Sony MDR-IF4000 User manual

MDR-IF4000
US Model
Canadian Model
AEP Model
E Model
SERVICE MANUAL
CORDLESS STEREO HEADPHONE
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-879-301-02
2005B02-1
© 2005.02
SPECIFICATIONS
Ver. 1.1 2005. 02
General
Modulation System
DQPSK-IM
Secondary carrier wave frequency
3.75 MHz
Playback frequency range
10 – 22,000 Hz
Power requirements
Rechargeable nickel-metal hydride
batteries (supplied) or commercially
available (size AAA) alkaline batteries
Mass Approx. 300 g (11 oz) (including the
supplied rechargeable nickel-metal
hydride batteries)
Supplied accessories
Rechargeable nickel-metal hydride
batteries
BP-HP550 (550 mAh min.) (2)
Operating Instructions (1)
Design and specifications are subject to change without notice.
•The MDR-IF4000 is the cordless stereo
headphones that comprises the MDR-
DS4000.
• MDR-DS4000 consists of the following models respectively.
Cordless stereo headphone MDR-IF4000
Digital surround processor DP-IF4000

2
MDR-IF4000
TABLE OF CONTENTS
Specifications ............................................................................ 1
1. GENERAL ................................................................... 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 4
2-2. Front Plate (R) Assy ........................................................ 4
2-3. RX Board ......................................................................... 5
2-4. Hunger (R) ....................................................................... 5
2-5. Wiring On The Right Side ............................................... 6
2-6. Front Plate (L) Assy ........................................................ 6
2-7. Batt Board ........................................................................ 7
2-8. Hanger (L) ....................................................................... 7
2-9. Wiring On The Left Side ................................................. 8
2-10. Hunger Lid (L) ................................................................ 8
2-11. Wiring On The SW Board ............................................... 9
2-12. How To Hang The Tension Spring .................................. 9
3. DIAGRAMS
3-1. Circuit Boards Location .................................................. 10
3-2. Block Diagrams ............................................................... 11
3-3. Printed Wiring Board – Receiver Section – .................... 12
3-4. Printed Wiring Board – Power Section – ........................ 13
3-5. Schematic Diagram – Receiver Section – ....................... 14
4. EXPLODED VIEWS
4-1. Housing (L) Assy Section ................................................ 17
4-2. Housing (R) Assy Section ............................................... 18
5. ELECTRICAL PARTS LIST .................................. 19
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• Repaier DP-IF4000 with MDR-IF4000.

3
MDR-IF4000
SECTION 1
GENERAL
This section is extracted
from instruction manual.
LOCATING THE CONTROLS
1Ear pad (left)
2Battery case button
3Battery case
Press the button of the left housing to
open the battery compartment lid.
This battery case is for the rechargeable
nickel-metal hydride batteries (supplied)
or commercially available (size AAA)
alkaline batteries only.
4Infrared sensor
There are infrared sensors in two
locations on both sides.
5Self-adjusting band
The headphones automatically turn on
when you put them on.
6VOL (Volume) control
Use to ad ust the volume.
7Ear pad (right)
8POWER indicator
By pulling up the self-ad usting band, the
indicator lights red when battery power is
sufficient.

4
MDR-IF4000
SECTION 2
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
2-2. FRONT PLATE (R) ASSY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
2-2. FRONT PLATE (R) ASSY
(Page 4)
2-6. FRONT PLATE (L) ASSY
(Page 6)
2-3. RX BOARD
(Page 5)
2-4. HANGER (R)
(Page 5)
2-7. BATT BOARD
(Page 7)
2-8. HANGER (L)
(Page 7)
2-10.HANGER LID (L)
(Page 8)
2-9. WIRING ON THE
LEFT SIDE
(Page 8)
2-11.WIRING ON THE
SW BOARD
(Page 9)
2-12.HOW TO HANG
THE TENSDION
SPRING
(Page 9)
2-5. WIRING ON THE
RIGHT SIDE
(Page 6)
SET
1 ear pad (R)
4 Removal the solder at 2 places.
2 two screws
(P 2.6x6)
3 screw (P 2.6x6)
5 front plate (R) assy
from RX board
driver (R-CH) side
housing (R) assy
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
Connect a red lead to
the marked one of the
driver terminals.
natural
RED

