Sony SPP-68 User manual

MICROFILM
SERVICE MANUAL
CORDLESS TELEPHONE
E Model
SPECIFICATIONS
SPP-68

– 2 –
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK !OR DOTTED
LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
TABLE OF CONTENTS
1. SERVICING NOTES ................................................ 3
2. GENERAL
Setting up the phone ....................................................... 4
Making and receiving calls ............................................. 4
Speed dialing ................................................................... 5
Resetting the digital security code.................................. 5
Paging .............................................................................. 5
3. DISASSEMBLY ......................................................... 6
4. TEST MODE
4-1. Base Unit Section............................................................ 8
4-2. Handset Section............................................................... 10
5. ELECTRICAL ADJUSTMENTS
5-1. Base Unit Section............................................................ 13
5-2. Handset Section............................................................... 14
6. DIAGRAMS
6-1. Block Diagram – BASE UNIT Section –...................... 19
6-2. Block Diagram – HANDSET Section –........................ 21
6-3. Notes for Printed Wiring Board and
Schematic Diagram ......................................................... 23
6-4. Printed Wiring Boards – BASE UNIT Section – .......... 25
6-5. Schematic Diagram – BASE UNIT Section –................ 27
6-6. Printed Wiring Board – HANDSET Section –.............. 29
6-7. Schematic Diagram – HANDSET Section –................. 31
6-8. IC Pin Function Description ........................................... 33
7. EXPLODED VIEWS................................................ 35
8. ELECTRICAL PARTS LIST ............................... 37

– 3 –
PREVENT ELECTROSTATIC DESTRUCTION
• To prevent electrostatic destruction in replacing the main board, etc., fasten the CN602 cable as shown below.
SECTION 1
SERVICING NOTES
JW5
JW10
JW12 D101
JW6
JW7
JW3
C502
C303
X501
SUB board
BASE MAIN board
cabinet lower
CN602

– 4 –
SECTION 2
GENERAL This section is extracted from
instruction manual.

– 5 –

– 6 –
• HANDSET
REAR CABINET
HAND MAIN BOARD
Note: Follow the disassembly procedure in the numerical order given.
SECTION 3
DISASSEMBLY
4 Removal the rear cabinet to
direction of the arrow
A .
2 two screws
(BTP2.6
× 8)
3 two claws
3 two claws
1 battery case li
d
A
2 two screws
(BTP2.6
× 8)
1 screw
(BTP2.6
× 12)
3 HAND MAIN board
4 terminal ass’
y
(charge)
5 connector
(CN101)

– 7 –
• BASESET
BASESET (UPPER) ASS’Y
BASE MAIN BOARD
2 baseset (upper) ass’y
1 screw
(P3
× 10)
1 screw
(P3
× 10)
1 two screws
(P3
× 10)
3 connector
(CN301)
1 three screws
(BTP2.6
× 8)
2 screw
(BTP2.6
× 8)
3 ring termina
l
4 BASE MAIN board
4 SUB board

– 8 –
SECTION 4
TEST MODE
4-1. BASE UNIT SECTION
<Enter theTest Mode>
ManualTest Mode
1. Set the [DIALMODE] switch to “P” (pulse).
2. While pressing the [PAGE] key, switch on the power supply
(Reset start).
3. With the [PAGE] key, still held down, switch the [DIALMODE]
switch “P” (pulse) n“T” (tone) n“P” (pulse).
4. When you release the [PAGE] key, test mode starts.
5. Frist dial “0” at 10 pps. Then ouput “1”, “4”, “8” and “#”
with DTMF.
6. Set to TX ON. Goes to external line state in 1 CH.
• Release theTest Mode
1. Pull out the AC adapter and turn off the power.
[BASE MAIN Board] (Conductor side)
MJ201
IC501
IC101
CF101
TP47 (DIAL MODE
)
TP106 (5V)
TP67 (TEST1)
TP64 (M4)
TP65 (TEST3)
TP61 (M1)
TP62 (M2)
TP63 (M3)
TP66 (TEST2)
TP21 (CHG DET)
TP46 (PAGE)
MachineTest Mode
1. With one of the CH setting terminals in “H” input state, cause
Reset of Power ON. Equipment enters machine test mode.
2. Setting of CH according to logic input with CH setting termi-
nal.
3. ON/OFF of TX is according to the input logic of the Dial Mode
terminal.
• Release theTest Mode
1. Pull out the AC adapter and turn off the power.
2. Remove the short plug and turn on the power again.

