Sony HCD-LX10000 - Cd Deck/receiver For High Power Mini Hi-fi... User manual

US Model
SERVICE MANUAL
MiNi Hi-Fi COMPONENT SYSTEM
Sony Corporation
Audio Business Group
Published by SonyTechno Create Corporation
9-887-216-02
2008A04-1
© 2008.01
SPECIFICATIONS
Ver. 1.1 2008.01
– Continued on next page –
•HCD-LX10000 is the Amplifier,
CD player, tape deck and tuner
section in MHC-LX10000.
Model Name Using Similar Mechanism HCD-GX9900
CD CD Mechanism Type CDM74-F1BD81
Section Base Unit Name BU-F1BD81A
Optical Pick-up Name KSM-215DCP/C2NP
TAPE Model Name Using Similar Mechanism HC-GX9900
Section Tape Transport Mechanism Type CMAT5Z2
AUDIO POWER SPECIFICATION
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
With 6-ohm loads, both channels driven, from120 Hz – 10 kHz; rates 230
watts per channelminimum RMS power, with no more than 10% total
harmonic distortion from 250 miliwatts to rated output.
Amplifier section
Total harmonic distortion Less than 0.1%
(6 ohms at 1 kHz, 100 W)
Inputs
VIDEO/MD (AUDIO) IN (phono jacks): voltage 250/450 mV,
impedance 47 kiloohms
TV (AUDIO) IN (phono jack): voltage 250 mV,
impedance 47 kiloohms
MIC (phone jack): sensitivity 1 mV,
impedance 10 kiloohms
Outputs
PHONES (stereo mini jack): accepts headphones of
8 ohms or more
FRONT SPEAKER: Use only the supplied speaker
SURROUND SPEAKER: Use only the supplied speaker
Disc player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=780 nm)
Emission duration:
continuous
Laser Output Max. 44.6 µW*
*This output is the value
measured at a distance of
200 mm from the objective
lens surface on the Optical
Pick-up Block with 7 mm
aperture.
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Wave length 780 – 790 nm
Signal-to-noise ratio More than 90 dB
Dynamic range More than 90 dB
Tape deck section
Recording system 4-track 2-channel stereo
Frequency response 50 – 13,000 Hz (±3 dB),
using Sony TYPE I tape
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
Antenna FM lead antenna
Antenna terminals 75 ohm unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range 530 – 1,710 kHz
(with the interval set at 10kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
HCD-LX10000

2
HCD-LX10000
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
This appliance is classified as
a CLASS 1 LASER product.
This label is located on the rear
exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND INTHE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleadedsoldermeltsat a temperature about40°Chigherthan
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
Checktheantenna terminals, metaltrim, “metallized” knobs,screws,
and all other exposed metal parts forAC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. Acommercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. Abattery-operatedAC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOMorbattery-operatedAC voltmeter.The“limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2VAC range are suitable. (See
Fig. A)
SAFETY CHECK-OUT
To Exposed Metal
Parts on Set
0.15 µF1.5 kΩAC
Voltmeter
(0.75V)
Earth Ground
Fig.A. Using an AC voltmeter to check AC leakage.
General
Power requirements 120 VAC, 60 Hz
Power consumption 250 watts
Dimensions (w/h/d) (Approx.) 280 ×360 ×398.5 mm
Mass (Approx.) 15.6 kg
Supplied accessories: Remote Commander (1)
Batteries (2)
AM loop antenna (1)
FM lead antenna (1)
Front speaker pads (8)
Surround speaker pads (8)
Design and specifications are subject to change without notice.

