TechNexion TEP-1560-BSW User manual

3.1 Cut-out Dimensions
3.2 VESA Mounng
3.3 Rear Mounng
3.4 Surface Mounng
TEP-1010-BSW / TEP-1560-BSW
Quickstart Guide
3 Installaon Instrucons
This secon describes the mounng procedures for TEP series device. The material in the mounng area must provide sufficient strength for support of this HMI.
This device is compable with VESA MIS-D Standard 100*100mm. There are 4 VESA MIS-D (M4) mounng holes on the rear side of the device. M4 screws with at least
6mm head-to-p length are required to secure this device.
There are 10 (TEP-1010-BSW) / 16 (TEP-1560-BSW) mounng holes (M4) on the rear side of the device required for surface mounng. M4 screws with at least 6mm
head-to-p length are required to secure this device.
There are 7 (TEP-1010-BSW) / 14 (TEP-1560-BSW) mounng clips required for rear mounng.
INNOVATORS OF TECHNOLOGY
TEP-1010-BSW TEP-1560-BSW
TEP-1010-BSW TEP-1560-BSW
TEP-1560-BSW
TEP-1560-BSW
TEP-1010-BSW
TEP-1010-BSW
2 Dimensions
1 Safety Precauons
Thank you for purchasing a TechNexion TEP series device. This installaon guide will be helpful in the installaon, wiring and inspecon of your TechNexion HMI. Before
using the product, please read this guide to ensure correct use. You should thoroughly understand all safety precauons before proceeding with the installaon, wiring,
and operaon. Place this instrucon sheet in a safe locaon for future reference. The following suggesons will help you.
• Keep the device dry. Precipitaon, humidity, and all types of liquids or moisture can contain minerals that will corrode electronic circuits. If your device does get wet,
allow it to dry completely.
• Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be damaged.
• Do not store the device in hot areas. High temperatures can shorten the life of electronic devices, damage baeries, and warp or melt certain plascs.
• Do not store the device in cold areas. When the device returns to its normal temperature, moisture can form inside the device and damage electronic circuit boards.
• Do not aempt to open the device. This product is designed for specific applicaons and needs to be installed by qualified personnel.
• Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and fine mechanics.
• Do not paint the device. Paint can clog the parts and prevent proper operaon.
• Unauthorized modificaons or aachments could damage the device and may violate regulaons governing radio devices.
• Do not touch any internal or exposed parts of the device as electrical shock may result.
• Do not open the device while power is on. Otherwise electrical shock may result.
• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.
• Be sure the venlaon holes are not obstructed during operaon. Otherwise malfuncon may result due to bad venlaon or overheang.
These suggesons apply equally to your device, baery, charger, or any enhancement. If any device is not working properly, take it to the nearest authorized service
facility for service.
•Make sure that the available power source matches the required input power of the device. Failure to observe this cauon may result in electric shock or fire.
•Do not power the unit by DC input when you apply power over the PoE (RJ45).
1.1 Storage and Installaon
1.2 Wiring
1.3 Maintenance and Inspecon
!
Unit : mm
375
235
246
165
TEP-1010-BSW
Unit : mm
75
182.1
137.2
263.5
TEP-1560-BSW
407.1
257.4
137.2
62
1 2
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4 External Connectors
• All Rights Reserved. No part of this document may be photocopied, reproduced, stored in a retrieval system, or transmied, in any form or by any means whether, electronic, mechanical, or otherwise
without the prior wrien permission of TechNexion Ltd.
• No warranty of accuracy is given concerning the contents of the informaon contained in this publicaon. To the extent permied by law no liability (including liability to any person by reason of
negligence) will be accepted by TechNexion Ltd., its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or inaccuracies in this document.
• TechNexion Ltd. reserves the right to change details in this publicaon without noce. Please download the most updated version at: hps://www.technexion.com/support/download-center/
TEP-1560-BSW
TEP-1010-BSW
Phone: [phone] Web: www.technexion.com
16F-5, No. 736, Zhongzheng Road, ZhongHe District, 23511, New Taipei City, Taiwan © 2001-2018 TechNexion Ltd.
2018-12-13
5.1.1 Galvanic Isolated Serial Port Connector (RS-XXX) (oponal)
5.1 Galvanic Isolated Connectors Pin Definion (TEP1010-xxxxx-Rxx-Lxxx-XG21-xxxx-xxx-xxxx) (oponal)
5 Addional I/O Connectors: GPIO1, GPIO2, and RS-XXX (oponal)
Header: Molex 43045-1000 (10-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-1000 (10-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.
Header: Molex 43045-1000 (10-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-1000 (10-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.
