SPI Supplies plasma prep III User manual

Version 1.0 9/11
Structure Probe, Inc. / SPI Supplies
Street address for UPS, FedEx, DHL, other couriers, trucks
206 Garfield Ave.
West Chester, PA19380
Mailing address P.O. Box 656 West Chester,
PA 19381-0656 USA
Toll-free from USA/Canada: 1-(800)-2424-SPI
Phone: 1-(610)-436-5400
FAX: 1-(610)-436-5755
E-mail: spi3spi@2spi.com
For further information regarding any of the other products designed and manufactured by SPI Supplies, contact your
local representative or directly to SPI Supplies at the address above, or visit www.2spi.com
•Carbon and Sputter Coaters
•Osmium Plasma Coaters
•Ion Mills
•Plasma Reactor for ashing and etching
•High Vacuum Bench Top Evaporators
•Critical Point Dryers
•Electron Microscopy Supplies, Consumables and Accessories

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Warranty
The SPI Supplies unit you have purchased is guaranteed to be free of defects in workmanship on the day of
shipment. This warranty covers parts and labor for a period of one year, excluding shipping charges or
consumables. Breakage of glassware is specifically excluded from this warranty.
Proper use of your unit, according to the operation manual, should result in trouble-free operation. Any improper
use of the SPI Supplies unit through modifications or unreasonable operating procedures will void this warranty.
Disclaimer
SPI Supplies instruments are designed for simplicity of installation and operation. This manual provides full and
complete information in both these areas. SPI Supplies therefore assumes no liability or responsibility of any
kind for damage or injury resulting from incorrect installation or operation of the machine.
If anyquestions arise, call SPI Supplies from the USA/Canada 1-800-2424-SPI or 1-610-436-5400 for assistance.
For all other countries, contact our nearest agent or SPI Supplies directly. A listing of our agents may be found
on our website at:
http://www.2spi.com/info/agents/

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1 Contents
1.1 Manual Layout
This Operation Manual is divided up into the following major sections, each section dealing with
specific topics, as follows:
Section 1 – Contents
Section 2 - Health and Safety
General section which applies to all SPI Supplies products detailing the very important issues of Health
and Safety applicable when using sample preparation equipment.
Section 3 - Introduction
Introduces this manual.
Section 4 - General Description
Identifies each of the equipment items and provides an overview of their functions and how they work.
Section 5 - Installation
Instructions on how this Instrument should be installed and the connections which should be made
between the equipment items.
Section 6 - Operation
Instructions on how to start-up and run the instrument.
Section 7 - Maintenance
Instructions on routine maintenance checks and determining if the system is functioning correctly.
Information on how to identify faults in the system and how to rectify these faults.
Section 8 – Spare parts and consumables
Section 9 – Technical Diagrams

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1.2 Section Contents
Section1 – Contents................................................................................................... 4
1.1 Manual Layout.................................................................................................4
1.2 Section Contents .............................................................................................5
1.3 Illustrations ......................................................................................................6
Section 2 – Health and Safety ...................................................................................7
2.1 Safety Policy....................................................................................................7
2.2 Servicing..........................................................................................................7
2.2.1 Disclaimer.....................................................................................................7
2.2.2 Operators and Service Engineers................................................................7
2.3 Hazard Signals and Signs...............................................................................8
2.3.1 Hazard Signal Words – Definition ................................................................8
2.4 Good Working Practices..................................................................................9
2.5 Plasma Prep III Plasma Cleaner Specific Potential Safety Hazards...............9
Section 3 – Introduction........................................................................................... 11
3.1 Return of Goods ............................................................................................ 11
3.2 Returns Procedure ........................................................................................ 11
Section 4 – Description............................................................................................12
4.1 Overview........................................................................................................12
4.2 Typical Plasma Process ................................................................................12
4.3 Technical Specifications ................................................................................13
4.4 Equipment Controls and Indicators ...............................................................14
4.4.1 Front Panel.................................................................................................14
4.4.2 Rear Panel .................................................................................................15
4.5 Equipment Description ..................................................................................16
4.5.1 RF Generator .............................................................................................16
4.5.2 Vacuum System .........................................................................................16
4.5.3 Gas Supply System....................................................................................16
4.5.4 Reaction Chamber .....................................................................................16
Section 5 – Installation.............................................................................................17
5.1 Site Requirements.........................................................................................17
5.2 Assembly.......................................................................................................17
5.2.1 Installing the Outer Chamber.....................................................................17
5.2.2 Engaging the TEM Specimen Stage Adapter.............................................18
5.2.2 Vacuum Pump Installation..........................................................................18
5.2.3 Connecting the Process Gas .....................................................................19
Section 6 – Operation...............................................................................................20
6.1 Overview........................................................................................................20
6.1.1 Initial Pump Down and Operation ..............................................................20
6.1.2 Loading Samples........................................................................................21
6.1.3 Shut Down Procedure................................................................................21
6.2 Connecting the Plasma Prep III Process Controller......................................22
Section 7 – Maintenance..........................................................................................23
7.1 Overview........................................................................................................23

