Sony HCD-VP1 User manual

MICROFILM
SERVICE MANUAL
MICRO HiFi COMPONENT SYSTEM
SPECIFICATIONS
HCD-VP1
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol aare trade-
marks of Dolby Laboratories Licensing Corporation.
E Model
Chinese Model
HCD-VP1 is the Amplifier,Video CD
player,Tape Deck andTuner section
in CMT-VP1.
Model Name Using Similar Mechanism HCD-CP1
CD Mechanism Type KSL-2130CCP/K1N
Optical Pick-up Name KSS-213C/K1N
Model Name Using Similar Mechanism HCD-ED1
Tape Transport Mechanism Type CMAL1Z023A
CD
Section
Tape
Section

2
TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Setting the Time .............................................................. 4
2. DISASSEMBLY ......................................................... 5
3. SERVICE MODE...................................................... 10
4. ELECTRICAL CONFIRMATIONS AND
ADJUSTMENTS
DECK Section ................................................................. 11
CD Section ...................................................................... 13
5. DIAGRAMS
5-1. Block Diagram – SERVO Section – ............................... 15
5-2. Block Diagram – TAPE Section – .................................. 16
5-3. Block Diagram – MAIN Section – ................................. 17
5-4. Block Diagram
– DISPLAY/POWER SUPPLY Section – ...................... 18
5-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 19
5-6. Printed Wiring Board – CD Board – .............................. 20
5-7. Schematic Diagram – CD Board – ................................. 21
5-8. Schematic Diagram – MAIN Board (1/4) – ................... 22
5-9. Schematic Diagram
– MAIN Board (2/4), HP/MIC Board,
VIDEO SW Board, LOADING Board – ........................ 23
5-10. Schematic Diagram – MAIN Board (3/4) – ................... 24
5-11. Schematic Diagram
– MAIN Board (4/4), LCD Board – .............................. 25
5-12. Printed Wiring Board – MAIN Board – ......................... 26
5-13. Printed Wiring Boards
– LCD Board, HP/MIC Board,
VIDEO SW Board, LOADING Board – ........................ 27
5-14. Printed Wiring Board – CONTROL Board – ................. 28
5-15. Schematic Diagram – CONTROL Board – .................... 29
5-16. Printed Wiring Board – POWER Board – ...................... 30
5-17. Schematic Diagram – POWER Board – ......................... 30
5-18. IC Pin Function Description ........................................... 35
6. EXPLODED VIEWS................................................ 37
7. ELECTRICAL PARTS LIST ............................... 42
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
The following caution label is located inside the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK !OR DOTTED
LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.

3
SECTION 1
GENERAL
LOCATION OF CONTROLS
• Front View 1Tape deck
2Liquid crystal display
3DSG button and indicator
4VOLUME knob
5TAPE Pbutton
6TAPE 6button
7TAPE œ, p, 0, )buttons
8TAPE REC rbutton
9CD SYNC button and indicator
0TUNER/BAND button
!¡ TUNING +/– buttons
!™ TUNING MODE button
!£ CD EJECT 6button
!¢ CD ^, p, =/0, +/) buttons
!∞ CD PLAY MODE button
!§ CD REPEAT button
!¶ TUNER button and indicator
!• CD button and indicator
!ª TAPE button and indicator
@º MD/VIDEO button and indicator
@¡ 1/ubutton and indicator
@™ Remote sensor
@£ CD disc tray
@¢ PHONES jack
@∞ MIC IN jack
@§ MIC VOL knob
@¶ VCD ON indicator
@• PBC indicator
@ª SELECT button
#º PREV button
#¡ RETURN button
#™ NEXT button
12 3 4 5 6
8
7
9
!º
!¡
!™
!¶
!§
!∞
!£
!¢
!ª
@º
@¡
@™
@£
@¢ @∞ @§ @¶ @• @ª #¡
!•
#º
2
1
5
6
7
8
9
0
• Rear View
#™
4
31AM ANTENNA terminals
2FM ANTENNA terminals
3SYSTEM SELECT switch
4VIDEO OUT jack
5POWER SELECT switch
6LINE OUT jacks
7MD IN jacks
8VIDEO IN jacks
9OPTICAL DIGITAL OUT (CD)
0SPEAKER terminals

