Sony Cyber-shot DSC-HX20 User manual

SERVICE MANUAL
DSC-HX20/HX20V/HX30/HX30V_L3
LEVEL 3
Check the SERVICE NOTE (LEVEL 2) before the service.
Revision History
Published by Sony Techno Create Corporation
Sony Corporation
983465912.pdf
DIGITAL STILL CAMERA
The components identified by mark
0or dotted line with mark 0are
critical for safety.
Replace only with part number
specified.
Les composants identifiés par une
marque 0sont critiques pour la
sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.
9-834-659-12
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Japanese Model
Photo: DSC-HX30V/BLACK
Ver. Date History Contents S.M. Rev.
issued
1.0 2012.03 Official Release — —
1.1 2012.06 Revised-1
(A1 12-083)
• Addition of DSC-HX20.
Page 2-1, 2-2
Yes
2012F08-1
© 2012.06
Ver. 1.1 2012.06
DSC-HX20/HX20V/HX30/HX30V
Revised-1
Replace the previously issued
SERVICE MANUAL 9-834-659-11
with this Manual.

– 2 –
DSC-HX20/HX20V/HX30/HX30V_L3
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE WITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST
ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM-
PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT
LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
注意
電池の交換は，正しく行わないと破裂する恐れがあります。
電池を交換する場合には必ず同じ型名の電池又は同等品と
交換してください。
使用済み電池は，取扱指示に従って処分してください。
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes and
bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to the
customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs of
deterioration. Point them out to the customer and recommend their
replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
• Set the soldering iron tip temperature to 350 °C approximately.
• Do not touch the soldering iron on the same conductor of the circuit
board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
1. 注意事項をお守りください。
 サービスのとき特に注意を要する個所については，キャビ
ネット，シャーシ，部品などにラベルや捺印で注意事項を
表示しています。これらの注意書き及び取扱説明書等の注
意事項を必ずお守り下さい。
2. 指定部品のご使用を
 セットの部品は難燃性や耐電圧など安全上の特性を持った
ものとなっています。従って交換部品は，使用されていた
ものと同じ特性の部品を使用して下さい。特に回路図，部
品表に0印で指定されている安全上重要な部品は必ず指定
のものをご使用下さい。
3. 部品の取付けや配線の引きまわしはもとどおりに
 安全上，チューブやテープなどの絶縁材料を使用したり，
プリント基板から浮かして取付けた部品があります。また
内部配線は引きまわしやクランパによって発熱部品や高圧
部品に接近しないよう配慮されていますので，これらは必
ずもとどおりにして下さい。
4. サービス後は安全点検を
 サービスのために取外したネジ，部品，配線がもとどおり
になっているか，またサービスした個所の周辺を劣化させ
てしまったところがないかなどを点検し，安全性が確保さ
れていることを確認して下さい。
5. チップ部品交換時の注意
 ・ 取外した部品は再使用しないで下さい。
 ・ タンタルコンデンサのマイナス側は熱に弱いため交換時
は注意して下さい。
6. フレキシブルプリント基板の取扱いについて
 ・ 半田こてのこて先温度は約350℃に設定してください。
 ・ 同一パターンに何度もコテ先を当てないで下さい。（3回
以内）
 ・ パターンに力が加わらないよう注意して下さい。
サービス，点検時には次のことにご注意ください。
– ENGLISH – – JAPANESE –
UNLEADED SOLDER
This unit uses unleaded solder.
Boards requiring use of unleaded solder are printed with the lead free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
lead free mark due to their particular size.)
: LEAD FREE MARK
Be careful to the following points to solder or unsolder.
• Set the soldering iron tip temperature to 350 °C approximately.
If cannot control temperature, solder/unsolder at high temperature
for a short time.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Be sure to control soldering iron tips used for unleaded solder and
those for leaded solder so they are managed separately. Mixing un-
leaded solder and leaded solder will cause detachment phenomenon.
無鉛半田について
本機には無鉛半田が使用されています。
無鉛半田を使用している基板には，無鉛（LeadFree）を意味する
レッドフリーマークがプリントされています。
（注意：基板サイズによっては，無鉛半田を使用していてもレッ
ドフリーマークがプリントされていないものがありま
す）
：レッドフリーマーク
無鉛半田は，下記の点に注意して使用してください。
・ 半田こてのこて先温度は約350℃に設定してください。
温度調節が無理な場合は，高温短時間で作業を行ってくだ
さい。
注意：半田こてを長く当てすぎると，基板のパターン（銅
箔）がはがれてしまうことがありますので，注意して
ください。また，従来の半田よりも粘性が強いため，
IC端子などが半田ブリッジしないように注意してく
ださい。
・ 半田こてのこて先は，必ず無鉛半田用と有鉛半田用に分け
て管理してください。
無鉛半田と有鉛半田が混在すると剥離現象が発生してしま
います。

DSC-HX20/HX20V/HX30/HX30V_L3
2-1
Ref. No. Part No. DescriptionRef. No. Part No. Description
2. REPAIR PARTS LIST
(ENGLISH)
NOTE:
• -XX, -X mean standardized parts, so they may have some differ-
ences from the original one.
• Items marked “*” are not stocked since they are seldom required for
routine service. Some delay should be anticipated when ordering
these items.
• The mechanical parts with no reference number in the exploded
views are not supplied.
• Due to standardization, replacements in the parts list may be dif-
ferent from the parts specified in the diagrams or the components
used on the set.
• CAPACITORS:
uF: μF
• COILS
uH: μH
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
• SEMICONDUCTORS
In each case, u: μ, for example:
uA...: μA... , uPA... , μPA... ,
uPB... , μPB... , uPC... , μPC... ,
uPD..., μPD...
When indicating parts by reference num-
ber, please include the board name.
The components identified by mark 0
or dotted line with mark 0are critical
for safety.
Replace only with part number speci-
fied.
Les composants identifiés par une mar-
que 0sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Note: Be sure to read “Precautions for Replacement
of Imager” on page 6-1.
(JAPANESE)
【使用上の注意】
• ここに記載されている部品は,補修用部品であるため,回路図及び
セットに付いている部品と異なる場合があります。
• -XX,-Xは標準化部品のため, セットに付いている部品と異なる場
合があります。
• *印の部品は常備在庫しておりません。
• コンデンサの単位でuFはμFを示します。
• 抵抗の単位Ωは省略してあります。
 金 被：金属被膜抵抗。
 サンキン：酸化金属被膜抵抗。
• インダクタの単位でuHはμHを示します。
• 半導体の名称でuA...,uPA...,uPB...,uPC...,uPD...等はそれぞれμA...,
μPA...,μPB...,μPC...,μPD...を示します。
図面番号で部品を指定するときは基板名又はブロック
を併せて指定してください。
お願い
0印の部品，または0印付の点線で囲まれた部品は，
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。
注意
電池の交換は，正しく行わないと破裂する恐れがあります。
電池を交換する場合には必ず同じ型名の電池又は同等品と
交換してください。
使用済み電池は，取扱指示に従って処分してください。
Note:イメージャの交換時は6-1ページの“イメージャ
交換時の注意”を必ずお読みください。
A-1870-789-A BT-077 FLEXIBLE BOARD, COMPLETE
******************************
(BT901 is not included in BT-077 FLEXIBLE BOARD.)
