Silicon Laboratories UG532 User manual

UG532: ZGM230S Dev Kit User's Guide
The ZGM230S Dev Kit is a low-cost, small form factor develop-
ment and evaluation platform for the ZGM230S Z-Wave SiP Mod-
ule (System-in-Package Module).
The board is a small and cost-effective, feature-rich, prototype and development platform
based on the ZGM230S Z-Wave System-in-Package Module. The ZGM230S Dev Kit is
an ideal platform for developing energy-friendly connected IoT devices.
A built-in SEGGER J-Link debugger ensures easy debugging through the USB Type-C
connector.
TARGET DEVICE
• ZGM230S Z-Wave SiP Module
(ZGM230SB27HGN3)
•+14 dBm TX power
• -110.9 dBm RX sensitivity @100 kbps
• 32-bit ARM® Cortex®-M33 with 39 MHz
maximum operating frequency
• 512 kB flash and 64 kB RAM
• Integrated DC-DC converter
KIT FEATURES
• SMA connector for antenna connection
• Power control of on-board peripherals for
ultra-low power operation
•Relative humidity and temperature sensor
• Ambient light sensor
• Hall effect sensor
• 6-axis inertial sensor
• LC sensor for metal detection
• Pressure sensor
• 8 Mbit flash for OTA programming and
data logging
• RGB LED, two single color LEDs, and two
push buttons
• 20-pin 2.54 mm breakout pads
• Qwiic® connector
• SEGGER J-Link on-board debugger
• Virtual COM port
• Packet Trace Interface (PTI)
• Mini Simplicity connector for AEM and
packet trace using external Silicon Labs
debugger
• USB or coin cell battery powered
• External battery connector
SOFTWARE SUPPORT
• Simplicity Studio™
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Table of Contents
1. Introduction ................................
4
1.1 Kit Contents ...............................4
1.2 Getting Started ..............................4
1.3 Hardware Content .............................4
1.4 Kit Hardware Layout ............................5
2. Specifications ...............................6
2.1 Recommended Operating Conditions ......................6
2.2 Current Consumption ............................7
3. Hardware .................................9
3.1 Block Diagram ..............................9
3.2 Power Supply ..............................10
3.3 ZGM230S Reset .............................10
3.4 Peripherals ...............................11
3.4.1 Si7021 Relative Humidity and Temperature Sensor ................12
3.4.2 Si7210 Hall Effect Sensor .........................12
3.4.3 ICM-20689 6-Axis Inertial Sensor ......................13
3.4.4 VEML6035 Ambient Light Sensor ......................14
3.4.5 BMP384 Barometric Pressure Sensor .....................14
3.4.6 External Memory ............................15
3.4.7 Push Buttons, Single-color LEDs and RGB LED .................15
3.4.8 Metal Detector (LC Sensor) ........................16
3.5 On-board Debugger ............................17
3.6 Connectors ...............................18
3.6.1 Breakout Pads ............................19
3.6.2 Qwiic Connector ............................20
3.6.3 Mini Simplicity Connector .........................20
3.6.4 Debug USB Type-C Connector .......................20
4. Debugging ...............................21
4.1 On-board Debugger ............................22
4.2 External Debugger.............................22
4.3 Virtual COM Port .............................22
5. Radio .................................23
5.1 Introduction ...............................23
5.2 EMC Compliance .............................23
5.2.1 Introduction .............................23
5.2.2 EMC Regulation Emission Limits ......................23
5.3 RF Performance .............................24
5.3.1 Conducted Power Measurements ......................24
5.3.2 Radiated Power Measurements .......................26
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5.4 EMC Compliance Recommendations ......................29
5.4.1 Recommendations for 868 MHz ETSI ETSI EN 300-200-1 Compliance .........29
5.4.2 Recommendations for 915 MHz FCC 15.247 Compliance ..............30
5.4.3 Recommendations for 921 MHz ARIB STD-T108 Compliance ............30
6. Schematics, Assembly Drawings, and BOM ...................31
7. Kit Revision History and Errata .......................32
7.1 Revision History .............................32
7.2 Errata .................................32
8. Board Revision History and Errata ......................33
8.1 Revision History .............................33
8.2 Errata .................................33
9. Document Revision History .........................34
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1. Introduction
The ZGM230S Dev Kit (OPN: ZGM230-DK2603A) has been designed to inspire customers to make battery-operated IoT devices with
the Silicon Labs ZGM230S Z-wave System-in-Package (SiP) Module. The highlights of the board include six different environmental
sensors accessible to the ZGM230S wireless MCU. The peripherals are grouped into power domains that can be turned on and off by
the application code as needed.