4
This section is extracted from
instruction manual.

5
COVER (UPPER)
TAPE MECHANISM DECK
Note: Follow the disassembly procedure in the numerical order given.
SECTION 2
DISASSEMBLY
1 two case screws
3 cover (upper)
2 four screws
(BTP3
× 8)
1 two case crew
s
6 two screws
2 connector
5 tape
mechanism deck
1 flat wire (12 core)
3 two screws
(BTP3 × 8)
3 two screws
(BTP3 × 8)
7 motor
8 main belt
9 F/R belt
0 claw
!¡ pinch roller
4 lag

6
FRONT PANEL SECTION
• FRONT PANEL SECTION INSTALLATION
Note: Follow the assembly procedure in the numerical order given.
1 connector
(CN812)
1 connector
(CN303)
1 connector
1 connector
(CN809)
2 flat wire (12 core)
2 flat wire (18 core)
(CN802)
2 flat wire (20 core)
(CN804)
5 two bosses
3 screw
(KTP3
× 6)
7 front panel section
6 connector (CN603
)
4 two screws
(BTP3
× 8)
3 screw
(KTP3
× 6)
6 connector
5 flat wire (12 core)
5 flat wire (20 core)
(CN804)
5 flat wire (18 core)
(CN802)
6 three connectors
(CN303, 809, 812
)
2 connector
(CNP806)
Note: As CNP806 pin is bent easily,
treat is carefully.
3 screw
(KTP3
× 6)
4 two screws
(BTP3
× 8)
3 screw
(KTP3
× 6)
1 two bosses

7
CD MECHANISM DECK SECTION
VCD BLOCK
3 two screws
(BTP3 × 8)
3 two screws
(BTP3 × 8)
2 flat wire (19 core)
(CN805)
1 two connectors
1 connector
(CN306)
4 CD mechanism deck section
2 three screws
4 two screws
(P2
× 8)
4 screw
(P2
× 8)
3 VCD block
5 holder (VCD)
1 flat wire (24 core
)
(CN701)

8
3 coil spring
(front)
3 coil spring
(rear)
3 coil spring
(rear)
2 washer
(2130)
2 washer (2130)
2 washer (2130)
3 coil spring
(front)
2 washer (2130)
1 two screws
(P2.6
× 10)
1 two screws
(P2.6
× 10)
4 mechanism deck ass’y
MECHANISM DECK ASS’Y
Note: As 3coil springs are missed easily, terat them carefully.
TRAY (2130)
4 Pull the tray (2130).
8 Remove the tray (2130).
7 lock lever
1 two screws
(PTPWH2.6
× 7)
2 chucking yoke (K)
6 damper (S)
5 claw
7 lock lever
3 Rotate the control cam
in the direction of arrow
A .
A

9
2 Install the drive gear with gear
position as shown in figure.
gear
front side
1 Install the control cam
with gear position as shown
in figure.
gear
front side
3 screw
(PTPWH2.6 × 16)
5 two screws
(PTPWH2.6 × 7)
4 sub chassis
• SUB CHASSIS INSTALLATION
Note: Follow the assembly procedure in the numerical order given.

10
SECTION 3
SERVICE MODE
[Liquid Crystal Display All Lit Check Mode]
Procedure:
1. Set to standby state.
2. Press three buttons of p(TAPE), p(CD), and [MD/VIDEO]
simultaneously.
3. Liquid crystal display are all turned on.
4. To release from this mode, press the 1/ubutton to turn the
power OFF.
[Tape Deck Aging Mode]
This mode can be used for operation check of tape deck section.
Procedure:
1. Set a tape in the tape deck.
2. Set to standby state.
3. Press three buttons of p(TAPE), p(CD), and [TAPE] si-
multaneously.
4. The aging is executed in bellow sequence.
5. To release from the aging mode, press the 1/ubutton to turn
the power OFF.
Aging mode sequence:
[CD Aging Mode]
This mode can be used for operation check of CD section.
Procedure:
1. Load a CD disc.
2. Set to standby state.
3. Press three buttons of p(TAPE), p(CD), and [TUNER]
simultaneously.
4. The aging is executed in bellow sequence.
5. To release from the aging mode, press the 1/ubutton to turn
the power OFF.
Aging mode sequence:
Start
REC pause for 3 seconds
FWD REC
Fast forward
REV Play
REC pause for 3 seconds
REV REC
Rewind
FWD Play Shut off
Shut off
Shut off
Shut off
1 minute
3 minutes
1 minute
3 minutes
Start
Open the disc tray
Close the disc tray
Play the last track

