Seagate ST212 User manual

ST212 PRODUCT MANUAL
March 24, 1986©
36010-001, Revision B
Seagate reserves theright to change, without notice,
the specifications contained in this manual.
Seagate •920 Dise Drive, Seotts Valley, CA 95066-4544, USA
Tel. [phone] •Telex 176455 SEAGATE SCVL

TABLE Of CONTENTS 1.0 SPECIFICATION
SUMMARY.................................. 1
1.1 Performance Specifications.......... .......................... .. 1
1.1.1 Access Time Definition and Timing 1
1.2 Functional Specifications. ..................................... .. 1
1.3 Physical Specifications 1
1.4 Reliability Specifications..................... .. . . . . . . . . . . . . . . . .. 1
1.4.1 Read Error Rates 1
1.4.1.1 Bit Jitter............................ ................. .. 2
1.4.2 Media Defects 2
1.5 Environmental Specifications 2
1.5.1 Ambient Temperature 2
1.5.2 Temperature Gradient 2
1.5.3 Relative Humidity 2
1.5.4 Altitude Limits 2
1.5.5 Operating Shock............................................ 2
1.5.6 Nonoperating
Shock........................................ 2
1.6 DC Power Requirements 3
1.6.1 Input Noise Ripple 3
1.6.2 Input Noise Frequency. ...................................
.. 3
1.7 Mounting Requirements 4
1.7.1 Handling and Static-Discharge Precautions. .................. .. 5
2.0 ST212 HOST/DRIVE INTERFACE 6
2.1 Control/Status SignaIs: PCB Edge-Connector JI ................. .. 6
2.2 Data Signals:PCB Edge-Connector J2.. . . . . . . . . . . . . . . . . . . . . . . . .. 8
2.3 DC Power: Connector J3 10
2.4 Frame Grounding: Lug JI0 10
3.0 DRIVE CONFIGURATION 11
3.1 Drive Configuration: Shunt J9 (MLC-Ol) 11
3.2 Drive Select Il
3.2.1 Daisy-chain 11
3.3 Radial 12
3.4 Write Fault 12
3.5 Life Test 12
4.0 CONTROL INPUT SIGNAIS 13
4.1 Head Select 2°, 21
,22,23
•••••••••••••••••••••••••••••••••••••••• 13
4.2 Write Gate 13
4.3 Step 14
4.3.1 Buffered Seek 14
4.3.2 Slow-step (Single-track) 15
4.3.3 Auto-truncation 16
4.4 Direction In 16
4.5 Drive Select 16
S.O CONTROL OUTPUT SIGNALS 18
5.1 Drive Selected 18
5.2 Index 18
5.3 Track 0 18
5.4 Ready 18
5.5 Seek Complete 19
5.6 Write Fault 19
5.6.1 Write Fault Signal Generation 19
5.6.1.1 Write Current Interruption ,20
5.7 Fault Detection: PC Board 20292-XXX 20
5.7.1 Voltage and Head Select Comparator 20
5.7.2 Write Fault Reset 20
5.8 Fault Detection: PC Board 20243-XXX 21
5.8.1 Voltage Comparator ~ .. 21
5.8.2 Head Select Comparators 21
6.0 READ/WRITE OPERATIONS .; 22
6.1 Write Operation: PC Board 20292-XXX 22
6.1.1 MFM Write Data '22
Table of Contents iii

6.1.2 Write Gate 23
6.1.3 Write DataProcessing 23
6.1.4 Precompensation 23
6.2 Write Operation: PC Board 20243-XXX 24
6.2.1 Write Gate ' 24
6.2.2 Line Receiver 24
6.3 Formatting 25
6.4 Read Operation: PC Board 20292-XXX 26
6.4.1 MFM Read Data ' 26
6.4.2 Head Select 26
6.4.3 LSI Preamp 26
6.4.4 Low Pass Filter 26
6.4.5 Read Data Conversion 26
6.5 Read Operation: PC Board 20243-XXX 27
6.5.1 Head Select 27
6.5.2 LSI Preamp ~ 27
6.5.3 Low Pass Filter 27
6.5.4 Phase Shifter ;, 27
6.5.5 Zero Cross Detector 27
6.5.6 Time Domain Filter 28
6.5.7 Line Driver 28
7.0 MICROPROCESSOR 29
7.1 MPU: PC Board 20292-XXX ...........................•........ 29
7.2 MPU: PC Board 20243-XXX 30
8.0 MOfOR SPEED CONTROL 31
8.1 Motor Speed Control: PC Board 20292-XXX 31
8.1.1 Hall Effect Transducer 31
8.1.2 Spindle Motor Control LSI 31
8.2 Motor Speed Control PC Board: 20249-XXX 31
8.2.1 Hall Effect Transducer 32
8.2.2 Speed Reference Circuit 32
8.2.3 Pulse Shaper 32
8.2.4 Integrator 32
8.2.5 Current Limit 32
8.2.6 Microprocessor: Motor On 32
8.2.7 Motor Drivers 32
8.2.8 Dynamic Brake 32
9.0 FIELD SERVICE ' 33
9.1 Test Point Data: PC Board 20292-XXX 33
9.1.1 DifferentiaI Read Filter: Test Points 1and 2 34
9.1.2 Track 0Sensor: IC 3B, Pin 134
9.1.3 Index Sensor: Test Point 9 34
9.2 Test Point Data: PC Board 20243-XXX 35
9.2.1 DifferentiaI Read Filter: Test Points 1and 2 35
9.2.2 Read Data: Test Points 3and 4 36
9.2.3 Track 0: Test Point 5.- 36
9.2.4 Index Sensor: Test Point 6 36
9.3 Field Accessible Components 36
9.3.1 Main Control PC Board 37
9.3.2 Motor Control PC Board Removal (MLC-OO only) 37
9.3.3 Index Sensor Removal 38
9.3.4 Installing the Optional Full-height Front Panel 38
9.3.5 Track 0Sensor Removal 39
Schematics
PCB 20243-XXX .......................•..... ' 41
PCB 20249-XXX 43
PCB 20292-XXX ' .. ' 45
iv
Table of Contents