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7.2 O-ring Maintenance.......................................................................................23
7.3 Cleaning.........................................................................................................23
7.4 Vacuum System Adjustments........................................................................24
7.5 Replacement Parts........................................................................................24
Section 8 – Replacement Parts...............................................................................25
Section 9 – Technical Diagrams..............................................................................26
1.3 Illustrations
Figure 2.1 – Hazard Warning Symbols ........................................................................8
Figure 2.2 – Typical Warning Symbols.........................................................................8
Figure 4.4.1 – Front Panel..........................................................................................14
Figure 4.4.2 – Rear Panel..........................................................................................15
Figure 5.2.1 – Chamber Cross-section......................................................................18
Table 8.1 – Replacement Parts..................................................................................25
Figure 9.1 – Logic Flow Chart....................................................................................26
Figure 9.2 – Plasma Prep III Plasma Cleaner Chassis Wiring Diagram....................27
Figure 9.3 – Plasma Prep III Plasma Cleaner Control Panel Schematic...................28
Figure 9.4 – Plasma Prep III Plasma Cleaner RF Control Board Schematic.............29

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2 HEALTH AND SAFETY
Safety is very important when using any instrumentation and all users of our equipment should read
this section.
This section of the Manual applies to all specimen preparation equipment supplied by SPI Supplies,
not just the particular instrument for which the manual refers.
Included in this section are details on warning notations and good working practices.
2.1 Safety Policy
This section contains important information relating to all health and safety aspects of the equipment.
As such it should be read, and understood, by all personnel using the instrument whether as an
operator or in a service capacity.
SPI Supplies is committed to providing a safe working environment for its employees and those that
use its equipment.
SPI Supplies regularly reviews its operations to make environmental, health and safety improvements
in line with applicable legislation.
The equipment has been designed as a free-standing instrument. SPI Supplies cannot be held
responsible for any damage, injury or consequential loss arising from the use of its equipment for any
other purposes, or any unauthorized modifications made to the equipment.
All service work carried out on the equipment should only be undertaken by suitably qualified personnel.
SPI Supplies is not liable for any damage, injury or consequential loss resulting from servicing by
unqualified personnel. SPI Supplies will also not be liable for damage, injury or consequential loss
resulting from incorrect operation of the instrument or customer modification of the instrument.
2.2 Servicing
2.2.1 Disclaimer
All service work on the equipment should be carried out by qualified personnel. SPI Supplies cannot
be liable for damage, injury or consequential loss resulting from servicing from unqualified personnel.
SPI Supplies will also not be liable for damage, injury or consequential loss resulting from incorrect
operation of the instrument or modification of the instrument.
2.2.2 Operators and Service Engineers
A normal operator of the equipment not trained in or qualified for service work on the equipment and
may cause a hazard to himself/herself or others if such work is attempted. Operators should therefore
restrict themselves to the normal operation of the equipment and not remove covers from the
electronic equipment or dismantling of the instruments, or otherwise attempt to thwart the intent of the
safety interlock system.
Service Engineers who are suitably trained to assess and isolate electrical, mechanical and vacuum
hazards should be the only personnel who access the equipment.