11
Note: Confirm each contents of this section first of all. If the results are
not satisfied, do the adjustment.
1. Demagnetize the record/playback head with a head demagne-
tizer.
2. Do not use a magnetized screwdriver for the adjustments.
3. After the adjustments, apply suitable locking compound to the
parts adjust.
4. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.
5. The adjustments should be performed in the order given in
this service manual. (As a general rule, playback circuit ad-
justment should be completed before performing recording
circuit adjustment)
6. The adjustments should be performed for both L-CH and R-
CH.
7. Switches and controls should be set as follows unless other-
wise specified.
• Test Tape
Record/Playback Head Azimuth Adjustment
Procedure:
1. Mode: Playback
SECTION 4
ELECTRICAL CONFIRMATIONS AND ADJUSTMENTS
0 dB=0.775 V
DECK SECTION
Tape Signal Used for
P-4-A100 10 kHz, –10 dB Azimuth Adjustment
P-4-L300 315 Hz, 0 dB Level Adjustment
set
MAIN board
LINE OUT jack (PJ301)
L-CH, R-CH
+
–
level mete
r
test tape
P-4-A100
(10 kHz, –10 dB)
Screw
position
L-CH
peak
within
1dB
Output
level
L-CH
peak R-CH
peak
within
1dB
Screw
position
R-CH
peak
2. Turn the adjustment screw and check output peaks. If the peaks
do not match for L-CH and R-CH, turn the adjustment screw
so that outputs match within 1dB of peak.
3. Mode: Playback
4. Repeat step 1 to 3 in playback (REV) mode.
5. After the adjustments, apply suitable locking compound to the
pats adjusted.
Adjustment Location:
test tape
P-4-A100
(10 kHz, –10 dB)
R-CH
oscilloscope
L-CH
R-CH
VH
waveform of oscilloscope
in phase 45 ° 90 ° 135 ° 180 °
good wrong
MAIN board
LINE OUT jack (PJ301)
L-CH
set
forward
reverse

12
Playback level Confirmation and Adjustment
Procedure:
Mode: Playback
Confirm playback level is within specification values as follows.
If these levels are out of specification values, adjust the RV151
(L-CH) and RV251 (R-CH) on the MAIN board so that the level
meter reading become within specified value.
Specified value:
PJ301 PB level: 301.5 to 338.3 mV (–8.2 to –7.2 dB) level differ-
ence between the channels: within ±0.5 dB
Adjustment Location: MAIN board
REC Bias Confirmation and Adjustment
Procedure:
1. Mode: Record
2. Mode: Playback
3. Confirm playback the signal recorded in step 1 become speci-
fied value as follows.
If these values are out of specification values, adjust the RV153
(L-CH) and RV253 (R-CH) on the MAIN board to repeat steps
1and 2.
Specified value: Playback output of 315 Hz to playback output
of 10 kHz: ± 0.5 dB
Adjustment Location: MAIN board
+
–
set
test tape
P-4-L300
(315 Hz, 0 dB)
MAIN board
LINE OUT jack (PJ301)
L-CH, R-CH
level meter
REC Level Confirmation and Adjustment
Procedure:
1. Mode: Record
2. Mode: Playback
3. Confirm playback the signal recorded in step 1 become speci-
fied value as follows.
If these values are out of specification values, adjust the RV252
(R-CH) and RV152 (L-CH) on the MAIN board to repeat steps
1 and 2.
Specified value:
PJ301 PB level: 47.2 to 53.0 mV (– 24.3 to – 23.3 dB)
Adjustment Location: MAIN board
– MAIN Board (Conductor Side) –
attenuator
set
MAIN board
MD IN jack (PJ301)
L-CH, R-CH
1) 315 Hz
2) 10 kHz 50 mV (–23.8 dB)



