Sunsea AIoT SIMCom SIM7600NA User manual

SIM7600NA,SIM7600NA miniPCIE_User
Manual

Smart Machine Smart Decision
SIM7600NA_user manual _V1.00 2 2020-1-7
Document Title SIM7600NA,SIM7600NA miniPCIE_user manual
Version 1.00
Date 2020-1-7
Status Released
Document Control ID SIM7600NA,SIM7600NA miniPCIE_user manual _V1.00
General Notes
SIMCom offers this information as a service to its users to support the application and engineering
efforts that use the products designed by SIMCom. The information provided is based on the
requirements specifically from the users. SIMCom has not undertaken any independent search for
additional relevant information, including any information that may be in the user’s possession.
Furthermore, the system validation of the product designed by SIMCom within a larger electronic
system remains the responsibility of the user or the user’s system integrator. All specifications
supplied herein are subject to change without notice.
IC Caution:
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to
the following two conditions:
(1) This device may not cause interference, and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.

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Ce matériel est complété par une exposition de rayonnements IC pour un environnement
naturel. Ce matériel doit être installé et se faire avec une distance minimale de 20cm entre les
radiateurs et les autresYour body shop.
For a host manufacture’s using a certified modular, if (1) the module’s IC number is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have
straightforward commonly used methods for access to remove the module so that the IC
number of the module is visible; then an additional permanent label referring to the enclosed
module: “Contains Transmitter Module IC: 23761-8PYA007” or “Contains IC:
23761-8PYA007” must be used.
This radio transmitter IC: 23761-8PYA007 has been approved by Imovation,Science and Economic
Development Canada to operate with the antenna types listed below,with the maximm permissible
gain indicated.Antenna types not included in this list that have gain greater than the maximm gain
indicated for any type listed are strictly prohibilted for use with this device.
Antenna List:
Model: MF25D
Antenna Gain: Band 2:1.87dBi,Band 4:3.12dBi, Band 5:0.91dBi, Band 12:0.95dBi, Band
13:2.23dBi, Band 14:2.18dBi, Band 25:1.87dBi,Band 26:1.40dBi, Band 41:3.20dBi, Band
66:3.12dBi, Band 71:-0.48dBi
Single Module
FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept
any interference received, including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
The modular can be installed or integrated in mobile or fix devices only. This modular cannot be
installed in any portable device.
FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment. This transmitter must not be co-located or operating in conjunction with any other
Type: Dipole antenna with non-standard SMA connector(50ohm)

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antenna or transmitter. This modular must be installed and operated with a minimum distance of 20
cm between the radiator and user body.
If the FCC identification number is not visible when the module is installed inside another device,
then the outside of the device into which the module is installed must also display a label
referring to the enclosed module. This exterior label can use wording such as the following:
“Contains Transmitter Module FCC ID: 2AJYU-8PYA006 Or Contains FCC ID:
2AJYU-8PYA006”
When the module is installed inside another device, the user manual of the host must contain
below warning statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause
undesired operation.
2. Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions
as described in the user documentation that comes with the product.
Any company of the host device which install this modular with Single modular approval should
perform the test of radiated emissionand spurious emission according to FCC part 15C : 15.247
and 15.209 requirement,Only if the test result comply with FCC part 15C : 15.247 and 15.209
requirement,then the host can be sold legally.
Copyright
This document contains the proprietary technical information which is the property of SIMCom
Limited, copying of this document, giving it to others, the using or communication of the contents
thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
payment of the damages. All rights are reserved in the event of grant of a patent or the registration
of a utility model or design. All specifications supplied herein are subject to change without notice
Copyright © SIMCom Wireless Solutions Co., Ltd. 2020