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2.3 Hazard Signals and Signs
2.3.1 Hazard Signal Words - Definitions
WARNING
Warnings are given where failure to observe the instruction could result in injury or death
to people.
CAUTION
Cautions are given where failure to observe the instructions could result in damage to
the equipment associated equipment and process.
Figure 2.1 - Hazard Warning Symbols
WARNING
Do NOT depress button “P” as this will change the program.
Figure 2.2 - Typical Warning sign as shown in this Manual

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2.4 Good Working Practices
It is essential that good hygienic working practices are adopted at all times especially in an ultra high vacuum
or cleanroom environment and are generally of the “Common sense” type. Some simple good practice rules
are:
If in doubt don't.
If in doubt ask.
When handling solvents wear face mask, gloves, apron and work only in a well ventilated
area.
Mop up any spillages immediately, using procedures appropriate for the spilled material.
When handling or decanting mineral oils wear protective clothing.
Aerosols of mineral oils, such as that produced by gas ballasting, can prove to be hazardous
and an exhaust is recommended.
Before attempting to service electrical apparatus, isolate from the mains.
Treat all unknown substances as hazardous.
Dispose of substances in an appropriate manner.
Use the correct tool for the job.
Keep a straight back and bend from the knees when lifting heavy objects.
Wear protective clothing when using liquid nitrogen.
Affix pressurised gas cylinders firmly to walls or racks. Use the correct regulating valves on
gas cylinders and always transport cylinders using the appropriate specialist trolley.
Obey safety regulations regarding lifts, hoists and machine tools.
Always make sure you understand a procedure well before attempting it for the first time.
2.5 Plasma Prep III Plasma Cleaner Specific Potential Safety Hazards
The following Safety Hazards are specific to the SPI Supplies Plasma Prep III Plasma Cleaner
CAUTION
Be sure to keep all vacuum parts, especially any O-rings or seals clean and free from excessive
moisture, chips, dust etc. All such parts should be replaced if suspected of damage.
CAUTION
Do not handle any parts to be placed in the glass chamber with your bare hands. Contamination such
as skin oil may cause trouble to the ultimate pressure.

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WARNING
Use care when handling or installing the glass outer chamber, as they are extremely fragile.
WARNING
Be careful when handling the vacuum oil, because it is very hot just after the pump is operated.
WARNING
Never run the rotary vacuum pump without vacuum oil.
WARNING
The used vacuum oil and oil mist traps should be disposed safely in accordance with all local and
national safety and environmental requirements.
WARNING
Since the gas most commonly used in the Plasma Prep Plasma Cleaner is oxygen (O2), NO OPEN
FLAME and NO SMOKING signs should be posted near the instrument.
WARNING
There are two micro-switch interlocks engineered into the Plasma Prep III Plasma Cleaner to prevent
injury to operating personnel. They are:
A. RF Shield Interlock – This switch cuts off AC power to the RF power supply. This
ensures that the Plasma Prep III Plasma Cleaner will not function without the shield
in place.
B. Cover, Right Side, Center – This This switch shuts off all primary power to the
Plasma Prep III Plasma Cleaner. It is to prevent the operation of the system while
the top of the unit is off.