< CAPACITOR >
C101 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C102 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V
*C104 1-116-456-11 CERAMIC CHIP 0.047uF 10% 350V
< CONNECTOR >
CN101 1-821-858-61 CONNECTOR, FPC (LIF (NON-ZIF))
< DIODE >
D001 6-502-887-01 DIODE SCM-J14DTT96
*D101 6-503-638-01 DIODE RFU02VS6SGJTR
< IC >
IC101 6-716-806-01 IC R2J20071DNS
< COIL >
*L101 1-400-820-11 INDUCTOR 2.2uH
< TRANSISTOR >
Q101 6-552-987-01 TRANSISTOR RJP4010AGE-01
< RESISTOR >
R101 1-218-871-11 METAL CHIP 10K 0.5% 1/10W
R102 1-208-889-11 METAL CHIP 1.2K 0.5% 1/16W
R103 1-208-861-81 METAL CHIP 82 0.5% 1/16W
R104 1-208-661-11 METAL CHIP 120 0.5% 1/16W
R105 1-216-121-11 METAL CHIP 1M 5% 1/10W
< TRANSFORMER >
*T101 1-445-749-21 D.C.-D.C.CONVERTER TRANSFORMER
A-1870-790-A CD-840 FLEXIBLE BOARD, COMPLETE
******************************
(All mounted parts are not supplied, but they are included in CD-840 FLEXIBLE COMPLETE
BOARD.)
A-1873-028-A RL-129 BOARD, COMPLETE (SERVICE) (HX20V/HX30V)
A-1870-786-A RL-129 BOARD, COMPLETE (SERVICE) (HX20/HX30)
*******************************
(ANT401, C418, CP401, ET401, IC404, L402, R419, SE201 and X402 are not supplied,
but they are included in RL-129 COMPLETE BOARD (SERVICE).)
(BT001 is not included in BT-077 FLEXIBLE BOARD.)
< ANTENNA >
ANT401 (Not supplied) ANTENNA, GPS (HX20V/HX30V)
< BATTERY >
BT001 1-756-710-12 LITHIUM RECHARGEABLE BATTERY
< CAPACITOR >
C101 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V
C102 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C103 1-119-923-11 CERAMIC CHIP 0.047uF 10% 10V
C104 1-119-923-11 CERAMIC CHIP 0.047uF 10% 10V
C105 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C106 1-114-411-21 CERAMIC CHIP 0.33uF 10% 6.3V
C107 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C201 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
(HX20V/HX30V)
C202 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
(HX20V/HX30V)
C301 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C302 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C303 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C403 1-100-415-91 CERAMIC CHIP 0.47uF 10% 6.3V
(HX20V/HX30V)
C404 1-127-715-11 CERAMIC CHIP 0.22uF 10% 16V
(HX20V/HX30V)
C405 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
(HX20V/HX30V)
C406 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
(HX20V/HX30V)
C408 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
(HX20V/HX30V)
C409 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
(HX20V/HX30V)
C410 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
(HX20V/HX30V)
C411 1-128-607-11 CERAMIC CHIP 18PF 5% 25V
(HX20V/HX30V)
C412 1-128-606-91 CERAMIC CHIP 15PF 5% 25V
(HX20V/HX30V)
C413 1-116-153-11 CERAMIC CHIP 18PF 1% 50V
(HX20V/HX30V)
*C415 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V
(HX20V/HX30V)
C416 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
(HX20V/HX30V)
C417 1-128-639-91 CERAMIC CHIP 0.01uF 10V
(HX20V/HX30V)
C418 (Not supplied) CERAMIC CHIP 2.2PF 0.1PF 50V
(HX20V/HX30V)
C421 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
(HX20V/HX30V)
C424 1-116-390-91 CERAMIC CHIP 2.2uF 20% 6.3V
(HX20V/HX30V)
C425 1-116-390-91 CERAMIC CHIP 2.2uF 20% 6.3V
(HX20V/HX30V)
C426 1-116-875-91 CERAMIC CHIP 1uF 20% 6.3V
(HX20V/HX30V)
C428 1-116-875-91 CERAMIC CHIP 1uF 20% 6.3V
(HX20V/HX30V)
C429 1-116-875-91 CERAMIC CHIP 1uF 20% 6.3V
(HX20V/HX30V)
C430 1-116-875-91 CERAMIC CHIP 1uF 20% 6.3V
(HX20V/HX30V)
< CONNECTOR >
CN001 1-822-378-11 CONNECTOR, FPC (ZIF) 33P
CN002 1-821-857-51 CONNECTOR, FPC (LIF (NON-ZIF)) 6P
2-2. ELECTRICAL PARTS LIST
BT-077 CD-840 RL-129
The changed portions from
Ver. 1.0 are shown in blue.
Ver. 1.1 2012.06

DSC-HX20/HX20V/HX30/HX30V_L3
2-2
Ref. No. Part No. DescriptionRef. No. Part No. Description
< FE MODULE >
CP401 (Not supplied) FE MODULE (HX20V/HX30V)
< DIODE >
D001 6-502-196-01 DIODE SML-D12Y8WT86SP
*D002 6-502-294-01 DIODE SML-D13M8WT86S
D401 6-501-106-01 DIODE 1SS387CT (TL3SONY) (HX20V/HX30V)
D403 6-501-106-01 DIODE 1SS387CT (TL3SONY) (HX20V/HX30V)
< SHIELD CASE >
ET401 (Not supplied) SHIELD CASE (HX20V/HX30V)
< IC >
IC101 6-707-333-01 IC NJM3230SE7
IC401 6-718-365-01 IC S-80928CNPF-G8YTFG (HX20V/HX30V)
IC402 6-718-414-01 IC RP173K421B-TR (HX20V/HX30V)
IC403 6-715-228-01 IC SN74AUP2G126YFPR (HX20V/HX30V)
IC404 (Not supplied) IC MT3339 (HX20V/HX30V)
< COIL >
L401 1-469-232-21 INDUCTOR 56nH (HX20V/HX30V)
L402 (Not supplied) INDUCTOR 9.1nH (HX20V/HX30V)
L403 1-481-981-11 INDUCTOR 4.7uH (HX20V/HX30V)
< TRANSISTOR >
Q402 6-550-601-01 TRANSISTOR UNRF2A300AS0 (HX20V/HX30V)
< RESISTOR >
R003 1-218-945-11 METAL CHIP 220 5% 1/16W
R025 1-218-945-11 METAL CHIP 220 5% 1/16W
R026 1-218-955-11 METAL CHIP 1.5K 5% 1/16W
R102 1-218-969-11 METAL CHIP 22K 5% 1/16W
R103 1-218-969-11 METAL CHIP 22K 5% 1/16W
R105 1-218-965-11 METAL CHIP 10K 5% 1/16W
R106 1-208-711-11 METAL CHIP 15K 0.5% 1/16W
R107 1-218-985-11 METAL CHIP 470K 5% 1/16W
R401 1-218-990-81 SHORT CHIP 0 (HX20V/HX30V)
R402 1-218-990-81 SHORT CHIP 0 (HX20V/HX30V)
R403 1-240-695-91 METAL CHIP 1K 5% 1/20W
(HX20V/HX30V)
R410 1-240-695-91 METAL CHIP 1K 5% 1/20W
(HX20V/HX30V)
R411 1-240-735-91 METAL CHIP 3.3M 5% 1/20W
(HX20V/HX30V)
R412 1-240-718-91 METAL CHIP 100K 5% 1/20W
(HX20V/HX30V)
R414 1-240-707-91 METAL CHIP 10K 5% 1/20W
(HX20V/HX30V)
R415 1-240-830-11 METAL CHIP 100K 0.5% 1/20W
(HX20V/HX30V)
R416 1-240-830-11 METAL CHIP 100K 0.5% 1/20W
(HX20V/HX30V)
R417 1-694-535-91 SHORT CHIP 0 (HX20V/HX30V)
R419 (Not supplied) METAL CHIP 680K 5% 1/20W
(HX20V/HX30V)
< COMPOSITION CIRCUIT BLOCK >
RB001 1-234-376-11 RES, NETWORK 2.2K (1005X4)
RB002 1-234-376-11 RES, NETWORK 2.2K (1005X4)
RB003 1-234-376-11 RES, NETWORK 2.2K (1005X4)
< SWITCH >
S001 1-786-914-31 SWITCH, TACTILE
S002 1-786-914-31 SWITCH, TACTILE
*S005 1-798-136-21 TACTILE SWITCH
S006 1-798-420-11 SWITCH, DETECTION
S007 1-798-035-61 ROTARY SWITCH
< SENSOR>
SE101 1-479-022-61 SENSOR, ANGULAR VELOCITY (32.2kHz)
SE201 (Not supplied) ELECTRONIC COMPASS SENSOR (HX20V/HX30V)
SE301 1-490-064-22 SENSOR 3 AXIAL ACCELERATION
< VIBRATOR >
X401 1-814-169-11 VIBRATOR, CRYSTAL (32.768KHZ) (HX20V/HX30V)
X402 (Not supplied) OSCILLATOR, CRYSTAL (16.368MHz) (HX20V/HX30V)
1-885-400-11 RL-130 FLEXIBLE BOARD
********************
A-1872-783-A ST BLOCK (350) BLACK SERVICE (BLACK)
A-1872-784-A ST BLOCK (350) BROWN SERVICE (BROWN)
(Not supplied) ST-281 FLEXIBLE BOARD, COMPLETE
******************************
(ST-281 FLEXIBLE COMPLETE BOARD is not supplied, but this is included in ST BLOCK
SERVICE.)