3
HCD-LX10000
TABLE OF CONTENTS
1. SERVICING NOTES ................................................ 4
2. GENERAL
Location of Controls........................................................ 5
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 7
3-2. Side Panel, Top Case ....................................................... 8
3-3. Loading Panel Assy ......................................................... 8
3-4. Front Panel Assy .............................................................. 9
3-5. Tuner Pack ....................................................................... 9
3-6. Tape Mechanism Deck, MIC Board ................................ 10
3-7. PANEL Board, CD-SW Board ........................................ 10
3-8. CD Mechanism Deck ...................................................... 11
3-9. Back Panel ....................................................................... 11
3-10. PRIMARY Board, LIGHTING Board ............................ 12
3-11. Power AMP PC Board Assy, MAIN Board ..................... 12
3-12. SURROUND Board, PA Board ....................................... 13
3-13. Power Transformer (T1200) ............................................ 13
3-14. DRIVER Board, SW Board............................................. 14
3-15. CD Board, Optical Pick-up (KSM-215DCP/C2NP) ....... 14
3-16. SENSOR Board ............................................................... 15
3-17. MOTOR (TB) Board ....................................................... 15
3-18. MOTOR (LD) Board....................................................... 16
4. TEST MODE.............................................................. 17
5. MECHANICAL ADJUSTMENTS ....................... 21
6. ELECTRICAL ADJUSTMENTS
Deck section .................................................................... 21
CD Section ...................................................................... 22
7. DIAGRAMS ................................................................. 25
7-1. Circuit Boards Location .................................................. 26
7-2. Block Diagram – CD Section – ...................................... 27
7-3. Block Diagram – Tape/Tuner Section – ......................... 28
7-4. Block Diagram – Main Section – ................................... 29
7-5. Block Diagram – AMP Section – ................................... 30
7-6. Block Diagram – Display/Power Section –.................... 31
7-7. Printed Wiring Board – CD Board – .............................. 32
7-8. Schematic Diagram – CD Board – ................................. 33
7-9. Printed Wiring Boards – CD Mechanism Boards – ....... 34
7-10. Schematic Diagram – CD Mechanism Boards – ............ 35
7-11. Printed Wiring Board – MAIN Board – ......................... 36
7-12. Schematic Diagram – MAIN Board (1/3) – ................... 37
7-13. Schematic Diagram – MAIN Board (2/3) – ................... 38
7-14. Schematic Diagram – MAIN Board (3/3) – ................... 39
7-15. Printed Wiring Board – PANEL Board – ....................... 40
7-16. Schematic Diagram – PANEL Board – ........................... 41
7-17. Printed Wiring Boards – CD-SW, JOG, MIC, LIGHTING
Boards –........................................................................... 42
7-18. Schematic Diagram – CD-SW, JOG, MIC, LIGHTING
Boards –........................................................................... 43
7-19. Printed Wiring Board – PA Board – ............................... 44
7-20. Schematic Diagram – PA Board – .................................. 45
7-21. Printed Wiring Boards – TRANS, PRIMARY Boards – 46
7-22. Schematic Diagram – TRANS, PRIMARY Boards – .... 47
7-23. IC Pin Function Description............................................ 50
8. EXPLODED VIEWS
8-1. Case (Top), Back Panel Section ...................................... 56
8-2. Front Panel Section ......................................................... 57
8-3. Chassis Section................................................................ 58
8-4. CD Mechanism Deck Section-1
(CDM74-F1BD81).......................................................... 59
8-5. CD Mechanism Deck Section-2
(CDM74-F1BD81).......................................................... 60
9. ELECTRICAL PARTS LIST................................ 61

4
HCD-LX10000 SECTION 1
SERVICING NOTES
NOTES ON HANDLINGTHE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carryoutthe“S curve check”in“CD section adjustment” andcheck
that the S curve waveform is output several times.

5
HCD-LX10000
SECTION 2
GENERAL This section is extracted
from instruction manual.
LOCATINGTHE CONTROLS
ALBUM +/−qg
AMP MENU wl
CD eg
CD SYNC 9
Deck A wj
Deck B qk
DIRECTION qf
DISC 1 ~ 3 1
Disc tray 5
DISPLAY el
Display r;
ECHO LEVEL w;
ENTER qj
EQ BAND 7
EX-CHANGE/DISC SKIP 2
GROOVE es
ILLUMINATION ek
IR Receptor eh
MASTER VOLUME 4
MIC 1 (jack) wd
MIC 2 (jack) ws
MIC LEVEL wa
MP3 BOOSTER 6
OPERATION DIAL wg
PHONES (jack) wf
Power illuminator ql
REC PAUSE/START qs
SOUND FLASH wh
SURR SPEAKER MODE ra
TAPE A/B ed
Tape lid qk wj
TUNER/BAND ef
TUNING +/ñ qd
TV ea
VIDEO/MD e;
?/1 (power) ej
ZOPEN/CLOSE 3
nN (play) 8
. > (gobackward/forward)qd
m M (rewind/fast forward)
qg
X(pause) q;
x(stop) qa
ZA (Eject A) wk
B Z(Eject B) qh
List of button locations
ALPHABETICAL ORDER
A - D
E - L
M - R
S - Z
SYMBOLS
Top Panel
231
Front Panel
w fwaws w d
qd
q
f
q g
q h
q j
q k
q l
ra
el
ej
eg
ed
ea
wg
wh
wj
wk wl
e;
es
ef
eh
ek
r;
4
6
7
89
q;
qz
qs
5
w;

