Sony HCD-ZX50MD User manual

1
HCD-ZX50MD
HCD-ZX50MD is the tuner, deck, CD, MD and
amplifier section in DHC-ZX50MD.
SPECIFICATIONS
MINI Hi-Fi COMPONENT SYSTEM
— Continued on next page —
Model Name Using Similar Mechanism NEW
CD Mechanism Type CDM53F-K4BD40
Base Unit Type BU-K4BD40
Optical Pick-up Type KSM-213DHAP/Z-NP
Model Name Using Similar Mechanism MDS-JE640
MD Mechanism Type MDM-7B
Optical Pick-up Type KMS-260B/J1N
Model Name Using Similar Mechanism HCD-ZX10
Tape Transport Mechanism Type TCM-230AWR12
CD
SECTION
MD
SECTION
US Model
AEP Model
UK Model
E Model
Australian Model
TAPE DECK
SECTION
Amplifier section
AUDIO POWER SPECIFICATIONS:
(US model only)
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
with 8 ohm loads both channels driven, from 120–
10,000 Hz; rates 80 watts per channel minimum
RMS power, with no more than 10 % total
harmonic distortion from
250 milliwatts to rated output.
Total harmonics distortion Less than 0.07 %
(8 ohms at 1 kHz, 50 W)
European model:
DIN power output (rated) 60 + 60 watts
(8 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
80 + 80 watts
(8 ohms at 1 kHz,
10 % THD)
Music power output (reference)
140 + 140 watts
(8 ohms at 1 kHz,
10 % THD)
Other models:
The following measured at 120/220/240 V AC, 50/60 Hz
DIN power output (rated) 115 + 115 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
150 + 150 watts
(6 ohms at 1 kHz,
10 % THD)
Inputs
VIDEO (AUDIO) IN: voltage 250 mV,
(phono jacks) impedance 47 kilohms
MIC: sensitivity 1 mV,
(mini jack) impedance 10 kilohms
(Asian model only)
Outputs
PHONES: accepts headphones of
(stereo mini jack) 8 ohms or more
FRONT SPEAKER:
US and European models: accepts impedance of 8 to 16 ohms
Other models: accepts impedance of 6 to 16 ohms
SUPER WOOFER: Voltage 1 V, impedance 1 kilohms
CD player section
System Compact disc and digital audio
system
Laser Semiconductor laser
(λ=780nm)
Emission duration: continuous
Laser output Max. 44.6 µW*
*This output is the value measured
at a distance of 200 mm from the
objective lens surface on the
Optical Pick-up Block with 7 mm
aperture.
Wavelength 780 –790 nm
Frequency response 2 Hz –20 kHz (±0.5 dB)
Signal-to-noise ratio More than 90 dB
Dynamic range More than 90 dB
SERVICE MANUAL
Ver 1.2 2001.12
9-929-512-13
2001L0200-1
© 2001.12
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation

2
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
US model: 87.5 – 108.0 MHz (100 kHz step)
Other models: 87.5 – 108.0 MHz (50 kHz step)
Antenna FM lead antenna
Antenna terminals 75 ohm unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
US model: 530 – 1,710 kHz
(with the interval set at
10 kHz)
531 – 1,710 kHz
(with the interval set at
9 kHz)
European model: 531 – 1,602 kHz
(with the interval set at
9 kHz)
Other models: 531 – 1,602 kHz
(with the interval set at
9 kHz)
530 – 1,710 kHz
(with the interval set at
10 kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
General
Power requirements
US model: 120 V AC, 60 Hz
European model: 230 V AC, 50/60 Hz
Australian and New Zealand models:
230 –240 V AC, 50/60 Hz
Mexican model: 120 V AC, 60 Hz
Other models: 120 V, 220 V, 230 –240 V AC,
50/60 Hz
Adjustable with voltage selector
Power consumption
US model: 150 watts
European model: 160 watts
Other models: 180 watts
Dimensions (w/h/d) Approx. 250 x 375 x 395 mm
Mass
US model: Approx. 11.5 kg
European model: Approx. 11.5 kg
Other models: Approx. 12.0 kg
Supplied accessories: AM loop antenna (1)
FM lead antenna (1)
Remote Commander (1)
Batteries (2)
Speaker cords (2)
Front speaker pads (8)
Design and specifications are subject to change
without notice.
MD deck section
System MiniDisc digital audio system
Laser Semiconductor laser (π=780 nm)
Emission duration: continuous
Laser output Max. .6 µW*
*This output is the value measured
at a distance of 200 mm from the
objective lens surface on the
Optical Pick-up Block with a
7 mm aperture.
Sampling frequency .1 kHz
Frequency response 20 - 20,000 Hz
OPTICAL IN (North American model only)
(Square optical connector jacks, rear panel)
Wavelength 700 nm
Tape player section
Recording system -track 2-channel stereo
Frequency response 0 – 13,000 Hz (±3 db),
(DOLBY NR OFF) using Sony TYPE I cassette
0 – 1 ,000 Hz (±3 db),
using Sony TYPE II cassette

