Sony Ericsson F500 Series User manual

Working Instruction, Electrical
Working Instruction, Electrical
Applicable for F500 and K500 family
Contents
1Replacement of parts ......................................................................................................2
1.1 Battery connector...............................................................................................2
1.2 Board to board connector ..................................................................................3
1.3 FPC connector ...................................................................................................4
1.4 Form shield can fence........................................................................................5
1.5 Replacing shield can fence if damage at repair centers.....................................7
2BGA Equipment reflow profiles ....................................................................................8
3Revision History..............................................................................................................9
3/00021-2/FEA 209 544/86 C
Company Internal Sony Ericsson Mobile Communications AB
Approved according to 000 21-LXE 107 42/1

Working Instruction, Electrical
1 Replacement of parts
1.1 Battery connector
Process tools
• BGA replacement equipment
• Pair of tweezers
• Solder cleaning wiper (Tin wick)
• Solder paste
• Gel flux
Equipment
• ESD-gloves (cotton gloves)
• ESD-wristband
Instruction
• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86
Step-by-Step Instructions
1 Replace the component.
Use BGA repair equipment.
No special treatment due to through pins.
• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86
3/00021-2/FEA 209 544/86 C
Company Internal Sony Ericsson Mobile Communications AB
2(9)

Working Instruction, Electrical
1.2 Board to board connector
Process tools
• BGA replacement equipment
• Pair of tweezers
• Solder cleaning wiper (Tin wick)
• Solder paste
• Gel flux
Equipment
• ESD-gloves (cotton gloves)
• ESD-wristband
Instruction
• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86
Step-by-Step Instructions
1 Replace the component.
Use BGA repair equipment.
After soldering check for solder bridges between
solder joints.
• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86
3/00021-2/FEA 209 544/86 C
Company Internal Sony Ericsson Mobile Communications AB
3(9)

Working Instruction, Electrical
1.3 FPC connector
Process tools
• Dentist hook
• BGA replacement
• Pair of tweezers
• Solder cleaning wiper (Tin wick)
• Solder paste
• Gel flux
Equipment
• ESD-gloves (cotton gloves)
• ESD-wristband
Instruction
• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86
Step-by-Step Instructions
1 Replace the component.
Use BGA repair equipment.
After soldering check for solder bridges between
solder joints.
• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86
3/00021-2/FEA 209 544/86 C
Company Internal Sony Ericsson Mobile Communications AB
4(9)

Working Instruction, Electrical
1.4 Form shield can fence
Process tools
• Dentist hook
• Cutting pliers
• Shield fence pliers NTZ 112 537
Equipment
• ESD-gloves (cotton gloves)
• ESD-wristband
Instruction
• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86
Step-by-Step Instructions
3/00021-2/FEA 209 544/86 C
Company Internal Sony Ericsson Mobile Communications AB
5(9)

Working Instruction, Electrical
Step-by-Step Instructions
1 Remove the shield can lid.
If needed it is allowed to remove the pick up
area with a cutting pliers (1). This pick up area is
only used when machine mounting the can and
there is no need to put it back again.
NOTE!
Assure that the cutting pliers is sharp-edged to
prevent damaging the shield can fence.
Cut the fence according to the red lines in the
picture.
Form the frame carefully without bending the
shield can fence wall. Use Shield fence pliers
NTZ 112 537.
Replace the component and gently fold back the
fence. Be very cautious with the shield can fence
wall.
Put back a new shield can lid. Press on all sides
of the lid until you hear a “click” sound.
• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86
3/00021-2/FEA 209 544/86 C
Company Internal Sony Ericsson Mobile Communications AB
6(9)

Working Instruction, Electrical
1.5 Replacing shield can fence if damage at repair centers
Process tools
• Dentist hook
• BGA repair equipment
• Hot air soldering station
• Pair of tweezers
• Solder cleaning wiper (Tin wick)
• Solder paste
• Solder wire
• Gel flux
• Cutting pliers
Equipment
• ESD-gloves (cotton gloves)
• ESD-wristband
Instruction
• Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86
Step-by-Step Instructions
1 NOTE!
Replacing shield can fence is only done at repair
centers when a shield can fence is damaged after
bending the frame.
This operation is very time consuming and must
be performed by very skilled repair operators.
Remove the shield can fence by using hot air (or
preferrably with BGA repair equipment).
Most often it is necessary to remove the shield
can fence in pieces by using cutting pliers.
Assemble a new shield can fence with BGA
repair equipment.
• Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/86
3/00021-2/FEA 209 544/86 C
Company Internal Sony Ericsson Mobile Communications AB
7(9)

Working Instruction, Electrical
2 BGA Equipment reflow profiles
These values are strongly depending on the BGA replacement equipment.
Nozzle type will be chosen after the outer size of the actual component. Make sure the nozzle
does not affect any near placed components.
NOTE:
These values are recommendations and may have to be changed depending on the type of
equipment.
General reflow profile sn/pb
Cooling zone
Reflow zone
Preheat zone
250
Temperature [ºC]
200
150
100
50
0
0 40 80 120 160 200 240 280
Time [Seconds]
Ramp rate < 3°C/sec
Ramp rate cooling zone < 6°C/sec
Time above liquidus 60-150 sec
Minimum temperature 215°C
Maximum temperature 225°C or 235°C for 10-20 sec
Total time Appr. 4-7 min
* The higher temperature in case the board has extremely high ∆T.
3/00021-2/FEA 209 544/86 C
Company Internal Sony Ericsson Mobile Communications AB
8(9)

Working Instruction, Electrical
3/00021-2/FEA 209 544/86 C
Company Internal Sony Ericsson Mobile Communications AB
9(9)
3 Revision History
Rev. Date Changes / Comments
A 2004-06-30 Initial release
B 2004-07-13 Revision update due to publishing problems
C 2004-08-19 K500 Added