Sony MDX-66XLP - Mobile Minidisc Changer User manual

1
Ver 1.1 2002. 04
Model Name Using Similar Mechanism NEW
Mini Disc Mechanism Type MG-798LP-133
Optical Pick-up Name KMS-241C/J1N
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
MDX-66XLP
SPECIFICATIONS
System Mini disc digital audio system
Frequency response 10 – 20,000 Hz
Wow and flutter Below measurable limit
Signal-to-noise ratio 95 dB
Outputs Bus control output (8 PIN)
Analog audio output (RCA PIN)
Current drain 300 mA (MD playback)
600 mA (during loading or
ejecting a disc)
Dimensions Approx. 176 ×83.5 ×142 mm
(7 ×3 3/8 ×5 18/32 in.) (w/h/d)
not incl.
projecting parts and controls
Mass Approx. 1.1 kg (2 lb. 7 oz.)
Power requirement 12 V DC car battery (negative
ground)
Supplied accessories Mounting hardware (1 set)
Bus cable 5.5 m (1)
RCA pin cord 5.5 m (1)
• U.S. and foreign patents licensed from Dolby
Laboratories.
• Design and specifications are subject to change without
notice.
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
9-873-582-02
2002D0400-1
© 2002. 04
MINIDISC CHANGER
FEATURES
• MDLP (MiniDisc Long Play) playback.
• Sony BUS system compatible with mobile MD
changers.
•Direct-in system for inserting and removing
MDs easily.
•The MD changer compartment has a built in light
for easy use even in the dark.
•1bit Digital/Analog converter for high quality
sound reproduction.

2
MDX-66XLP
TABLE OF CONTENTS
1. SERVICE NOTE
1-1. To Place the Set into Playback Mode.................................. 3
1-2. How to Check the Servo Board Waveforms........................ 3
2. GENERAL
Preparations (US, Canadian Model)........................................ 4
Connections (US, Canadian Model)........................................ 4
Preparations (AEP, UK Model) ............................................... 5
Connections (AEP, UK Model) ............................................... 5
3. DISASSEMBLY
3-1. Panel (Rear) Assy ................................................................ 6
3-2. Case (Upper) ....................................................................... 7
3-3. Panel (Front) Assy ............................................................... 7
3-4. MD Block ............................................................................ 8
3-5. Main Board ......................................................................... 8
3-6. Chassis (OP) Block .............................................................9
3-7. Servo Board......................................................................... 9
3-8. Optical Pick-up ................................................................. 10
3-9. Note on Assembly for the Chassis (OP) Block ................. 11
4. DIAGRAMS
4-1. IC Pin Descriptions ........................................................... 12
4-2. Block Diagram .................................................................. 18
4-3. Circuit Boards Location .................................................... 19
4-4. Printed Wiring Boards –Servo Section–............................ 20
4-5. Schematic Diagram –Servo Section–................................ 22
4-6. Schematic Diagram –Main Section–................................. 23
4-7. Printed Wiring Boards –Main Section– ............................ 24
4-8. Printed Wiring Board –Power Section– ............................26
4-9. Schematic Diagram –Power Section– ............................... 27
5. EXPLODED VIEWS
5-1. Case Section ...................................................................... 30
5-2. Main Board Section .......................................................... 31
5-3. MD Section (1).................................................................. 32
5-4. MD Section (2).................................................................. 33
5-5. MD Section (3).................................................................. 34
6. ELECTRICAL PARTS LIST ........................................ 35
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
laser-tap
OPTICAL PICK-UP FLEXIBLE BOARD
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
NOTES ON PICK-UP FLEXIBLE BOARD
The pick-up flexible board in this set is secured to the optical pick-
up with an adhesive tape. Once the tape is removed, an adhering
force becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick-
up flexible board with a new one.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(KMS-241C/J1N)
The laser diode in the optical pick-up block may suffer electrostatic
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform measures against
electrostatic break-down sufficiently before the operation. The
flexible board is easily damaged and should be handled with care.
CLASS
PRODUCTLASER
1
This label is located on the bottom of the chassis.
AEP, UK model
US, Canadian model
Ver 1.1