Programming the ZGM230S Dev Kit is easily done using a USB Type-C cable and the on-board J-Link debugger. A USB virtual COM
port provides a serial connection to the target application, and the Packet Trace Interface (PTI) offers invaluable debug information
about transmitted and received packets in wireless links. Included on the board is an 8 Mbit serial flash that can be used for Over-The-
Air (OTA) firmware upgrade, or as a general-purpose, non-volatile memory. The ZGM230S Dev Kit is supported in Simplicity Studio™,
and a Board Support Package (BSP) is provided to give application developers a flying start.
Energy profiling and advanced wireless network analysis and debugging tools are available through the provided Mini Simplicity Con-
nector using an external Silicon Labs debugger.
Connecting external hardware to the ZGM230S Dev Kit can be done using the 20 breakout pads, which present peripherals from the
ZGM230S Z-Wave SiP Module such as I2C, SPI, UART, and GPIOs. The breakout pads follow the same pinout as the expansion head-
ers (EXP) on other Silicon Labs Starter Kits. The board also features a Qwiic connector which can be used to connect hardware from
the Qwiic Connect System through I2C.
1.1 Kit Contents
The following items are included in the box:
• 1x ZGM230S Dev Kit board (BRD2603A).
• 1x 868-915 MHz antenna (LPRS ANT-SS900).
1.2 Getting Started
Detailed instructions for how to get started with your new ZGM230S Dev Kit can be found on the Silicon Labs web page:
https://www.silabs.com/dev-tools
1.3 Hardware Content
The following key hardware elements are included on the ZGM230S Dev Kit:
• ZGM230S SiP Module with 39 MHz operating frequency, 512 kB kB flash, and 64 kB RAM
• SMA antenna connector for wireless transmission
• Silicon Labs Si7021 relative humidity and temperature sensor
• Silicon Labs Si7210 Hall effect sensor
• Vishay VEML6035 ambient light sensor
• TDK InvenSense ICM-20689 6-axis inertial sensor
• Bosch Sensortec BMP384 pressure sensor
• Macronix ultra-low power 8 Mbit SPI flash (MX25R8035F)
• LESENSE metal detector LC-sensor
• Two single color LEDs and two push buttons
• RGB LED
• Power enable signals and isolation switches for ultra-low power operation
• On-board SEGGER J-Link debugger for easy programming and debugging, which includes a USB virtual COM port and Packet
Trace Interface (PTI)
• Mini Simplicity connector for access to energy profiling and advanced wireless network debugging
• Qwiic connector for connecting external hardware from the Qwiic Connect System
• Breakout pads for GPIO access and connection to external hardware
• Reset button
• Automatic switchover between USB and battery power
• CR2032 coin cell holder and external battery connector
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Introduction
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1.4 Kit Hardware Layout
ZGM230S Dev Kit layout is shown below.
Top View Bottom View
Push Buttons
35.6 mm
55.9 mm
Reset Button
20-pin EXP-header
Breakout Pads
6-axis
Inertial Sensor
Qwiic Connector
USB Type-C Connector
- Virtual COM port
- Debug access
- Packet trace
Hall Effect
Sensor
LEDs
Humidity and
Temperature Sensor
Mini Simplicity
Connector
Pressure
Sensor
Ambient
Light & UV
Sensor
ZGM230S
Z-Wave 800
SiP Module
SMA Antenna
Connector
On-board USB
J-Link Debugger
External
Battery Connector
CR2032 Coin Cell
Holder
RGB LED
LC Sensor
Figure 1.1. ZGM230S Dev Kit Hardware Layout
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Introduction
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2. Specifications
2.1 Recommended Operating Conditions
The following table is intended to serve as a guideline for correct use of the ZGM230S Dev Kit, indicating typical operating conditions
and some design limits.