< SWITCH >
S001 1-798-420-11 SWITCH, DETECTION
A-1870-787-A SW-589 BOARD, COMPLETE (HX30/HX30V)
A-1870-788-A SW-589 BOARD, COMPLETE (HX20/HX20V)
*****************************
(ANT901 is not supplied, but this is included in SW-589 COMPLETE BOARD (SERVICE).)
< ANTENNA >
ANT901 (Not supplied) WLAN ANTENNA (HX30/HX30V)
< CAPACITOR >
C901 1-117-728-81 CERAMIC CHIP 1PF 0.1PF 16V
(HX30/HX30V)
C903 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
(HX30/HX30V)
C904 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
(HX30/HX30V)
C905 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
(HX30/HX30V)
C906 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
(HX30/HX30V)
C908 1-114-172-91 CERAMIC CHIP 2.2uF 20% 4V
(HX30/HX30V)
C909 1-114-172-91 CERAMIC CHIP 2.2uF 20% 4V
(HX30/HX30V)
C910 1-114-172-91 CERAMIC CHIP 2.2uF 20% 4V
(HX30/HX30V)
C912 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V
(HX30/HX30V)
< CONNECTOR >
CN901 1-822-245-61 CONNECTOR, FPC (LIF (NON-ZIF))
< WLAN MODULE >
CP901 1-490-020-11 WLAN MODULE (HX30/HX30V)
< IC >
IC901 6-718-369-01 IC TPS22902BYFPR (HX30/HX30V)
IC902 6-718-369-01 IC TPS22902BYFPR (HX30/HX30V)
< COIL >
L902 1-414-840-11 INDUCTOR 10nH (HX30/HX30V)
L903 1-414-840-11 INDUCTOR 10nH (HX30/HX30V)
< RESISTOR >
R801 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R802 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R903 1-240-691-91 METAL CHIP 470 5% 1/20W
(HX30/HX30V)
R910 1-694-535-91 SHORT CHIP 0 (HX30/HX30V)
R911 1-240-727-91 METAL CHIP 560K 5% 1/20W
(HX30/HX30V)
R912 1-240-726-91 METAL CHIP 470K 5% 1/20W
(HX30/HX30V)
R915 1-218-990-81 SHORT CHIP 0 (HX30/HX30V)
< COMPOSITION CIRCUIT BLOCK >
RB801 1-234-376-11 RES, NETWORK 2.2K (1005X4)
< SWITCH >
S801 1-786-914-31 SWITCH, TACTILE
S802 1-786-914-31 SWITCH, TACTILE
S803 1-798-417-11 SWITCH, ROTARY
*S804 1-786-914-51 SWITCH, TACTILE
S805 1-786-914-31 SWITCH, TACTILE
< VIBRATOR >
X901 1-814-587-11 OSCILLATOR, CRYSTAL (26MHz) (HX30/HX30V)
1-885-489-11 SW-592 FLEXIBLE BOARD
*********************
A-1872-666-A SY-325 BOARD, COMPLETE (SERVICE)
*******************************
(IC202 and R472 are not supplied, but they are included in SY-325 COMPLETE BOARD
(SERVICE).)
< CAPACITOR >
C001 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C002 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C003 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C004 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C005 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C006 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C007 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V
C008 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V
C009 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V
C010 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C011 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C012 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C013 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V
C014 1-100-671-11 CERAMIC CHIP 4.7uF 20% 25V
C020 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C022 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C024 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C025 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C026 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C051 1-114-246-11 CERAMIC CHIP 1uF 20% 25V
C053 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C054 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C056 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C057 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C058 1-116-717-11 CERAMIC CHIP 10uF 20% 10V
C059 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C061 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C102 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C103 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C104 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C107 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V
C108 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C109 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V
C110 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C111 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C112 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C113 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C114 1-164-852-11 CERAMIC CHIP 12PF 5% 50V
C115 1-164-852-11 CERAMIC CHIP 12PF 5% 50V
C116 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C118 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C119 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C202 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C204 1-128-608-91 CERAMIC CHIP 22PF 5% 25V
C208 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C211 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C212 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C220 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C221 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C223 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V
C224 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C230 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C232 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C242 1-100-743-91 CERAMIC CHIP 2.2uF 20% 16V
C248 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V
C249 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V
C254 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C255 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C261 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C262 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C263 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C264 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
Ref. No. Part No. Description Ref. No. Part No. Description
RL-129 RL-130 ST-281 SW-589 SW-592 SY-325BT-077 CD-840 RL-129
The changed portions from
Ver. 1.0 are shown in blue.
