Seagate ST225 User manual

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ST225
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OEM MANUAL II
PLEASE NOTE
SPECIFICATIONS OF THE ST213 HALF HEIGHT
10MB DRIVE CAN BE FOUND AT THE BACK OF
THIS MANUAL.
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Appendix 3: S1213
Specifications
PHYSICAL ORGANI7.ATION
TrKu: t.210
Cylinden: 815
Red/Write He••••: 2
DIK': 1
UNroltMAmD CAPACITY
Pet Driw:
~rCrlindor.
•••• Trocl.:
roRMAmD CA'ACT\'
Per Drtw:
P.rCylindet:
An Tnc:k:
IW SectOl':
SeetON per lrKk:
12.1' Mea_byt"
20.'32 Bytee
Xl.416 Byt ••
MJ.n Moa.by1"
11.4088)1"
•.••048)1"
512 8y1"
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ST225 OEM MANUAL
October 22, 1985©
36005-001, Rev. F
1per H)-bll. ,ud •
Iper lO'tbit.rv.d··
Jper to"seeb
fUNCnONALSP£CnCATIONS
Rot.honlll Speed: 3.600 RPM t ''''
Record!n. Scheme: MFM
Recordihl Den.U,: '.827 BPI
Flu Den.lty: '.827 Fa
TrackDen.II,: 588TPI
Interface: ST412
o.'a Tr.Mr., tt.,.: S.O Mes.bUslleC
ACaSS TIME lIad. -U •• ,
1rKk·lo·TrKk; 20mMIC
Aver'lIt8: aSmRC
Full Strub: UOmaec
Lalency: I.JJmsec; noml •••1
EnOR RATES
RKowf.bI. ReIHl Enon:
Non.rtICowr.W. RlrIHf Enon:
Seek Erron:
·1itK.~~wHhlll"ret""
uNo4I NCCftIftlbie ."hlll •• ,.., ••
REWlnsrY S'WnCATIONS
MTBf: 20.000 A7wer~ Houn
PM: Not Requhod
M1TR: 30Mlnul••
SeI'YlceU": S'lean
OP£RATIONAL ENVIRONMENT
AmbMtnI1empefllturo: ttrC 10 45"'C ISD-Flo 113-F,
Temperalure C,.ch.nt: 1O"'Cthr. (1S·''''r.1
Rel,liw HumidUy: • 1080'" nonconden.lnl
Maximum Wet Bulb: 28'1: 1'•.• ·'1nonconden.lnf;
DC!'OWU REQUIREMENTS
.IZVOC f: 5'" .1 AmIN 'yp.
2.2 Ampl mall .•• power·up
• ,VOC t,•••. 1 Amptlyp.
PowItr: 14.11
W.'IJIYp.
PHYSICAL SP£anCATIONS
U.lahl: 1.131nchet ma•. lfI..mm'
\Vkllh: S_lS = Inchet 1148.0S ~ mm'
Depth: 1.00 Inc:heemu:.1203.Zmmt
WelSh': US II.. IUS kal
040 mlJ OEAl/~",,
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Seagate'" reserves the right to change, without
notice. the specifications contained in this manual.
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920 Disc Drive. Scotts Valley. Calirornia 9S066-4S44. USA
Telephone: (408) 4)8·6SS0 Telex: I764SSSEt\GATE SCVL

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Appendix 1:32 Sector, 256 Byte/Sector Format Example
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A:~I·I·I·I·I·I·I·I·I·H;tJ·~1·1·1·1+1·1·1·1·1·1·'jj~~