3
MDX-66XLP
1-1. TO PLACE THE SET INTO PLAYBACK MODE
The this set has no key control function and cannot be placed into
the Playback mode alone.
For key control, the this set is controlled through serial
communication with a master unit (car audio player, TV tuner or
source selector compatible with the Sony BUS system.)
To service the this set, the set should be connected as given below:
SECTION 1
SERVICE NOTE
1-2. HOW TO CHECK THE SERVO BOARD
WAVEFORMS
1. Remove the panel (rear) assy, case (upper) and panel (front) assy.
Then, remove the main board from the mechanism deck. (See
page 8 of “SECTION 3. DISASSEMBLY”.)
2. Remove the chassis (OP) block from the mechanism deck. (See
page 9 of “SECTION 3. DISASSEMBLY”.)
3. Short each bridge points BP1 and BP2 on the main board by
solder bridge.
4. Connect the power board with the main board by the main
flexible board. Connect the main board with the servo board by
the servo flexible board.
5. Connect to a master unit. With the master unit OFF, press the
preset buttons 4t5t1(2 seconds or more each) in this
turn to enter the TEST mode.
6. Open the doors and insert a disc in the chassis (OP) assy. Use the
SOURCE button on the master unit to select to MD to
playback.
7. Check the waveforms at each point on the servo board.
Note: Afterthis checkis completed,removesolderbetween shorted
bridge points BP1 and BP2 and open these points.
MDX-66XLP Master unit
BUS CONTROL INBUS CONTROL OUT
BP1
BP2
– main board (conductor side) –

4
MDX-66XLP SECTION 2
GENERAL This section is extracted
from instruction manual.
PREPARATIONS (US, Canadian Model)
CONNECTIONS (US, Canadian Model)

5
MDX-66XLP
PREPARATIONS (AEP, UK Model)
CONNECTIONS (AEP, UK Model)

6
MDX-66XLP SECTION 3
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
Note : Follow the disassembly procedure in the numerical order given.
3-1. PANEL (REAR) ASSY
3-1. PANEL (REAR) ASSY
(Page 6)
3-2. CASE (UPPER)
(Page 7)
SET
3-3. PANEL (FRONT) ASSY
(Page 7)
3-4. MD BLOCK
(Page 8)
3-5. MAIN BOARD
(Page 8)
3-6. CHASSIS (OP) BLOCK
(Page 9)
3-7. SERVO BOARD
(Page 9)
3-8. OPTICAL PICK-UP
(Page 10)
2 two screws
4 BVTT 2.6x6
3 BVTT 2.6x6
6 panel (rear) assy
5 CN901
1 cover
(PTT 2.6x8)

7
MDX-66XLP
3-2. CASE (UPPER)
3-3. PANEL (FRONT) ASSY
1 BVTT 2.6x
6
3 case (upper)
2 BVTT 2.6x6
1 claw
2 claw
3 panel (front) assy
4 CN620

8
MDX-66XLP
3-4. MD BLOCK
3-5. MAIN BOARD
1 damper (798)
2 damper (798)
3 tension spring (FL)
4 tension spring (FL)
5 tension spring (FL)
6 MD block
1 cushion
3 escutcheon
6 chassis (front)
7 collar (EHS)
5 lead stopper
qg CN700
qf CN701
qd CN603
qa CN601
0 CN600
qs CN50
0
9 CN602
qk MAIN board
qh cushion (MAIN)
8 sheet (MAIN PC board)
2 two screws
(M1.7)
qj special flat
three screws
(1.7x3)
4 two
screws
(M1.7)

9
MDX-66XLP
3-7. SERVO BOARD
3-6. CHASSIS (OP) BLOCK
4 bearing (ELV)
7 bearing (ELV)
9 worm wheel (ELV2)
6 chassis (OP) block
3 chassis (bottom) assy
1 precision screw
(P 1.7x1.8)
2 precision
three screws
(P 1.7x1.8)
5 bearing (ELV)
8 bearing (ELV)
1 CN200
6 CN100
5 CN300
4 CN400
3 three screws
(M1.7x2.2)
7 SERVO board
2 Unsolder the
motor lead wires.