Ver. 1.1 2012.06

DSC-HX20/HX20V/HX30/HX30V_L3
2-3
Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. DescriptionRef. No. Part No. Description
C265 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C266 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C267 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C268 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C270 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C271 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C272 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C273 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C274 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C276 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C277 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C282 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C284 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C285 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C286 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C288 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C290 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C292 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C293 1-164-856-81 CERAMIC CHIP 18PF 5% 50V
C294 1-164-856-81 CERAMIC CHIP 18PF 5% 50V
C295 1-164-856-81 CERAMIC CHIP 18PF 5% 50V
C296 1-164-856-81 CERAMIC CHIP 18PF 5% 50V
C361 1-100-743-91 CERAMIC CHIP 2.2uF 20% 16V
C365 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C366 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C369 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C370 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C375 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C376 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C377 1-128-627-91 CERAMIC CHIP 0.001uF 10% 16V
C378 1-128-627-91 CERAMIC CHIP 0.001uF 10% 16V
C379 1-128-627-91 CERAMIC CHIP 0.001uF 10% 16V
C380 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V
C381 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C382 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V
C383 1-128-627-91 CERAMIC CHIP 0.001uF 10% 16V
C384 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C385 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C386 1-114-582-91 CERAMIC CHIP 0.1uF 10% 16V
C387 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C388 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C404 1-165-897-11 TANTAL. CHIP 22uF 20% 10V
C405 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C406 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C407 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C408 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C437 1-164-939-11 CERAMIC CHIP 0.0022uF 10% 50V
C438 1-164-939-11 CERAMIC CHIP 0.0022uF 10% 50V
C439 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C440 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C442 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C443 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C444 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V
C445 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V
C446 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V
C447 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V
C449 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V
C450 1-164-939-11 CERAMIC CHIP 0.0022uF 10% 50V
C451 1-100-965-91 CERAMIC CHIP 0.047uF 10% 6.3V
C452 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C453 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C454 1-164-939-11 CERAMIC CHIP 0.0022uF 10% 50V
C455 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C456 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C457 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C458 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C701 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C702 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C703 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C704 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C705 1-114-983-91 CERAMIC CHIP 2.2uF 10% 16V
C706 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C707 1-112-300-91 CERAMIC CHIP 4.7uF 10% 10V
C709 1-100-415-91 CERAMIC CHIP 0.47uF 10% 6.3V
C710 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C711 1-112-300-91 CERAMIC CHIP 4.7uF 10% 10V
C712 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C713 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C714 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C715 1-112-717-91 CERAMIC CHIP 1uF 10% 6.3V
C716 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C717 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C719 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C721 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C726 1-164-856-81 CERAMIC CHIP 18PF 5% 50V
C727 1-164-856-81 CERAMIC CHIP 18PF 5% 50V
< CONNECTOR >
*CN405 1-821-503-11 CONNECTOR, FPC (ZIF) 39P
CN701 1-821-501-11 CONNECTOR, FPC (ZIF) 51P
CN702 1-822-245-61 CONNECTOR, FPC (LIF (NON-ZIF))
CN703 1-822-378-11 CONNECTOR, FPC (ZIF) 33P
*CN704 1-842-522-21 CONNECTOR, FPC (ZIF) 61P
CN705 1-821-858-61 CONNECTOR, FPC (LIF (NON-ZIF))
CN706 1-843-212-11 CONNECTOR, USB
CN707 1-822-837-31 CARD CONNECTOR
CN708 1-842-602-11 CONNECTOR, HDMI
< DIODE >
D001 6-502-934-01 DIODE DB2S31100K8
D002 6-503-318-01 DIODE DB2J20100L
D021 6-503-218-01 DIODE RKZ6.8B2KJR1
D051 6-503-217-01 DIODE RKZ5.6B2KJR1