Table 2.1. Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit
USB Supply Input Voltage VUSB — 5.0 — V
Battery Supply Input Voltage VVBAT 1.9 3.0 3.6 V
Supply Input Voltage (VMCU supplied externally) VVMCU 1.9 3.3 3.6 V
Operating Temperature TOP — 25 — ˚C
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Specifications
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2.2 Current Consumption
The table below summarizes the data sheet current consumption of the various components on the board. The operating current of the
board greatly depends on the application. The number of enabled sensors, how often they are sampled, and how often the radio is
transmitting or receiving are examples of factors that influence the operating current. In many cases the given conditions differ from the
operating conditions on the ZGM230S Dev Kit, but the table can still be used as an indication of how much each feature contributes to
the total current consumption. More details can be found in the specific data sheet for each device.
Table 2.2. Current Consumption
Parameter Symbol Condition Typ Unit
ZGM230S Current Con-
sumption1
IZGM230S MCU current consumption in EM0 mode with all peripherals
disabled, VREGVDD = IOVDD = 3.3 V, VSCALE1, 39 MHz
crystal, CPU running Prime from flash at 25 ˚C
27 µA/MHz
EM4, BURTC with LFRCO 0.7 µA
Radio system current consumption in receive mode, active
packet reception (VREGVDD = IOVDD = 3.3 V, MCU in EM1
and all MCU peripherals disabled, HCLK = 39 MHz, 100
kbps, 2-GFSK, f = 916 MHz, VSCALE1, EM1P at 25 ˚C)
4.9 mA
Radio system current consumption in transmit mode
(VREGVDD = IOVDD = 3.3 V, MCU in EM1 and all MCU pe-
ripherals disabled, HCLK = 39 MHz, f = 916 MHz, CW, 14
dBm output power, VSCALE1 at 25 ˚C)
30 mA
Ambient Light Sensor Cur-
rent Consumption 2
IVEML6035 Shutdown at 1.8 V 0.5 µA
Operation mode at 1.8 V (ALS only) 170 µA
RH/Temp Sensor Current
Consumption3
ISi7021 Standby, -40 to +85˚C 0.06 µA
RH conversion in progress 150 µA
Temperature conversion in progress 90 µA
Peak IDD during I2C operations 3.5 mA
Hall Effect Magnetic Sensor
Current Consumption 4
IDD Sleep mode at 3.3 V 50 nA
Average current for periodic activation at 3.3 V, sleep timer
enabled, 200 msec sleep time
0.4 µA
Conversion in progress at 3.3 V 5 mA
Pressure Sensor Current
Consumption5
IBMP384 Ultra-low power mode (ODR = 1 Hz) 3.4 µA
Highest resolution (ODR = 1 Hz) 46.4 µA
IMU Current Consumption6IIMU Full-chip sleep mode at 1.8 V supply 6 µA
Gyroscope Only, 100 Hz update rate at 1.8 V supply 1.6 mA
Accelerometer only, 100 Hz update rate at 1.8 V supply 57 µA
Gyroscope + Accelerometer, 100 Hz update rate at 1.8 V
supply
1.9 mA
Serial Flash Memory Cur-
rent Consumption 7
IFlash Deep power-down current in ultra-low power mode at 1.8 V 0.007 µA
Standby current in ultra-low power mode at 1.8 V 5 µA
Write status register current in ultra-low power mode at 1.8 V 3.1 mA
On-board Debugger Sleep
Current Consumption 8
IDBG On-board debugger current consumption when USB cable is
not inserted (EFM32GG12 EM4S mode current consumption)
80 nA
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Specifications
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Parameter Symbol Condition Typ Unit
Minimum Board Current
Consumption
IBOARD Minimum total board current consumption for VMCU = 3.3 V
with ZGM230S in EM4S, the USB cable disconnected, and all
peripherals either in sleep mode or disconnected
0.5 µA
Note:
1. From ZGM230S data sheet
2. From VEML6035 data sheet
3. From Si7021-A20 data sheet
4. From Si7210 data sheet
5. From BMP384 data sheet
6. From ICM-20689 data sheet
7. From MX25R8035F data sheet
8. From EFM32GG12 data sheet
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Specifications
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3. Hardware
The core of the ZGM230S Dev Kit is the ZGM230S Z-Wave SiP Module (System-in-Package Module). The board also contains several
peripherals connected to the ZGM230S. Refer to section 1.4 Kit Hardware Layout for placement and layout of the hardware compo-
nents.
3.1 Block Diagram
An overview of the ZGM230S Dev Kit is illustrated in the figure below.