3
SELF-DIAGNOSIS FUNCTION
The self-diagnosis function consists of error codes for customers which are displayed automatically when errors occur, and error codes which
show the error history in the test mode during servicing. For details on how to view error codes for the customer, refer to the following box
in the instruction manual. For details on how to check error codes during servicing, refer to the following “Procedure for using the Self-
Diagnosis Function (Error History Display Mode)”.
Procedure for using the Self-Diagnosis Function (Error History Display Mode).
Note: Perform the self-diagnosis function in the “error history display mode” in the test mode. The following describes the least required
procedure. Be careful not to enter other modes by mistake. If other modes are entered accidentally, press the NAME EDIT/
CHARACTER button while REC IT is lit, and when REC IT goes off, press the MD Zbutton to exit the mode.
Self-diagnosis Display
This system has the Self-diagnosis display
function to let you know if there is a system
malfunction. The display shows a code made up of
three letters and a message alternately to show you
the problem. To solve the problem refer to the
following list. If any problem persists, consult
your nearest Sony dealer.
C11 / Protected
The MD is protected against erasure.
pRemove the MD and slide the tab to close the
slot (page 37).
C12 / Cannot Copy
You are attempting to record a CD with a
format that the system does not support, such as
CD-ROM.
p––
C13 / REC Error
Recording is not possible.
pMove the system to a stable place and start
recording over from the beginning.
The MD is dirty or is scratched or the MD does
not meet the standards.
pChange the MD with another one and start
recording over from the beginning.
C13 / Read Error
The MD cannot read the disc information
correctly.
pEject the MD once, then insert it again.
C14 / Toc Error
The MD cannot read the disc information
correctly.
pChange the MD with another one.
pErase all the recorded contents of the MD
using the Erase function on page 52.
C41 / Cannot Copy
This unit complies with the Serial Copy
Management System (SCMS) which limits the
number of digital copies that can be made of
any given digital audio source (page 90).
C71 / Check OPT-IN
You tried to record from the digital component
when no component is connected to OPTICAL
IN jack or the digital component is not
connected correctly.
pConnect the digital component correctly to
OPTICAL IN jack with a digital optical cable.
The power of the connected digital component
is off.
pTurn on the digital component.
E0001 / MEMORY NG
The component has internal problems.
pConsult your nearest Sony dealer.
E0101 / LASER NG
There is a problem with the laser pickup.
pThe laser pickup may be damaged. Consult
your nearest Sony dealer.
1. In the power ON state, set the function to MD, and while pressing the DISPLAY and xbuttons together, press V-GROOVE . While
the test mode is set. “[Check]”will be displayed.
2. Move the multi-stick left and right to display “[Service]”and press the PUSH ENTER button.
3. Move the multi-stick left and right to display “Err Display”.
4. Press the PUSH ENTER button to enter the error history mode. “op rec tm”will be displayed.
5. Select the item to be displayed or executed using the multi-stick.
6. Press the NAME EDIT/CHARACTER button so that REC IT lights up.
7. Press the MD REC MODE button to display the selected item.
8. Press the REC MODE button another time to return to step 4.
9. Pressing the CLEAR button when REC IT is lit displays “Err Display”and exits the error history display mode.
10. To exit the test mode, press the MD Zbutton while REC IT is off. This sets the standby state and ends the test mode.