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Contents
Contents ............................................................................................................................................. 5
Revision History ................................................................................................................................ 7
1Introduction ................................................................................................................................ 8
1.1Product Outline ..................................................................................................................... 8
1.2Hardware Interface Overview ............................................................................................... 8
1.3Hardware Block Diagram.................................................................................................... 10
1.4Functional Overview ........................................................................................................... 11
2Package Information ............................................................................................................... 13
2.1Pin Assignment Overview ................................................................................................... 13
2.2Pin Description .................................................................................................................... 16
2.3Mechanical Information ...................................................................................................... 21
2.4Footprint Recommendation ................................................................................................. 22
3Interface Application ............................................................................................................... 23
3.1Power Supply ...................................................................................................................... 23
3.1.1Power Supply Design Guide ........................................................................................ 24
3.1.2Recommended Power Supply Circuit .......................................................................... 25
3.1.3Voltage Monitor ............................................................................................................ 25
3.2Power on/Power off/Reset Function .................................................................................... 26
3.2.1Power on ....................................................................................................................... 26
3.2.2Power off ...................................................................................................................... 27
3.2.3Reset Function .............................................................................................................. 28
3.3UART Interface ................................................................................................................... 29
3.3.1UART Design Guide .................................................................................................... 29
3.3.2RI and DTR Behavior ................................................................................................... 31
3.4USB Interface ...................................................................................................................... 32
3.5HSIC interface ..................................................................................................................... 33
3.7SGMII Interface .................................................................................................................. 33
3.7.1Reference schematic with AR8033 .............................................................................. 34
3.7.2Reference schematic with BCM89820 ......................................................................... 35
3.8USIM Interface.................................................................................................................... 36
3.8.1USIM Application Guide .............................................................................................. 36
3.9PCM Interface ..................................................................................................................... 40
3.9.1PCM timing .................................................................................................................. 40
3.9.2PCM Application Guide ............................................................................................... 41
3.10SD Interface ..................................................................................................................... 42
3.11I2C Interface .................................................................................................................... 44
3.12SDIO Interface ................................................................................................................. 44
3.13SPI Interface .................................................................................................................... 45
3.14Network status ................................................................................................................. 45

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3.15Flight Mode Control ........................................................................................................ 46
3.16Other interface ................................................................................................................. 46
3.16.1Sink Current Source .................................................................................................. 46
3.16.2ADC .......................................................................................................................... 4 7
3.16.3LDO .......................................................................................................................... 4 7
4RF Specifications ...................................................................................................................... 49
4.7GSM/UMTS/LTE RF Specifications .................................................................................. 49
4.8GSM /UMTS/LTE Antenna Design Guide .......................................................................... 50
4.9GNSS .................................................................................................................................. 52
4.9.1GNSS Technical specification ...................................................................................... 52
4.9.2GNSS Application Guide ............................................................................................. 52
5Electrical Specifications ........................................................................................................... 54
5.7Absolute maximum ratings ................................................................................................. 54
5.8Operating conditions ........................................................................................................... 54
5.9Operating Mode .................................................................................................................. 55
5.9.1Operating Mode Definition .......................................................................................... 55
5.9.2Sleep mode ................................................................................................................... 5 6
5.9.3Minimum functionality mode and Flight mode ............................................................ 56
5.10Current Consumption ....................................................................................................... 57
5.11ESD Notes ....................................................................................................................... 57
6SMT Production Guide ........................................................................................................... 59
6.7Top and Bottom View of MODULE ................................................................................... 59
6.8Label Information ................................................................................................................ 60
6.9Typical SMT Reflow Profile ............................................................................................... 60
6.10Moisture Sensitivity Level (MSL) ................................................................................... 61
6.11Stencil Foil Design Recommendation ............................................................................. 62
7Packaging .................................................................................................................................. 63
Appendix .......................................................................................................................................... 65
Ⅰ. Coding Schemes and Maximum Net Data Rates over Air Interface ....................................... 65
Ⅱ. Related Documents .................................................................................................................. 65
Ⅲ. Terms and Abbreviations ........................................................................................................ 68
Ⅳ. Safety Caution ......................................................................................................................... 70

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Revision History
Data Version Description of change Author
2020-1-7 1.00 Original Xutao.Jiang
Qiang.Zhang