Memory
Sensors
Radio
Device Connectivity
Debugging
J-Link
Debugger
USB Type-C
Connector
SMA Antenna
Connector
8 Mbit
MX25R
Buttons and LEDs
ZGM230S
Z-Wave SiP Module
Breakout Pads
(EXP-Header pinout)
Si7021 Si7210
VEML6035
Temperature
& Humidity
Sensor
Ambient
Light
Sensor
Hall Effect
Sensor
ICM-20689
6-axis Inertial
Sensor
BMP384
Pressure
Sensor
User Buttons
& LEDs
Mini-Simplicity
Connector
Serial Flash
Qwiic
Connector
LC SENSE
Metal Detector
Sensor
Figure 3.1. Kit Block Diagram
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3.2 Power Supply
The kit can be powered through one of these interfaces:
• USB Type-C
•Battery (CR2032 battery or external battery connected through 2-pin battery header)
• Mini Simplicity connector
The figure below shows the power options available on the kit and illustrates the main system power architecture.
USB Type-C LDO
5V0
IN OUT
Automatic
Switchover
3V3
VMCU
Battery
ZGM230S
SiP Module
Peripherals
Peripherals
Peripherals
Peripherals
Mini Simplicity
Connector
Figure 3.2. ZGM230S Dev Kit Power Architecture
Power is normally applied either through the USB cable or a CR2032 battery. A 2-pin 1.25 mm pitch battery connector for external bat-
teries is also available as an alternative to a CR2032 battery. When the USB cable is connected, VBUS is regulated down to 3.3 V. An
automatic switchover circuit switches the main system power from battery power to USB power when the USB cable is inserted and
protects the battery from reverse current.
Power can also be applied through the Mini Simplicity connector. There must be no other power sources present on the kit as power is
injected directly to the VMCU net. It is important to follow this recommendation to avoid power conflicts and backfeeding the battery.
Powering the ZGM230S Dev Kit through the Mini Simplicity connector allows current measurements using the Advanced Energy Moni-
toring (AEM) as described in section 4.2 External Debugger.
Important: When powering the board through the Mini Simplicity connector, the USB and battery power sources must be removed.
The power supply options are summarized in the table below.
Table 3.1. ZGM230S Dev Kit Power Options
Supply Mode Typical Input Voltage VMCU Source 3V3 5V
USB power 5.0 V On-board regulator On-board regulator USB VBUS
Battery 3.0 V Battery voltage Disconnected No voltage present
Mini Simplicity 3.3 V Debugger dependent Disconnected No voltage present
3.3 ZGM230S Reset
The ZGM230S can be reset by a few different sources:
• A user pressing the RESET button.
•The on-board debugger pulling the #RESET pin low.
• An external debugger pulling the #RESET pin low.
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3.4 Peripherals
The ZGM230S Dev Kit contains a set of peripherals that can be accessed from the ZGM230S. All the peripherals have enable signals
which can be used to completely turn off the peripherals that are not in use, or they can be put into a state that draws a minuscule
amount of power. This option allows for the lowest possible power consumption in every application. The following peripherals are ac-
cessible to the ZGM230S:
• One Silicon Labs Si7021 relative humidity & temperature sensor
• One Silicon Labs Si7210 Hall effect sensor
• One Vishay VEML6035 ambient light sensor
• One TDK InvenSense ICM-20689 6-axis inertial measurement sensor
• One Bosch Sensortec BMP384 pressure sensor
• One Macronix MX25R8035F ultra-low power 8 Mbit SPI flash
• Two single color LEDs and two push buttons
• One RGB LED
• One LESENSE LC-Sensor metal detector
The figure below gives an overview of the peripherals that are connected to the ZGM230S. Note that some of the peripherals share the
same interface and enable signals. As the enable signals do not have external pull-down resistors on the board, the application code
should actively drive the signals either low or high to prevent the lines from floating.
PC10 (I2C0_SCL#14)
PC11 (I2C0_SDA#16)
ZGM230S
ICM-20689
MX25R
VMCU
Si7021
VEML6035 Si7210 BMP384
VMCU
I2C
SENSOR ENABLEIMU ENABLE
SPI IMU CS
SPI
VMCU
SPI FLASH CS
IMU INTERRUPT
8 Mbit
Flash
3
2
2
Buttons RGB LED
GPIO GPIO GPIO
Single Color LEDs
32
METAL DETECTOR
LESENSE_LC_SENSE
LESENSE_LC_EXCITE
Figure 3.3. Peripherals
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3.4.1 Si7021 Relative Humidity and Temperature Sensor
The Si7021 I2C relative humidity and temperature sensor is a monolithic CMOS IC integrating humidity and temperature sensor ele-
ments, an analog-to-digital converter, signal processing, calibration data, and an I2C interface. The patented use of industry-standard,
low-K polymeric dielectrics for sensing humidity enables the construction of low-power, monolithic CMOS Sensor ICs with low drift and
hysteresis, and excellent long term stability. The Si7021 offers an accurate, low-power, factory-calibrated digital solution ideal for
measuring humidity, dew-point, and temperature in applications ranging from HVAC/R and asset tracking to industrial and consumer
platforms.
