Samsung MX-F730 User manual

MINI-CompactSystem
ModelNameMX-F730
ModelCodeMX-F730/ZD
SERVICEMANUAL
MINI-CompactSystem
MX-F730
Contents
1.Precaution
2.ProductSpecication
3.DisassemblyandReassembly
4.Troubleshooting
5.PCBDiagram
6.SchematicDiagram
RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.SafetyPrecautions...................................................................................................................1−1
1.2.ServicingPrecautions...............................................................................................................1−3
1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4
2.ProductSpecication.........................................................................................................................2−1
2.1.ProductFeature.......................................................................................................................2−1
2.2.Specications..........................................................................................................................2−2
2.3.SpecicationsAnalysis.............................................................................................................2−3
2.4.Accessories............................................................................................................................2−4
2.4.1.SuppliedAccessories...................................................................................................2−4
3.DisassemblyandReassembly..............................................................................................................3−1
3.1.MainDisassemblyandReassembly.............................................................................................3−1
3.2.DECKDisassemblyandReassembly...........................................................................................3−6
4.Troubleshooting................................................................................................................................4−1
4.1.CheckpointsbyErrorMode.......................................................................................................4−1
4.1.1.NoPower...................................................................................................................4−2
4.1.2.NoOutput..................................................................................................................4−4
4.2.MeasurestobetakenwhentheProtectionCircuitoperates...............................................................4−5
4.2.1.OperationofPowerBlockProtectionCircuit....................................................................4−5
4.2.2.CheckAMPinPowerProtection....................................................................................4−6
4.3.MICOM,MPEGInitialization&Update......................................................................................4−7
4.4.Buyer-RegionCodeSettingMethod............................................................................................4−8
4.4.1.TheinsertingmethodofRegionCodeafterreplacingtheMainPBA.....................................4−8
5.PCBDiagram...................................................................................................................................5−1
5.1.WiringDiagram.......................................................................................................................5−1
5.2.FRONTPCBTop....................................................................................................................5−2
5.2.1.PinConnection...........................................................................................................5−3
5.3.FRONTPCBBottom...............................................................................................................5−4
5.4.MAINPCBTop......................................................................................................................5−5
5.4.1.PinConnection...........................................................................................................5−6
5.4.2.TestPointWaveForm..................................................................................................5−7
5.5.MAINPCBBottom..................................................................................................................5−8
5.6.SMPSPCBTop.......................................................................................................................5−9
5.6.1.PinConnection...........................................................................................................5−10
5.7.SMPSPCBBottom..................................................................................................................5−11
6.SchematicDiagram...........................................................................................................................6−1
6.1.OverallBlockDiagram.............................................................................................................6−1
6.2.FRONT.................................................................................................................................6−2
iCopyright©1995-2013SAMSUNG.Allrightsreserved.

Contents
6.3.MAIN-1.................................................................................................................................6−3
6.4.MAIN-2.................................................................................................................................6−4
6.5.MAIN-3.................................................................................................................................6−5
6.5.1.TestPointWaveForm..................................................................................................6−6
6.6.MAIN-4.................................................................................................................................6−7
6.7.MAIN-5.................................................................................................................................6−8
6.8.SMPS-1.................................................................................................................................6−9
6.9.SMPS-2.................................................................................................................................6−10
Copyright©1995-2013SAMSUNG.Allrightsreserved.ii