-1 •..'.•IftCIPCI••••
I\-.cIIIt IIfO ent_
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IdHNn N_1N<r fleW
N•• 1N<r eI.,ln s.rnt
I:'WTRODUcriON •.••••••••.••••••••••••••••••••••••.••••••.••••• 'On
i.OSi'ECiHCATiOS SUMMARY •••••••••••••••••••••••••••••••••.• 8
1.1 Perrormance Specificalions ........•.•.••••..••.•.•...•...•••....• i
1.1.1 Access Time Ddinition and Timins .•.••..•.•..•.•..•...•..••.. I
1.2 Funclional Specifica.ions .••.•.•••.••.••••.•.•..•..••.•.•.•.••••. I
1.3 Physical Specificalions ...•..........•.••••.•..•..••..•....•••... !
1.4 RtiiabililY Specificalions ..........•...••••..•.•.•.•..•••..•.•••.. 2
1.4.1 Read Error Rales ....•.......•.•..•••••.•••.•....••..•.•..... 2
1.4.1.1 Bil Jiner •....•.....•......••..••....•.•.•...•..•......•. 2
1.4.2 Media DereCIS ••••........••.•.••••.•..•.......••••..•••.... 2
I.S Environmental Specifications ...........•••...........••.••.•.••.. 2
1.5.1 Ambien. Temperalure ..........•..••.•...•..••.••••..••....•. 2
1.5.2 TemperaiUre Gradi.ni. ......•...•...••..••..•..........•.••.• 2
1.5.3 Relalive HumidilY ......•..•.••......••.•.•.•.•..........•••• 3
I.SA Ahilude Limi.s .........••......•••.••..••......•...••.•.••• 3
I.S.S Optrating Shock ....•....••.....••••..••......•.••••••.•.... 3
1.5.6 Operaling Vibralion ........•.....•...•.••......••...•..•..•• 3
1.5.7 Nonope,ating Shock ..•...•.•......•......•.......•..•..•.•.. 3
!.S.8 Nonoperaling Vibralion ...........••.......••....••••••••.•.. 3
1.6 DC Power Requiremenls ...•.....•..•..••..•.•..•..•....•••...•.• 3
1.6.1 Inpu. Noise Ripple •....•..•.•....•.....•.•••.•.....•.••..•.. 4
1.6.2 Inpu. Noise Frequency •..•..•....•••••...•.......•.•..•.••••• 4
1.6.3 H.al Dissipation ••...•••..•.•..••.•.••.•••..•...••.••.•...•. 4
1.7 Mounling Requirements ...•.....••.••.•.•.••••.•.•.•••...••••... 5
1.7.1 Shock Mounring Recommendalion .•••....••...•.•....••.•••... 5
1.7.2 Handling and Slatic·Discharge Precautions .••.••......••.•.•••.• 6
1.7.3 Shipping Zone .•.....•......•..••.••...••••.....••..•.•..•.• 6
USn25 HOST/DRiVE INTERFACE ••••••••••••••••••••••••••••••• 7
2.1 Conlrol/Slatus Signals: PCB Edge·Connector. JI .•..•...•••••.•....• 7
2.2 Dala Signals; PCB Edge·Conneclor, J2 ...•••..•...••.•...••••..••.• 9
2.3 DC Power Connector, J3 .•••.....•..••.•..•.•.•...•.....••....•.. II
3.0 DRIVE CONfiGURATION ••••••••••••••••••••.•• , ••••••••••••• 13
3.1 Drive Configuralion Shunt. J7 ..••••.•••••.••••••...•.•.••....••.. 13
3.2 Drive Seleci Configuralion .•••.......•.•••••..•..•.•.•.•.••..••.. 13
3.2.1 Daisy.Chain •...•••.•...••.•..•.•.•...••...•.•...••.•••..... 13
3.3 Radial ..•...•...••....•.•..•.•..•.•...•••••.••.•.•••.••.•..•.. 14
3.4 Write Fault ....••.•••...•.•.•...•.•.••••.•..•••..•...•••...•••• 14