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3 INTRODUCTION
This manual provides installation, operation and maintenance instructions for the Plasma Prep III
Plasma Cleaner. You must use the Plasma Prep III Plasma Cleaner as described in this manual.
Note that the servicing and maintenance procedures should only be carried out by qualified service
personnel and it is essential that all users should read the Health and Safety section of this manual.
3.1 Return of Goods
If goods are to be returned to SPI Supplies for repair or servicing the customer should contact SPI
Supplies or their local distributor before shipment.A"Return Authorization Number" should be obtained
in advance of any shipment. This number is to be clearly marked on the outside of the shipment. To
obtain an RA#, contact our Customer Service Department and be sure to provide us with the following
details:
* SPI Invoice Number and Invoice Date (if applicable)
* Method of shipment if applicable (post office, UPS, FedEx, Air Freight, etc.)
* Product(s) in question
* What is wrong with the product, or why do you want to make this return?
This can also be done expeditiously through the SPI Supplies website at:
http://www.2spi.com/return_number.html
For returns outside the United States, contact either your closest SPI Supplies agent (see
http://www.2spi.com/info/agents/) or SPI Supplies in the USAby phone (1-610-436-5400), fax (1-610-436-
5755), or by email (spi3spi@2spi.com).
3.2 Returns Procedure
Warranty Claim
All components are sold with a return to factory warranty (unless otherwise stated), which covers
failure during the first 12 months after delivery.
Returns must be sent courier paid, SPI Supplies will cover the return courier costs. This covers defects,
which arise as a result of a failure in design or manufacturing. It is a condition of warranty that
equipment must be used in accordance with the manufacturers instructions and not have been
subjected to misuse. This warranty does not cover consumable items or glassware. To make a claim
under the terms of this warranty provision contact the Customer Service Department at SPI Supplies.
Chargeable Repairs
Contact the Customer Service Department at SPI Supplies to obtain an estimate of repair costs.
Service of equipment is generally completed within twenty working days after receipt of the equipment.
A minimum evaluation fee is normally applied. Additional fees are charged as a per hour repair rate in
addition to parts.
Returns
All returns to SPI Supplies are required to follow the procedure described above in Section 3.2. All
returned items are required to have a Return Authorisation Number, which can also be obtained at
www.2spi.com/return-number.html.
Packaging and Shipping
All goods shipped to the factory must be sealed and packed in a suitable carton. If the original
packaging is not available SPI Supplies should be contacted for advice. DO NOT SHIP ANY
GLASSWARE ASSEMBLED INSIDE THE UNIT. SPI Supplies will not be responsible for damage
resulting from inadequate returns packaging or contamination of delicate structures by stray particles
under any circumstances. All non-warranty goods returned to the factory must be sent courrier, pre-
paid. They will be returned courrier, pre-paid and added to the final invoice unless otherwise arranged.

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4 DESCRIPTION
4.1 Overview
The SPI Supplies Plasma Prep III Plasma Cleaner is a table-top plasma chemistry reactor designed to
provide plasma technology at a moderate cost. This simple-to-operate instrument can perform repeatable
plasma chemical reactions with a minimum of automation. All controls are manual; however, where
necessary, automatic monitors and controls take over to protect the equipment and the samples in the
reactor.
The Plasma Prep III Plasma Cleaner comes equipped with an internally housed solid state RF generator.
RF power is transferred from the power amplifier via a matching network to the reaction chamber.Avariable
capacitor provides a tuning control. Metering of the forward and reverse power and enables tuning of the
instrument and is displayed on an LED selectable push button switch.
The Plasma Prep III Plasma Cleaner is a small reactor that weighs under 31 pounds fully assembled,
less vacuum pump.With the exception of the external vacuum pump, it is a fully self-contained machine.
It consists of an RF generator and associated tuning circuits, a vacuum system with solenoid control
valves, a constant feed gas supply system and a reaction chamber system, which includes one Pyrex®
glass or quartz chamber and a polymer chamber seal including an adapter for the TEM Specimen Stage.
4.2 Typical Plasma Process
The "Plasma Process" is accomplished through the use of a low pressure, RF induced gaseous
discharge. The TEM Specimen Stage and related material or specimen is loaded into the reaction
chamber using the appropriate adapter. The chamber is evacuated to a mild vacuum (approximately 250
mTorr) by a mechanical vacuum pump. A carrier gas is drawn through the chamber over the specimen.
Radio frequency power is applied around the chamber (at 13.56MHz). This excites the carrier gas
molecules and changes some of them into chemically active species.
The mechanism employed in this process is one of oxidation. Electrons, produced by ionization
of gas, gain energy in the electric field. Subsequent collisions between these energetic electrons and
neutral gas molecules result in an energy transfer to the molecules producing chemically active atoms,
free radicals, ions and free electrons. The combustion products, which are completely dissociated and
harmless, are carried away in the gas stream. The unique property of this process is that it occurs near
ambient temperatures without employing toxic chemicals.
As compared to traditional plasma etching of materials, plasma cleaning, using a far lower power,
is designed literally to "tickle" the top surface of a material. For the purpose of removing thin adsorbed
layers of contamination on a TEM foil sample for example, or on the sample Stage itself, a low power
plasma cleaner will do the job just fine. Indeed, using argon for example, at higher power could actually
"etch" and cause damage to the metal parts of the microscope stage. At less than 10 watt operation
level, one is easily able to remove the slightly held contamination that is responsible for loss of contrast
and image quality in most TEMs.