– 9 –
Channel Setting
During startup in machine test mode, make the following channel settings by loading the terminal input data.
MachineTest Mode Input/Output
1. Input (Input ports for other than main tasks)
2. Output (Output ports for other than main tasks)
Pin Name Pin No. Function H Logic L Logic
CHARGE DET !• State in section 1. Input Refer to Section 1. Input
Pin No. @£ @¢ @∞ @§ TX Frequency RX Frequency
Channel M1 (TP61) M2 (TP62) M3 (TP63) M4 (TP64) (MHz) (MHz)
CH1 H L L L 43.720 48.760
CH2 L H L L 43.740 48.840
CH3 H H L L 43.820 48.860
CH4 L L H L 43.840 48.920
CH5 43.920 49.020
CH6 43.960 49.080
CH7 44.120 49.100
CH8 44.160 49.160
CH9 44.180 49.200
CH10 44.200 49.240
CH11 44.320 49.280
CH12 44.360 49.360
CH13 44.400 49.400
CH14 H L H L 44.460 49.460
CH15 L H H L 44.480 49.500
CH16 H H H L 46.610 49.670
CH17 L L L H 46.630 49.845
CH18 46.670 49.860
CH19 46.710 49.770
CH20 46.730 49.875
CH21 46.770 49.830
CH22 46.830 49.890
CH23 H L L H 46.870 49.930
CH24 L H L H 46.930 49.990
CH25 H H L H 46.970 49.970
TEST1 L L H H 43.780 48.800
TEST2 H L H H 43.890 48.970
TEST3 L H H H 46.800 49.910
TEST4 H H H H 46.900 49.950
TEST 1 (TP67) TEST 2 (TP66) TEST 3 (TP65) Operation with CHARGE LED Operation with TX ON
@ª @• @¶
L L L If RSSI (H) is, detected: Light ON If RSSI (H) is, detected: Light ON
L L H If RSSI (L) is, detected: Light ON If RSSI (L) is, detected: Light ON
L H L If TX LOCK is detected: Light OFF If TX LOCK is detected: Light OFF
L H H If RX LOCK is detected: Light OFF If RX LOCK is detected: Light OFF
H L L BEEP output
H L H ID CODE output
H H L If RING is detected: Light ON If RING is detected: Light ON
H H H If PAGE KEY is input: Light ON If PAGE KEY is input: Light ON
Pin Name Pin No. Function Logic
M1 (TP61) @£
M2 (TP62) @¢ Setting the CH (channel) Refer to channel setting
M3 (TP63) @∞
M4 (TP64) @§
DIAL MODE (TP47) !¶ Setting the TX ON/OFF H (T); OFF, L (P): ON
Manual: Channel increment Incrementing of channels in order from 16 to 25.
PAGE (TP46) !§ Machine: Dial data “5” is output to Key input with “L” input. The first time there is
DTMF/DP exchange output of “5” with DTMF.

– 10 –
4-2. HANDSET SECTION
<Enter theTest Mode>
ManualTest Mode
1. Enter the test mode by pressing [0] key while pressing the [1]
key and [TALK] when in idle condition.
(Key operation: [0] n[1] n[TALK] )
2. The RINGER will ring for 500msec when the test mode is
started.
3. Measurement mode of consumption current. (42# state. Refer
to 2-3)
4. Use key input to carry out the various settings.
5. Use port inputs to set output from LED terminals.
• Release theTest Mode
1. Press the [0], [0] and [#] key.
2. Turn OFF the power. (Remove the battery and replace them)
[HAND MAIN Board] (Conductor side)
L102
IC101 IC501
TP33 (TEST CH)
TP44 (TEST ACT)TP43 (TEST SW)TP36 (H)TP35 (TALK LED)
TP13 (ROW 5
)
TP14 (ROW 4
)
TP15 (ROW 3
)
TP16 (ROW 2
)
TP17 (ROW 1
)
TP55 (KEY LED)
MachineTest Mode
1. When power on reset is applied while a H (high) is input to the
TEST SW (TP43) terminal (IC501 pin $º), the RING (Level
H, 500 msec) sounds.
2. Following that, at a timing in which the TEST SW terminal
has “H” (High) input, there is output of “L” by the CH (Chan-
nel) setting control terminal. Then there is PLL setting to the
CH which was read to with the CH setting terminal according
to that “L” output.
3. Set the TX setting to TX OFF.
4. The TX channel is used by voice, not by data.
5. Use port inputs to set output from LED terminals
• Release theTest Mode
1. Turn off the power.
2. Remove the short plug and turn on the power.