3.5 lire Test. ...•.•••...•....•••..•.....••••...••..•••.••••.•.••••. 14
3.6 Recovery Mode ••.•.•........•....••..•..•..•..•...••••.•.••.... IS
4.0 CONTROL INi'UYSiGNALS ••••••••••••••••••••••••••••••••••• 16
4.1 Head Seleci 2", 2'. 2'. 2' ..•...•.....•....••.••••.....••..•...••..• i6
4.2 Wrile Gale •.......•....•......•.••..••..•.•......•.•••••..•... 16
4.3 Slep ....•.....••...•....•••.•..•••••••.•.••.•....•....•••••••• 17
4.3.1 Burrered Seek ..•..•.•.•.•..•..•..••••.••••.•.•.•.•••••.••••. 18
4.3.2 Slow·Slep (Track-Io-Tr:ack) .••..••••.••••.••••.••.••..••.•••.•. 18
4.3.3 AUlo·Truncation •.. , •....•...•.•..••.•.••••..•.•.••.••.•.••• 19
4.4 Direclion In •....••.•• , •.••..•..•..•••••..••.••..•.••.••.•..... 19
4.5 Drive Select. ......•.•••....••......•••.•.•....•....•..•..•.•••. 20
4.6 Recovery Mode ...••••......•......••••.•.••••..•.•..•.••.•..... 21
5.0 CONTROL OUTPUT SiGNALS ••••••••••••••••••••••••••••••••• 22
5.1 Drive Selected ....•..•••...••.....•...••.....••••.•....••••••.•. 22
5.2 Index ..•..•.•...•••••.•....•....••..•.•••.••..••..•.•••.••..•. 22
5.3 Track" .....•..•.......•.•......•••••••••.•....•.••.•.•••••..• 22
5.4 index and Track" Scnsinl ..•..•...••.••••.•.............•..•••.• 22
5.5 Ready .•..•.•...••.•.•..•••.••..••..••...•.•....•••....••.•... 23
5.6 Seck Complete ...••.•..•....•.....•..•••.•.••.•.•...••.••.•.••• 23
5.7 Writc f~uli ....•................•..•••••..••••........••.••••.. 23
S.7.1 Wriie fault Signll <lener.iion ......••••.••••...••...•..•..••.• 23
5.7.1.1 Wrile Curreni imerrupiioli .......•....•...•..........••.•. 23
TABLE OF CONTENTS
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MTA f1ELD
A nu••••ric21•• 1•• in Hex dtfinin. lhe hoad ••lcc1ed
floW Dnnl" •••
A field or .1I,etOS 10sync lhe VfO for lhe 10
••AI" H•• wilh • dropptd clock 10nOliry lhe conlrol •••.lhal dal. "IIOWI
"Fr Hex dtfinin. Ih.1 10 Mid dal. follows
A nu••••ric.1 •• Iu. in Hex dtfinin. lhe dtl.nl posilion or lhe lCualor
A num.rical •• Iu. in H•• d.finin. lhe •••• or rot Ihi, ••••ion of 1M
rotation
Cyclic Redundancy (1)<ck inrormalion uoed 10••riry lhe ••Iidily of Ih.
10 fieldinrorm'lion juS! •••d
lam wrinen durin, format to isolale the ViniC' !Plitt (~;litd. Thii
field a$SUm ••Iid ••adin. of field numhor 7 .nd .11owslhe IJ 1»1<5
r<quirtd ror Dal. VfO lock.
A field of .11'''0110 sync 1M VFO rot lhe d••• fitld
"AI" H•• wilh • dropped clock 10 notiry lhe con,roIk, lhal dall rollow>
"fA" H•• dtfinin. lhai UKrclata rollow,
This am .,waibbk for UKrIbl,;
Cyclic Redu••••ncy Check inrorm.,ion uKd 10 •.nry lhe •• Iidityof
the UKr data Mid informillion JUst read
Z••OI wriuon durin. updol' to i••I.lo tho writ. splitt eft.,td. This
field '$SUm •• Iod••:odin. IIr field oumher lJ.nd .11owslhe IJ
byl•• '«Iuired rot VfO lock rot ,he ID fitld of lhe ••• 1KC'ot.