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4.3 Technical Specifications
Main Body
Model No.
Plasma Prep III Plasma Cleaner (SPI# 11055-AB or AX)
Weight
31 lbs / 14 kg
Height
10.5 inches / 26.7 cm
Width
11.8 inches / 30.0 cm
Length
14.8 inches / 37.6 cm
RF Power
0 to 100 Watts
RF Frequency
13.56 MHz – crystal controlled
AC Power
100 to 240 V AC, 50/60 Hz (not including vacuum pump)
Gas Introduction
Sublimated gas is introduced into the gas reactor (chamber).
Evacuation
Rotary Vane Vacuum Pump or Scroll Pump
Vacuum Pump Requirements
Vacuum Pump Capable of 50-100 liters/min. If using O2 or CF4, Fomblin®
oil is recommended
Power
100 to 240 V AC, 50/60 Hz, 15 amp service
Oil Mist Trap
Please change element every 1,500 to 2,000 running hours
NOTE:
This equipment complies with Title47, Part 18 of theFederal Communications Commission Rules when operated
as set forth in the accompanying instruction book. The fundamental (+/- 7 kHz) falls within the unlimited radiation
ISM bands defined in FCC 18.301. Field strength levels of emissions outside the fundamental are below the
limits of FCC 18.305.
This ISM device complies with Canadian ICES-001.

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4.4 Controls and Indicators
4.4.1 Front Panel
Figure 4.4.1 – Front Panel
1 – Main Power Button – This button controls the main power to the Plasma Prep III Plasma Cleaner. When
lit, main power is on. When unlit, main power is off.
2 – Vacuum Button – This button controls the vacuum interlock to the Plasma Prep III Plasma Cleaner. When
lit, the chamber is under vacuum. When unlit, the chamber is not being evacuated or is isolated.
3 – Vent Button – This button controls the venting of the chamber. When lit, the chamber is being vented.
When unlit, the chamber is not being vented.
4 – RF Button – This button turns the RF power generator on and off. When lit, the RF power is on. When
unlit, the RF power is off.
5 – RF Level Dial – This dial controls the intensity of the RF power being generated. Turning the dial
clockwise will increase the RF power. Turning the dial counter-clockwise will decrease the RF power.
6 – Fwd/Rev Button – This button will toggle the forward and reverse power displays. An “F” indicates that
forward power is being displayed. An “r” indicates reverse power is being displayed.

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7 – Tuning Dial – This dial is used to tune the RF field. Tuning should be done in such as way as to maximize
the forward power, while keeping the reverse power to a minimum.
8 – Power Display – This display shows the current power being generated in watts.
9 – Chamber Pressure Display – This display shows the current chamber pressure in mTorr.
4.4.2 Rear Panel
Figure 4.4.2 – Rear Panel
10 – Vacuum Inlet – Flange for vacuum hose (NW16) connected to the Plasma Prep III Plasma Cleaner.
11 – Gas Inlet – Gas supply is connected to the Plasma Prep III Plasma Cleaner. This is a barbed fitting for a
standard tubing.
12 – Power Inlet and Fuses – Main power cord connection to the Plasma Prep III Plasma Cleaner.
13 – Comm Port – Communication Port to connect to the optional Plasma Prep III Process Control Unit (SPI
#11052-AB). This unit allows the control input of two gasses (each separately, or mixed) as well as a
programmable timer system interfaced tot he Plasma Prep III Plasma Cleaner.