D052 6-502-193-01 DIODE SML-D12V8WT86SN
*D208 6-502-988-01 DIODE RB480Y-40T2R
D701 6-502-934-01 DIODE DB2S31100K8
D702 6-502-934-01 DIODE DB2S31100K8
D703 8-719-056-23 DIODE MA2S111-(K8).SO
D705 6-501-216-01 DIODE CL-271HR-C-TS
D706 6-502-934-01 DIODE DB2S31100K8
D707 6-502-934-01 DIODE DB2S31100K8
< FUSE >
*F001 1-576-843-31 FUSE (0.8A/32V)
F051 1-576-415-31 FUSE (2A/32V)
*F052 1-576-612-31 FUSE (1A/32V)
F053 1-576-415-31 FUSE (2A/32V)
SY-325
< FERRITE BEAD >
FB251 1-400-725-21 FERRITE, EMI (SMD) (1005)
FB252 1-400-725-21 FERRITE, EMI (SMD) (1005)
FB253 1-400-725-21 FERRITE, EMI (SMD) (1005)
FB254 1-469-580-21 INDUCTOR, FERRITE BEAD (1005)
FB255 1-400-198-21 INDUCTOR, FERRITE BEAD (1005)
FB361 1-481-912-21 EMI FERRITE (SMD) (1005)
< IC >
IC001 6-716-846-01 IC MB44C022PW-G-ERE1
IC002 6-716-873-01 IC RP109L111DA-TR
IC003 6-717-899-01 IC BD8335GWL-E2
IC004 6-717-900-01 IC RP173K501B-TR
IC051 6-718-064-01 IC BD91407GW-E2
IC052 6-718-065-01 IC MAX8976EWA+T
IC101 6-716-838-01 IC BU76381GUW-E2
*IC201 6-716-958-01 IC uPD79F0107FC-404-2N1-E2-A
IC202 (Not supplied) IC AVY2G2G05A
IC401 6-716-760-01 IC R2J30503LG
IC402 6-715-211-01 IC MM3404A28URE
< COIL >
L001 1-481-036-11 INDUCTOR 4.7uH
L002 1-460-359-11 INDUCTOR 4.7uH
L003 1-481-036-11 INDUCTOR 4.7uH
L004 1-481-036-11 INDUCTOR 4.7uH
L006 1-460-369-11 INDUCTOR 33uH
L007 1-460-359-11 INDUCTOR 4.7uH
*L701 1-481-642-11 INDUCTOR 10uH
< LINE FILTER >
LF701 1-457-539-11 COMMON MODE CHOKE COIL
LF702 1-457-539-11 COMMON MODE CHOKE COIL
LF703 1-457-223-11 COMMON MODE CHOKE COIL
< TRANSISTOR >
Q051 6-552-999-01 TRANSISTOR RW1E025RPT2CR
*Q052 6-552-530-01 TRANSISTOR DMC964030R
*Q056 6-552-354-01 TRANSISTOR DRC3144E0L
Q206 6-552-830-01 TRANSISTOR SSM6N15AFE
Q207 6-552-621-01 TRANSISTOR SSM3K37MFV, L3SOF
< RESISTOR >
R011 1-220-872-81 METAL CHIP 12 0.5% 1/16W
R051 1-218-977-11 METAL CHIP 100K 5% 1/16W
R053 1-240-718-91 METAL CHIP 100K 5% 1/20W
R054 1-208-927-11 METAL CHIP 47K 0.5% 1/16W
R059 1-240-695-91 METAL CHIP 1K 5% 1/20W
R060 1-240-718-91 METAL CHIP 100K 5% 1/20W
R064 1-240-707-91 METAL CHIP 10K 5% 1/20W
R068 1-240-691-91 METAL CHIP 470 5% 1/20W
R115 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R116 1-218-957-11 METAL CHIP 2.2K 5% 1/16W
R117 1-240-695-91 METAL CHIP 1K 5% 1/20W
R118 1-240-695-91 METAL CHIP 1K 5% 1/20W
R119 1-694-535-91 SHORT CHIP 0
R205 1-218-990-81 SHORT CHIP 0
R208 1-218-990-81 SHORT CHIP 0
R212 1-208-869-11 METAL CHIP 180 0.5% 1/16W
R215 1-218-867-11 METAL CHIP 6.8K 0.5% 1/10W
R217 1-218-965-11 METAL CHIP 10K 5% 1/16W
R218 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R219 1-240-695-91 METAL CHIP 1K 5% 1/20W
R221 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R222 1-218-970-11 METAL CHIP 27K 5% 1/16W
R229 1-218-956-11 METAL CHIP 1.8K 5% 1/16W
R230 1-218-956-11 METAL CHIP 1.8K 5% 1/16W
R247 1-218-990-81 SHORT CHIP 0
R248 1-218-990-81 SHORT CHIP 0
R264 1-240-695-91 METAL CHIP 1K 5% 1/20W
R265 1-240-695-91 METAL CHIP 1K 5% 1/20W
R272 1-240-683-91 METAL CHIP 100 5% 1/20W
R273 1-240-679-91 METAL CHIP 47 5% 1/20W
R278 1-240-683-91 METAL CHIP 100 5% 1/20W
R279 1-240-683-91 METAL CHIP 100 5% 1/20W
R284 1-208-935-11 METAL CHIP 100K 0.5% 1/16W
R285 1-218-965-11 METAL CHIP 10K 5% 1/16W
R290 1-218-973-11 METAL CHIP 47K 5% 1/16W
R291 1-208-943-11 METAL CHIP 220K 0.5% 1/16W
R292 1-208-943-11 METAL CHIP 220K 0.5% 1/16W
R309 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R310 1-218-961-11 METAL CHIP 4.7K 5% 1/16W
R359 1-240-683-91 METAL CHIP 100 5% 1/20W
R364 1-240-683-91 METAL CHIP 100 5% 1/20W
R367 1-240-683-91 METAL CHIP 100 5% 1/20W
R369 1-240-683-91 METAL CHIP 100 5% 1/20W
R370 1-240-679-91 METAL CHIP 47 5% 1/20W
R371 1-240-679-91 METAL CHIP 47 5% 1/20W
R372 1-240-679-91 METAL CHIP 47 5% 1/20W
R373 1-240-679-91 METAL CHIP 47 5% 1/20W
R374 1-240-679-91 METAL CHIP 47 5% 1/20W
R375 1-240-679-91 METAL CHIP 47 5% 1/20W
R376 1-240-679-91 METAL CHIP 47 5% 1/20W
R377 1-240-679-91 METAL CHIP 47 5% 1/20W
R378 1-240-683-91 METAL CHIP 100 5% 1/20W
R379 1-240-683-91 METAL CHIP 100 5% 1/20W
R380 1-240-683-91 METAL CHIP 100 5% 1/20W
R381 1-240-683-91 METAL CHIP 100 5% 1/20W
R382 1-240-683-91 METAL CHIP 100 5% 1/20W
R383 1-240-683-91 METAL CHIP 100 5% 1/20W
R384 1-240-683-91 METAL CHIP 100 5% 1/20W
R385 1-240-683-91 METAL CHIP 100 5% 1/20W
R386 1-208-668-11 METAL CHIP 240 0.5% 1/16W
R401 1-694-535-91 SHORT CHIP 0
*R408 1-248-350-11 RES-CHIP 1.5 1% 1/3W
R410 1-694-535-91 SHORT CHIP 0
R418 1-208-711-11 METAL CHIP 15K 0.5% 1/16W
R431 1-218-948-11 METAL CHIP 390 5% 1/16W
R438 1-218-947-11 METAL CHIP 330 5% 1/16W
R439 1-218-947-11 METAL CHIP 330 5% 1/16W
R441 1-694-535-91 SHORT CHIP 0
R463 1-208-721-11 METAL CHIP 39K 0.5% 1/16W
R464 1-208-721-11 METAL CHIP 39K 0.5% 1/16W
R465 1-218-958-11 METAL CHIP 2.7K 5% 1/16W
R466 1-218-958-11 METAL CHIP 2.7K 5% 1/16W
R467 1-208-703-11 METAL CHIP 6.8K 0.5% 1/16W
R468 1-208-703-11 METAL CHIP 6.8K 0.5% 1/16W

DSC-HX20/HX20V/HX30/HX30V_L3
2-4E
Ref. No. Part No. Description
R471 1-250-519-11 METAL CHIP 10K 1% 1/16W
R472 (Not supplied) METAL CHIP 1.1K 1% 1/16W
R473 1-218-973-11 METAL CHIP 47K 5% 1/16W
R477 1-240-707-91 METAL CHIP 10K 5% 1/20W
R478 1-240-707-91 METAL CHIP 10K 5% 1/20W
R701 1-240-699-91 METAL CHIP 2.2K 5% 1/20W
R702 1-240-699-91 METAL CHIP 2.2K 5% 1/20W
R704 1-694-535-91 SHORT CHIP 0
R705 1-218-945-11 METAL CHIP 220 5% 1/16W
R706 1-694-535-91 SHORT CHIP 0
R708 1-240-695-91 METAL CHIP 1K 5% 1/20W