1.Precaution
1.Precaution
FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards
suchaselectricalshockandX-rays.
1.1.SafetyPrecautions
1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol
knobsandthecompartmentcovers.
2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith
dangerousinternalcomponents.
3)DesignAlterationWarning:
Neveralteroraddtothemechanicalorelectricaldesignoftheunit.
Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.
Also,anydesignchangesoradditionswillvoidthemanufacturer’swarranty.
4)LeakageCurrentHotCheckFigure1.1ACLeakageTest:
WARNING
Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies.
Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoaACoutlet.Withtheunit’spowerswitchedfrom
theONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts.
KnownGrounds-Earth
KnownMetalparts-screwheads,metalcabinets,etc.
DEVICE
UNDER
TES T
LEAKAGE
CURRENT
TES TER
TES T ALL
EXPO S ED METAL
SU RFACES
2-WIRE CORD
ALSO TES T WITH
PLUG REVER S ED
(US ING AC
ADAPTER P LUG
AS R EQ UIR ED)
EARTH
GROUND
(READING
SH OULD NOT BE
ABOVE 0.5mA)
Figure1.1ACLeakageTest
1-1Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precaution
5)InsulationResistanceColdCheck:
(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs.
(2)SetthepowerswitchtoON.(3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.
Example:screwheads,metalcabinets,antennaport,etc.Ifanyoftheexposedmetallicpartshasareturnpathtothe
chassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured
resistanceshouldbe“innite.”Iftheresistanceisoutsidetheselimits,ashockhazardmightexist.SeeFigure1.2
InsulationResistanceTest
Ante nna
Term inal
ohm
Expo sed
Meta l P art
Ohmmet er
Figure1.2InsulationResistanceTest
6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith
partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany
potentialhazards.
7)Observetheoriginalleaddress,especiallynearthefollowingareas:Antennawiring,sharpedges,andespeciallytheAC
andhighvoltagepowersupplies.Alwaysinspectforpinched,out-of-place,orfrayedwiring.
Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.ChecktheACpowercordfordamage.
Makesurethatnowiresorcomponentstouchthermallyhotparts.
8)ProductSafetyNotice:
Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual
inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom
theoriginal—evenifthereplacementisratedforhighervoltage,wattage,etc.
9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,or.Usereplacement
componentsthathavethesameratings,especiallyforameresistanceanddielectricstrengthspecications.A
replacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreateshock,reorother
hazards.
Copyright©1995-2013SAMSUNG.Allrightsreserved.1-2

1.Precaution
1.2.ServicingPrecautions
1)Servicingprecautionsareprintedonthecabinet.Followthem.
2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto:
(a)Removeorreinstallanycomponentorassembly,(b)Disconnectanelectricalplugorconnector,(c)Connecta
testcomponentinparallelwithanelectrolyticcapacitor.
3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety.Aninsulationtubeortapeissometimesused.
Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements
totheiroriginalposition.
4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.Makesurethat
theportionaroundtheservicedparthasnotbeendamaged.
5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels,
inputterminalsandearphonejacks).
6)InsulationCheckingProcedure:
DisconnectthepowercordfromtheACsource.Connectaninsulationresistancemeter(500V)tothebladesofthe
ACplug.TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove)
shouldbegreaterthan1megohm.
7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall
solid-stateheatsinksarecorrectlyinstalled.
8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead;
alwaysremovetheinstrument’sgroundleadlast.
CAUTION
Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe
servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.
1-3Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precaution
1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)
Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity.
SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs).
Examplesincludeintegratedcircuitsandsomeeld-effecttransistors.
Thefollowingtechniqueswillreducetheoccurrenceofcomponentdamagecausedbystaticelectricity:
1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour
bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit
priortoapplyingpower–thisisanelectricshockprecaution.)
2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent
accumulationofelectrostaticcharge.
3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.
4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.
5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan
accumulatesufcientelectricalchargetodamageESDs).
6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit.
MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum
foilorotherconductivematerials.
7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial
tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.
8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or
liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.
Copyright©1995-2013SAMSUNG.Allrightsreserved.1-4

2.ProductSpecication
2.ProductSpecication
2.1.ProductFeature
■Power
•2.0ch:550WTotalRMS/6000WPMPO
•IRAmp
■SpecializedFunction
•CDRipping(Abletorippingwhilelistening)
•NewBassSoundSystem(CalledGIGASound)
•Connectivity
•USB
•MIC
■Disc
•Type:1Tray
•Compatible
-DVD/Divx(OnlyMX-F730D),MP3,CD/CD-R,RW,WMA
2-1Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.ProductSpecication
2.2.Specications
■BasicSpecication
Weight2.3Kg
Dimensions203(W)x306(H)x256.5(D)mm
OperatingTemperatureRange+5°C~+35°C
General
OperatingHumidityRange10%to75%
Signal/Noiseratio55dB
Usablesensitivity12dB FMTuner
Totalharmonicdistortion0.6%
Signal/Noiseratio35dB
Usablesensitivity58dB
AMTuner
(optional)
Totalharmonicdistortion1.5%
ReadingSpeed:4.8~5.6m/sec.
CDDiscCD:12cm(CompactDisc)
MaximumPlayTime:74min.
TotalOutputPower550Watts(MAX)
Frontspeakeroutput275W/CH(4Ω/100Hz)
Frequencyrange20Hz~20KHz
S/NRatio80dB
Channelseparation65dB
Amplier
Inputsensitivity(AUX)800mV
NOTE
•SamsungElectronicsCo.,Ltdreservestherighttochangethespecicationswithoutnotice.
•Weightanddimensionsareapproximate.
•Designandspecicationsaresubjecttochangewithoutpriornotice.
•ForthepowersupplyandPowerConsumption,refertothelabelattachedtotheproduct.
Copyright©1995-2013SAMSUNG.Allrightsreserved.2-2