– 11 –
Channel Setting
During startup in machine test mode, make the following channel settings by loading the terminal input data.
MachineTest Mode Input/Output
1. Input (Input ports for other than main tasks)
2. Output (Output ports for other than main tasks)
Pin Name Pin No. Function H Logic L Logic
TALK LED (TP35) $• Various input/output monitor output (default: RSSI(H) No detection Detection
detection).
KEY LED (TP55) 2During test mode: All lights lit, However, does not include No light Light
measurement of consumption current.
Pin No. #¢ #£ #™ #¡ @ª RX Frequency TX Frequency
Channel ROW5(TP13) ROW 4 (TP14) ROW 3 (TP15) ROW 2 (TP16) ROW 1 (TP17) (MHz) (MHz)
CH1HLLLL 43.720 48.760
CH2 H L L L H 43.740 48.840
CH3 H L L H L 43.820 48.860
CH4 H L L H H 43.840 48.920
CH5 H L H L L 43.920 49.020
CH6 H L H L H 43.960 49.080
CH7 H L H H L 44.120 49.100
CH8 H L H H H 44.160 49.160
CH9 H H L L L 44.180 49.200
CH10 H H L L H 44.200 49.240
CH11 H H L H L 44.320 49.280
CH12 H H L H H 44.360 49.360
CH13 H H H L L 44.400 49.400
CH14 H H H L H 44.460 49.460
CH15 H H H H L 44.480 49.500
CH16 L L H H L 46.610 49.670
CH17 L L H H H 46.630 49.845
CH18 L H L L L 46.670 49.860
CH19 L H L L H 46.710 49.770
CH20 L H L H L 46.730 49.875
CH21 L H L H H 46.770 49.830
CH22 L H H L L 46.830 49.890
CH23 L H H L H 46.870 49.930
CH24 L H H H L 46.930 49.990
CH25 L H H H H 46.970 49.970
TEST1 L L L H L 43.780 48.800
TEST2 L L L H H 43.890 48.970
TEST3 L L H L L 46.800 49.910
TEST4 L L H L H 46.900 49.950
Pin Name Pin No. Function Logic
ROW 1 (TP17) @ª
ROW 2 (TP16) #¡
ROW 3 (TP15) #™ Setting the CH (channel) Refer to channel setting
ROW 4 (TP14) #£
ROW 5 (TP13) #¢
TEST CH (TP33) 1Control terminal for setting the CH (channel) H: OFF, L: ON
TEST SW (TP43) $º Start up of test mode H: Start, L: No start
TEST ACT (TP44) $¢ During test mode, causes start of intermittent operation H: Intermittent start
with external input.