5
MDR-IF4000
2-3. RX BAORD
2-4. HANGER (R)
2
1 Removal the solder at 9 places.
3 RX board
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
housing (R) assy
to PD2 board
cushion (B)
to BATT board
and driver (L-CH)
to BATT board
and driver (L-CH)
to driver
(R-CH)
WHT
BLK
natural
natural
natural
RED
RED
GRN
GRN
5 hanger (R
)
Pay attention to the leads
when assembling.
Pay attention to the leads
when assembling.
3
2
4
1 two screws (P2.6 x 6)
hanger lid (R)
projection

6
MDR-IF4000
2-5. WIRING ON THE RIGHT SIDE
2-6. FRONT PLATE (L) ASSY
RD1 board (R-CH front)
RD2 board (R-CH rear)

1 ear pad (L)
4 Removal the solder at 2 places.
2 two screws
(P 2.6x6)
3 screw (P 2.6x6)
5 front plate (R) assy
from RX board
driver (R-CH) side
housing (L) assy
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
natural
natural GRN
GRN RED
Connect a green lead to
the marked one of the
driver terminals.

7
MDR-IF4000
2-7. BATT BOARD
2-8. HANGER (L)
3
4 BATT board
1 Removal the solder at 4 places.
2 two screws
(P 2.6x6)
to RX board
to RX board
to SW board
to driver (L-CH)
housing (L) assy
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
natural
natural
RED
RED
RED
GRN
GRN
2
3
4
5 hanger (L)
Pay attention to the leads
when assembling.
Pay attention to the leads
when assembling.
1 two screws (P2.6 x 6)
hanger lid (L)
projection

8
MDR-IF4000
2-9. WIRING ON THE LEFT SIDE
2-10. HANGER LID (L)
RD2 board (L-CH front)
RD1 board (L-CH rear)
3 head band
hanger lid (L)
1 screw (P2.6 x 6)
2 screw (P2.6 x 6)

9
MDR-IF4000
2-11. WIRING ON THE SW BOARD
2-12. HOW TO HANG THE TENSION SPRING
head ban
d
cushion (B)
SW board

SW board
suspender assy
suspender assy
S701
housing (L) assy
hanger lid (L)
tension spring
Note for installation : Insert the end of the
suspender assy under
the S701 on SW board.

10
MDR-IF4000 SECTION 3
DIAGRAMS
For schematic diagrams.
Note:
•All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4 W or less unless otherwise
specified.
•f: internal component.
•C: panel designation.
•A: B+ Line.
•H: adjustment for repair.
•Power voltage is dc 2.4 V and fed with regulated dc power
supply from battery terminal.
•Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
F: ANALOG
J: RF
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
For printed wiring boards.
Note:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•f: internal component.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Waveforms
1V/DIV, 50 ns/DIV
3.5Vp-p
12.288 MHz
1 IC101 rd OSCO
3-1. CIRCUIT BOARDS LOCATION
RX board
BATT boar
d
SW board
RD2 board
(R-CH REAR)
RD1 board
(R-CH FRONT)
RD2 board
(L-CH FRONT)
RD1 board
(L-CH REAR)

MDR-IF4000
1111
MDR-IF4000
3-2. BLOCK DIAGRAM
31 16
60 2
54 3
59 1
105 16
I/V
AMP
IN ADIN
SCKI
DATA
BCK
LRCK
PD
+2.5V
IC102
RESET
OUT
DAOUT/
ROUT
BCK/RCLK
LRCK/RCS
8 4
VOUTR
4
13
XRST
61
DTVALID
APX
A/D
CONTROL
RAM
IC101
IR RECEIVER/DSP
IC201
D/A CONVERTER
IC001
FRONTEND
D401-408
IR
RECEIVER
DEMODULATOR
DATA BUS
OUTPUT I/F
SID/
GCA/
BPF
Q302
MUTE
RV201
IC302
HEADPHONE
AMP
IC301
HEADPHONE
AMP
Q301
MUTE
Q101
MUTE
DRIVE
5
8
SP001
SPEAKER
(R CH)
9 4
VOUTL
5
8
SP002
SPEAKER
(L CH)
1VOUT 2
VDD
IC501
+1.5V
REGULATOR
IC503
+2.8V DC/DC
CONVERTOR
5VOUT
OUT LX
D601D501
D502
POWER
S602
S701 S701
AUTO
ON/OFF
S601
2
VIN
1 2
+1.5V
+2.5V
IC502
+2.5V
REGULATOR
5VOUT 1
VIN Q601,602
+B SWITCH
IC601
LEVEL DETECT
BATTERY
DETECT CHARGE
TERMINAL
RECHARGEABLE
BATTERY
(BP-HP550)
1.2V 550mAhX2
w
VOL
・SIGNAL PATH
: RF
: ANALOG