600 Ω
blank tape
CN-123
AF OSC
+
–
set
recorded
portion
MAIN board
LINE OUT jack (PJ301)
L-CH, R-CH
level meter
set
MAIN board
MD IN jack (PJ301)
L-CH, R-CH
315 Hz, 50 mV (–23.8 dB) blank tape
CS-123
600
Ω
attenuator
AF OSC
+
–
set
recorded
portion
MAIN board
LINE OUT jack (PJ301)
L-CH, R-CH
level meter
PJ301
Playback Level
REC Bias
REC Level
RV252 (R)
IC352
LINE OUT (L/R)
MD IN (L/R)
VIDEO IN (L/R)
RV152 (L)
RV251 (R)
RV151 (L)
RV253 (R)
RV153 (L)

13
CD SECTION
Notes:
1. CD block basically constructed to operate without adjustment. There-
fore, check each item in order given.
2. UseYEDS-18 disc (Part No.: 3-702-101-01) unless otherwise indicated.
3. Use the oscilloscope with more than 10 MΩimpedance.
4. Clean an object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
S-Curve Confirmation
Connection:
Procedure:
1. Connect an oscilloscope to IC703 pin !∞ and TP (VC) on the
CD board.
2. Connect between TP (FOK) and TP (GND) on the CD board
by lead wire.
3. Turn the power ON.
4. Press the [EJECT] (CD) button to open the disc tray, and
put the disc (YEDS-18).
5. Press the [EJECT] (CD) button to close the disc tray (Actu-
ate the focus search).
6. Confirm that the waveform on the oscilloscope is symmetrical
between A and B and that peak to peak level is within 3.0 ±
1.0 Vp-p.
S-curve waveform
7. After confirmation, disconnect the lead wire in step 2.
Note: • Try to measure several times to make sure that the ratio ofA : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the brightness
to obtain best waveform.
RF Level Confirmation
Connection:
Procedure:
1. Connect an oscilloscope to IC703 pin !§ and TP (VC) on the
CD board.
2. Turn the power ON.
3. Load the disc (YEDS-18), and press the [] button to play-
back the disc.
4. Confirm that the waveform on the oscilloscope is clear and
that the RF signal level is correct.
Note: Clear RF signal waveform means that the shape “≈” can be clearly
distinguished at the center of the waveform.
+
–
CD board
IC703 pin
!∞
TP (VC)
oscilloscope
+
–
CD board
IC703 pin
!§
TP (VC)
oscilloscope
(AC range)
RF signal waveform
When observing the eye pattern, set the oscilloscope forAC range
and raise vertical sensitivity.
Connecting Location:
– CD Board (Conductor Side) –
VOLT/DIV: 200 mV
TIME/DIV: 500 ns
(with the 10: 1 probe
in use)
level: 1.3 Vp-p
+0.25
–0.20
6
6
within 3.0 ± 1.0 Vp-p
A
B
symmetry
TP (GND)
TP (VC)
TP (FOK) 20 11
110
CN701
IC701
IC703
^