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1 Introduction
This document describes the electronic specifications, RF specifications, interfaces, mechanical
characteristics and testing results of the SIMCom MODULE. With the help of this document and
other software application notes/user guides, users can understand and use MODULE to design and
develop applications quickly.
1.1 Product Outline
Aimed at the North American market, the MODULE support GSM, WCDMA, LTE-TDD and
LTE-FDD. Users can choose the MODULE according to the wireless network configuration. The
supported radio frequency bands are described in the following table.
Table 1: Module frequency bands
Standar
d Frequency SIM7600NA SIM7600NA-H
FDD B2 √ √
FDD B4 √ √
FDD B5 √ √
FDD B12 √ √
FDD B13 √ √
FDD B14 √ √
FDD B25 √ √
FDD B26 √ √
FDD B71 √ √
FDD B66 √ √
TDD B41 √ √
Category CAT1 CAT4
With a small physical dimension of 30*30*2.9 mm and with the functions integrated, the
MODULE can meet almost any space requirement in users’ applications, such as smart phone,
PDA, industrial handheld, machine-to-machine and vehicle application, etc.
1.2 Hardware Interface Overview
The interfaces are described in detail in the next chapters include:
● Power Supply
● USB2.0 Interface
● UART Interface
● MMC/SD Interface
● SDIO Interface
● USIM Interface
● SPI Interface

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● GPIO
● ADC
● LDO Power Output
● Current Sink Source
● PCM Interface
● SPI Interface
● I2C Interface
● HSIC Interface
● SGMII Interface

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1.3 Hardware Block Diagram
The block diagram of the MODULE is shown in the figure below.
Figure 1: MODULE block diagram

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1.4 Functional Overview
Table 2: General features
Feature Implementation
Power supply Single supply voltage 3.4~4.2V, Recommend supply voltage 3.8V
Power saving Current in sleep mode : <5mA
Radio frequency bands Please refer to the table 1
Transmitting power
LTE power class: 3 (0.25W)
Data Transmission
Throughput
LTE CAT 1: 10 Mbps(DL)
5 Mbps(UL)
LTE CAT 4 :150 Mbps (DL)
50 Mbps (UL)
Antenna
LTE main antenna.
LTE auxiliary antenna
GNSS antenna
GNSS GNSS engine (GPS,GLONASS and BD)
Protocol: NMEA 0183
SMS
MT, MO, CB, Text and PDU mode
SMS storage: USIM card or ME(default)
Transmission of SMS alternatively over CS or PS.
USIM interface Support identity card: 1.8V/ 3V
USIM application toolkit Support SAT class 3, GSM 11.14 Release 98
Support USAT
Phonebook management Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN
Audio feature
Support PCM interface
Only support PCM master mode and short frame sync, 16-bit linear data
formats
UART interface
A full modem serial port by default
Baud rate: 300bps to 4Mbps(default:115200bps)
Auto baud rate: 9600,19200,38400,57600,115200bps
Can be used as the AT commands or data stream channel
Support RTS/CTS hardware handshake
Multiplex ability according to GSM 07.10 Multiplexer Protocol
MMC/SD Support MMC and SD cards with 2.85 V on SD port
SDIO Support SDIO with 1.8 V only on SDIO port
USB USB 2.0 high speed interface, Can used be send AT command, Software
update, GNSS NMEA,USB voice function etc.
Firmware upgrade Firmware upgrade over USB interface or FOTA

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Physical characteristics Size:30*30*2.9m
Weight:5.7 g
Temperature range
Normal operation temperature: -30°C to +80°C
Extended operation temperature: -40°C to +85°C*
Storage temperature -45°C to +90°C
*Note: Module is able to make and receive voice calls, data calls, SMS and make
GPRS/UMTS/HSPA+/LTE traffic in -40℃~ +85℃. The performance will be reduced slightly
from the 3GPP specifications if the temperature is outside the normal operating temperature
range and still within the extreme operating temperature range.