On the ZGM230S Dev Kit, the Si7021 is connected through a switch. The switch must therefore be enabled by setting PC07 high be-
fore it can be used by the application. This enables power to the Si7021 and connects the I2C lines used for the sensor to the
ZGM230S I2C bus. The application code should always drive the PC07 signal either high or low to prevent it from floating. The figure
below shows how the Si7021 is connected to the ZGM230S.
Si7021
Temperature
& Humidity
Sensor
VMCU
ZGM230S
PB05
PB06
PC07
VDD_SENSOR
I2C_SCL
I2C_SDA
SENSOR_ENABLE
SENSOR_I2C_SCL
SENSOR_I2C_SDA
0: Sensor is not powered
1: Sensor is powered
Figure 3.4. Si7021 Relative Humidity and Temperature Sensor
Although measures have been taken to thermally isolate the sensor from the board, temperature readings will be influenced when pow-
er is dissipated on the board. More accurate temperature measurements are achieved when powering the board with a battery or
through the Mini Simplicity connector as self-heating from the on-board LDO is eliminated and the on-board debugger is put in a low-
power state.
3.4.2 Si7210 Hall Effect Sensor
The Si7210 family of Hall effect sensors from Silicon Labs combines a chopper-stabilized Hall element with a low-noise analog amplifi-
er, 13-bit analog-to-digital converter, and an I2C interface. Leveraging Silicon Labs' proven CMOS design techniques, the Si7210 family
incorporates digital signal processing to provide precise compensation for temperature and offset drift. The 13-bit magnetic field
strength can be read through the I2C interface at any time. Applications for the Si7210 include mechanical position sensing in consum-
er, industrial, and automotive applications, reed switch replacement, fluid level measurement, speed sensing, and control knobs, and
switches.
On the ZGM230S Dev Kit, the Si7210 is connected through a switch. The switch must therefore be enabled by setting PC07 high be-
fore it can be used by the application. This enables power to the Si7210 and connects the I2C lines used for the sensor to the
ZGM230S I2C bus. The application code should always drive the PC07 signal either high or low to prevent it from floating. The figure
below shows how the Si7210 is connected to the ZGM230S.
VMCU
ZGM230S
PB05
PB06
PC07
VDD_SENSOR
I2C_SCL
I2C_SDA
SENSOR_ENABLE
SENSOR_I2C_SCL
SENSOR_I2C_SDA
0: Sensor is not powered
1: Sensor is powered
Si7210
Hall Effect
Sensor
Figure 3.5. Hall Effect Sensor
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3.4.3 ICM-20689 6-Axis Inertial Sensor
The ICM-20689 is a 6-axis inertial sensor consisting of a 3-axis gyroscope and a 3-axis accelerometer. The sensor detects acceleration
and angular rate in and around the X-, Y-, and Z-axes with integrated 16-bit ADCs and programmable digital filters.
On the ZGM230S Dev Kit, the ICM-20689 is connected through a switch. The switch must be enabled by setting PD03 high before it
can be used by the application. This enables power to the ICM-20689 and connects the SPI lines used for the sensor to the ZGM230S
SPI bus. The application code should always drive the PD03 signal either high or low to prevent it from floating. Note the presence of
the external pull-up resistor on the interrupt line as this can cause back powering if not handled correctly in software. The SPI CS line is
also exported on the breakout pads, so simultaneous SPI operation on the breakout pads and IMU is not possible unless an alternative
pin is used for SPI CS on the breakout pads. The figure below shows how the ICM-20689 is connected to the ZGM230S.