R719 1-218-990-81 SHORT CHIP 0
R720 1-218-990-81 SHORT CHIP 0
< COMPOSITION CIRCUIT BLOCK >
RB261 1-234-378-21 RES, NETWORK 10K (1005X4)
< SENSOR >
SE401 8-826-002-51 GYRO SENSOR GSU-X370D/N-S
< THERMISTOR >
TH051 1-805-194-21 THERMISTOR, NTC (SMD)
TH261 1-805-194-21 THERMISTOR, NTC (SMD)
< VIBRATOR >
X101 1-781-525-11 VIBRATOR, CRYSTAL (32.768kHz)
X206 1-487-897-31 SILICON OSCILLATOR (12MHz)
SY-325

4-1
DSC-HX20/HX20V/HX30/HX30V_L3
4. BLOCK DIAGRAMS
4-1. OVERALL BLOCK DIAGRAM( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.
CN101
MT_+
MT_-
SP +/-
MT_+
MT_-
ST-281
FLEXIBLE
BOARD
M
S001
FLASH
UNIT
M901
STROBE
UP/DOWN
SP+/-
: VIDEO SIGNAL
: VIDEO/AUDIO SIGNAL
CN707
(MICRO USB)
: AUDIO SIGNAL
IC051
USB
INTERFACE
(2/9)
IC052
SMART POWER
SELECTOR
(2/9)
CP401
FM
MODULE
(5/5)
CN706
XRESET_REQ
TE0_SDWP
D707
MSX_INS_HIZ_MPU
IC_202_CRADLE_UO/UI
USBIF_RST
USB_ID
XINT_IF
I2C_SCK/SDA
EN_HW
IBUS_DEFUSB_CUR_LIM
XUSB_PWR_EN
XINT_CHG
TE0_XSDCD
D706
MSX_D0 - D7, MSX_CLK/BS
SD_DAT0 - DAT3, SD_CLK/CMD
LENS
LENS BLOCK
IRIS
(METER)
IRIS
MOTOR
M
M
M
PITCH
MOTOR
M
M
M
YAW
MOTOR
FOCUS
MOTOR
SHUTTER
MOTOR
ZOOM
MOTOR
OPTICAL
IMAGE
STABILIZER
SW-589 BOARD
CD-840
FLEXIBLE
BOARD
CMOS
IMAGER
CP001
IMGR_RST
DOAP, DOAM, DOBP, DOBM,
DOCP, DOCM, DODP, DODM,
DOEP, DOEM, DOFP, DOFM,
DOGP, DOGM, DOHP, DOHM,
DOIP, DOIM, DOJP, DOJM ,
XVS
XHS
DCKP, DCKM
SDI/SDO
SCK/XCE
OSC_CLK_OUT
SY-325 BOARD
CN405
ND+/-
SHUTTER+/-
FOCUS+/-
ZM_SENS_1ST
XZM_RST_LED
PITCH_HALL+/-, PITCH_BIAS-
ZOOM+/-
XZM_FG_LED
ZM_DC_FG_A/B
YAW+/-
YAW_HALL+/-, YAW_BAIS-
PITCH+/-
LENS_TEMP
MR +/-
SENS_DATA_P1-P10 , SENS_DATA_M1-M10
IMGR_RST
SENS_SI/SO
CN701
SENS_SCK/XCS
SENS_VD
SENS_HD
SENS_CLK_P/M
CMOS_CLK_OUT
JOGDIAL_A/B
KEY_AD1
KEY_AD2
XDIRECT_PB
JOGDIAL_A/B
KEY_AD1
KEY_AD2
XDIRECT_PB
CN702CN901
SW-592
FLEXIBLE
BOARD
S801-S805
MSHUT_EN, MSHUT_DIR
IRIS_DIR_B, IRIS_BRK_B
X206
12MHz
ZM_BRK_A
STRB_POP_BRK_A
STRB_POP_DIR_A
XSYS_RESET
XCS_IC_401
CLK_IC_401
IC_401_SI/SO
IC_401_SCK
CAM_V
IC_401_P_LIMIT
IC_401_EXPOSE
XIC_401_RST
IC_401_INT_REQ
PITCH_AD
YAW_AD
MT_+, MT_-
IC_202_VD
XZM_FG_LED
ZM_DC_FG_A/B
ZM_SENS_1ST
XZM_RST_LED
LENS_TEMP
IC_201_SI/SO/CLOCK
XMS_ACC_LED
(5/9 - 7/9)
IC202
CPU,
CAMERA, DSP,
AV SI GNAL
PROCESS,
LENS CONTROL,
MODE CONTROL,
HDMI PROCESS
IC401
OIS DRIVE,
IRIS MOTOR DRIVE,
FOCUS MOTOR DRIVE,
ZOOM MOTOR DRIVE,
SHUTTER MOTOR DRIVE
(8/9)
XSYS_RESET
D705
(MS ACCESS)
BATTERY
DETECTOR
(4/9)
IC201
XCS_IC_201
XIC_201_SCK
XSTRB_FULL
STRB_CHG
STRB_CHG_CNT
STRB_ON
XAF_LED
XSTRB_FULL
STRB_CHG
CN705
STRB_CHG_CNT
STRB_ON
D703
XSTRB_POPUP_SENS
XSTRB_POPDOWN_SENS
XSTRB_POPUP_SENS
XSTRB_POPDOWN_SENS
BT-077 FLEXIBLE BOARD
ST_UNREG
Q101
FLASH
DRIVE
08
CHARGE
CONTROL,
FLASH
CONTROL
(2/2)
IC101
XE_H
TRIGGER
XE_L
+
C901, C902
CHARGING
CAPACITOR
D101
5
4 6
1
T101
LCD_CLK_OUT
LCD_VS
LCD_R_D0 - D7, LCD_G_D0 - D7, LCD_B_D0 - D7
LCD_HS
BL_L
BL_H
CN704
DC/DC
CONVERTER,
POWER
CONTROL
(1/9)
IC001
X101
32.768kHz
XRESET_REQ
XCS_DD
CABC_PWM
XWAKE
XSYS_RESET
BL_H/L
IC_202_I2S_SDI0/SDO
IC_202_I2S_WCLK/BCLK
SP+/-
MIC_SIG_L
MIC_SIG_R
I2C_SCK/SDA
ACC_INT
MODE_DIAL0
MODE_DIAL1
KEY_AD0
XAE_LOCK
XSHUT_SW
XPOWER_LED
XUSB_LED
MIC_SIG_L
MIC_SIG_R
I2C_SCK/SDA
ACC_INTACC_INT
XUSB_LED
XPOWER_LED
FRONT CONTROL ,
AUDIO
PROCESSOR
(3/9)
IC101
XCS_AUDIO
XDIRECT_PB
IC_202_AUDIO_MCLK
MICBIAS_L
MICBIAS_R
XCS_LCD
XSYS_RESET
3.0 INCH
COLOR
LCD
LCD BACKLIGHT
LCD901
(LCD MODULE)
XAF_LED
XWAKE
XMS_IN
XEXT_IN
MODE_DIAL_0
MODE_DIAL_1
KEY_AD_0
XAE_LOCK_SW
XSHUT_SW
XPOWER_LED
MIC_SIG_R
MIC_SIG_L
Q206
LEVEL SHIFT
Q207
LEVEL SHIFT
CN708
CN703 CN001
HDMI_SCL
HDMI_SDA
HPD
HDMI_CEC
HDMI_CLOCKP/CLOCKN
HDMI
AV_ SO, AV_S CK
AV_SI/SO, AV_SCK
AV_SI/SO, AV_SCK
AV_SI/SO, AV_SCK
HDMI_DATA0P/N - HDMI_DATA2P/N
XSYS_RESET
ID_VIDEO
MICROPHONE
UNIT
D001, D002
S001, S005 - S007
RL-130
FLEXIBLE
BOARD
RL-129 BOARD
CN002
(1/2)
WLAN_SD_ / DAT0-DAT3, CMD
WLAN_SD_CLK
XWLAN_RST
WLAN_SD_ / D0 - D3, CMD
WLAN_SD_CLK
XWLAN_RST
SP901
(SPEAKER)
D001
SELF-TIMER,
SMILE SHUTTER,
AF ILLUMINATOR
4
G3
H2
H3
L1
8
11
10
5,7
30,31
20-29, 32-41
2, 3
14
5, 61 - 430 - 3324,2934, 3537,39
21
23
17, 18, 2013,149,11,12 25,27
15 , 16
8
ZOOM
FG
ZOOM
RESET
SENSOR
FOCUS
RESET
SENSOR
LENS TEMP
SENSOR
HALL
ELEMENT
HALL
ELEMENT
F5
D1
E3
PITCH/YAW
SENSOR
(8/9)
SE401
AF2
AC30
AK28
AK29
AC29
P25
AB17
B2
12
13
14
15
4
7
3
5
6
W2
W1
31
1
2
30
59, 58 5 - 28
29
60
57
E5
D1
E1
AH2
8,9,5,6,2,311, 12
15
14
19
16
C3
21
19
15, 16
3
6
21
19
15, 16
17 17
7
8
2
10
9
3
4
C4
AF21
2,3
3
4
7
8
2
10
9
19,2021,22 3 - 58 - 10
13
17
16
23, 24
3
4
5
18
17
16
19,20
8
2
3 - 7
13
19
14-18 1, 2
K19
K16
1, 2
AE20
XMS_IN
USB_CN_DM/DP
USB_DM/DP
TE0_SDWP
XEXT_IN
26
25
24
18
MEMORY
STICK
PRO DUO
SD
Q052
SWITCH
SE301
3 AXIS
ACCELERATION
SENSOR
(4/5)
SE201
ELECTRONIC
COMPASS
SENSOR
(3/5)
SE101
ROLL
SENSOR
(2/5)
ROLL_AD
GPS
RECEIVER
(5/5)
IC404
LEVEL SHIFT
(5/5)
IC403
Q402
GPS_TX_M
GPS_RTS_M
GPS_RX_M
GPS_CTS_M
BUF_ENABLE
GPS_RST_M
IC_202_GPS_UI
IC_202_GPS_CTS
IC_202_GPS_UO
IC_202_GPS_RTS
IC_202_RDY
GPS_RST
IC_202_GPS_UI
IC_202_GPS_CTS
IC_202_GPS_UO
IC_202_GPS_RTS
IC_202_RDY
GPS_RST A4 D1
X40132.768kHz
ANT401
(GPS ANTENNA)
X402
16.368MHz
H5
H4
26
27
24
25
23
31
26
27
24
25
23
31
2,4,7,8,10,11,
13,16,17,20
1,3,6,15
21,23
14
Wi-Fi
MODULE
(2/2)
CP901
26 2
11
ANT901
(Wi-Fi ANTENNA)
X90126MHz
HX30/HX30V
ROLL SENSOR
AMP
(2/5)
IC101
ROLL_AD
VST_C_RESET_R
13
11
13
11
VST_C_RESET_R
ROLL_AD
VST_C_RESET_R
HX20V/HX30V

DSC-HX20/HX20V/HX30/HX30V_L3
4-2E
4-2. POWER BLOCK DIAGRAM ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.