14

1515
HCD-VP1
SECTION 5
DIAGRAMS
5-1. BLOCK DIAGRAM – SERVO Section –
VCD BLOCK
(1/2)
A/D
CONVERTER
OUT+
OUT–
3
4
7
2
1
5
10
6
4
5
6
16
15
14
13
8
9
19
2
1
77
78
71
55
54
45
47
46
6320
31 33 34 32
36
38
39
26
93
27
28 29
80
88
89
100
2
4
6
8
10
20
19
10
9
4
5
16
17
27
26
23, 24
E
B
C
D
A
A+5V
F
DETECTOR
A
B
C
D
RF
SUMMING
AMP
FOCUS
ERROR AMP
RF EQ
SWITCH
Q702
RF EQ
AMP
TRACKING
ERROR AMP
RFO
17
RFE
FE
FE BIAS
RF AMP,
FOCUS/TRACKING ERROR AMP
IC703
TE
E
FF I-V AMP
E I-V AMP
AUTOMATIC
POWER
CONTROL
Q701
OPTICAL
TRANSCEIVER
IC308
OPTICAL
DIGITAL OUT (CD)
APC LD
AMP
APC PD
AMP
LD
LD
PD
LASER DIODE
RFAC MIX
ASYO
ASYI
FILTER
FILO
PCO
CLTV
FILI
DIGITAL PLL
ASYMMETRY
CORRECTOR
EFM
DEMODULATOR REGISTER
DIGITAL SIGNAL PROCESSOR
IC701 (1/2)
MON
MDP
MDS
94 95 96 97
FSW
CLV
PROCESSOR
18-TIMES
OVERSAMPLING
FILTER
NOISE
SHAPER
INTERNAL BUS
32K
RAM
ERROR
CORRECTOR
SUBQ
SQCK
83
SCLK
79
MUTE
76
EXCK
SUBCODE Q
PROCESSOR
SUBCODE P – W
PROCESSOR
SYNC
PROTECTOR
TIMING
GENERATOR 1
TIMING
GENERATOR 2
DATA
VCKI
XTAO
62
XTAI
BCLK
LRCK
RFCK
GFS
56
C2PO
DOUT
DIGITAL
OUT
SERIAL/PARALLEL
PROCESSOR
D/A DIGITAL
PROCESSOR
CLOCK
GENERATOR
ADDRESS
GENERATOR
PRIORITY
ENCODER
PEAK
DETECTOR
74
SCOR
81 73
WFCK
75
SBSO
SE
TE
FE
RFDC
FOCUS/TRACKING/SLED
SERVO DSP
FOCUS/TRACKING/SLED
PWM GENERATOR
SFDR
IN+
IN–
OUT+
OUT–
IN–
IN+
IN–
IN+
15
MUTE
SRDR
TFDR
TRDR
FFDR
FRDR
COUT
MIRR/DFCT/
FOK
DETECTOR
SERVO AUTO
SEQUENCER
SERVO
INTERFACE
CPU
INTERFACE
CLOK 86
DATA
87
XLAT
SENS
FOK
91
92
MIRR
DFCT
IN+, IN–
OUT+
OUT–
M101
(SPINDLE)
MOTOR
DRIVE
LDON
MUTE
MOTOR
DRIVE
COIL
DRIVE
OUT–
OUT+
COIL
DRIVE
M
M
M102
(SLED)
05
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SLED MOTOR DRIVE
IC702
2-AXIS
DEVICE
(TRACKING)
(FOCUS)
DIGITAL SERVO
PROCESSOR
IC701 (2/2)
OPTICAL PICK-UP
(KSS-213C/K1N)
LDON
PD
•SIGNAL PATH
: CD PLAY (AUDIO)
: CD PLAY (VIDEO)
I-V AMP
12
13
2
1
SUBQ
SQCK/SCLK
SCOR
VARI-PITCH
DOUBLE SPEED
IC704
D+5V
S901
(DISC TRAY CLOSE DET)
S902
(DISC TRAY OPEN DET)
IN1TR-OPEN OUT1
DISC TRAY OPEN/CLOSE
MOTOR DRIVE
IC309
SW-CLOSE
SW-OPEN
5 2
IN2TR-CLOSE OUT2
6 10
M
M901
DISC TRAY
OPEN/CLOSE
FOK
SENS
DATA
CLK
XTL
XRST
XRST
PAL
AUTO
NTSC
SW401
SYSTEM SELECT
CTRL2
XTAL 16.9344MHz
AD
BCK
LRCK
C2PO
DO DO
VIDEO OUT J401
VIDEO OUT
A +5V
S701
(LIMIT)
: DIGITAL OUT
LIMIT
GFS
VIDEO SYSTEM
F
(Page 17)
CD L-CH
L-OUT
R-OUT R-CH
15 11 100 17 13 12
S-REQ S-CLK S-ACK RST S-SO S-SI
S-REQ
S-CLK
S-ACK
RST
S-SO
S-SI
SYSTEM CONTROLLER
IC801 (1/4)