VMCU
ZGM230S
PC03
PC01
PD03
SPI_SCLK
SPI_COPI
IMU_ENABLE
IMU_SPI_SCLK
IMU_SPI_COPI
0: Sensor is not powered
1: Sensor is powered
ICM-20689
6-axis Intertial
Sensor
SPI_CIPO
PC02 IMU_SPI_CIPO
IMU_SPI_CS
VDD_SENSOR
IMU_INT
PA05 (EM4WU0)
SPI_CS
PC00
Figure 3.6. ICM-20689 6-Axis Inertial Sensor
The inertial sensor is located close to the geometrical center of the board. The coordinate system and rotation of the sensor follows the
right-hand rule, and the spatial orientation of the board is shown in the figure below.
Figure 3.7. ZGM230S Dev Kit Spatial Orientation
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3.4.4 VEML6035 Ambient Light Sensor
The VEML6035 is an ambient light sensor with I2C digital interface.
On the ZGM230S Dev Kit, the VEML6035 is connected through a switch. The switch must therefore be enabled by setting PC07 high
before it can be used by the application. This enables power to the VEML6035 and connects the I2C lines used for the sensor to the
ZGM230S I2C bus. The application code should always drive the PC07 signal either high or low to prevent it from floating. The figure
below shows how the VEML6035 is connected to the ZGM230S.
VMCU
ZGM230S
PB05
PB06
PC07
VDD_SENSOR
I2C_SCL
I2C_SDA
SENSOR_ENABLE
SENSOR_I2C_SCL
SENSOR_I2C_SDA
0: Sensor is not powered
1: Sensor is powered
VEML6035
Ambient
Light Sensor
Figure 3.8. VEML6035 Ambient Light Sensor
3.4.5 BMP384 Barometric Pressure Sensor
The BMP384 is a combined absolute barometric pressure sensor and temperature sensor with a digital interface supporting both SPI
and I2C. No external sensing elements are needed, and the device has an integrated ADC and ASIC with built-in configurable IIR filter
to suppress noise. Selectable oversampling rates provide trade-off between low power and high resolution, and an option to skip either
temperature or pressure measurement is available in case one or the other is unnecessary.
On the ZGM230S Dev Kit, the BMP384 is connected through a switch. The switch must therefore be enabled by setting PC07 high
before it can be used by the application. This enables power to the BMP384 and connects the I2C lines used for the sensor to the
ZGM230S I2C bus. The I2C lines are shared with other on-board I2C peripherals. The application code should always drive the PC07
signal either high or low to prevent it from floating. The I2C bus is shared with the Qwiic Connector and is also exported on the breakout
pads. The figure below shows how the BMP384 is connected to the ZGM230S.
VMCU
ZGM230S
PB05
PB06
PC07
VDD_SENSOR
I2C_SCL
I2C_SDA
SENSOR_ENABLE
SENSOR_I2C_SCL
SENSOR_I2C_SDA
0: Sensor is not powered
1: Sensor is powered
BMP384
Ambient
Light Sensor
Figure 3.9. BMP384 Absolute Pressure Sensor
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3.4.6 External Memory
The ZGM230S Dev Kit includes an 8 Mbit Macronix SPI Flash that is connected directly to the ZGM230S. The MX25R series are ultra-
low power serial flash devices, so there is no need for a separate enable switch to keep current consumption down. However, it is im-
portant that the flash is always put in deep power down mode when not used. This is done by issuing a command over the SPI inter-
face. In deep power down, the MX25R typically adds approximately 100 nA to the current consumption. The figure below shows how
the serial flash is connected to the ZGM230S.
ZGM230S
Serial Flash
8 Mbit
MX25R
SPI_COPI
SPI_CIPO
FLASH_SPI_CS
VMCU
SPI_SCLK
PC03
PC01
PC02
PC00
Figure 3.10. Serial Flash
3.4.7 Push Buttons, Single-color LEDs and RGB LED
The kit has two user push buttons marked BTN0 and BTN1. They are connected directly to the ZGM230S and are debounced by RC
filters with a time constant of 1 ms. The buttons are connected to pins PB03 and PB02.
The kit also features two yellow LEDs marked LED0 and LED1 that are controlled by GPIO pins on the ZGM230S. The LEDs are con-
nected to pins PC08 and PC09 in an active-high configuration.
The kit has an RGB LED marked LED100, controlled by GPIO pins on the ZGM230S. The LED is connected in an active-low configura-
tion, and each color can be PWM controlled using the ZGM230S's TIMER peripherals to generate a wide variety of colors.