MDR-IF4000
1212
MDR-IF4000
3-3. PRINTED WIRING BOARD – RECEIVER SECTION – : Uses unleaded solder.
13
54
1
12
24
13
1732
64
49
33
48
16
1
1
8
16
9
14
85
1 4
8 5
E
E
E
1
3
5
4
+B SIG
+B
+B
+B
+B
+B
+B
SIG
SIG
SIG
SIG
SIG
D502
IC201
R110
C007
C124
C123
C119
L109
C120
C125
C121
L101
R101
L102
R102
L105
R103
C105
C104
C103
C110
C116
C210
C204
C208
L201
C206
C207
C108
L107
R104
C109
C112
C107
C311
C313
C314
C305
R307
C310
L104
C102
L103
C101
R502
L303
C113
C304
D104
R112
C117
D103
R107
L004
C003
C017
C005
C126
R109
C010
C008
R111
C118
C001
C013
C016
C012
IC101
C014
C011
C002
R003
C111
R004
L002
C006
R001
R002
C115
C004
C015
L001
C009
L108
R108
L003
L304
R306
L306
C309
C317
IC302
L305
R308
C302
Q301
L301
R302
Q302
C301
C308
IC301
L302
R301
C202
C201
R201
RV201
R202
C203
L106
R106
D102
D101
Q101
X101
IC501
C509
R501
C501
C130
C303
C312
C307
C316
IC102
C315
C205
C306
C502
IC001
VOL
POWER
2.5V
GND
+B
D407
D405
D403
D401
D402
D404
D406
D408
11
(11)
1-864-936- 11
(11)
1-864-936-
11
(11)
1-864-939-
11
(11)
1-864-939-
11
(11)
1-864-938-
11
(11)
1-864-938-
A
BATT BOARD
(Page 13)
(GRN)
(NAT)
(RED)
-R
(NAT)+R (RED)-L
(NAT)+L (GRN)
SP001
DRIVER
(R-CH)
SP002
DRIVER
(L-CH)
RX BOARD (SIDE A)RX BOARD (SIDE B)
PD2 BOARD
(R-CH REAR SECTION)
PD1 BOARD
(R-CH FRONT SECTION)
PD2 BOARD
(L-CH FRONT SECTION)
PD1 BOARD
(L-CH REAR SECTION)
23 4 5 6 7 89 10
A
1
B
C
D
E
Ref. No. Location
D101 A-3
D102 A-3
D103 A-2
D104 C-3
D401 C-9
D402 C-9
D403 D-9
D404 D-9
D405 B-9
D406 B-9
D407 A-9
D408 A-9
D502 D-3
IC001 B-3
IC101 B-2
IC102 A-3
IC201 C-2
IC301 D-3
IC302 D-2
IC501 D-4
Q101 C-3
Q301 D-3
Q302 D-2
•Semiconductor Location

MDR-IF4000
1313
MDR-IF4000
3-4. PRINTED WIRING BOARD – POWER SECTION – : Uses unleaded solder.
E
E
1
1
1
3
5
4
3
5
4
3
IC601
R603
R601
RED
RED
RED
RED
Q602
D601
C604
C603
Q601
R602
R604
C506
L502
C510
C511
C507
C508
R503
C513
C516
C514
CHG(+)
BATT(+)
CHARGE
TERMINAL
CHG(
-
)
C602
C504
IC502
C505
IC503
C605
D501
C503
2.5V
(GRN)
(NAT)(RED)
GRN
+B
L501
S601
(BATT DET)S602 (BATT DET)
S701
(AUTO ON/OFF)
BAT101
RECHARGEABLE
BATTERY
BP–HP550
1.2V 550mAh. 2PCS
11
(11)
1-864-935-
11
(11)
1-864-937-
BATT(
-
)
A
RX BOARD
Suffix-11
(Page 12)
RX BOARD
Suffix-12
(Page 25)
BATT BOARD
SW BOARD
23 4 5 6 7
A
1
B
C
D
E
F
Ref. No. Location
D501 B-3
D601 E-4
IC502 D-3
IC503 B-3
IC601 E-3
Q601 D-4
Q602 D-4
•Semiconductor Location