FIGURES
FIGURE 1: Typical +12 Volt DC Start-up Current Profile 3
FIGURE
2: Mounting Dimensions : 4
FIGURE
3: JI Connector Dimensions. ........................... .. 6
FIGURE
4: Control/Status SignaIs. .............................. .. 7
FIGURE
5: J2 Connector Dimensions. ........................... .. 8
FIGURE
6: Data SignaIs 9
FIGURE
7: Host/Drive Interface and Drive Configuration 10
FIGURE 8: Daisy-chain Configuration ~ 11
FIGURE 9: Radial Configuration 12
FIGURE 10: Control SignaIs Driver/Receiver Combination 13
FIGURE Il Read/Write Timing 14
FIGURE 12 General Step Timing 15
FIGURE 13: Slow-step Timing 15
FIGURE 14: Auto-truncation Timing 16
FIGURE 15: Drive Select 17
FIGURE 16: Typical Power-up Sequence 19
FIGURE 1'7: Fault Detection PC Board 20292-XXX 20
FIGURE
18: Fault Detection PC Board 20243-XXX 21
FIGURE 19: Data Signal Driver/Receiver Combination 22
FIGURE 20: Write Operation PC Board 20292-XXX 22
FIGURE 21: Write Operation PC Board 20243-XXX 24
FIGURE
22: 17-Sector, 512-Byte/Sector Format Example 25
FIGURE 23: Read Operation PC Board 20292-XXX 26
FIGURE
24: Read Operation PC Board 20243-XXX 27
FIGURE 25: MPU: PC Board 20292-XXX 29
FIGURE
26: MPU: PC Board 20243-XXX 30
FIGURE
27: Motor Speed Control: PC Board 20292-XXX 31
FIGURE 28: Motor Speed Control: PC Board 20249-XXX 31
FIGURE 29: Test Point Locations PC Board 20292-XXX 33
FIGURE 30: DifferentiaI Read Filter 34
FIGURE 31: Index Sensor 34
FIGURE
32: Test Point Locations PC Board 20243-XXX 35
FIGURE 33: Read Data 36
FIGURE 34: ST212 PC Board Removal 37
FIGURE 35: Index Sensor Adjustment/Removal 38
FIGURE 36: Track "Sens or Removal 39
TABLES
TABLE 1: JI Host/Drive Pin Assignments. ........................ .. 7
TABLE
2: J2 Host/Drive Pin Assignments. ........................ .. 9
TABLE
3: Precompensation Pattern 23
ST212 PRODUCT MANUAL/Rev. B.v