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4.5 Equipment Description
4.5.1 RF Generator
RF Generator - The RF power source includes a solid state oscillator operating at 13.56 MHz, the FCC-authorized
industrial frequency. A solid state linear driver and amplifier supplies a continuous wave power from 1 watt to a
maximum of 100 watts. Power transfer to the reaction chamber is accomplished via an impedance matching
network.
4.5.2 Vacuum System
Vacuum System - The vacuum system includes the vacuum pump (not supplied as part of the Plasma Prep III
Plasma Cleaner), the vacuum hose, the vacuum valves and the control circuitry. The vacuum valve switch is
interlocked with the RF generator switch to prevent the RF power from coming on unless the vacuum valve is
energized.An internal vacuum meter is used to monitor chamber pressure.
4.5.3 Gas Supply System
Gas Supply System - The gas supply system for the Plasma Prep Plasma Cleaner consists of the gas delivery
system inside the reaction chamber. This delivery system is a glass tube sealed on the inner end and perforated
along its bottom surface. Sliding the tubing over the barbed fittings on the glass chamber makes connections to the
delivery tube.
4.5.4 Reaction Chamber
Reaction Chamber - The reaction chamber sub-system consists of an upper and lower electrode, a Pyrex glass
outer reaction chamber, and a polymer adapter seal (See Fig. 2-1). (NOTE: For CF4operation, a quartz chamber
should be used, though care should be taken in using such a reactive gas with a TEM Specimen Stage). The
chamber is sealed with aflat gasket, which seats againsta raised lip on the polymer adapter portion. The gas delivery
tube feeds through the back of the outer chamber section. This chamber section also provides connection to the
vacuum hose by a glass tube joined at the front of the chamber. This arrangement provides for the best gas
conduction flow and results in repeatable, dependable processing.
5INSTALLATION
5.1 Site Requirements
There are very few constraints on the location of the Plasma Prep III Plasma Cleaner. The machine should
be operated in a well ventilated area away from any corrosive fumes. The supply from the cooling fan should

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not be obstructed. The machine's exhaust (the vacuum pump exhaust) should be vented away from
operating personnel. The machine should be far enough away from high voltage equipment to prevent
possible high voltage interference. Finally, please ensure the you have the following available:
1) Vacuum pump (See Sec 4.3))
2) Gas supply – Oxygen (O2) or other reactive gas (industrial grade), with approved regulator
capable of supplying 5 PSIG and shut off valve
3) 100 to 240 V AC, 50/60 Hz, 15 amp service
5.2 Assembly
The only assembly required when installing the Plasma Prep Plasma Cleaner consists of putting the
outer chamber into the electrodes, and connections for the gas, vacuum, and electrical power.
5.2.1 Installing The Outer Chamber
With the machine resting on a convenient work surface, remove the four screws (two on each side) at the
bottom of the sheet metal top cover. Remove the top cover only.
A. Remove the four screws on the front panel. Be careful of the wire connection to the terminal block
on the chassis and carefully lay the panel to the side. Note that the adapter chamber seal is held
against the front panel with retaining wires. These should not be removed at this time.
B. Remove the two nylon screws and spacing bushings on the left side and loosen the two nylon
screws on the right side.
C. Remove the outer chamber from its shipping container. Make sure no packing material is in the
chamber.
D. Locate the exhaust manifold at the front-center floor of the cabinet. Loosen the brass compression
nut to accept the extension of the outer chamber for fitting into vacuum manifold.
E. Lift the upper shell (cover will "hinge" on the two loosened screws). Slide chamber to the rear of
the shell and engage the pre-fitted silicon tube.
F. Following insertion of the glass extension inside the manifold, tighten the knurled compression
nut, finger tight. DO NOT OVERTIGHTEN as this can affect the vacuum. Care must be used to
ensure that the silicon tubes are firmly in place and the glass neck fits into the vacuum manifold
without it being cocked. If not properly aligned, the glass neck can break upon use.
G. Replace the two nylon screws that were removed from the left side and re-tighten them. DO
NOT OVERTIGHTEN as this can damage the threads.
H. The upper tube will attach over the barbed fitting on the gas inlet valve. The tube from the middle
of the chamber is not used as part of the standard operation. A cap is placed over this fitting.