10
MDX-66XLP
3-8. OPTICAL PICK-UP
1 two screws
(K1.7x3.5)
2 optical pick-up

11
MDX-66XLP
3-9. NOTE ON ASSEMBLY FOR THE CHASSIS (OP) BLOCK
A
B
BB
A
A
2 Turn the three feed
screw (ELV) assy fully in
the direction of arrows A .
qa Turn the three gear (ELVB) fully
in the direction of arrows B .
6 bearing (ELV)
7 bearing (ELV)
0 precision
three screws
(P1.7x1.8)
9 precision screw
(P1.7x1.8)
8 chassis (bottom) assy
5 chassis (OP) block
3 bearing (ELV)
4 bearing (ELV)
1 worm wheel (ELV2)
qf gear (ELVC)
qs gear (ELVA2)
qg polyethylene washer
qd polyethylene washer

12
MDX-66XLP
4-1. IC PIN DESCRIPTIONS
• IC100 CXA2523AR (RF AMP)
Pin No. Pin Name I/O Pin Description
1 I I I-V converted RF signal input (I) from detector of optical pick-up
2 J I I-V converted RF signal input (J) from detector of optical pick-up
3 VC O Center voltage (+1.65 V) generation output
4 – 9 A – F I Signal input (A to F) from detector of optical pick-up
10 PD I Quantity monitor input of light from laser diode of optical pick-up
11 APC O Laser amplifier output to automatic power control circuit
12 APCREF I Reference voltage input for laser power setting
13 GND — Ground pin
14 TEMPI I Temperature sensor connecting pin (Not used in this set.)
15 TEMPR O Reference voltage output for temperature sensor (Not used in this set.)
16 SWDT I Write data signal input from System controller (IC600)
17 SCLK I Serial clock signal input from System controller (IC600)
18 XLAT I Serial latch signal input from System controller (IC600)
19 XSTBY I Standby signal input (“L” : Standby) (Fixed at “H” in this set.)
20 FOCNT I Center frequency control voltage input of internal circuit filter (BPF22, BPF3T and EQ)
21 VREF O Reference voltage output (Not used in this set.)
22 EQADJ I Center frequency setting input of internal circuit filter (EQ)
23 3TADJ I Center frequency setting input of internal circuit filter (BPF3T)
24 VCC — Power supply pin (+3.3V)
25 WBLADJ I Center frequency setting input of internal circuit filter (BPF22)
26 TE O Tracking error signal output to CXD2662R (IC200)
27 CSLED I Connecting pin for low pass filter condenser of sled error signal
28 SE O Sled error signal output to CXD2662R (IC200)
29 ADFM O FM signal output of ADIP
30 ADIN I FM signal input of ADIP by AC combination
31 ADAGC I External condenser connecting pin forAGC of ADIP
32 ADFG O ADIP double FM signal output (22.05 kHz ± 1 kHz) to CXD2662R (IC200)
33 AUX O Support signal (I3 signal/temperature signal) output (Not used in this set.)
34 FE O Focus error signal output to CXD2662R (IC200)
35 ABCD O Quantity signal output of light to CXD2662R (IC200)
36 BOTM O Bottom hold signal output of quantity signal (RF/ABCD) of light to CXD2662R (IC200)
37 PEAK O Peak hold signal output of quantity signal (RF/ABCD) of light to CXD2662R (IC200)
38 RF O Playback EFM RF signal output to CXD2662R (IC200)
39 RFAGC I External condenser connecting pin of AGC circuit for RF
40 AGCI I RF signal input by AC combination
41 COMPO O User comparator output pin (Not used in this set.)
42 COMPP I User comparator input pin (Fixed at “L” in this set.)
43 ADDC I External condenser connecting pin for low frequency interception of ADIP amplifier
44 OPO O External condenser connect pin for lower cut ofADIP amplifier
45 OPN I User operational amplifier inversion input pin (Fixed at “L” in this set.)
46 RFO O RF signal output
47 MORFI I RF signal input of MO by AC combination
48 MORFO O RF signal output of MO
SECTION 4
DIAGRAMS