6
HCD-LX10000 This section is extracted
from instruction manual.
Remote control
ALBUM + qf
ALBUM −qh
CD wf
CLEAR qk
CLOCK/TIMER SELECT 2
CLOCK/TIMER SET 4
DISC SKIP qd
DISPLAY wh
ENTER qs
EQ qj
FM MODE 6
FUNCTION 8
PLAY MODE 5
REPEAT 6
SLEEP 1
TAPE wd
TUNER/BAND 7
TUNER MEMORY wg
TUNING MODE 5
VOLUME +/−qg
The + button has a tactile dot.*
?/1 (power) 3
x(stop) qa
X(pause) ql
N (play) w;
−.(go backward) ws
>+ (go forward) wa
m(rewind) q;
M(fast forward) 9
*Usethe tactile dot as a reference
when operating the system.
ALPHABETICAL ORDER
A - E
F - Z
SYMBOLS
7
5
q;
qg
qh
qj
qk
w;
ws
wd
wg
wh
qf
qd
qs
qa
9
8
6
4
3
12
ql
wa
wf

7
HCD-LX10000
SECTION 3
DISASSEMBLY
• This set can be disassembled in the order shown below.
3-1. DISASSEMBLY FLOW
3-2.SIDE PANEL, TOP CASE
(Page 8)
3-3.LOADING PANEL ASSY
(Page 8)
3-4.FRONT PANEL ASSY
(Page 9)
3-5.TUNER PACK
(Page 9)
3-13.POWER TRANSFORMER
(T1200)
(Page 13)
3-11.POWER AMP PC BOARD ASSY,
MAIN BOARD
(Page 12)
3-8.CD MECHANISM DECK
(Page 11)
3-7.PANEL BOARD,
CD-SW BOARD
(Page 10)
3-6.TAPE MECHANISM DECK,
MIC BOARD
(Page 10)
3-14.DRIVER BOARD,
SW BOARD
(Page 14)
3-10.PRIMARY BOARD,
LIGHTING BOARD
(Page 12)
3-17.MOTOR (TB) BOARD
(Page 15)
3-18.MOTOR (LD) BOARD
(Page 16)
3-16.SENSOR BOARD
(Page 15)
3-12.SURROUND BOARD,
PA BOARD
(Page 13)
3-9.BACK PANEL
(Page 11)
3-15.CD BOARD,
OPTICAL PICK-UP
(KSM-215DCP/C2NP)
(Page 14)
SET

8
HCD-LX10000
Note: Follow the disassembly procedure in the numerical order given.
3-2. SIDE PANEL,TOP CASE
3-3. LOADING PANEL ASSY
1 screw (case 3TP2)
(3
× 8)
2 two screws
(case 3 TP2)
(3
× 12)
3 two screws
(+BVTP 3
× 10)
4
5
panel (side-L)
6 screw
(case 3 TP2)
(3
× 8)
7 two screws
(case 3 TP2)
(3
× 12)
8 two screws
(+BVTP 3
× 10)
9
0
panel (side-R)
qa two screws
(+BVTP 3
× 10)
qs
qd
CASE (TOP)
CD mechanism deck (CDM74-F1BD81)
1 Turn the pulley to the arrow direction.
Front side
Pulley
2 Pull out disc tray
3
4
loading panel assy

9
HCD-LX10000
3-4. FRONT PANEL ASSY
3-5.TUNER PACK
1 two screws
(+BVTP 3
× 10)
2 three screws
(+BVTP 3
× 10)
3 screw
(+BVTP 3
× 10)
5 screw
(+BVTP 3
× 6)
4 screw
(+BVTP 3
× 10)
6 front panel assy
7 connector
(CN100)
8 CNP508
9 CNP509
q; connector
(CN503)
lug
qa connector
(CN1102)
qs connector
(tape mechanism deck)
2 CNP1
3 tuner pack
4 cover (tuner)
1 two screws
(+BVTP 3
× 6
)

10
HCD-LX10000
3-6.TAPE MECHANISM DECK, MIC BOARD
3-7. PANEL BOARD, CD-SW BOARD
1 four screws
(+BVTP2.6 (3CR)
)
2 cover (TCM)
3 screw
(+BVTP2.6 (3CR))
4 tape mechanism deck
5 two screws
(+BVTP2.6 (3CR))
6 bracket (MIC)
8 MIC board
7 two knobs (MIC)
1 knob vol
2 knob (AMS)
3 three screws
(+BVTP2.6 (3CR)
)
4 two screws
(+BVTP2.6 (3CR))
5 two screws
(+BVTP2.6 (3CR))
6 two screws
(+BVTP2.6 (3CR))
7 three screws
(+BVTP2.6 (3CR))
qa three screws
(+BV3 (3CR))
8 connector
(CNS902)
0 PANEL board
qs CD-SW board
9 claw