PERFORMANCE SPECIFICATIONS
1.0
SPECIFICATION
SUMMARY
CAPACITY
Per Drive:
Per Surface:
Per Track:
Per Sector:
Sectors
Per Track:
UNFORMATTED
12.76 MB
6.38 MB
10,416 Bytes
NA
NA
FORMATTED
10.0 MB
5.0 MB
8,192 Bytes
256 Bytes
32 Sectors
1.1
ACCESS TIME DEFINITION AND TIMING 1.1.1
23.0 msec. max.
65.0 msec. max!
170.0 msec.
Access
time is defined as the time from the leading edge of the last Step pulse
received
to SEEK COMPLETE (including settling). The Step pulse period must
be between 5 p,sec. to 500 p,sec.
Track-to-Track:
Average:
Maximum:
FUNCTIONAL SPECIFICATIONS
1.2
Rotational Speed:
Average Latency:
Recording Density:
Track Density:
Cylinders:
Tracks:
Discs:
Recording
Method:
Data Transfer Rate:
3,600
RPM ± 1070
8.33 msec.
10,560
BPI/FCI
550 TPI
306
1,224
1
MFM
5.0 Megabits/second
PHYSICAL SPECIFICATIONS 1.3
Height:
Width:
Depth:
Weight:
1.63 inches max. (41.4
mm)
5.75 inches max. (146.05 mm)
8.00 inches max. (203.2 mm)
3.00 lbs (1.4 Kg)
RELIABILITY SPECIFICATIONS 1.4
MTBF:
PM:
MTTR:
Service Life:
11,000 Power-on
Hours
2
Not Required
30 Minutes
5Years
READ ERROR RATES
Recoverable Read Errors:
Nonrecoverable Read Errors:
Seek Errors:
1
per 1010 bits read 3
1 per 10
12
bits read 4
1 per 10
6seeks
1.4.1
1. Buffered-Seek
2. Typical usage at 25 oC at sea level. Calculated per Mil. Spec. 217.
3. Recoverable within 16 retries
4. Not recoverable within 16 retries
ST212
PRODUCT MANUAL/Rev. B1

1.4.1.1 BIT-JITTER
Bit jitter reduction determines the relationship between theleading edge of Read
data and the center of the data window.
The specified Read error rates are based
on the following bit jitter specifica-
tion: The
data separator must provide at least -40 dB of bit jitter reduction- at
2F with an offset error of less than 1.5 nsec. shift from the center of the data
window.
1.4.2 MEDIA DEFECTS
Amedia defect is aRead error when data, which has been correctly written,
cannot be recovered within
16 retries.
Aprintout will be provided with each drive shipped-listing the location
of any
defect by head, cylinder, sector and byte.5It will also specify the number
of bytes
from Index.
There will be no more
than four (4) defects per Read/Write head for amaxi-
mum total of sixteen (16) per drive. Cylinder Zero will be free of defects.
1.5
1.5.1
Operating:
Nonoperating:
1.5.2
Operating:
Nonoperating:
1.5.3
Operating:
Maximum
Wet Bulb:
Nonoperating:
1.5.4
Operating:
Nonoperating:
1.5.5
ENVIRONMENTAL SPECIFICATIONS
AMBlENT TEMPERATURE
10 oC to 45 oC (50 OF to 113 OF)
-40°C to 60°C (-40°F to 140°F)
TEMPERATURE GRADIENT
10°C/hr (18°F/hr) max.
Below condensation
RELATIVE HUMIDITY
8to 80070 noncondensing
26
oC (78.8 OF)
5to 95070 noncondensing
ALTITUDE LIMITS
-1,000 ft to 10,000 ft
-1,000 ft to 30,000 ft
OPERATING SHOCK
Maximum permitted shock without incurring nonrecoverable errors: 10 O's 6.7
1.5.6 NONOPERATING SHOCK
Maximum permitted shock without incurring physical damage or degradation
in performance: 40
0'S8 ..
5. Based on a32-sector, 256 byte/sector format
6. Il msec. -half-sine wave shock pulse.
7. Input levels at the drive mounting screws, drive mounted in an approved orientation.
8. Il msec., half sine-wave
2ST212
PRODUCT MANUAL/Rev. B

OC POWER REQUIREMENTS 1.6
The ST212 is listed in accordance with UL 478 and CSA C22.2 (0-MI982), and
meets
aIl applicable sections of IEC 380 and VDE 0806/08.81, as tested by TUV-
Rheinland, North America.
Power may be applied or removed in any sequence without loss of data or damage
to the drive.
+12 VDC
Voltage Tolerance (inc. ripple):
Maximum Current
at Power-on:
± 5070 Both seek and non-
seek conditions
3.2 Amp
1.0 Amp typical
+5 VDC:
Voltage Tolerance (inc. ripple):
Maximum Current
at Power-on:
POWER:
± 5070 Both seek and non-
seek conditions
1.2 Amp
1.0 Amp typical
17 Watts typical
INPUT NOISE RIPPLE
1.&.1
The maximum permitted ripple is 50 mV (peak-to-peak) on either + 12 Volts
or +5 Volts.
INPUT NOISE FREQUENCY
20 MHz max. on both the + 12 VDC and + 5 VDC Hnes.
1.&.2
AMPS r------~-----...,...-----~
15
10
5
4.0 t---------+------4-------I
3.5
3.2~---llIo....
3.0
2.5
2.0
t---------+------4-~-----I
.5
0.0 ..... ---"' ....... ~
o
1.5
1.0
FIGURE 1:
Typical
+12Volt OC
Start-up Current
Profile
SECONDS
ST212 PRODUCT MANUAL/Rev. B3