13
MDX-66XLP
• SERVO BOARD IC200 CXD2662R (DIGITAL SERVO SIGNAL PROCESSOR, DIGITAL SIGNAL PROCESSOR)
Pin No. Pin Name I/O Pin Description
1 MNT0 (FOK) O Focus OK signal output to the MD mechanism controller (IC600)
“H” is output when focus is on (“L”: NG)
2 MNT1 (SHOCK) O Track jump detection signal output to the MD mechanism controller (IC600)
3 MNT2 (XBUSY) O Busy monitor signal output to the MD mechanism controller (IC600)
4 MNT3 (SLOCK) O Spindle servo lock status monitor signal output to the MD mechanism controller
(IC600)
5 SWDT I Writing serial data signal input from the MD mechanism controller (IC600)
6 SCLK I (S) Serial data transfer clock signal input from the MD mechanism controller (IC600)
7 XLAT I (S) Serial data latch pulse signal input from the MD mechanism controller (IC600)
8 SRDT O (3) Reading serial data signal output to the MD mechanism controller (IC600)
9 SENS O (3) Internal status (SENSE) output to the MD mechanism controller (IC600)
10 XRST I (S) Reset signal input from the MD mechanism controller (IC600) “L”: reset
11 SQSY O Subcode Q sync (SCOR) output to the MD mechanism controller (IC600)
“L” is output every 13.3 msec Almost all, “H” is output
12 DQSY O Digital In U-bit CD format subcode Q sync (SCOR) output
“L” is output every 13.3 msec Almost all, “H” is output Not used (open).
13 RECP I Laser power selection signal input “L”: playback mode, “H”: recording mode
Not used (fixed at “L”.).
14 XINT O Interrupt status output to the MD mechanism controller (IC600)
15 TX I Recording data output enable signal input Writing data transmission timing input
(Also serves as the magnetic head on/off output) Not used (fixed at “L”.).
16 OSCI I System clock signal (512 Fs = 22.5792 MHz) input terminal
17 OSCO O System clock signal (512 Fs = 22.5792 MHz) output terminal Not used (open)
18 XTSL I Input terminal for the system clock frequency setting
“L”: 45.1584 MHz, “H”: 22.5792 MHz (fixed at “L” in this set.)
19 DIN0 I Digital audio signal input terminal when recording mode (for digital optical input)
Not used.
20 DIN1 I Digital audio signal input terminal when recording mode (for digital optical input)
Not used.
21 DOUT O Digital audio signal output terminal when playback mode (for digital optical output)
22 DATAI I Serial data input terminal Not used (fixed at “L”.).
23 LRCKI I L/R sampling clock signal (44.1 kHz) input terminal Not used (fixed at “L”.).
24 XBCKI I Bit clock signal (2.8224 MHz) input terminal Not used (fixed at “L”.).
25 ADDT I Recording data input Not used (fixed at “L”.).
26 DADT O Playback data output to the A/D, D/A converter (IC500)
27 LRCK O L/R sampling clock signal (44.1 kHz) output to the A/D, D/A converter (IC500)
28 XBCK O Bit clock signal (2.8224 MHz) output to the A/D, D/A converter (IC500)
29 FS256 O Clock signal (11.2896 MHz) output to the A/D, D/A converter (IC500)
30 DVDD — Power supply terminal (+3.3 V) (digital system)
31 – 34 A03 – A00 O Address signal output to the D-RAM (IC201)
35 A10 O Address signal output to the external D-RAM Not used (open).
36 – 40 A04 – A08 O Address signal output to the D-RAM (IC201)
41 A11 O Address signal output Not used (open).
42 DVSS — Ground terminal (digital system)
43 XOE O Output enable signal output to the D-RAM (IC201) “L” active
44 XCAS O Column address strobe signal output to the D-RAM (IC201) “L” active
45 A09 O Address signal output to the D-RAM (IC201)