MDR-IF4000
1414
MDR-IF4000
3-5. SCHEMATIC DIAGRAM – RECEIVER SECTION –
TP004
S601 D601
S602 NIMH1
NIMH2
C605 C604
C602
R602
R603
R601
R604
C603
C504
C505
L501 D501
C503
C510
L502
C506 C511
C507
C508
R503
TP505 C516
C513
C313
C312
R308
Q302
Q301
C310
R307
R106
C208
D104
R112
C117
C210
R107
D103
C130
IC102
R111
C126
C120
C121
L109
C119
R109
R110
C123 C124 C125
C118
D101
D102
017
C015
L004 C016
L106
C116
C110
TP103
C103
C101
C102
L104
L103
R103
L105
R501
C509
IC501
C501 C502
L201
C206
C204 C207
C205
C203
RV201
R302
C303
C309 R306
L306
L305
C316
C307
L303
L302
C301 R301
L301
R502
D502
C304
L108 R108
X101
C111
C113
C115
R004
R003
C001
C013
L002
C002
C010
C006
R001
L003
C011
C014
C012
R002
C009
C007
L001 IC001
L102 R102
R101
L101
C105
C104
IC201
R202
R201
R104
C109
C112
C108
L107
C107
C202
C302
C305
C311
C314
SP002
SP001
D404
D403
D401 D402
D405 D406
D407 D408
C003 C008
C005
C004
TP601
TP602
C514
C201
C306
C308
L304
C317
C315
IC302
IC301
Q101
Q601
Q602
IC601
IC503
IC502
S701
IC101
BATT DET RB501V-40TE-17
BATT DET NI-MH
NI-MH
10.01
2.2
100k
1k
10k
1M
0.01
100
10V
0.1
RB161M-20FTR
100
10V 4.7
10
10V 4.7
10
10V 0.1
10k
1
0.1
10
10V
100p
10k
UN2225-(TX)
MUTE
UN2225-(TX)
MUTE
10
10V
10k
10k
10
16V
1SS355TE-17
10k
10
10V
1
10k
1SS355TE-17
0.022
BU4223G
RESET
4.7k
0.1
0.1
22
6.3V
0.1
3.3k
820
0.01 0.1 0.1
1
1SS355TE-17
1SS355TE-17
0.1
0.1
0.001
0.1
0.1
0.1
0.1
0.1
1k
10k
0.1
XC62HR1502MR
1.5V REG
0.1 47
4V
0.1
47
4V 0.1
0.0022
0.0022
50k/50k
10k
100p
15p 68k 0.1
0.1
15p 68k
470
SLR-342VC3F
10
10V
1k
12.288MHz
15p
0.1
15p
1.5k
33k
0.0047
0.01
47
6.3V
330p
0.1
2.2k
0.0068
100p
0.0068
1k
22
6.3V
0.1
CXA3668N-T4
1k
1k
1
10
16V
PCM1773
1k
1k
68
1
1
47
6.3V
0.1
10
10V
10
10V
3.3
10V
10
10V
3.3
10V
040020
040020
PP508
PP508
PP508 PP508
PP508 PP508
PP508 PP508
10.1
10
16V
0.1
47
6.3V
10
10V
47
10V
0.1
0.1
47
10V
NJM2113V-TE2
HEADPHONE AMP
NJM2113V-TE2
HEADPHONE AMP
DTC144EE-TL
MUTE DRIVE
2SB1690K
+B SWITCH
2SC2412K-T
+B SWITCH
XC61CN1902NR
LEVEL DETECT
XC6371A281PR
+2.8V DC/DC
CONVERTOR
XC6219B252MR
+2.5V REG
(AUTO ON/OFF)
CXD4017R
VOL
POWER
BATTERY
RECHARGEABLE
1.2V 550mAh x 2
(L-CH)
(R-CH)
DRIVER
DRIVER
(R-CH
REAR SECTION)
(L-CH
(L-CH
FRONT SECTION)
B+
SIG
FRONTEND
IR RECEIVER/DSP
D/A CONVERTER
FRONT SECTION)
(R-CH
REAR SECTION)
CHARGE
TERMINAL
(
(
(BP-HP550)