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2 Package Information
2.1 Pin Assignment Overview
All functions of the MODULE will be provided through 135 pads that will be connected to the
users’ platform. The following Figure is a high-level view of the pin assignment of the MODULE.
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
*SPI_MISO
1
GND
81
GND
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
60
82
GND
PWRKEY
RESET
GND
GND
*SPI_CLK
*SPI_MOSI
*SPI_CS
USB_VBUS
USB_DN
USB_DP
GND
VDD_1V8
USB_ID
USIM_RST
USIM_CLK
USIM_VDD
MAIN_ANT
GND
DBG_TXD
GND
VDD_AUX
ISINK
ADC2
ADC1
SD_DET
STATUS
GPIO43*
NETLIGHT
GPIO41*
USIM_DET*
FLIGHTMODE*
SCL
SDA
GND
GND
GND
AUX_ANT
85 USB_BOOT●*
88
89
90
91
92
93
94
95
111
110
109
108
107
106
105
104
DBG_RXD
RESERVED
RESERVED
GPIO2
GPIO4
GND
RESERVED
RESERVED
SGMII_RST_N
SGMII_INT_N
GND
RESERVED
USIM_DATA
GND
UART
USB
VBAT
USIM
PCM
I2C
SPI
SDC SGMII
121 122 123
124 125
128 129
132 133
126 127
130 131
134 135
SDIO
120-135 GND
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
120
Figure 2: Pin assignment overview

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Table 3: Pin definition
Pin No. Pin name Pin No. Pin name
1 GND 2 GND
3 PWRKEY 4 RESET
5 GND 6 SPI_CLK*
7 SPI_MISO* 8 SPI_MOSI*
9 SPI_CS* 10 GND
11 USB_VBUS 12 USB_DN
13 USB_DP 14 GND
15 VDD_1V8 16 USB_ID
17 USIM_DATA 18 USIM_RST
19 USIM_CLK 20 USIM_VDD
21 SD_CMD 22 SD_DATA0
23 SD_DATA1 24 SD_DATA2
25 SD_DATA3 26 SD_CLK
27 SDIO_DATA1 28 SDIO_DATA2
29 SDIO_CMD 30 SDIO_DATA0
31 SDIO_DATA3 32 SDIO_CLK
33 GPIO3* 34 GPIO6*
35 HSIC_STROBE 36 HSIC_DATA
37 GND 38 VBAT
39 VBAT 40 GND
41 GND 42 DBG_TXD
43 GND 44 VDD_AUX
45 ISINK 46 ADC2
47 ADC1 48 SD_DET
49 STATUS 50 GPIO43*
51 NETLIGHT 52 GPIO41*
53 USIM_DET* 54 FLIGHTMODE*
55 SCL 56 SDA
57 GND 58 GND
59 AUX_ANT 60 GND
61 GND 62 VBAT
63 VBAT 64 GND
65 GND 66 RTS
67 CTS 68 RXD

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69 RI 70 DCD
71 TXD 72 DTR
73 PCM_OUT 74 PCM_IN
75 PCM_SYNC 76 PCM_CLK
77 GND 78 GND
79 GNSS_ANT 80 GND
81 GND 82 MAIN_ANT
83 COEX1●* 84 COEX2*
85 BOOT_CFG0●* 86 COEX3●*
87 GPIO77 88 RESERVED
89 RESERVED 90 RESERVED
91 RESERVED 92 RESERVED
93 GND 94 GPIO4
95 GPIO2 96 GPIO1
97 GPIO_54 98 GND
99 RESERVED 100 RESERVED
101 RESERVED 102 RESERVED
103 RESERVED 104 RESERVED
105 RESERVED 106 DBG_ RXD
107 RESERVED 108 SGMII_RST_N
109 SGMII_INT_N 110 GND
111 RESERVED 112 SGMII_RX_P
113 SGMII_RX_M 114 SGMII_TX_M
115 SGMII_TX_P 116 SGMII_MDIO
117 SGMII_MDC 118 GND
119 GPIO_19 120 GND
121 GND 122 GND
123 GND 124 GND
125 GND 126 GND
127 GND 128 GND
129 GND 130 GND
131 GND 132 GND
133 GND 134 GND
135 GND
NOTE: ● Means Before the normal power up, COEX1, COEX3 or BOOT_CFG0
cannot be pulled up, otherwise module will not be powered up normally.
* Means that pins has MUX function.