– 12 –
Key processing (Setting the manual test mode)
1. (Upper position) (Lower Position) Set with #.
2. 3X# can be substituted with X .
• By pressing the CH key there is increment of the channel. How-
ever, this does not include the test channel.
• Control of the power source during 38# DATA TX is (TX&RX
RF&RX AF=ON) in 44# state.
• Control of the power source during the 70# key check mode is
41# state (TX OFF).
• For CH setting, SIGOUT control and power source control (with
the exception of above-mentioned 38# state) the state can be set
independently.
Example: In 15 ch, the order for carrying out TX modulation
level and RSSI (H) sensitivity setting is as follows:
The following are possible:15# n44# n36#
36# n15# n44#
44# n36# n15#
Upper 4
position 0123 7
Lower TX RX RX MIC Lk
position RF AF
0 QUIT 10ch 20ch Batt Alarm H A L T GKEY TEST
1 1ch 11ch 21ch CHARG DET Gg G G G
2 2ch 12ch 22ch GggGG
3 3ch 13ch 23ch gg G G G
4 4ch 14ch 24ch RX LOCK gggGG
5 5ch 15ch 25ch TX LOCK gg g g G
6 6ch 16ch T1ch RSSI (H) ggggg
7 7ch 17ch T2ch RSSI (L) – – – – –
8 8ch 18ch T3ch DATA TX – – – – –
9 9ch 19ch T4ch – – – – –
Purpose CH setting only SIGOUT General
control operation
The standard is external line communication Condition
Application state. suveillance Measurement mode of consumption
State for standard electrical adjustment process. with TALK current.
LED.
g: ON, G: OFF
Lk: KEY LED

– 13 –
SECTION 5
ELECTRICAL ADJUSTMENTS
5-1. BASE UNIT SECTION
• Apply 9 V dc from regulated DC power supply.
• Set to base unit machine test mode. (See page 8)
• Switch position:
SW302 (DIAL MODE): P (pulse)
TX Section Adjustment
• Perform the adjustment at T3CH (28CH: 46.8 MHz) as a rule.
Note: The electrolytic capacitor (10 µF/10 V) connected TP23 (DET) to
GND. (Only TX section adjustment)
1. TX VT Adjustment
Setting:
Procedure :
1. The digital voltmeter connected TP6 (TXVT) to TP19 (GND).
2. Adjust the L52 for 2.2 ± 0.05 V reading on the digital voltme-
ter.
Adjustment Location: BASE MAIN board (See page 16)
10 µ F
+
BASE MAIN board
TP23 (DET)
set
+
–
digital voltmeter
BASE MAIN boar
d
TP6 (TX VT)
TP19 (GND)
+
–
digital voltmeter
BASE MAIN boar
d
TP5 (RX VT)
TP19 (GND)
RX Section Adjustment
1. RX Level Adjustment
• Perform the adjustment at T3CH (28CH: 49.910 MHz) as a rule.
Setting :
Procedure :
1. FM RF SSG condition :
Carrier frequency : 49.910 MHz
Modulation frequency: 1 kHz
Deviation : 3 kHz
Output level : 60 dBµV (1 mV) (EMF)
2. Adjust the FL101 for the maximum reading on the level meter.
Also check that the output level is within the specified values.
Specified value: – 2.6 to – 10.6 dBV
Adjustment Location: BASE MAIN board (See page 16)
2. RX VT Adjustment
Setting:
Procedure :
1. The digital voltmeter connectedTP5 (RXVT) to TP19 (GND).
2. Adjust the L101 for 2.4 ± 0.05 V reading on the digital volt-
meter.
Adjustment Location: BASE MAIN board (See page 16)
FM RF SSG
TP2
TP3 (RF GND)
BASE MAIN boar
d
level meter 600
Ω
+
–
PBX tester or
TP105
TP104
BASE MAIN
board
F.B.
DC 48 V

– 14 –
3. RSSI (H) Sensitivity Adjustment
• Perform the adjustment at T3CH (28CH: 49.910 MHz) as a rule.
Setting :
Procedure :
1. FM RF SSG condition :
Carrier frequency : 49.910 MHz
Modulation frequency: 20 Hz (EXT)
Deviation : AM 50%
Output level : 60 dBµV (1mV) (EMF)
2. Use the oscilloscope to confirm the FM RF SSG input (AF)
signal waveform and RSSI signal, and use the RV101 so that
they are synchronized matched (duty is synchronized).
Adjustment Location: BASE MAIN board (See page 16)
AF ocillator
output: 20 Hz
FM RF SSG
TP2
TP3 (RF GND)
BASE MAIN boar
d
RSSI WAVEFORM
RSSI output waveform
RF signal EX
T
signal 20Hz
0V
Adjust so that they
synchronize at 0V.
BASE MAIN boar
d
TP9 (SIG OUT)
TP19
+
–
oscilloscope
(DC range)
5-2. HANDSET SECTION
• Apply 4 V dc from regulated DC power supply.
• Set to handset machine test mode. (See page 10)
TX Section Adjustment
• Perform the adjustments at T1CH (26CH: 43.780 MHz) as a
rule.
1. TX VT Adjustment
Setting:
Procedure:
1. The digital voltmeter connected TP6 (TX VT) to TP3 (RX
GND).
2. Adjust the L52 for 0.9 V ± 0.05 V reading on the digital
voltmeter.
Adjustment Location: HAND MAIN board (See page 17)
+
–
digital voltmeter
TP6 (TX VT)
TP3 (RX GND
)