14
MDX-66XLP
Pin No. Pin Name I/O Pin Description
46 XRAS O Row address strobe signal output to the D-RAM (IC201) “L” active
47 XWE O Write enable signal output to the D-RAM (IC201) “L” active
48 D1 I/O
49 D0 I/O Two-way data bus with the D-RAM (IC201)
50 D2 I/O
51 D3 I/O
52 MDDT1 I (S) Digital in PLL oscillation input from the externalVCO Not used (fixed at “L”.).
53 ASYO O Playback EFM full-swing output terminal
54 ASYI I (A) Playback EFM asymmetry comparator voltage input terminal
55 AVDD — Power supply terminal (+3.3 V) (analog system)
56 BIAS I (A) Playback EFM asymmetry circuit constant current input terminal
57 RFI I (A) Playback EFM RF signal input from the CXA2523AR (IC100)
58 AVSS — Ground terminal (analog system)
59 PCO O (3) Phase comparison output for master clock of the recording/playback EFM master PLL
60 FILI I (A) Filter input for master clock of the recording/playback master PLL
61 FILO O (A) Filter output for master clock of the recording/playback master PLL
62 CLTV I (A) Internal VCO control voltage input of the recording/playback master PLL
63 PEAK I (A) Light amount signal (RF/ABCD) peak hold input from the CXA2523AR (IC100)
64 BOTM I (A) Light amount signal (RF/ABCD) bottom hold input from the CXA2523AR (IC100)
65 ABCD I (A) Light amount signal (ABCD) input form the CXA2523AR (IC100)
66 FE I (A) Focus error signal input from the CXA2523AR (IC100)
67 AUX1 I (A) Auxiliary signal (I3signal/temperature signal) input from the CXA2523AR (IC100)
68 VC I (A) Middle point voltage (+1.65 V) input from the CXA2523AR (IC100)
69 ADIO O (A) Monitor output of the A/D converter input signal Not used (open).
70 AVDD — Power supply terminal (+3.3 V) (analog system)
71 ADRT I (A) A/D converter operational range upper limit voltage input terminal
(fixed at “H” in this set)
72 ADRB I (A) A/D converter operational range lower limit voltage input terminal
(fixed at “L” in this set)
73 AVSS — Ground terminal (analog system)
74 SE I (A) Sled error signal input from the CXA2523AR (IC100)
75 TE I (A) Tracking error signal input from the CXA2523AR (IC100)
76 DCHG I (A) Connected to the +3.3 V power supply
77 APC I (A) Error signal input for the laser automatic power control Not used (fixed at “H”.).
78 ADFG I (S) ADIP duplex FM signal (22.05 kHz ± 1 kHz) input from the CXA2523AR (IC100)
79 F0CNT O Filter f0 control signal output Not used (open).
80 XLRF O Serial data latch pulse signal output Not used (open).
81 CKRF O Serial data transfer clock signal output Not used (open).
82 DTRF O Writing serial data output Not used (open).
83 APCREF O Control signal output to the reference voltage generator circuit for the laser automatic
power control
84 LDDR O PWM signal output for the laser automatic power control Not used (open).
85 TRDR O Tracking servo drive PWM signal (–) output to the MPC17A36VMEL (IC300)
86 TFDR O Tracking servo drive PWM signal (+) output to the MPC17A36VMEL (IC300)
87 DVDD — Power supply terminal (+3.3 V) (digital system)
88 FFDR O Focus servo drive PWM signal (+) output to the MPC17A36VMEL (IC300)
89 FRDR O Focus servo drive PWM signal (–) output to the MPC17A36VMEL (IC300)
90 FS4 O Clock signal (176.4 kHz) output terminal (X’tal system) Not used (open).

15
MDX-66XLP
Pin No. Pin Name I/O Pin Description
91 SRDR O Sled servo drive PWM signal (–) output to the MPC17A36VMEL (IC300)
92 SFDR O Sled servo drive PWM signal (+) output to the MPC17A36VMEL (IC300)
93 SPRD O Spindle servo drive PWM signal (–) output to the MPC17A36VMEL (IC300)
94 SPFD O Spindle servo drive PWM signal (+) output to the MPC17A36VMEL (IC300)
95 FGIN I (S)
96 TEST1 I Input terminal for the test (fixed at “L”.)
97 TEST2 I
98 TEST3 I
99 DVSS — Ground terminal (digital system)
100 EFMO O EFM signal output terminal when recording mode Not used (open).
* I (S) stands for schmitt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O.