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Figure 5.2.1 – Chamber Cross-section
CAUTION
Never use metallic screws in place of the nylon screws. Metal, even in small amounts, will
short circuit the chamber’s electrodes.
5.2.2 Engaging The TEM Specimen Stage Adapter
A. Close the door with the adapter and ensure that the door latch is secure.
B. Ensuring that the chamber adapter seal is seated against the outer chamber at the O-ring,
release the wires retaining the adapter chamber seal and allow the seal to align to the
outer chamber.
C. Use the blanking plug to seal the chamber when not using a TEM Specimen Stage.
5.2.3 Vacuum Pump Installation
A. Set the pump horizontally on the floor, close to where the instrument has been placed.

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B. Ensure that the pump is filled with the appropriate oil. If not, fill with the appropriate oil. Ensure that
the drain plug is closed, and remove the fill cap. Pour the appropriate oil into the pump until the oil
level indicator shows the proper amount has been added.
C. Connect the flexible metal vacuum pipe to the flange connection at the rear of the Plasma Prep III
Plasma Cleaner and to the vacuum pump using the O-rings and clamps provided.
CAUTION
Please be sure to use the appropriate pump manufacturer vacuum oil. For oils suitable
for various pumps, please contact your SPI Supplies Representative.
CAUTION
Be sure to keep the vacuum parts, especially the O-ring on the clamp center ring and
everything it may contact clean and free from excessive moisture, chips, dust etc. Also,
be sure not to damage the surface of them. Chips or visible dust, which enter the pump,
may cause mechanical failure. Evacuating excessive moisture will not only be harmful in
obtaining ultimate pressure, but will also corrode the pump during prolonged operation.
WARNING
Do not run the pump if the oil is below recommended levels. It may damage the pump.
5.2.4 Connecting the Process Gas
Connect the regulated gas supply hose to the quarter-inch fitting GAS IN, Item 12 of Figure 3-2, located at
rear of the machine.

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6OPERATION
6.1 Overview
Operation of the Plasma Prep Plasma Cleaner consists of loading the TEM Specimen Stage, evacuating
the reaction chamber, applying the process gas and applying the energizing RF power. The RF amplifier
must be resonated and the power level adjusted to the appropriate level. Upon completion of the process,
the RF power switch is turned off, and then the vacuum valve switch is turned off. The primary power must
remain on for the chamber to vent back to atmospheric pressure. After the vacuum valve switch is turned
off, the VENT valve switch must be energized. The main power can only be turned off after the vent switch
is energized.
The Plasma Prep III Plasma Cleaner comes with a BLANK and one or more adapters for your TEM
Specimen Stages. These adapters are designed to work with the specific TEM Specimen Stage so that a
vacuum good fit is obtained. While some of these adapters can be used for similar TEM Specimen Stages,
the identification and use of an adapter for each Stage is suggested.
6.1.1 Initial Pump Down and Operation
A. Power switch should be OFF (Red LED light will remain unlit). The “POWER LEVEL” control
dial should be turned completely counter-clockwise.
B. Start the vacuum pump. Turn on the AC power by depressing the “POWER” button.
C. Fit the BLANK adapter into the so that it is fully engaged and the o-rings make a good seal.
D. Turn on the vacuum by pressing the “VACUUM” button. Turn on the process gas, and ensure
the flow rate is set to 5 PSIG.Allow the unit to pump down for approximately one minute, or until
the chamber pressure reads approximately 250 mTorr.
E. Fit the RF shield over the adapter, align the pins, and secure it by twisting into place. Note that
at this time the micro switch is engaged. This interlock allows the RF power to be engaged.
F. Turn on the RF power by pressing the “RF POWER BUTTON”. Turn the “POWER LEVEL”
control dial clockwise until the LED readout displays a power of approximately 10 watts. Adjust
the “TUNING” control dial until the reading is maximized. Pressing the “FWD-REV” button will
change the LED readout from Forward Power (F) to Reverse Power (R). Select the Reverse
Power, and adjust the “TUNING” control dial until a minimum reading is achieved.
6.1.2Loading Samples
Table of contents