– 15 –
RX Section Adjustment
1. RX Level Adjustment
• Perform the adjustment at T1CH (26CH: 43.780 MHz) as a rule.
Setting :
Procedure :
1. FM RF SSG condition :
Carrier frequency : 43.780 MHz
Modulation : 1 kHz
Deviation : 3 kHz
Output level : 60 dBµV (1 mV) (EMF)
2. Adjust the FL101 for the maximum reading on the level meter.
Also check that the output level is within the specified values.
Specified value: –16.6 to –8.6 dBV
Adjustment Location: HAND MAIN board (See page 17)
2. RX VT Adjustment
Setting:
Procedure:
1. The digital voltmeter connected TP5 (RX VT) to TP3 (RX
GND).
2. Adjust the L102 for 0.8 V ± 0.05 V reading on the digital
voltmeter.
Adjustment Location: HAND MAIN board (See page 17)
FM RF SSG
TP2
TP3 (RX GND)
HAND MAIN board
level meter
+
–
HAND MAIN boar
d
TP27 (SP)
TP26 (SP)
3. RSSI (H) Sensitivity Adjustment
• Perform the adjustment at T1CH (26CH: 43.780 MHz) as a
rule.
Setting :
Procedure :
1. FM RF SSG condition :
Carrier frequency : 43.780 MHz
Modulation frequency : 20 Hz (EXT)
Deviation : AM 50%
Output level : 2 dBµV (1.259 µV) (EMF)
2. Use the oscilloscope to confirm the FM RF SSG input (AF)
signal waveform and RSSI signal, and use the RV101 so that
they are synchronized matched (duty is synchronized).
Adjustment Location: HAND MAIN board (See page 17)
AF ocillator
output: 20 Hz
FM RF SSG
TP2
TP3 (RX GND)
HAND MAIN board
HAND MAIN board
TP9 (SIG IN)
TP3 (RX GND)
+
–
oscilloscope
(DC range)
RSSI WAVEFORM
RSSI output waveform
RF signal EXT
signal 20Hz
0V
Adjust so that they
synchronize at 0V.
+
–
digital voltmeter
TP5 (RX VT)
TP3 (RX GND
)

– 16 –
Adjustment Location :
[BASE MAIN Board] (Component Side)
[BASE MAIN Board] (Conductor Side)
RV101 RSSI (H) Sensitivity Adjustmen
t
FL101 RX Level Adjustment
L101 RX VT Adjustment
L52 TX VT Adjustment
TP3 (RF GND)
TP5
(RX VT)
TP6 (TX VT)
IC101 CF101
TP19 (GND)
TP9 (SIG OUT)
IC501
MJ201
TP105
TP104
TP2

– 17 –
[HAND MAIN Board] (Component Side)
[HAND MAIN Board] (Conductor Side)
L52 TX VT Adjustment
L102 RX VT Adjustment
FL101 RX Level Adjustment
RV101 RSSI (H) Sensitivity Adjustment
TP27 (SP)
TP26 (SP)
TP3 (RX GND)
TP5
(RX VT) TP9
(SIGIN)
IC501
TP6 (TX VT)
IC101
L102
TP2
Adjustment Location :