16
MDX-66XLP
• IC600 µPD784216AGC-151-8EU (SYSTEM CONTROL)
Pin No. Pin Name I/O Pin Description
1 M1 O Elevator motor (M904) drive signal output
2 M1 O Elevator motor (M904) drive signal output
3 M2 O Loading motor (M903) drive signal output
4 M2 O Loading motor (M903) drive signal output
5 MDMON O Mechanism deck system power control output (“H” : Power ON)
6 LES I Loading end sensor detection switch (S902) input
7 SES I Store end sensor detection switch (S903) input
8 HOME I Home position detection switch (S901) input (“L” : Home position)
9 VDD — Power supply pin (+5 V)
10 X2 — Main system clock connecting pin (14 MHz)
11 X1 — Main system clock connecting pin (14 MHz)
12 VSS — Ground pin
13 XT2 — Sub system clock connecting pin (32.768 kHz)
14 XT1 — Sub system clock connecting pin (32.768 kHz)
15 RESET — System reset input
16 BU IN I Backup OFF detection input (“L” : Backup OFF)
17 BUS ON I BUS OFF detection of SONY BUS (“H” : BUS OFF)
18 SQ SY I Sub code Q sync input from CXD2662R (IC200)
19 STR SW I STOP switch (S600) input
20 — O Not used.
21 CC XINT I Interruption status input from CXD2662R (IC200)
22 — O Not used.
23 AVDD — Power supply for A/D converter (+5 V)
24 AVREF0 — Reference voltage for A/D converter
25 INIT I Initial input pin at reset (Not used in this set.)
26 TEMP I Thermistor connecting pin for temperature detection
27 EHS I Elevator height position detection input
28, 29 — I Connect to ground.
30 – 32 — I Connect to ground.
33 AVSS — Analog ground
34 ERR PWM O Error data output (Not used in this set.)
35 — O Not used.
36 AVREF1 — Reference voltage for D/A converter
37, 38 — O Not used.
39 — O Not used.
40 MD SI I Read data signal input from CXD2662R (IC200)
41 MD SO O Write data signal output to CXA2523AR (IC100) and CXD2662R (IC200)
42 MD CKO O Serial clock signal output to CXA2523AR (IC100) and CXD2662R (IC200)
43 — O Not used.
44 — O Not used.
45 UNISI I Serial data input for SONY BUS
46 UNISO O Serial data output for SONY BUS
47 UNI CKI I Serial clock input for SONY BUS
48 LINKOFF O Link control signal output for SONY BUS (“H” : Link OFF) (Not used in this set.)
49 — O Not used.
50 — I Not used.
51, 52 D-BASS1, 2 O Digital D-BASS select output 1, 2 (Not used in this set.)
53 – 55 — O Not used.
56 – 59 MNT0 – 3 I Monitor 0 – 3 signal input from CXD2662R (IC200)
60 AGING O Not used.
61 AGCHK O Not used.
62 TFTON O Not used.

17 17
MDX-66XLP
Pin No. Pin Name I/O Pin Description
63 — O Not used.
64 EE CS O Chip select output to EEPROM (Not used in this set.)
65 EE CKO O Serial clock output to EEPROM (Not used in this set.)
66 EE SIO I/O Data input/output to EEPROM (Not used in this set.)
67 SENS I Internal status input from CXD2662R (IC200)
68 LIMIT SW I Optical pick-up innermost track limit position detection switch (S400) input
69 DOORSW I Front door open detection switch (S620) input (“L” : Open complete)
70 MD LAT O Serial latch signal output to CXA2523AR (IC100) and CXD2662R (IC200)
71 MD RST O Reset signal output to CXD2662R (IC200)
72 VSS — Ground pin
73 MD ON O Servo system power control output (“H” : Power ON) (Not used in this set.)
74 EMPH O O De-emphasis circuit control output (“H” : De-emphasis ON)
75 A ATT O Analog mute control output (“H” : Mute ON)
76 ILLON O Illumination lamp light-up control output (“H” : Lamp light-up) (Not used in this set.)
77 TSTSMD I Single mode setting pin (“L” : Single mode)
78 TSTCKO O Serial clock output to LED for TEST mode display (Not used in this set.)
79 TSTSO O Serial data output to LED for TEST mode display (Not used in this set.)
80 TSTMOD I TEST mode setting pin (“L” : TEST mode)
81 VDD — Power supply pin (+5 V)
82 – 85 TSTOUT0 – 3 O TEST key output pin of 4 ×8 matrix (Not used in this set.)
86 – 93 TSTIN0 – 7 I TEST key input pin of 4 ×8 matrix (Not used in this set.)
94 TEST/VPP — Fixed at “L” in this set.
95 DCS1 I Disc with/without detection 1 switch (S611) input (“H” : with disc)
96 DCS2 I Disc with/without detection 2 switch (S612) input (“H” : with disc)
97 DCS3 I Disc with/without detection 3 switch (S613) input (“H” : with disc)
98 DCS4 I Disc with/without detection 4 switch (S614) input (“H” : with disc)
99 DCS5 I Disc with/without detection 5 switch (S615) input (“H” : with disc)
100 DCS6 I Disc with/without detection 6 switch (S616) input (“H” : with disc)