User Buttons
& LEDs
ZGM230S
RGBLED_G
RGBLED_B
BUTTON1
BUTTON0
PB03
PB02
PA00
PC04
PB01 RGBLED_R
PC08
PC09
LED0
LED1
Figure 3.11. Buttons and LEDs
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3.4.8 Metal Detector (LC Sensor)
An inductive-capacitive sensor for demonstrating the Low Energy Sensor Interface (LESENSE) is located on the top left of the board.
The LESENSE peripheral uses the voltage digital-to-analog converter (VDAC) to set up an oscillating current through the inductor and
then uses the analog comparator (ACMP) to measure the oscillation decay time. The oscillation decay time will be affected by the pres-
ence of metal objects within a few millimeters of the inductor.
The LC sensor can be used for implementing a sensor that wakes up the ZGM230S from sleep when a metal object comes close to the
inductor, which again can be used as a utility meter pulse counter, door alarm switch, position indicator or other applications where one
wants to sense the presence of a metal object.
LESENSE_LC_EXCITE
LC Sensor
LESENSE_LC_SENSE
100 Ω
100 nF
330 pF
470 µH
1.5 kΩ
ZGM230S
PB0
PB4
Figure 3.12. LC Metal Sensor
For more information about the LC sensor usage and operation, refer to the application note, "AN0029: Low Energy Sensor Interface --
Inductive Sense", which is available in Simplicity Studio or in the document library on the Silicon Labs website.
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3.5 On-board Debugger
The ZGM230S Dev Kit contains a microcontroller separate from the ZGM230S Z-Wave SiP Module that provides the user with an on-
board J-Link debugger through the USB Type-C port. This microcontroller is referred to as the "on-board debugger" and is not program-
mable by the user. When the USB cable is removed, the on-board debugger goes into a very low power shutoff mode (EM4S).
In addition to providing code download and debug features, the on-board debugger also presents a virtual COM port for general pur-
pose application serial data transfer. The Packet Trace Interface (PTI) is also supported which offers invaluable debug information
about transmitted and received packets in wireless links.
The figure below shows the connections between the target ZGM230S device and the on-board debugger. The figure also shows the
Mini Simplicity Connector, and how this is connected to the same I/O pins.
Refer to section 4. Debugging for more details on debugging.
Mini Simplicity
Connector
EFR32MG
ZGM230S
PA01 (GPIO.SWCLK)
PA02 (GPIO.SWDIO)
PA03 (GPIO.SWV)
PA08
PA09
PA10
PA07
VCOM_TX
VCOM_RX
VCOM_CTS
VCOM_RTS
DEBUG_SWCLK
DEBUG_SWDIO
DEBUG_SWO
On-Board
J-Link
Debugger
Host
PC USB
DEBUG_PTI_DATA PD04 (FRC.DOUT)
PD05 (FRC.DFRAME)
DEBUG_PTI_FRAME
DEBUG_RESET RESETn
Figure 3.13. On-Board Debugger Connections
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3.6 Connectors
The ZGM230S Dev Kit features a Mini Simplicity Connector, a USB Type-C connector, and 20 breakout pads that follow the EXP head-
er pinout. The connectors are placed on the top side of the board, and their placement and pinout are seen shown the figure below. For
additional information on the connectors see the following sub-chapters.
EXP2 - VMCU
EXP4 - SPI_COPI - PC01
EXP18 - 5V
EXP20 - 3V3
EXP6 - SPI_CIPO - PC02
EXP8 - SPI_SCLK - PC03
EXP10 - SPI_CS - PC00
EXP12 - UART_TX - PA08
EXP14 - UART_RX - PA09
EXP16 - I2C_SDA - PB06
I2C_SDA - PB06
GND - EXP1
PB03 - GPIO - EXP3
PB02 - GPIO - EXP5
PC05 - GPIO - EXP7
PC06 - GPIO - EXP9
PD02 - GPIO - EXP11
PA04 - GPIO - EXP13
PB05 - I2C_SCL - EXP15
BOARD_ID_SCL - EXP17
BOARD_ID_SDA - EXP19
Expansion Header
Breakout Pads
VMCU
VMCU
RST
PA08 - VCOM_TX
PA02 - SWDIO
PD05 - PTI_FRAME
GND
GND
VCOM_RX - PA09
I2C_SCL - PB05
SWO - PA03
SWCLK - PA01
PTI_DATA - PD04
Mini Simplicity
Connector
USB Type-C
Connector
Mini Simplicity
Connector
qwiic
Connector
qwiic
Connector
Pin 1
1 2
A
1
2
5
10
Figure 3.14. ZGM230S Dev Kit Connectors
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3.6.1 Breakout Pads
Twenty breakout pads, which follow the EXP header pinout, are provided and allow connection of peripherals or add-on boards. Ten of
the pads are located along the left side of the board and ten are located on the right side. The breakout pads expose I/O pins that can
be used with most of the ZGM230S's features. Additionally, the VMCU (main power rail), 3V3 (LDO regulator output), and 5V power
rails are also exposed.