SPP-68
– 19 – – 20 –
SECTION 6
DIAGRAMS
6-1. BLOCK DIAGRAM – BASE UNIT Section –
05
B.P.F.
BPF1 RF AMP
Q1
B.P.F.
BPF51 TX AMP
Q51 TX VCO Q52
B.P.F.
BPF2
TEL AMP
Q202
SIDE TONE
CANCEL
LINE TX
DRIVE
Q203
HOOK ON/OFF
SWITCH
PH202
HOOK ON/OFF
SWITCH CONTROL
Q201
IF
IN
FL101
(DET)
MIX1
OUT CF102
10.68MHz
ANT1
TELESCOPIC
ANTENNA
RX FREQUENCY:
49.67 – 49.99MHz
TX FREQUENCY:
46.61 – 46.97MHz
CF101
460kHz
MIX1
IN1
40
LO IN
43 LO OUT
44 CONTR
42
PD OUT
46
VCC2
RX SYSTEM B+ 41
47
9
1
38 32 IF
AMP
RX
VCO
RX
PLL
TX
PLL
CPU
INTERFACE
TX
SPLATTER
DATA
COMP
TX
MUTE COMPRESSOR/
LIMITER
LOCAL
OSCILLATOR
QUADRATURE
DETECTOR
RSSI CARRIER
DETECTOR
RX LEVEL
RV101
RSSI (H)
SENSITIVITY
RX VT
TX VT
EXPANDER
AF
OUT
L.P.F.
PREAMP
MIC AMP
PRE
IN
15 COMP
IN
24
28
27
SIG
OUT
RSSI
H/L
LO1
LO2
X101
10.22MHz
22
4
3
MIC
IN
FIL IN 1410
EXP
OUT 17
DA OUT
23
QUAD
PD
OUT
FIL OUT
D51
MODULATOR
DATA
CLK
LATCH
DATA
CLK
LATCH
DATA
CLK
LATCH
TX-DATA
TVCOIN
11
COMP
OUT
8
5
67
7
REGULATOR
Q601
CHARGE
REGULATOR
Q402
CURRENT
LIMITER
Q403
CHARGE DETECT
Q401
VOLTAGE
DETECT
IC301
RESET
SWITCH
Q302
REGULATOR
Q301
B+ SWITCH
Q54
PAGE
16
DIALMODE
17 12
• SIGNAL PATH
: RX
: TX
: BELL
RX
MUTE RECEIVER
AMP
AMP
OUT 19
AMP
OUT
20
AMP
IN
D101
18
X501
4.048MHz
OSC2
9
OSC1
10
DATA
2
CLK
3
STB
1
RX-DATA
4 20
DTMF
21
D401
POWER
CHARGE/IN USE CHARGE
TERMINAL
B+
TX SYSTEM B+
SYSTEM CONTROLLER
IC501
MIX, IF AMP, LIMITER AMP,
PLL, EXPANDER/COMPRESSOR
IC101
IC101 (1/2) IC101 (2/2)
RSSI H/L
19
SIG-IN
5
+
–
RESET CHG-DET TX +B CTRL
18 22 14
POW-DET
DP
30
MIX2
OUT
MIX2
IN
2ND
MIX
1ST
MIX
36 34
L52
(TX VCO)
L101
(RX VCO)
S301
PAGE
SW302
DIAL MODE
T
P
+
+
RINGER
DETECT
PH201
T201
LINE TRANSFORMER
LINE
MJ201
D205
RECT
J301
DC IN 9V
–+
RING
6
H-MUTE