16
HCD-VP1
16
5-2. BLOCK DIAGRAM –TAPE Section –
05
C(Page 18)
B(Page 17)
A(Page 17)
•SIGNAL PATH
: TAPE RECORD
: TAPE PLAY
REC-BIAS
REC-MUTE
DOLBY
L-MUTE
REC/PB
MOT-CON
BIAS
R/MUTE
NR-ON
L/M
R/P
(CrO2DET)
DECK A/B
SELECT
REC/PB
Q351
REC/PB SWITCHING
IC350
DECK PROCESS,
DOLBY NR AMP
IC352
R-CH
R-CH
L-CH
(RECORD/PLAYBACK)
R-CH R-CH
N N/C/M C M
10
86
87
88
96
95
19
20
18
25 24 23
17
16
15
35
32
37
41
39
4
8
7 9
(ERASE)
(HALF DET (SIDE-A))
(HALF DET (SIDE-B))
(CASSETTE IN DET)
(HEAD POSITION DET)
Q352
REC/PB
PB-L
REC-L
Q353
Q354
Q356
Q355
PLAYBACK
EQ AMP
IC351
DOLBY NR
AMP
CIRCUIT
BIAS SWITCH
CIRCUIT
RV151
PLAYBACK
LEVEL (L)
RV152
RECORD
LEVEL (L)
33, 34
BIAS
TRAP
CAPSTAN/REEL
MOTOR DRIVE
Q657, 659
TAPE-END
1
T-MODE
6
TC-SW
32
TAPE END DETECT
SENSOR
T150
BIAS OSC
T351
+8V
RECORD
BIAS (L)
BIAS OSC
Q357, 358
REC BIAS
SWITCH
Q359, 360
RV153
RECORD
BIAS (R)
RV253
M
(CAPSTAN/REEL)
SOL-CON
30
TRIGGER
PLUNGER DRIVE
Q656, 658
(TRIGGER PLUNGER)
SYSTEM CONTROLLER
IC801 (2/4)

1717
HCD-VP1
5-3. BLOCK DIAGRAM – MAIN Section –
05
A
(Page 16)
•SIGNAL PATH
: TAPE RECORD
: TAPE PLAY
: CD PLAY (ANALOG OUT)
: MIC IN
: TUNER
TX
TEX
MD/VIDEO-ON
D304
SYSTEM CONTROLLER
IC801 (3/4)
X802
32.768kHz
LIN4
LIN1
INL
R-CH
PJ301 (1/2)
REC-L
B
(Page 16) PB-L
SDA SCL
92
93
XTAL1
EXTAL1
X801
4.19MHz
40
39
24
LINE OUT-MUTE 97
HP-CHK 31
AMP-STBY 23
AMP-MUTE 22
1 30
STBY MUTE
9 10
15
11
SCK
28
TU-CLK
29
TU-CE
TU-DATA/SDA
4
TUNED
9
14
LIN3
13
11
LIN2
MOL 16
12
D
(Page 18) CD-ON
L
MD IN
R
L
R
L
R
L
R
R-CH
D302
R-CH 6
LOUT
5
ROUT R-CH
R-CH
R-CH
R-CH
R-CH
R-CH
R-CH
R-CH
Q808
TUNER ON SWITCH
INPUT SELECT SWITCH,
TONE CONTROL,
ELECTRICAL VOLUME
IC301
IN+
3OUT 14
POWER AMP
IC101
L-CH
10
3
R-CH
TUNER PACK
R-CH
VIDEO IN MUTING
Q102, 103
LINE AMP
IC307
HEADPHONE
AMP
IC303
MUTING
CONTROL SWITCH
Q317, 318
LED DRIVE
Q853
MUTING
CONTROL SWITCH
Q303, 304
STANDBY ON/OFF
CONTROL SWITCH
Q305, 306
MUTING
CONTROL SWITCH
Q308, 320
MUTING
Q106
MUTING
Q101
VOLUME
CONTROL
CIRCUIT
TONE
CONTROL
CIRCUIT
ATT
MUTING
Q132
R-CH
PJ301 (2/2)
LINE OUT
J301
PHONES
SJ301
SPEAKER
IMPEDANCE
USE 6-16Ω
D853
MD/VIDEO
+
Q808
DI
4
CK
2
CE
5
DO
8
TUNED
ANTENNA
FM ANT
ANT GND
ANT GND
AM ANT
FM
75Ω
AM
+
+
–
–
INPUT SELECT SWITCH
19
TU-COUNT
18
E
(Page 18)
13 75
RV401
MIC VOL
MIC AMP
IC401
J402
MIC IN
F
(Page 15) CD L-CH
TU-ON