The breakout pads are pinned out similar to the EXP header found on other Silicon Labs Starter Kits, which ensures that commonly
used peripherals such as SPI, UART, and I2C buses are available on fixed locations. The rest of the pins are used for general purpose
IO. The EXP header allows the definition of EXP boards that can plug into a number of different Silicon Labs starter kits.
The pin-routing on ZGM230S is very flexible, so most peripherals can be routed to any pin. However, pins may be shared between the
breakout pads and other functions on the ZGM230S Dev Kit. The table below includes an overview of the EXP header and functionality
that is shared with the kit.
Table 3.2. Expansion Header Pinout
Pin Connection EXP Header Function Shared Feature
Right Side Breakout Pins
2 VMCU ZGM230S voltage domain, included in AEM measurements.
4 PC01 SPI_COPI IMU & Flash
6 PC02 SPI_CIPO IMU & Flash
8 PC03 SPI_SCLK IMU & Flash
10 PC00 SPI_CS IMU
12 PA08 UART_TX Virtual COM Port
14 PA09 UART_RX Virtual COM Port
16 PB06 I2C_SDA Sensor I2C bus
18 5V Board USB voltage
20 3V3 Board controller supply
Left Side Breakout Pins
1 GND Ground
3 PB03 GPIO Button 0
5 PB02 GPIO Button 1
7 PC05 GPIO
9 PC06 GPIO
11 PD02 GPIO
13 PA04 GPIO
15 PB05 I2C_SCL Sensor I2C bus
17 BOARD_ID_SCL Connected to Board Controller for identification of add-on boards.
19 BOARD_ID_SDA Connected to Board Controller for identification of add-on boards.
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3.6.2 Qwiic Connector
The ZGM230S Dev Kit features a Qwiic connector compatible with Qwiic Connect System hardware. The Qwiic connector provides an
easy way to expand the functionality of the ZGM230S Dev Kit with sensors, LCDs, and other peripherals over the I2C interface. The
Qwiic connector is a 4-pin polarized JST connector, which ensures the cable is inserted the right way.
Qwiic Connect System hardware is daisy chain-able as long as each I2C device in the chain has a unique I2C address.
Note: The Qwiic I2C lines are shared with the on-board I2C sensors, and are also exposed on the breakout pads.
The table below gives an overview of the Qwiic connections to the ZGM230S.
Table 3.3. Qwiic Connector Pinout
Qwiic Pin Connection Shared Feature
Ground GND
3.3V VMCU
SDA PB06 Breakout pads, I2C sensors
SCL PB05 Breakout pads, I2C sensors
3.6.3 Mini Simplicity Connector
The Mini Simplicity connector is a 10-pin 1.27 mm pitch connector that allows the use of an external debugger such as the one found
on a Silicon Labs Wireless Starter Kit mainboard. See section 4.2 External Debugger for more details. The pinout of the connector on
the board is described in the table below with the names being referenced from the ZGM230S.
Table 3.4. Mini Simplicity Connector Pin Descriptions
Pin number Function Connection Description
1 AEM VMCU Target voltage on the debugged application. May be supplied and
monitored by the AEM on an external debugger.
2 GND GND Ground
3 RST RESET ZGM230S reset
4 VCOM_RX PA09 Virtual COM Rx
5 VCOM_TX PA08 Virtual COM Tx
6 SWO PA03 Serial Wire Output
7 SWDIO PA02 Serial Wire Data
8 SWCLK PA01 Serial Wire Clock
9 PTI_FRAME PD05 Packet Trace Frame
10 PTI_DATA PD04 Packet Trace Data
3.6.4 Debug USB Type-C Connector
The debug USB port can be used for uploading code, debugging, and as a Virtual COM port. More information is available in section
4. Debugging.
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