A fitld of.II •••.01 which acts II•bulf•• Ioti"un ••••0<110.11_
for ~ "'arialion
315 Ims TOTAL
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I SY:-IC BYTE
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ADDRESS
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NUMBER
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WRITE
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14 J WRITE
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j.8 Faull D~t~':lion ., , , H
5.8.\ DC·Um'al~ Si8n~1 ~4
'.8.1.1 VoUla~~ Comparalor., , H
'.8.2 H~ad Select Comparators ., ............•..................... 24
6.0 powt:R·B.\ SF.Ql'E;I;n: .•..•...........••....•••..••••••• :: ... 25
7.U UATATR.",;I;Sn:R U;I;t:s ...............••..••.•.....•••.....•. 26
7.1 WrileOper.ation., ......................•....................•.. 26
7.1.1 :\IFM \;vrile Data .............................•......•.•..... 27
7.\.2 Write Gale, .....................•....•........•......••.... 27
7.1.3 Line R"'cei\'~r . , 27
7.\04 Precorrnpensation ...........................•.......•....•... 27
7.2 R~ad Ope ••:"ion 28
7.2.\ M F~I Read Dala .............•.•...........•.•......•....... 28
7.2.2 Head Select 28
7.2.3 lSI Preamp , .................•..•..•....•.............. 28
7.204low·PatsS Filler ..................•........•..........•.•.. · .28
7.2.5 Phase Shifr~r 28
7.2.6 Z~ro·ClosS DCICclOr , ................••.................. 29
7.2.7 Time I>omain Fih~r ..................•.....•................ 29
1.2.8 Line Du-h'er ............................•.................. 29
1.0 TlIt:ORY OF OPERATIO;l;S .....•.....•..•......••.•.••.•••..•• 30
8.1 Microproc~sor .................................•............... 30
8.1.1 MPU·h,ilializing ............................•....•..•...•••. 30
8.1.2 MPU-Itdle ......................•.................•......... 30
8.\.3 Seeking: , ........................•.......................•.. 31
8.2 Spindle M01er Conllel .........•....•...•.............•.......•. 31
9.0 fIELD SERVICE ....•••...•......••..••.••..••••.••••...•....• 3J
9.1 PC Board Removal ....................•..•..................... JJ
10.0COMPOSf.:\T LOCATIO:\S. SCm:MATICS .....•.......•.•...• J5
APPE:IODIXI::J2Srclnr. 256 D)'le/Se<lor Formal Eumple •....••••.•••• 31
APPE:-IDIX 2~ Siandard Spares List. ..........••.......•••.........•. 39
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Itit i. III TABLES
TABLE I: JI Host/Drive Pin Assignments ......•..................... 8
TABLE 2: J2 HOSi/Drive Pin Assignments .. _.• _.....•..........•..•.. 10
TABLE 3: Precompensalion Pallem .......•..••..................... 27
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FIGURES
FIGURE I: lYrical RMS +12Voh DC Slan-UpCurn:ni Pial .........•.. ~
FIGURE 2: Reference Dimensions •.•..•.••..••.•..•...•...•.••..•.•. $
FIGURE 3: Mounling Dimensions ...........•...................... 6
FIGURE 4: JI ConneclOr Dimensions ......••.•..................... 7
FIGURE S:Control/S.alus Signals ..........••...................•.. 8
FIGURE 6: J2 Connector Dimensions _................•.•... 9
FIGURE 7: Dala Signals .................•.. _ 10
FIGURE 8: JJ Conneclor ....•.............. - II
FIGURE 9: HOSi/Drive Imerface and Drh-eConfiguralion 12
FIGURE 10:Daisy-Chain Configuration 13
FIGURE II: Radial Configuralion _ , ...........•... 14
FIGURE 12:Comrol Signals Drh·er/ReceiverCombinalion ...•........... 16
FIGURE 13:Read/Wrile Timing ...............•..................... 17
FIGURE 14:Buffered·Seek Timing _ 18
FIGURE IS: Slow-Step Timing _•..........•.......... 18
FIGURE 16:AUla-Truncation Timing ........••.•..................•.. 19
FIGURE 17:Drive Select .....•..................................... 20
FIGURE 18:Recovery Mode Timing ......•••..•...................... 21
FIGURE 19:Faull Detection Flow ..........•........•............... 24
FIGURE 20: Power·On Sequence Timing _ 2S
FIGURE 21: Dala Signal Driver/Receiver CombirUltion 26
FIGURE 22: Write Operation _ 26
FIGURE 23: Read Operation , .•...................... 28
FIGURE 24: Microprocessor Operation ..........................•.... 30
FIGURE 2S: Spindle MOIOIControl ...........••...............••.... 31
FIGURE 26: PC Board Removal ..........• _" _ n
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il II mlndator)' tilat approved £SO p"nudonl be OMen-ed during tills
proccdn". nil Indnllft and-stade wrilt-lt •• pI.
Note: Earlier revisions of this PCB. Seagale part number 20301, required
the PROM (7D) to be Iransferred 10 Ihe replacement PCB. This il no longer
'required and the replacement board il downward compatible for all
verlions.