1818
MDX-66XLP
4-2. BLOCK DIAGRAM
+9V
DCS6
DCS1
8
FOCUS
6
DRIVER
CONTROL
15
16
SLED/SPINDLE MOTOR DRIVE,
FOCUS/TRACKING COIL DRIVE
IC300
29
TRACKING
31
DRIVER
CONTROL
22
21
26
M902
(SLED)
24
DRIVER
CONTROL
19
20
M
13
M901
(SPINDLE)
11
DRIVER
CONTROL
17
18
M
7
4
6
9
11 APC
10 PD
LD
AUTOMATIC
POWER CONTROL
Q100
RF AMP
IC100
SWDT
SCLK
RFO 46
AGCI 40
DETECTOR
D/A CONVERTER
IC500
ELEVATOR MOTOR DRIVE
IC700
7
M904
(ELEVATOR)
9
DRIVER
CONTROL
4
2
M
LOADING MOTOR DRIVE
IC701
7
M903
(LOADING)
9
DRIVER
CONTROL
4
2
M
5
2
8
1
F
F
C
C
B
BJ
J
A
A
D
D
E
E
I
I
PD
SWDT
SCLK
XLAT
XLAT 18
16
17
RF 38
TE
SE
ADFG 32
26
28
FE
BOTM 36
34
PEAK
ABCD
37
35
78 ADFG
74 SE
75 TE
57 RFI
67 AUX1
PEAK HOLD
Q200
DIGITAL SIGNAL PROCESSOR,
DIGITAL SERVO SIGNAL PROCESSOR
IC200
63 PEAK
64 BOTM
66 FE
65 ABCD
83 APC REFAPC REF 12
88 FFDR
89 FRDR
86 TFDR
85 TRDR
93 SPRD
94 SPFD
91 SRDR
92 SFDR
XLAT XLAT
7
SCLK SCLK
6
SWDT SWDT
5
XRST XRST
10 15 RSTB
XINT XINT
14
SRDT SRDT
8
SQSY SQSY
11
DOUT DOUT
21
DADT
FS256
28
26
XBCK
LRCK 27
29
6
18
17 74
56
57
58
59
67
EMPH O
MNT0
MNT1
MNT2
MNT3
SENS
9
12
MUTE
DMI
VOUTR R-CH
VOUTL
XTI
5DATA
4
BCK
1
LRCK
XRST
XLAT
SWDT
SCLK
XINT 43 21 CC XINT
SRDT 21 40 MD SI
SQSY 65 18 SQ SY
DOUT
71 MD RST
70 MD LAT
41 MD SO
42 MD CKO
LEVEL SHIFT
IC602
1M1
2M1
3M2
4M2
S901
(HOME POSITION DET)
8HOME
6LES
69 DOORSW
S400
(LIMIT)
68 LIMIT SW
27 EHS
7SES
95
ı
100
MDMON 5
TEMP 26
78
411
69
10
213
BUS INTERFACE
IC900
SYS RST
BATT
B/U+5V
BUS CLK
BUS DATA
BUS ON
RESET
SW
SW
RESET 15
UNI CKI 47
UNISO 46
UNISI 45
BUS ON 17
IC601
RESET
+
–
5
LINE AMP
IC930
7
6
MUTING
Q920
MUTING
Q910
64
7
31 2
5
CN900
CN902-1
CN902-2
L
R
A ATT 75 R-CH
BU IN 16 BATTERY DET
Q940, 941
AUDIO
OUT
+9V REG.
Q931
P/U+5V
DRV+5V
4
2
1
INPUT
VCC
OUT
DRIVE
+5V REG.
Q972
+3V REG.
Q800, 801
+3.3V
LAMP DRIVE
Q600, 601
8
IC970
REGULATOR CONTROL
PL620
(ILLUMINATION)
14
13
X601
32.768kHz
11
10
X600
14MHz
X2
X1
XT2
XT1
19
STR SW
S600
STOP
SYSTEM CONTROL
IC600
(BUS CONTROL OUT)
OPTICAL PICK-UP BLOCK
MUTING
SWITCH
Q500
MUTING
CONTROL
SWITCH
Q932
B+ SWITCH
Q930,970
B/U+5V
B/U+5V
B+ SWITCH
Q602 +6V REG.
Q950
XOE
XCAS
43
44
A09
XRAS 46
45
49
·
48
·
50
·
51
1
·
2
·
24
·
25
22 OE
23 CAS
5A9
4RAS
D3
D0
AO8
D3
D0
A8
RAM
IC201
34
ı
31
·
36
ı
40
9
ı
12
·
14
ı
18
AO0 A0
XWE 47 3WE
OSCI
16
X200
45MHz
MNT0
MNT1
MNT2
MNT3
SENS
MNT0
MNT1
MNT2
MNT3
SENS
SENS 9
MNT3 4
MNT2 3
MNT1 2
MNT0 1
LEVEL SHIFT
IC603
RV901
ELEVATOR HEIGHT
SENSOR
S611-616
DISC WITH/
WITHOUT DET
S902
LOADING END
SENSOR DET
S620
FRONT DOOR
OPEN DET
S903
STORE END
SENSOR DET
Signal Path
: PB
TH600
OSC
BUFFER
IC203
1213
1011
89
65
43
89