18
HCD-VP1
18
5-4. BLOCK DIAGRAM – DISPLAY/POWER SUPPLY Section –
05
SYSTEM CONTROLLER,
LCD DRIVER
IC801 (4/4)
C
(Page 16)
REC/PB
D(Page 17)
CD-ON
MUTING
CONTROL SWITCH
Q311, 312
+12V
REGULATOR
IC306
+5V
REGULATOR
Q310
+8V
REGULATOR
IC304
+8V
REGULATOR
IC311
–8V
REGULATOR
IC305
–5V
REGULATOR
IC312
RECT
D911 – 914
RECT
D907 – 910
POWER TRANSFORMER
T901
VOLTAGE
SELECTOR
S901
LINE
FILTER
LF901
+10V
REGULATOR
Q313
AC IN
B+
B–
+5V
CD BLOCK B+
+12V
TDA7439 (IC301) B+
+10V
TUNER PACK B+
–8V
AUDIO
CIRCUIT
POWER AMP
(IC101, 201)
D315
E(Page 17)
TU-ON
REGULATOR
CONTROL SWITCH
Q321, 322
LED DRIVE
Q852
D814
D815
D813
D812
D802
Q655
CD
D852
CD-ON 94
VCD 8
TU-ON 25
TC-ON
REG-CON
98
26
RESET 38
+7.5V
REGULATOR
Q314
RESET SIGNAL
GENERATOR
IC803
FM 7.5V
FM CIRCUIT B+
B+ SWITCH
Q661, 662
B+ SWITCH
Q653, 654
B+ SWITCH
Q651, 652
LED B+
REGULATOR
CONTROL SWITCH
Q315, 316
LED DRIVE
Q500 VCD ON
D500
PBC 16 LED DRIVE
Q501 PBC
D501
LED DRIVE
Q855 TUNER
D855
LED DRIVE
Q854
LED DRIVE
Q856
LED DRIVE
Q858
TAPE
D854
DSG
D856
D858
(DISC TRAY ILLUMINATION)
STANDBY
I/u
D851
D657 – 660
(LCD BACK LIGHT)
BACK UP +5V
SYSTEM CONTROLLER (IC801) B+
Q859
REMOTE CONTROL
RECEIVER
IC802
3REMOCON
D.S.G.
27
LED DRIVE
Q857
CD SYNC
D857 CD-SYNC
ROTARY
ENCODER
RV801
JOG-A
21
JOG-B
20
36 – 33
SEG0 – SEG31
KEY1 – KEY4
54 – 85
COM0 – COM3
50 – 53
S801 – 822, 824-829
RV801
VOLUME
LIQUID CRYSTAL
DISPLAY
LCD801
CASSETTE HOLDER
BACK LIGHT
7
–5V
CD BLOCK B–
+8V
AUDIO CIRCUIT
+8V
CD BLOCK, DISC TRAY OPEN/
CLOSE MOTOR DRIVER (IC306) B+

1919
HCD-VP1
5-5. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS • Circuit Boards Location
Note on PrintedWiring Boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•b: Pattern from the side which enables seeing.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•2: nonflammable resistor.
•C: panel designation.
Note: The components identified by mark !or dotted line
with mark !are critical for safety.
Replace only with part number specified.
•U: B+ Line.
•V: B– Line.
•H: adjustment for repair.
• Voltages are takenwithaVOM (Input impedance10MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F:TUNER
E:TAPE (PLAY)
a:TAPE (REC)
J: CD (AUDIO)
L: CD (VIDEO)
c: DIGITAL OUT
N: MIC IN
LCD board
POWER board
VIDEO SW board
MAIN board
HP/MIC board
LOADING board
CD board
CONTROL board

20
HCD-VP1
20
5-6. PRINTED WIRING BOARD – CD Board – • See page 19 for Circuit Boards Location.
• Semiconductor
Location
Ref. No. Location
IC701 B-5
IC702 F-3
IC703 E-6
IC704 B-3
Q701 E-5
Q702 D-6
(Page 26)