4
ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTS
Selecting theTest Mode
Display
op rec tm
op play tm
spdl rp tm
retry err
total err
err history
retry adrs
er refresh
op change
spdl change
History
Displays the total recording time.
When the total recording time is more than 1 minute, displays the hour and minute
When less than 1 minute, displays “Under 1 min”
The display time is the time the laser is set to high power, which is about 1/4 of the actual recording time.
Displays the total playback time.
When the total playback time is more than 1 minute, displays the hour and minute
When less than 1 minute, displays “Under 1 min”
Displays the total rotating time of the spindle motor.
When the total rotating time is more than 1 minute, displays the hour and minute
When less than 1 minute, displays “Under 1 min”
Displays the total number of retry errors during recording and playback
Displays “r xx p yy”. xx is the number of errors during recording. yy is the number of errors during playback.
This is displayed in hexadecimal from 00 to FF.
Displays the total number of errors
Displays “total xx”. This is displayed in hexadecimal from 00 to FF.
Displays the past ten errors.
Displays “0x ErrCd@@”.
X is the history number. The younger the number, the more recent is the history (00 is the latest). @@ is the error
code.
Select the error history number using the Multi stick.
Displays the past five retry addresses.
Displays “xx ADRS yyyy”, xx is the history number, yyyy is the cluster with the retry error.
Select the error history number using the Multi stick.
Mode for erasing the error and retry address histories
Procedure
1. Press the MD REC MODE button while “REC IT”is lit when displayed as “er refresh”.
2. Press the PUSH ENTER button when the display changes to “er refresh?”.
When “complete!”is displayed, it means erasure has completed.
Be sure to check the following after executing this mode.
*Data has been erased.
*Perform recording and playback, and check that the mechanism is normal.
Mode for erasing the total time of op rec tm, op play tm.
These histories are based on the time of replacement of the optical pick-up. If the optical pick-up has been
replaced, perform this procedure and erase the history.
Procedure
1. Press the MD REC MODE button while “REC IT”is lit when displayed as “op change”.
2. Press the PUSH ENTER button when the display changes to “op change?”.
When “Complete!”is displayed, it means erasure has completed.
Mode for erasing the total spdl rp tm time
These histories are based on the time of replacement of the spindle motor. If the spindle motor has been replaced,
perform this procedure and erase the history.
Procedure
1. Press the MD REC MODE button while “REC IT”is lit when displayed as “spdl change”
2. Press the PUSH ENTER button when the display changes to “spdl change?”
When “Complete!”is displayed, it means erasure has completed.

5
Description
Table of Error Codes
Error Code
10
12
20
21
22
23
24
30
31
40
41
42
43
50
51
Could not load
Loading switches combined incorrectly
Timed out without reading the top of PTOC
Could read top of PTOC, but detected error
Timed out without accessing UTOC
Timed out without reading UTOC
Error in UTOC
Could not start playback
Error in sector
Retry cause generated during normal recording
Retried in DRAM overflow
Retry occurred during TOC writing
Retry aborted during S.F editing
Other than access processing, and could not read address.
Focus NG occurred and overran.