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2.2 Pin Description
Table 4: IO parameters definition
Pin type Description
PI Power input
PO Power output
AI Analog input
AIO Analog input/output
I/O Bidirectional input /output
DI Digital input
DO Digital output
DOH Digital output with high level
DOL Digital output with low level
PU Pull up
PD Pull down
Table 5: Pin description
Pin name Pin No. Default
status Description Comment
Power supply
VBAT 38,39,
62,63 PI Power supply, voltage range:
3.4~4.2V.
VDD_AUX 44 PO
LDO power output for other
external circuits with Max
150mA current output. Its output
voltage is 2.85V by default.(The
voltage can be configured from
1.7V to 3.05V by AT
command).
If used SGMII
function ,this pin
used for SGMII
function.
If unused, keep it
open.
VDD_1V8 15 PO
1.8 output with Max 50mA
current output for external
circuit, such as level shift
circuit.
If unused, keep it
open.
GND
1,2,5,
10,14,37
,40,41,4
3,57,58,
60,61,64
,65,77,7
8,80,81,
93,96,11
0,118,12
0,121,12
2,123,12
4,125,12
6,127,12
8,129,13
Ground

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0,131,13
2,133,13
4135
System Control
PWRKEY 3 DI,PU System power on/off control
input, active low.
The high voltage is
0.8V;
RESET 4 DI, PU System reset control input,
active low.
RESET has been
pulled up to 1.8V
via 40Kohm resistor
internally.
SD interface
SD_CMD 21 I/O,PD SDIO command
If unused, keep
them open.
SD_DATA0 22 I/O,PD
SDIO data
SD_DATA1 23 I/O,PD
SD_DATA2 24 I/O,PD
SD_DATA3 25 I/O,PD
SD_CLK 26 DO SDIO clock
SD_DET 48 DI,PU
SD card insertion detect
H: SD card is removed
L: SD card is inserted
USIM interface
USIM_DATA 17 I/O,PU
USIM Card data I/O, which has
been pulled up via a 10KR
resistor to USIM_VDD
internally. Do not pull it up or
down externally.
All lines of USIM
interface should be
protected against
ESD.
USIM_RST 18 DO,PD USIM Reset
USIM_CLK 19 DO,PD USIM clock
USIM_VDD 20 PO,PD
Power output for USIM card, its
output Voltage depends on
USIM card type automatically.
Its output current is up to 50mA.
SPI interface
SPI_CLK* 6 DO SPI clock output
Default SPI
Optional: BT uart
function
SPI_MISO* 7 DI SPI master in/slave out data
SPI_MOSI* 8 DO SPI master out/slave in data
SPI_CS* 9 DO SPI chip-select output
USB
USB_VBUS 11 AI Valid USB detection input with
3.0~5.25V detection voltage
USB_DN 12 AI, AO Negative line of the differential,
bi-directional USB signal.

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USB_DP 13 AI, AO Positive line of the differential,
bi-directional USB signal.
USB_ID 16 AI High-speed USB ID input Keep it open.
SGMII interface
SGMII_RX_P 112 AI SGMII receive – positive
If unused, keep
them open.
SGMII_RX_M 113 AI SGMII receive - negative
SGMII_TX_M 114 AO SGMII transmit - negative
SGMII_TX_P 115 AO SGMII transmit– positive
SGMII_RST_N 108 DO Ethernet PHY reset External 1.5K
pull-up resistor
from 3.3V/2.5V to
MDIO_DATA and
10K pull-up resistor
from VDD_1V8 to
ETH_INT_N are
needed when the
Ethernet PHY is
connected.
If unused, please
keep them open.
SGMII_INT_N 109 DI,PU Ethernet PHY interrupt
SGMII_MDIO 116 DIO Management data
input/output-data
SGMII_MDC 117 DO Management data
input/output-clock
UART interface
RTS 66 DOH Request to send
If unused, keep
them open.
CTS 67 DI Clear to Send
RXD 68 DI Receive Data
RI 69 DOH Ring Indicator
DCD 70 DOH Carrier detects
TXD 71 DOH Transmit Data
DTR 72 DI,PU DTE get ready
DBG_UART
DBG_TXD 42 DO Log output
If unused, keep
them open.
DBG_RXD 106 DI Log input
I2C interface
SCL 55 OD I2C clock output If unused, keep
open, or else pull
them up via 2.2KΩ
resistors to 1.8V.
SDA 56 OD I2C data input/output
SDIO interface
SDIO_DATA1 27 I/O SDIO data1 It can be used for
WLAN function.
If unused, please
SDIO_DATA2 28 I/O SDIO data2
SDIO_CMD 29 I/O SDIO command