19 19
MDX-66XLP
4-3. CIRCUIT BOARDS LOCATION
SENSOR board
POWER board
SERVO board
LAMP board
MAIN board
Note:
The components identi-
fied by mark 0or dotted
linewith mark0are criti-
cal for safety.
Replace only with part
number specified.
Note:
Lescomposants identifiéspar
une marque 0sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
• % : indicates tolerance.
•C: panel designation.
•A: B+ Line.
• Powervoltage isdc14.4Vandfed withregulated dcpower
supply from Master unit.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PB
∗: Impossible to measure
• Voltages aretaken withaVOM(Inputimpedance 10MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E: PB
for printed wiring boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•a: Through hole. (Servo and Power Sections)
•z: Through hole. (Main Section)
•: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Parts onthepattern facesideseenfromthe
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.

2020
MDX-66XLP
4-4. PRINTED WIRING BOARD — SERVO SECTION — • Refer to page 19 for Circuit Boards Location.
1
A
B
C
D
E
F
G
H
I
J
23456789101112
SERVO BOARD (SIDE B)
S400
•Waveforms —Servo Board —
1
2
3
IC200 wj (LRCK)
3.2Vp-p
4
100mV/DIV, 10µsec/DIV
IC100 1, 2(I, J)
PLAY MODE
150mVp-p
5
500mV/DIV, 1µsec/DIV
IC100 ek (RF) PLAY MODE
Approx.
150mVp-p
200mV/DIV, 10µsec/DIV
IC100 4(A) PLAY MODE
2Vp-p
3.2Vp-p
22.7µsec
IC200 wk (XBCK)
354nsec
100mV/DIV, 10µsec/DIV
IC100 8(E) PLAY MODE
100mV/DIV, 10µsec/DIV
IC100 9(F) PLAY MODE
6
7
8
9
400mVp-p
Approx.
150mVp-p
Approx.
150mVp-p
Approx.
1.1Vp-p
200mV/DIV, 0.5msec/DIV
IC100 ef (FE) PLAY MODE
IC200 yh (FE) PLAY MODE
500mV/DIV, 0.5msec/DIV
IC100 wh (TE) PLAY MODE
IC200 ug (TE) PLAY MODE