2.ProductSpecication
2.3.SpecicationsAnalysis
ModelNameMX-F730MX-F730DBMX-E63*/MX-E66*
Photo
OUTPUTPOWER2.0CH550W2.0CH550WMX-E63*:2.0CH160W
MX-E66*:2.0CH350W
FRONTDISPLAYVFDVFDVFD
DIMMEROOO
BluetoothXXX
CD/DVDCDCD/DVDCD/DVD
MP3OOO
USBHOSTOOO
CDRIPPINGOOO
TAPEXXX
AUDIOINOOO
HEADPHONEXXO
FM/RDSFM/AMFM/AM,RDS(RUSSIAONLY)FM/AM
REMOTEKEY45KEY45KEY45KEY
DUALVOL TAGEXXO
SPK
IMPENDANCE3.5OHM3.5OHM4OHM
TIP
O:FeatureIncluded
X:NotIncluded
2-3Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.ProductSpecication
2.4.Accessories
2.4.1.SuppliedAccessories
AccessoriesItemItemcode
Batteries(AAA)4301-000121
TUNER/AUX
REPEAT
GIGA
REPEAT
A-B
AUTOCHANG E
RemoteControlAH59-02531A
User’sManualAH68-02604L
FM/AMAntenna
(Optional)AH42-00036A
Copyright©1995-2013SAMSUNG.Allrightsreserved.2-4

3.DisassemblyandReassembly
3.DisassemblyandReassembly
3.1.MainDisassemblyandReassembly
CAUTION
•Becarefultofollowthedisassemblysequencedescribedinthemanual.Otherwise,theproductmaybedamaged.
•BesuretocarefullyreadandunderstandthesafetyinstructionsbeforeperforminganyworkastheICchipson
thePCBarevulnerabletostaticelectricity.
•Inordertoassemblereversetheorderofdisassembly.
DescriptionDescriptionPhoto
1.PoweronandOpentheDeck,SeparateCD-Door.
2.Unfasten4screwsonthe2sideCover.
:BH3*10BLACK
CAUTION
Becarefulnottomakeanyscratchesasyouremovethem.
3-1Copyright©1995-2013SAMSUNG.Allrightsreserved.

3.DisassemblyandReassembly
DescriptionDescriptionPhoto
3.Unfasten2screwsonthebackCover.
:BH3*10BLACK
Copyright©1995-2013SAMSUNG.Allrightsreserved.3-2

3.DisassemblyandReassembly
DescriptionDescriptionPhoto
4.SeparatetheFrontpanel
3-3Copyright©1995-2013SAMSUNG.Allrightsreserved.

3.DisassemblyandReassembly
DescriptionDescriptionPhoto
5.Unfasten5ScrewsinSMPSanddetachAC-CORD&15Pshield
wire.
:BH3*10WHITE
6.Unfasten2screwsuptheDECK,SeparateDECKfromMECHA.
:BH3*10BLACK
Copyright©1995-2013SAMSUNG.Allrightsreserved.3-4

3.DisassemblyandReassembly
DescriptionDescriptionPhoto
7.Unfasten2screwsanddetachDECKwire.
:BH3*10WHITE
8.Unfasten10screws,andthenseparatethefrontPCBfromFront
Panel.
:BH3*10WHITE
3-5Copyright©1995-2013SAMSUNG.Allrightsreserved.

3.DisassemblyandReassembly
3.2.DECKDisassemblyandReassembly
DescriptionDescriptionPhoto
1.SeparateTray-DiscfromDECK.
Copyright©1995-2013SAMSUNG.Allrightsreserved.3-6

3.DisassemblyandReassembly
DescriptionDescriptionPhoto
OP EN/CLOS EOP EN/CLOS E
HOOKHOOK
HOOKHOOK
3-7Copyright©1995-2013SAMSUNG.Allrightsreserved.

3.DisassemblyandReassembly
DescriptionDescriptionPhoto
2.LiftupHolder-Cable,separateTraverse-DECK.
HOOKHOOK
HOOKHOOK
Copyright©1995-2013SAMSUNG.Allrightsreserved.3-8

3.DisassemblyandReassembly
DescriptionDescriptionPhoto
3.Disassemblecomplete.
Holde r-Ca bleHolde r-Ca ble
Tra verse- DeckTra verse- Deck
T
ra y-dis cTra y-dis c
Holde r-Chuck
Holde r-Chuck
3-9Copyright©1995-2013SAMSUNG.Allrightsreserved.