15
MDR-IF4000
• IC BLOCK DIAGRAMS
IC101 CXD4017R
TEST7 SYMCLK ICLK
XTST
TESTMD
PLVAR
VSS
APVCI
APAVD
APCPO
APAVS
VDDI
VSS
VCOR
VDDE
CHNUM
DIVCODE
PLREF
33
302928272625
24
23222120191817
34
35
36
37
38
44
46
47
48
515253
45
39
40
41
42
43
ADVRH
ADAVS
ADAVD
ADVRL
ADVIN
VSS
TEST4
VDDE
OSCI
VSS
CSOD
SRDT
SWDT
XSCEN
SCLK
SCMODE
TEST3
TEST2
TEST1
TEST0
OSCO
A/D
CONVERTER
DEMODULATOR ERROR
CORRECTOR
OUTPUT
I/F
CLOCK
SELECTOR
BUFFER
RAM
CLOCK
GENERATOR
CONTROLLER
PLL
6
7
8
9
10
XSM
SMCK
VDDE
VSS
2
3
4
5
MST
VDDE
VSS
XRST
DIFM0
1
11
12
13
14
DIFM1
DTSEL
15
16
APX
EXTCK
3231
TEST5 TEST6
4950
5657
BCK/RCLK TXOUT/RINFO
5455
6061
VDDI LRCK/RCS
5859
64
EMPFS0 EMPFS1
6263
DAOUT/ROUT DTVALID VDDE VSS

16
MDR-IF4000
IC001 CXA3668N-T4
14
15
1617
18
192021222324
DIVCODE GNDO
13
VCCS OUT VCCO DET GND2 AGCCAP2
AGCIREF2
VCC2 AGCIREF3 AGCCAP1
1110
98
7654321
VOUT15
GNDR
12
VREGIN
GNDR
GNDS
AGCIN
GNDI
IN
VCCI
SIS
GNDMOS
AGCIREF1
BIAS
FWR
S/D
CONV
GCA PREAMP OUTPUT_AMP
FWR
COMP
0
0
180
180
I/V AMP
GNDMOS
CONT
LPF
fc = 6MHz
4.5MHz
HPF
fc = 3MHz
COMP
COMP
/
IC301, 302 NJM2113V-TE2
5VOUT1
V+
GND
VOUT2
–VIN
+VIN
VREF
CD
–
+
–
+
1
2
3
4
6
7
8

17
MDR-IF4000
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
SECTION 4
EXPLODED VIEWS
4-1. HOUSING (L) ASSY SECTION
NOTE:
•-XX, -X mean standardized parts, so they may
have some differences from the original one.
•Items marked “*” are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering these
items.
•The mechanical parts with no reference number
in the exploded views are not supplied.
•Accessories are given in the last of this parts
list.
1
2
3
5
4
6
7
8
9
10
11
13
12
not
supplied
SP002
not supplied
(SW board)
A
A
B
B
14
not supplied
(PD1 board)
(PD2 board)
not supplied
13
15
16
1X-2024-577-1 LID ASSY, BATTERY
23-246-142-01 HOUSING (L)
3 3-246-148-01 BUTTON
42-547-961-01 LID (L), HANGER
52-345-564-01 HANGER (L)
63-257-911-01 SPRING, TENSION
73-246-151-03 TERMINAL (–), BATTERY
83-246-150-02 TERMINAL (+), BATTERY
9A-1083-889-A BATT BOARD, COMPLETE
10 3-246-152-02 TERMINAL, CHARGE
11 X-2024-574-1 PLATE (L) SUB ASSY, FRONT
12 3-246-153-13 PAD (L), EAR
13 3-253-143-01 SCREW (B2.6), (+)P TAPPING
14 3-254-070-11 SCREW
15 3-257-555-02 CUSHION (S/W)
16 3-252-068-01 CUSHION (B)
SP002 1-542-593-11 DRIVER (040F020)