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SDIO_DATA0 30 I/O SDIO data0 keep them open.
SDIO_DATA3 31 I/O SDIO data3
SDIO_CLK 32 DO SDIO clock
HSIC interface
HSIC_STROBE 35 I/O HSIC strobe wakeup If use, please refer
to document [27]
Otherwise please
keep them open.
HSIC_DATA 36 I/O HSIC data
PCM interface
PCM_OUT 73 DO,PD PCM data output.
If unused, please
keep them open.
PCM_IN 74 DI,PD PCM data input.
PCM_SYNC 75 I/O,PD PCM data frame sync signal.
PCM_CLK 76 I/O,PU PCM data bit clock.
GPIO
NETLIGHT 51 DO,PU LED control output as network
status indication.
If unused, keep
them open.
STATUS 49 DO,PU
Operating status output.
High level: Power on and
firmware ready
Low level: Power off
GPIO4 94 IO,PD Default: GPIO
GPIO2 95 IO,PD Default: GPIO
GPIO1 96 IO,PD Default: GPIO
GPIO_54 97 IO,PD Default: GPIO
GPIO_19 119 IO,PD Default: GPIO
RF interface
MAIN _ANT 82 AIO MAIN antenna soldering pad
GNSS_ANT 79 AI GNSS antenna soldering pad
AUX_ANT 59 AI Auxiliary antenna soldering pad
Other interface
ISINK 45 PI Ground-referenced current sink.
If unused, please
keep them open.
ADC1 47 AI Analog-digital converter input 1
ADC2 46 AI Analog-digital converter input 2
RESERVED
88,89,90
,91,92,9
9,100,10
1,102,10
3,104,10
5,107,11
1
Reserved for future use Please keep them
open.
Mux function interface
COEX1●* 83 I/O RF synchronizing between
Wi-Fi and LTE.
Default:COEX1●*
Option:WLAN_EN
●

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COEX2* 84 I/O RFsynchronizing between Wi-Fi
and LTE.
Default:COEX2*
Option: WoWWAN
●
COEX3●* 86 I/O RF synchronizing between
Wi-Fi and LTE.
Default:COEX3*
Option:BT_PCM_C
LK●
BOOT_CFG0●* 85 DI,PD
Boot configuration input.
Module will be forced into USB
download mode by connect 85
pin to VDD_1V8 during power
up.
Default:
BOOT_CFG0●*
Option:COEX_RX
D●
Do place 2 test
points for debug.
DO NOT PULL UP
BOOT_CFG0
DURING
NORMAL POWER
UP!
FLIGHTMODE* 54 DI,PU
Flight Mode control input.
High level(or open): Normal
Mode
Low level: Flight Mode
Default:
FLIGHTMODE*
Option:BT_PCM_I
N●
GPIO3* 33 IO GPIO
Default:GPIO3*
Option:WL_PWR_
EN●
GPIO6* 34 IO GPIO
Default:GPIO6*
Option:WL_SLP_C
LK●
USIM_DET* 53 IO
Default: GPIO
Optional: USIM card detecting
input.
H: USIM is removed
L: USIM is inserted
Default:USIM_DE
T*
Option:BT_EN●
GPIO77* 87 IO GPIO
Default:GPIO77*
Option:BT_PCM_O
UT●
GPIO43* 50 I/O,PD GPIO
Default:GPIO43*
Option:COEX_TX
D●
GPIO41* 52 I/O,PD GPIO
Default:GPIO41*
Option:BT_PCM_S
YNC●
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