Parts Required: PC Board 20301-004
Tools Required: Torque driver, T-IO and T-' TOI1l.,its
I. Secure a padded anti-static work surface.
2. Remove the two fronl panel screws (or if instaileJ, the printed circuit
cable shield.)
J. Orient the drive with the PCB up.
ot. Remove and retain the three PCB moundna screws. There may be
a clear insuladng washer installed at one or more of the mountin.
points. Be sure to replace at the same point(s) during reassembly.
,_ Locate and carefully free the Primed Circuit Cable. Do not crease
the cable.
6. Locale and carefully free the spindle motor and stepper motor
connections.
7. Lirt out the PCB.
8. Your replacement PCB will be shipped to you with a kit containing
two around springs.
a. Jr the spindle molor has a steel ball in the center of its hub, mount
the spring with the graphite bUllon (I).
b. Jr the spindle motor has a short post at the centerof the hub, mount
the bare copper sprina (2).
9. Verify thai the Ground Sprina assembly is aligned and will make
positive contact with the spindle hub. NOlethatlhe washer and hex
nUl bolh mounl on the solder side of Ihe PCB. Refer to Figur~ 17.
10. Tighten the Ground Spring mounting screw to 2.' inch/lbs. Transfer
the blue Isodamp pad to the replacement board.
II. Reconnect the Stepper and Spindle motor connections.
12. Reconnect Ihe Printed Circuit cable.
13. Torque the PCB mountina screws to 9 inch/lbs. Do not forget to
replace the clear insulating washer(s), ir Installed.
ISOOAUP - ••r •
The Seagate ST22S disc drive provides OEMs and system integratoi"$
with over 20 megabytes of formalled capacity in a $hock-~esisiani
half-heighi package. The ST225 is designed fOr single-user desk-lOp
systems, local storage in network or multi-user sysiems, Or lIS an add-
in upgrade for PCs. The low-power ST22S design is ideal for th~ lip-
plicalions in either rugged indumial or quiet office environments. The
ST225 supports the industry-siandard ST412 interface and has the
same voltage requirements for ease of integration.
High reliability is assured through the use of LSI, a single printed cir-
cuit board, mini-monolithic heads and proven oxide media. Scagate's
proprietary helical-band rotary-actuator features simplicity and ease of
manufacture with excellent thermal stability. A dedicated head ship-
ping zone assures data integrity during shipping and hllndling. The
ST225 offers II low-cost, rugged and reliable disc drive with an MTBF
of 20,000 hours.
Our manufacturing facilities have been designed and located ex-
clusively for high volume production and testing of disc drives.
Seagate's ongoing commitment to vertical integration assures availa-
biliiy of the latest technology at the same consistent quality and lowest
possible cost. Scagate inspects every assembly at every stage of the
production process. A proprietary test system continuously verifes oUr
goals of volume production with rigorous quality control.
Oct. 29, 1985
\A)lIage requirements. interface connectors and mounting requirements are iden-
tical to the 81225. Please refer to page 40, Appendix number 3 for specifications.
ST213
This manual may be used to install and configure 8eagate's ST213. The 81213 is a
half-heighl, single-disc. 10 Megabyie (formatted) Winchester. It employ s the samf[1
efficient helical-band rotary-actuator as the 81225 and also supports the industry-
standard 8T412 interface.
INTRODUCTION
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FIGURE 27:
Ground Spring
Assembly
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2·\6 UNe
GAOUNO/8UTTONHEAO SCREW
SPRING
(2) I
WASHER
HEX NUT
PC8
COMPONENT SIDE
.u ST11J OEM/II •••.f'
STZ1J OEM/II ••. F vii

9.0
FIELD SERVICE
The ST22$ doc:s nol require prcvcnlalivc mainlcnancc. The PC Board may
be eAchanicd in Ihe field. Refer below 10 Sccl;(m 9.1 for .hi! procedure.
PC BOARD REMOVAL 9.1
~
FIGURE 26:
PC Board Removal
UOUNTING SCREWS
:(>.0: COUPONENT SIDE
h. or o'
ISOOA•••• Ii
'SlUEt PCC_
\UOUNT ON SOlDER SlDEI CONNECTION
~
ST11' OEM/kt. T
SPlNOlE UQTOR
CONNECTION STEPPER MOTOR
CONNECTION
3J