18
MDR-IF4000
4-2. HOUSING (R) ASSY SECTION
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
51 3-246-154-13 PAD (R), EAR
52 X-2024-575-1 PLATE (R) SUB ASSY, FRONT
53 A-1083-890-A RX BOARD, COMPLETE
54 3-253-143-01 SCREW (B2.6), (+)P TAPPING
56 3-257-778-01 HOUSING (R)
57 X-2024-573-1 CAP (R) ASSY, HOUSING
58 2-345-565-01 HANGER (R)
59 3-246-141-71 LID (R), HANGER
60 3-246-137-01 BAND, HEAD
61 X-3383-905-2 CUSHION ASSY, HEAD
62 4-966-791-01 STOPPER (UPPER)
63 4-966-792-01 STOPPER, (LOWER)
64 3-252-068-01 CUSHION (B)
SP001 1-542-593-11 DRIVER (040F020)
51
52
54
64
53
56
57
59
58
60
61
62
64
62
63
63
54
not supplied
(PD2 board)
not supplied
not
supplied
SP001
not supplied
(PD1 board)
54
not supplied

19
MDR-IF4000
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
NOTE:
•Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
•-XX, -X mean standardized parts, so they
may have some difference from the original
one.
•Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
•CAPACITORS:
uF: µF
•RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
•COILS
uH: µH
•SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...
When indicating parts by reference
number, please include the board.
A-1083-889-A BATT BOARD, COMPLETE
******************
< CAPACITOR >
C503 1-135-856-91 TANTAL. CHIP 100uF 20% 10V
C504 1-135-856-91 TANTAL. CHIP 100uF 20% 10V
C505 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C506 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C507 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C508 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C510 1-100-507-91 CERAMIC CHIP 4.7uF 20% 6.3V
C511 1-100-507-91 CERAMIC CHIP 4.7uF 20% 6.3V
C513 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C514 1-110-569-11 TANTAL. CHIP 47uF 20% 6.3V
C516 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C602 1-165-884-91 CERAMIC CHIP 2.2uF 10% 6.3V
C603 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C604 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C605 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
< DIODE >
D501 6-500-220-11 DIODE RB161M-20FTR
D601 8-719-058-24 DIODE RB501V-40TE-17
< IC >
IC502 6-705-692-01 IC XC6219B252MR
IC503 6-707-196-01 IC XC6371A281PR
IC601 6-702-083-01 IC XC61CN1902NR
< COIL >
L501 1-410-645-31 INDUCTOR 100uH
L502 1-469-524-91 INDUCTOR 4.7uH
< TRANSISTOR >
Q601 6-550-363-01 TRANSISTOR 2SB1690KT146
Q602 8-729-901-81 TRANSISTOR 2SC2412K-T-146-R
< RESISTOR >
R503 1-216-833-11 METAL CHIP 10K 5% 1/10W
R601 1-216-833-11 METAL CHIP 10K 5% 1/10W
R602 1-216-845-11 METAL CHIP 100K 5% 1/10W
R603 1-216-821-11 METAL CHIP 1K 5% 1/10W
R604 1-216-857-11 METAL CHIP 1M 5% 1/10W
< SWITCH >
S601 1-786-130-11 SWITCH, PUSH (1 KEY) (BATT DET)
S602 1-762-917-11 SWITCH, DETECTION (SMALL TYPE)
(BATT DET)
************************************************************
PD1 BOARD (L-CH REAR)
*********
< DIODE >
D401 8-719-058-49 DIODE PP508
D402 8-719-058-49 DIODE PP508
************************************************************
PD1 BOARD (R-CH FRONT)
*********
< DIODE >
D405 8-719-058-49 DIODE PP508
D406 8-719-058-49 DIODE PP508
************************************************************
PD2 BOARD (L-CH FRONT)
*********
< DIODE >
D403 8-719-058-49 DIODE PP508
D404 8-719-058-49 DIODE PP508
************************************************************
1-864-939-11 PD2 BOARD (R-CH REAR)
*********
< DIODE >
D407 8-719-058-49 DIODE PP508
D408 8-719-058-49 DIODE PP508
************************************************************
A-1083-890-A RX BOARD, COMPLETE
******************
< CAPACITOR >
C001 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
C002 1-126-205-11 ELECT CHIP 47uF 20% 6.3V
C003 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C004 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
SECTION 5
ELECTRICAL PARTS LIST
BATT PD1 PD2 RX