ST-281
FLEXIBLE
BOARD
CN101
FLASH
UNIT
+
C901
CHARGING
CAPACITOR
+
C902
CHARGING
CAPACITOR
BT001
LITHIUM
BATTERY
DC/DC CONVERTER,
POWER CONTROL
(1/9)
IC001
SY-325 BOARD
BATT_SIG
USB_VBUS_DET
DD_3.1V
XPWR_ON
USB_VBUS_LED
A_3.1V
D002
S
+
D_VID
EXT_VCC
CN707
BATT_UNREG
F001
L006
L002
BL_L
IN1 (FB_1)
LX8
OVP8
–
BT901
BATTERY
TERMINAL
CN704
CN705 (2/2)
ST_UNREG
BT-077 FLEXIBLE BOARD (2/2)
D101
T101
L101
CHARGE CONTROL,
FLASH CONTROL
(2/2)
IC101
DD_3.1V
ST_UNREG
DD_3.1V
BL_H
BL_L
LCD
BACKLIGHT
3.0 INCH
COLOR
LCD
LCD901
(LCD MODULE)
DD_3.1V
CN701
CMOS
IMAGER
CP001
CD-840 FLEXIBLE BOARD
LX1
L007
L701
DD_3.1V
DD_1.8V
2.8V REG
(8/9)
IC402
VDD
CE
IC_401_2.8V
PITCH/YAW
SENSOR
(8/9)
SE401
REG_UNREG
MS_VCC
DD_1.2V
L003
IN2 (FB_2)
LX2
LDOEN
DD_1.8V
L001
IN3 (FB_3)
LX3
IN5 (FB_5)
VO5
VDD Vout
1.125V REG
(1/9)
IC002
LDO_1.125V
IN4 (FB_4)
VO4
DD_3.1V
MS_PSW
AUX_PSW EXT_VCC
MS_VCC
5.0V REG
(1/9)
IC004
VDD
CE
VOUT
PSWOUT5 MT_5.0V
HDMI_5.0V
HDMI_5V_ON
BL_H
VL8
MS_PWR_ON
AUX_PWR_ON
LDO_1.125V
DD_3.1V
DD_3.1V
BATT_SIG
DD_1.8V
DD_1.2V
EXT_VCC
DDR_1.2V
DDR_1.8V
D_VID
MS_PWR_ON
SD_PWR_ON
HDMI_5V_ON
SD_PWR_ON
MS_PWR_ON
DD_1.2V
VDD Vout
CE
2.8V REG
IC001
LDO_EN
D_LGC_1.2V
A_3.1V
LDO_CONT
HDMI_5.0V
CN708
HDMI
CN405
LENS BLOCK
FOCUS
RESET
SENSOR
OPTICAL
IMAGE
STABILIZER
IC_401_2.8V
VOUT2
XPWR_ON2
XPWR_OFF
XPWR_OFF
EVER_VDD
BATT_SENS
D001
BACKUP_VDD
IC101
FRONT CONTROL,
AUDIO PROCESSOR
(3/9)
IC_401_2.8V
IC_401_2.8V
IC_401_2.8V
DD_3.1V
DD_3.1V
MT_5.0V
DD_1.2V
VOUT
VO_5V
ST_UNREG
UNREG_MON
VBAT
XPWR_ON1
CN705 (1/2)
CN703CN001
UNREG
08
BACKUP_VDD
EVER_VDD
XPWR_ON4
XUSB_PWR_ON
BT-077
FLEXIBLE
BOARD
(1/2)
RL-130
FLEXIBLE
BOARD
SW-592
FLEXIBLE
BOARD
RL-129 BOARD
DD_1.8V IO_1.8V
DD_3.1V
DD_1.8V
REG_UNREG
XPWR_ON
REG_UNREG
BATT_SENS
USB_VBUS_IC_202
XPWR_OFF
Q051
B+
SWITCH
IC052
SMART
POWER
SELECTOR
(2/9)
IC051
USB
INTERFACE
(2/9)
EXTIN_CLK1
D001, D002
SE301
3 AXIS
ACCELERATION
SENSOR
(4/5)
SE201
ELECTRONIC
COMPASS
SENSOR
(3/5)
SE101
ROLL
SENSOR
(2/5)
IC_401_2.8V
MT_5.0V
IC_401_2.8V
X206
12MHz
AF2
SW-589 BOARD
CN702CN901
BACKUP_VDD
CE
B1
A2
B3
C1
D2
G1
G2
D5
A5
B4
1
4
B7
C7
A7
A8
4
3
1
F1
H4
F4
G5
B6
B5
46
44,45
41
3
48,49
1
2
40, 5232, 33
11
9, 10
8
10, 19, 38
C3
V25
F2
D3
D4
18
12
19
E3
AD16
C1
21-24
3
1
4
AF10
P24
E2
K13
AJ20
G3, G4
F4
AB10
16,17
IC201
BATTERY
DETECTOR
(4/9)
D705
(MS ACCESS)
F053
CN706
MICRO
USB
USB_VBUS SYS_A,
SYS_B
BAT_A,
BAT_B
VB VOUT
F051
BUS_A,
BUS_B
THM
nENU_EN_HW
TH051
F052
DD_3.1V
USB_VBUS_DET
1
B3,A3
A1,B1,B2
A2,A3,B3
B5,A5
E2
USB_VBUS_IC_202
GCNT
A4
B4,A4
DD_3.1V
LDO_EN
DD_1.2V
VO_5V
DD_1.8V
Q056
IC401
OIS DRIVE,
IRIS MOTOR DRIVE,
FOCUS MOTOR DRIVE,
ZOOM MOTOR DRIVE,
SHUTTER MOTOR DRIVE
(8/9)
IC003
DC/DC
CONVERTER
(1/9)
IC202
CPU,
CAMERA DSP
AV SIGNAL PROCESS,
LENS CONTROL,
MODE CONTROL,
HDMI PROCESS
(5/9 - 7/9)
HOT_STBY_OUT
HOT_STBY_IN
GPIO_SB_1
ADC1_IN9
GPIO_S_6
GPIO_S_3
CLK_SYS_IN
GPIO_S_2
FRC_RTG_IN1
FRC_RTG_OUT2
USB_VBUS
S002
ON/OFF
D001
SELF-TIMER,
SMILE SHUTTER,
AF ILLUMINATOR
12
10
11
14
9
11
10
7
3
16-19
1414
1818
55
66
20
MEMORY
STICK
PRO DUO
SD
R25
R24
C3
A4XMASK
B3
STBY_IN
STBYOUT
3 - 5
VOUT1VDD4REG_UNREG
GPS_UNREG
EVER_VDDEVER_VDD
GPS_ON
CE 3
1.8V REG
(5/5)
IC402
D403
D401
OUT2VDD
4
2.8V REG
(5/5)
IC401
FM MODULE
(5/5)
CP401
GPS
RECEIVER
(5/5)
IC404
TIMER G5
AVDD28_
TLDO_SW G2
32,33 32,33
29
30
29
30
12 12
ROLL SENSOR AMP
(2/5)
IC101
VOUT A1 VIN A2
DD_3.1V
ON B2
LAN LOAD SW
IC901
VOUT A1 VIN A2
DD_1.8V
DD_3.1V
DD_1.8V
ON B2
LAN LOAD SW
IC902
Wi-Fi
MODULE
(2/2)
CP901
X90126MHz
WLAN_VL_ON
WLAN_VH_ON
WLAN_VL_ON
WLAN_VH_ON
(2/2)
(2/2)
HX20V/HX30V
HX30/HX30V

DSC-HX20/HX20V/HX30/HX30V_L3
5-1E
5. FRAME SCHEMATIC DIAGRAMS
S005
(SHUTTER)
S006
S002
32 2
33
33
33
1
1
1
CN001
16
CN002
(ZOOM)
ON/OFF
S001
(CUSTOM)
S007
(MODE DIAL)
MICROPHONE
UNIT
CN405
SE401
(PITCH/YAW)
CN701
CN702
CN703
CN704
20 1
22 2
32 2
33 1
50
2
51
1
39
2
38
1
60
2
61
1
119
23
22 21
20
51
27
26
1
28
CN705
CN706
CN707
26 25
24 1
CN901
20 1
S804
(MOVIIE, REC) S801
S805
(DELETE)
S802
S803
(CURSOR KEY)
MENU
22 21
IC201
(Not supplied)
CP001
(Not sipplied)
MM
CN101
26 25
24 1
1
24
LENS BLOCK
SY-325
BOARD
(SIDE A)
SW-592 FLEXIBLE
BOARD SW-589 BOARD
(SIDE B)
RL-129 BOARD (SIDE B)