6
TABLE OF CONTENTS
MODEL IDENTIFICATION
— BACK PANEL —
•Abbreviation
G : German model
AED : North European model
MX : Mexican model
AR : Argentine model
HK : Hong Kong model
MY : Malaysia model
SP : Singapore model
KR : Korean model
AUS : Australian model
MODEL
US model
AEP, UK, G,AED, CIS model
MY, SP model
E model
AR model
HK model
MX model
AUS model
KR model
PARTS No.
4-227-556-0s
4-227-556-2s
4-227-556-3s
4-227-556-4s
4-227-556-5s
4-227-556-6s
4-227-556-7s
4-227-556-8s
4-227-556-9s
Parts No.
1. SERVICING NOTES ............................................. 7
2. GENERAL ........................................................................ 15
3. DISASSEMBLY
3-1. Case .................................................................................. 18
3-2. Front Panel Section .......................................................... 18
3-3. MD Mechanism Section
Tape Mechanism Deck Section (TCM-230AWR12)........ 19
3-4. Back Panel Section ........................................................... 19
3-5. MD Mechanism Deck Section (MDM-7B)...................... 20
3-6. Main Board, Front AMP Board ........................................ 20
3-7. CD Base Unit (BU-K4BD40)........................................... 21
3-8. CD Mechanism Deck Section (CDM53F-K4BD40)........ 21
3-9. Fitting Base (Guide) Assy, Bracket (Chassis) and
Fitting Base (Magnet) Assy ..............................................22
3-10. Tray (Sub) ......................................................................... 22
3-11. Chassis (Mold B) Section, Stocker Section and
Slider (Selection) ............................................................. 23
3-12. Gears Installation.............................................................. 23
3-13. Slider (Selection) Installation ........................................... 24
3-14. Stocker Section Installation .............................................. 24
3-15. Chassis (Mold B) Section Installation.............................. 25
3-16. BD Board.......................................................................... 25
4.TEST MODE...................................................................... 26
5. MECHANICAL ADJUSTMENTS............................... 35
6. ELECTRICAL ADJUSTMENTS................................. 35
7. DIAGRAMS
7-1. Circuit Boards Location ...................................................... 51
7-2. Block Diagrams
•CD Section ....................................................................... 54
•MD Section ...................................................................... 55
•SYSCON/SERVO Section ............................................... 56
•MAIN Section.................................................................. 57
7-3. Printed Wiring Board –Deck Section –.............................. 58
7-4. Schematic Diagram –Deck Section –................................ 59
7-5. Printed Wiring Board –CD Section –................................. 60
7-6. Schematic Diagram –CD Section –................................... 61
7-7. Printed Wiring Board –MD Section –................................ 62
7-8. Schematic Diagram –MD (1/2) Section –.......................... 63
7-9. Schematic Diagram –MD (2/2) Section –.......................... 64
7-10. Printed Wiring Board –Main Section –........................... 65
7-11. Schematic Diagram –Main (1/4) Section –..................... 66
7-12. Schematic Diagram –Main (2/4) Section –..................... 67
7-13. Schematic Diagram –Main (3/4) Section –..................... 68
7-14. Schematic Diagram –Main (4/4) Section –..................... 69
7-15. Printed Wiring Board –Digital (Side A) Section –.......... 70
7-16. Printed Wiring Board –Digital (Side B) Section –.......... 71
7-17. Schematic Diagram –Digital (1/2) Section –.................. 72
7-18. Schematic Diagram –Digital (2/2) Section –.................. 73
7-19. Printed Wiring Board
–AMP (US, AEP, UK, G, AED, CIS model) Section –.. 74
7-20. Schematic Diagram
–AMP (US, AEP, UK, G, AED, CIS model) Section –.. 75
7-21. Printed Wiring Board –AMP (E, MX,AR, HK,
MY, SP, KR, AUS model) Section –................................ 76
7-22. Schematic Diagram –AMP (E, MX,AR, HK,
MY, SP, KR, AUS model) Section –................................ 77
7-23. Printed Wiring Board –Panel Section –........................... 78
7-24. Schematic Diagram –Panel Section –............................. 79
7-25. Printed Wiring Board –Switch Section –........................ 80
7-26. Schematic Diagram –Switch Section –........................... 81
7-27. Printed Wiring Board –CD Mechanism Section –.......... 82
7-28. Schematic Diagram –CD Mechanism Section –............. 83
7-29. Printed Wiring Board –Leaf SW Section –..................... 84
7-30. Schematic Diagram –Leaf SW Section –........................ 84
7-31. Printed Wiring Board –MIC Section –............................ 85
7-32. Schematic Diagram –MIC Section –............................... 85
7-33. Printed Wiring Board –Power Supply (US, AEP, UK,
G, AED, CIS model) Section –........................................ 86
7-34. Schematic Diagram –Power Supply (US, AEP, UK,
G, AED, CIS model) Section –........................................ 87
7-35. Printed Wiring Board –Power Supply (E, MX, AR, HK,
MY, SP, KR, AUS model) Section –................................ 88
7-36. Schematic Diagram –Power Supply (E, MX, AR, HK,
MY, SP, KR, AUS model) Section –................................ 89
7-37. IC Block Diagrams........................................................... 90
7-38. IC Pin Functions............................................................... 94
8. EXPLODEDVIEWS
8-1. Back Panel Section ......................................................... 106
8-2. Front Panel Section ........................................................ 107
8-3. Chassis Section ............................................................... 108
8-4. CD Mechanism Deck Section-1 ..................................... 109
8-5. CD Mechanism Deck Section-2 ..................................... 110
8-6. Base Unit Section ........................................................... 111
8-7. Tape Mechanism Deck Section-1 ................................... 112
8-8. Tape Mechanism Deck Section-2 ................................... 113
8-9. MD Mechanism Section-1.............................................. 114
8-10. MD Mechanism Section-2.............................................. 115
9. ELECTRICAL PARTS LIST ...................................... 117

7
SAFETY CHECK-OUT
(US model only)
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Checkthe antenna terminals, metal trim,“metallized” knobs, screws,
and all other exposed metal parts forAC leakage. Check leakage as
described below.
LEAKAGE
TheAC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
1. Acommercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operatedAC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2VAC range are suitable. (See
Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
0.15µF
To Exposed Metal
Parts on Set
1.5kΩAC
voltmeter
(0.75V)
Earth Ground
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
otherthanthose specified herein may result inhazardousradiation
exposure.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
FOR CD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
FOR MD
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
This caution
label is located
inside the unit.
SECTION 1
SERVICE NOTES

8
CN503
CN701
Jig (J-2501-076-A)
Jig (J-2501-165-A)
Jig (J-2501-167-A) Jig (J-2501-011-A)
SERVICE POSITION
• CD MECHANISM BLOCK
Ver 1.2 2001.12

9
•BD (CD) BOARD
To repair the BD (CD) board,remove the bottom plate.
Bottom view

10
JIG FOR CHECKING BD (MD) BOARDWAVEFORM
The special jig (J-2501-196-A) is useful for checking the waveform of the BD (MD) board. The names of terminals and the checking items
to be performed are shown as follows.
GND : Ground
I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)
IOP : For measuring IOP (Check the deterioration of the optical pick-up laser)
TE : TRK error signal (Traverse adjustment)
VC : Reference level for checking the signal
RF : RF signal (Check jitter)
FE : Focus error signal
I+3V
Iop
GND
TE
FE
VC
RF
I+3V
IOP
GND
TE
FE
VC
RF
1
7
for
MDM-7
B
I+3V
CN105
IOP
TEVC
GND
FE RF