20
MDR-IF4000
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
C005 1-124-779-00 ELECT CHIP 10uF 20% 16V
C006 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C007 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C008 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C009 1-124-778-00 ELECT CHIP 22uF 20% 6.3V
C010 1-162-959-11 CERAMIC CHIP 330PF 5% 50V
C011 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V
C012 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V
C013 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C014 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C015 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C016 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C017 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C101 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C102 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C103 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C104 1-124-779-00 ELECT CHIP 10uF 20% 16V
C105 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C107 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C108 1-126-205-11 ELECT CHIP 47uF 20% 6.3V
C109 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C110 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C111 1-162-917-11 CERAMIC CHIP 15PF 5% 50V
C112 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C113 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C115 1-162-917-11 CERAMIC CHIP 15PF 5% 50V
C116 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C117 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C118 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C119 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C120 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C121 1-124-778-00 ELECT CHIP 22uF 20% 6.3V
C123 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C124 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C125 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C126 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C130 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C201 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C202 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C203 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C204 1-126-208-21 ELECT CHIP 47uF 20% 4V
C205 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C206 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C207 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C208 1-124-779-00 ELECT CHIP 10uF 20% 16V
C210 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C301 1-162-917-11 CERAMIC CHIP 15PF 5% 50V
C302 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C303 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C304 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C305 1-104-912-11 TANTAL. CHIP 3.3uF 20% 16V
C306 1-137-934-91 TANTAL. CHIP 47uF 20% 10V
C307 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C308 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C309 1-162-917-11 CERAMIC CHIP 15PF 5% 50V
C310 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C311 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C312 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C313 1-104-851-11 TANTAL. CHIP 10uF 20% 10V
C314 1-104-912-11 TANTAL. CHIP 3.3uF 20% 16V
C315 1-137-934-91 TANTAL. CHIP 47uF 20% 10V
C316 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C317 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C501 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C502 1-110-569-21 TANTAL. CHIP 47uF 4V
C509 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
< DIODE >
D101 8-719-988-61 DIODE 1SS355TE-17
D102 8-719-988-61 DIODE 1SS355TE-17
D103 8-719-988-61 DIODE 1SS355TE-17
D104 8-719-988-61 DIODE 1SS355TE-17
D502 8-719-059-98 DIODE SLR-342VC3F (POWER)
< IC >
IC001 8-753-208-23 IC CXA3668N-T4
IC101 8-752-425-06 IC CXD4017R
IC102 6-707-193-01 IC BU4223G-TR
IC201 6-707-192-01 IC PCM1773PWR
IC301 8-759-347-33 IC NJM2113V-TE2
IC302 8-759-347-33 IC NJM2113V-TE2
IC501 6-701-851-01 IC XC62HR1502MR
< COIL >
L001 1-469-525-91 INDUCTOR 10uH
L002 1-469-524-91 INDUCTOR 4.7uH
L003 1-412-002-31 INDUCTOR 4.7uH
L004 1-414-760-21 INDUCTOR, FERRITE BEAD
L101 1-414-760-21 INDUCTOR, FERRITE BEAD
L102 1-414-760-21 INDUCTOR, FERRITE BEAD
L103 1-469-524-91 INDUCTOR 4.7uH
L104 1-469-524-91 INDUCTOR 4.7uH
L105 1-414-760-21 INDUCTOR, FERRITE BEAD
L106 1-414-594-11 INDUCTOR, FERRITE BEAD
L107 1-469-524-91 INDUCTOR 4.7uH
L108 1-414-760-21 INDUCTOR, FERRITE BEAD
L109 1-469-526-91 INDUCTOR 22uH
L201 1-469-526-91 INDUCTOR 22uH
L301 1-469-524-91 INDUCTOR 4.7uH
L302 1-414-760-21 INDUCTOR, FERRITE BEAD
L303 1-414-760-21 INDUCTOR, FERRITE BEAD
L304 1-469-524-91 INDUCTOR 4.7uH
L305 1-414-760-21 INDUCTOR, FERRITE BEAD
L306 1-414-760-21 INDUCTOR, FERRITE BEAD
< TRANSISTOR >
Q101 8-729-928-81 TRANSISTOR DTC144EE
Q301 8-729-043-69 TRANSISTOR UN2225-(TX).S0
Q302 8-729-043-69 TRANSISTOR UN2225-(TX).S0
< RESISTOR >
R001 1-216-825-11 METAL CHIP 2.2K 5% 1/10W
R002 1-216-821-11 METAL CHIP 1K 5% 1/10W
R003 1-216-839-11 METAL CHIP 33K 5% 1/10W
R004 1-216-823-11 METAL CHIP 1.5K 5% 1/10W
R101 1-216-821-11 METAL CHIP 1K 5% 1/10W
RX