CD-840 FLEXIBLE BOARD
BT-077 FLEXIBLE
BOARD
SW-589 BOARD
(SIDE A)
SY-325
BOARD
(SIDE B)
LCD901
(LCD MODULE)
LCD BACKLIGHT
3.0 INCH
COLOR
LCD
CN708
(USB)
120
RL-130 FLEXIBLE
BOARD
S
RL-129 BOARD
(SIDE A)
1
51
ST-281 FLEXIBLE BOARD S001
STROBE
POSITION
DETECT
FLASH
UNIT
M901
STROBE
UP/DOWN
124
BT901
BATTERY
TERMINAL
C901
CHARGING
CAPACITOR
C902
CHARGING
CAPACITOR
SP901
(SPEAKER)
BT001
(LITHIUM BATTERY)
120

6-1
DSC-HX20/HX20V/HX30/HX30V_L3
6. SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS
– ENGLISH – – JAPANESE –
THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS AND PRINTED WIRING BOARDS.
(In addition to this, the necessary note is printed in each block.)
For Schematic Diagrams
• All capacitors are in μF unless otherwise noted. pF : μμF. 50
V or less are not indicated except for electrolytics and tantal-
ums.
• Chip resistors are 1/10 W unless otherwise noted.
kΩ=1000 Ω, MΩ=1000 kΩ.
• Caution when replacing chip parts.
New parts must be attached after removal of chip.
Be careful not to heat the minus side of tantalum capacitor,
Because it is damaged by the heat.
• Some chip part will be indicated as follows.
Example C541 L452
22U 10UH
TA A 2520
Kinds of capacitor External dimensions (mm)
Case size
• Constants of resistors, capacitors, ICs and etc with XX indicate
that they are not used.
In such cases, the unused circuits may be indicated.
• Parts with ★differ according to the model/destination.
Refer to the mount table for each function.
• All variable and adjustable resistors have characteristic curve
B, unless otherwise noted.
• Signal name
XEDIT → EDIT PB/XREC →PB/REC
•: non flammable resistor
• : fusible resistor
• : panel designation
• : B+ Line
• : B– Line
• : IN/OUT direction of (+, –) B LINE.
• : adjustment for repair.
For Printed Wiring Boards
• : Uses unleaded solder.
•: Circuit board
: Flexible board
Pattern from the side which enables seeing.
: pattern of the rear side
(The other layers’ patterns are not indicated)
• Through hole is omitted.
• There are a few cases that the part printed on diagram isn’t
mounted in this model.
• : panel designation
• Chip parts.
Transistor Diode
21
3
21
3
21
3
345
21
123
654
EB
C
31
5
2
46
123
654
31
5
2
46
123
54
43
12
312
45
534
12
14
23
46
2
5
31
12
43
14
23
Precautions for Replacement of Imager
• If the imager has been replaced, carry out all the adjustments
for the camera section.
• As the imager may be damaged by static electricity from its
structure, handle it carefully like for the MOS IC.
In addition, ensure that the receiver is not covered with dusts
nor exposed to strong light.
When indicating parts by reference num-
ber, please include the board name.
The components identified by mark 
or dotted line with mark are critical
for safety.
Replace only with part number speci-
fied.
Les composants identifiés par une mar-
que sont critiques pour la sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
回路図，プリント図共通ノート
（他に必要なノートは各セクションに記載しています）
回路図ノート
・ ケミコン，タンタルを除くコンデンサで，耐圧50V以下のも
のはその耐圧を省略。単位はすべてμF（pはpF）。
・ チップ抵抗で指示のないものは，1/10W以下。
 kΩ＝1000Ω，MΩ＝1000kΩ
・ チップ部品交換時の注意
 取り外した部品は再使用せず，未使用の部品をご使用くだ
さい。
 タンタルコンデンサのマイナス側は熱に弱いため注意して
ください。
・ チップ部品には下記のように表示したものがあります。
 例 C541 L452
  22U 10UH
  TA A 2520
  種類 外形寸法（mm）
  ケースサイズ
・ 抵抗，コンデンサ，ICなど定数にXXがあるものは，使用し
ていない事を示しています。このため，使用していない回
路が記載されている事があります。
・ ★印のある部品は，機種などにより異なりますので機能別
マウント一覧表を参照してください。
・ 可変抵抗と半固定抵抗で，B特性の表示を省略。
・ 信号名表記について，下記のような場合があります。
 XEDIT → EDIT PB/XREC → PB/REC
・ は不燃性抵抗。
・ はヒューズ抵抗。
・ はパネル表示名称。
・ はB＋ライン。
・ はB−ライン。
・ はBライン（＋，−）の入出力方向を示す。
・ は調整名称。
プリント図ノート
・ ：無鉛半田を使用しています。
・ ：基板
 ：フレキシブル配線板
 見ている面側のパターン。
 ：裏側のパターン
 （他のパターンについては表示されていません）
・ スルーホールは省略。
・ プリント図には，本機で使用していない部品が記載されて
いる場合があります。
・ はパネル表示名称。
• Chipparts.
 Transistor Diode
21
3
21
3
21
3
345
21
123
654
EB
C
31
5
2
46
123
654
31
5
2
46
123
54
43
12
312
45
534
12
14
23
46
2
5
31
12
4
3
14
23
イメージャ交換時の注意
・ イメージャを交換した場合は，カメラ部の全調整を行って
ください。
・ イメージャは構造上，静電気により破壊される恐れがある
ため，MOSICと同様に注意して取り扱ってください。
 また，受光部にはゴミの付着，および強い光がはいること
のないように注意してください。
図面番号で部品を指定するときは基板名又はブロック
を併せて指定してください。
お願い
印の部品，または印付の点線で囲まれた部品は，
安全性を維持するために，重要な部品です。
従って交換時は，必ず指定の部品を使用してください。