing the Rear Cover.
2. Separate the rear cover from the base frame and Scanner Ass'y.

Disassembly and Reassembly
3-2 Samsung Electronics
3-3 Scanner Ass'y
1. Before you remove the Scanner Ass'y, you
should remove:
- Rear Cover (see page 3-1)
2.Take out the Shield Main Upper.Unplug the one
connector and CCD cable.
Notice :
To avoid damage to the CCD cable connector ensure that
you pull the cable out carefully.Pull in line with the con-
nector not at an angle.
3. Remove the three screws, as shown below.
4. Open the Side Cover assembly first to open the
Front cover. In the other words, close the front
cover first to assembly it.
5. Remove two screws.
Side CoverAss’y
Front Cover
1
2

Disassembly and Reassembly
Samsung Electronics 3-3
6. Pull up the Scanner Ass'y in the direction of
arrow.
7. Remove the connector from the Platen Ass'y.
8. Open the ADF Ass’y in the direction of arrow.
Pull the ADF Ass'y upward and remove it.
9. Remove the three screws securing the Platen
Ass'y.

Disassembly and Reassembly
3-4 Samsung Electronics
10. Pull the OPE Ass'y and unplug the one connector.
11. Remove the five screws securing the Platen Ass'y.
12. Unlatch the Scan Upper Ass'y securing the
glass and remove it.
Notice :
When dismantling the Scan Assy ensure your work area
is clean. Dirt or dust on the scan head can lead to a deg-
radation in scanned image quality.
13. Remove the two scews and pull the Dummy
Upper Ass’y.
Dummy Upper Ass’y

Disassembly and Reassembly
Samsung Electronics 3-5
14. Remove the four screws and Channel Base
Frame.
15. Remove the five screws and Dummy Scan-
Lower.
16. Remove the CCD cable.
17.Pull up the Shaft CCD and take out the Scanner
Module.
18. Remove three screws and take out the Motor
Bracket.
Channel Base Frame
Cover Scan Lower
Cover Dummy Lower
CCD Cable
Scanner Module
Shaft CCD
Belt
Pully

Disassembly and Reassembly
3-6 Samsung Electronics
19. Remove the OPE Harness from the Platen
PBA. Remove two screws and take out the
Platen PBA.
Notice :
Take special care when reassembling the CCD Module
onto the Platen Ass'y.The CCD Module is located just to
the right side the Belt Tension Spring as shown below.
Platen PBA
OPE Harness
Scanner Module
Belt Tension Spring

Disassembly and Reassembly
Samsung Electronics 3-7
3-4 ADF Ass'y
1. Before you remove the ADF Ass'y, you should
remove:
- Rear Cover (see page 3-1)
- Scanner Ass'y (see page 3-2)
2. Remove the five screws from the Platen Cover.
3. Open the Cover.Remove Cover Side R.Unlatch
the Side Cover L by pushing the catch hooked to
the Platen Cover using a sharp tool and remove
Side Cover L.
4. Pull the ADF Ass'y upward and remove it.
5.Tack out he Open Cover.
Platen CoverAss’y
Side Cover L
Cover Open
Side Cover R
Platen CoverAss’y
Open Cover

Disassembly and Reassembly
3-8 Samsung Electronics
6.Take out the Pick-up Ass’y.
Remove the four screws and the ADF Upper. 7. Remove three screws and take out the ADF Motor ass'y.
Pick-up Ass’y
ADF Upper

Disassembly and Reassembly
Samsung Electronics 3-9
3-5 OPE Ass'y
1. Before you remove the OPE Ass'y, you should
remove:
- Rear Cover (see page 3-1)
- Scanner Ass'y (see page 3-2)
2. Remove ten screws securing the OPE PBA and
the LCD Module from the OPE Cover.
3. Remove the contact rubbers from the unit.
4. Remove the key pad from the unit.
Caution
The above information is for the SCX-5315F model.
For the SCX-5115 model, the OPE Ass’y is slightly differ-
ent, prats maked “a”are not fitted.

Disassembly and Reassembly
3-10 Samsung Electronics
3-6 Side Cover Ass'y
1. Remove the two screws to release the Stop-
per(Main Frame side) securing the Side Cover
to the Main Frame.
2. Completely open the Side Cover door.The left
hand hinge (1) should be lifted to free it.Then
push the whole door assembly to the left to free
the right hand hinge (2).
* MP-Tray
1.To dismantle the MP tray release the lower
hinges (1).
2. As shown in (1) below align the door supports in
a horizontal position.This will allow the Tray-
Case to be removed from the Tray Links.To
remove the Tray-Links adjust the position of the
Tray Link to a 45?angle to align the slot in the
Tray Link Tray-Case
MP Tray
1
2
1
1
1
2
3