– 2 –
Specifications ........................................................................... 1
1. GENERAL
Location and Function of Controls .................................... 3
2. DISASSEMBLY
2-1. Helical Antenna Removal ......................................... 10
2-2. Cabinet (Rear) Assy Removal .................................. 10
2-3. Microcomputer Board, IF Board,
RF Board Removal ....................................................11
3. TEST MODE................................................................ 12
4. ELECTRICAL ADJUSTMENS .............................. 13
5. DIAGRAMS
5-1. Explanation of IC Terminals .................................. 15
5-2. Block Diagram ....................................................... 17
5-3. Printed Wiring Boards – IF Section– ..................... 19
5-4. Schematic Diagram – IF Section– ......................... 21
5-5. Printed Wiring Boards – Microcomputer Section– 23
5-6. Schematic Diagram – Microcomputer Section– .... 25
5-7. Printed Wiring Boards – RF Section –................... 27
5-8. Schematic Diagram – RF Section (1/2) – .............. 39
5-9. Schematic Diagram – RF Section (2/2) – .............. 31
6. EXPLODEDVIEW..................................................... 35
7. ELECTRICAL PARTS LIST.................................... 36
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINEWITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICALTO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
TABLE OF CONTENTS