SPP-68
– 21 – – 22 –
6-2. BLOCK DIAGRAM – HANDSET Section –
05
B.P.F.
BPF1 RF AMP
Q1
B.P.F.
BPF51 TX AMP
Q51 TX VCO Q52
B.P.F.
BPF2
IF
IN
FL101
(DET)
MIX1
OUT CF102
10.66MHz
ANT2
RX FREQUENCY:
46.61 – 46.97MHz
TX FREQUENCY:
49.67 – 49.99MHz
CF101
460kHz
MIX1
IN1
40
LO IN
43 LO OUT
44 CONTR
42
PD OUT
46
VCC2
RX SYSTEM B+ 41
47
9
1
38 32 IF
AMP
RX
VCO
RX
PLL
TX
PLL
CPU
INTERFACE
TX
SPLATTER
DATA
COMP
TX
MUTE COMPRESSOR/
LIMITER
LOCAL
OSCILLATOR
QUADRATURE
DETECTOR
RSSI CARRIER
DETECTOR
RX LEVEL
RV101
RSSI (H)
SENSITIVITY
RX VT
TX VT
EXPANDER
AF
OUT
L.P.F.
PREAMP
MIC AMP
PRE
IN
15 COMP
IN
24
28
27
RSSI
H/L
SIG
OUT
LO1
LO2
X101
10.22MHz
22
4
3
MIC
IN MIC1
BATTERY LOW
SWITCHING
Q502
HOLD/RESET
SWITCH
Q501
GROUND ISOLATION
SWITCHING
Q202
FIL IN 1410
EXP
OUT 17
DA OUT
23
QUAD
PD
OUT
FIL OUT
D51
MODULATOR
DATA
CLK
LATCH
DATA
CLK
LATCH
DATA
CLK
LATCH
TX-DATA
TVCOIN
11
COMP
OUT
8
5
67
9
TX-DATA
10
VOLTAGE
DETECT
IC201
BUZZER
DRIVE
Q301
RESET
SWITCH
Q201
B+ SWITCH
Q54
21
• SIGNAL PATH
: RX
: TX
: BELL
RX
MUTE RECEIVER
AMP
BATTERY
DETECT
AMP
OUT 19
AMP
OUT
BATT
IN
DET
OUT B+
B+
B+
SP1
20
33
21
AMP
IN
18
X501
4.048MHz
OSC2
20
OSC1
17
PLL-DATA
5
PLL-CLK
7
PLL-STB
4
BEEP
11
RX-DATA
8
B+
TX SYSTEM B+
POWER
GROUND
MAIN
GROUND
SYSTEM CONTROLLER
IC501
MIX, IF AMP, LIMITER AMP,
PLL, EXPANDER/COMPRESSOR
IC101
IC101 (1/2) IC101 (2/2)
RSSI H/L
45
MIC
COL3
28
SIG-IN
3 37
RESET
12
HOLD TX +B CTRL
13
CHG-DET
MIX2
OUT
MIX2
IN
2ND
MIX
1ST
MIX
36 34
L52
(TX VCO)
L102
(RX VCO)
D101
46
H-MUTE
BATT-LOW
23
ACT4
22
ACT3
CHARGE
TERMINAL
BZ301
(BUZZER)
+
–
D202
D504
D502
38
BATT-DET
47
BT901
RECHARGEABLE
BATTERY PACK
(BP-T16)
ROW1 – ROW5
KEY MATRIX
(SEET KEY)
29, 31 – 34 24 – 27
COL0 – COL3 LED
48
D501
TALK/
BATT LOW

– 23 – – 24 –
6-3. NOTES FOR PRINTED WIRING BOARD AND SCHEMATIC DIAGRAM
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•¢: internal component.
•C: panel designation.
•U: B+ Line.
•H: adjustment for repair.
• Power voltage is dc 9 V and fed with regulated dc power
supply from external power voltage jack (J301 on the
BASE MAIN board).
• Powervoltage is dc 12V and fed with regulated dc power
supply from modular jack (MJ201 on the BASE MAIN
board) with 100 Ωin series.
• Powervoltage is dc 3.6 V andfed with regulated dc power
supply from battery jack (CN201 on the HAND MAIN
board).
• Voltages and waveforms are dc with respect to ground in
test mode.
∗: Impossible to measure
• Voltages aretakenwithaVOM(Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
N: RX
O: TX
P: bell
Note on Printed Wiring Boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•¢: internal component.
•b: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Partsonthepatternface side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Waveforms
– BASE MAIN Board –
1IC101 3(Test Mode)
2IC501 9(OSC2) (Tset Mode)
2IC501 @º (OSC2) (Tset Mode)
– HAND MAIN Board –
1IC101 3(Test Mode)
1.4 Vp-p
97.8 ns
3.1 Vp-p
247 ns
680 mVp-p
97.8 ns
3.6 Vp-p
247 ns