Port Pin # RS-232 + RS-232 RS-232 + RS-422 RS-232 + RS-485
Device
1 GND GND GND
COM1
COM1
COM1
COM1
COM2
COM2
COM2
COM2
2SERIAL1A_TXD SERIAL1A_TXD SERIAL1A_TXD
3SERIAL1A_RXD SERIAL1A_RXD SERIAL1A_RXD
4SERIAL1A_RTS SERIAL1A_RTS SERIAL1A_RTS
5SERIAL1A_CTS SERIAL1A_CTS SERIAL1A_CTS
6 GND GND GND
7SERIAL1B_TXD SERIAL1B_TXD+ SERIAL1B+
8 SERIAL1B_RXD SERIAL1B_RXD NC
NC
SERIAL1B-
9 SERIAL1B_RTS SERIAL1B_RXD+
SERIAL1B_TXD-10 SERIAL1B_CTS
12345
678910
RS-XXX:
5.1.2 Galvanic Isolated Digital I/O Connectors (GPIO1 / GPIO2) (oponal)
5.2.1 Non-Galvanic Isolated Serial Port Connector (RS-XXX) (oponal)
The dual 4-wire galvanic isolated serial port is set by default as follows: The primary and secondary serial ports are both set as RS-232 during manufacturing. For seng details of
the TEP-1010-BSW/TEP-1560-BSW serial ports in other modes, please refer to the TEP-1010-BSW/TEP-1560-BSW HARDWARE MANUAL.
This product is available with three oponal connectors: GPIO1, GPIO2, and RS-XXX that can be ordered in either a galvanic isolated or non-galvanic isolated version.
For detailed sengs informaon of the TEP-1010-BSW/TEP-1560-BSW GPIO ports, please refer to the TEP-1010-BSW/TEP-1560-BSW HARDWARE MANUAL.
The dual 4-wire non-galvanic isolated serial port can be configured as follows: The primary and secondary serial port can only be used as a standard RS-232
The unit is by default preloaded with soware that can download and install a selecon of Linux OS images over hardwired network. Simply connect a network to the
unit through the Ethernet LAN RJ45 connector and power it up, then follow the steps on the screen to load the soware. Local proxies will interfere with this process.
For more informaon, go to our Knowledge Base at: hps://www.technexion.com/support/knowledge-base/
To download drivers for the Windows operang systems, go to our Download Center at:
hps://www.technexion.com/support/download-center/
For more informaon about installing and configuring the Windows operang systems, see: hps://msdn.microso.com/en-us/
6 Soware and Driver Installaon
5.2 Non-Galvanic Isolated Connectors Pin Definion (TEP1010-xxxxx-Rxx-Lxxx-XS21- xxxx-xxx-xxxx) (oponal)
Description No.No. Description
1
2
3
4
5
6
12
13
14
15
16
7
8
9
10
11
17
18
19
20
21
LED Light indicator
Micro-SIM cardslot
MicroSD cardslot
USB OTG (Type-C) connector
LAN2 RJ45 connector
USB 2.0 Host connector
USB 2.0 Host connector
USB 3.0 Host connector
USB 3.0 Host connector
miniDP connector
HDMI connector
3.5mm jack Line out
3.5mm jack Line in
3.5mm jack Mic in
Reset button
Power button
Power Input connector
LAN1 RJ45 connector (PoE)
GPIO1 connector (optional)
GPIO2 connector (optional)
RS-XXX (Serial Port) connector (optional)
12345
678910
Port Pin # RS-232 + RS-232 Device
1
2
3
4
5
7
6
8
9
10
GND
SERIAL1A_TXD
SERIAL1A_RXD
SERIAL1A_RTS
SERIAL1A_CTS
GND
SERIAL1B_TXD
SERIAL1B_RXD
SERIAL1B_RTS
SERIAL1B_CTS
COM1
COM1
COM1
COM1
COM2
COM2
COM2
COM2
GPIO1A
GPIO1B
GND_DIO
GND
GPIO1C
GPIO1D
VCC_DIO
VCC
Max. 5.25V
Max. 5.25V
Max. 12.39V
Max. 12.39V
Max. 12.39V
12V
DIG_IN1
DIG_IN2
Ground for digital I/O
Common Ground
DIG_OUT5
DIG_OUT6
Supply Output
DIG_IN1
DIG_IN2
Ground for digital I/O
Common Ground
DIG_OUT5
DIG_OUT6
Supply Output
GPIO2A
GPIO2B
GND_DIO
GND
GPIO2C
GPIO2D
VCC_DIO
VCC
Port Pin #
GPIO1 Signal
GPIO1 Description
GPIO2 Signal GPIO2 Description Voltage
1
2
3
4
5
6
7
8
1234
5678
Header: Molex 43045-0800 (8-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-0800 (8-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.
GPIO1/GPIO2:
Header: Molex 43045-0800 (8-pin Micro-Fit 3.0).
Cable receptacle: Molex 43025-0800 (8-pin Micro-Fit 3.0) plug with crimp contact Molex 43030-0007.
5.2.2 Non-Galvanic Isolated Digital I/O Connectors (GPIO1 / GPIO2) (oponal)
For detailed sengs informaon of the TEP-1010-BSW/TEP-1560-BSW GPIO ports, please refer to the TEP-1010-BSW/TEP-1560-BSW HARDWARE MANUAL.
GPIO1/GPIO2:
GPIO1A
GPIO1B
NC
GND
GPIO1C
GPIO1D
NC
VCC
DIG_IN1/OUT1
DIG_IN2/OUT2
Common Ground
DIG_IN5/OUT5
DIG_IN5/OUT6
Supply Output
3.3V
3.3V
3.3V
3.3V
12V
DIG_IN1/OUT1
DIG_IN2/OUT2
Common Ground
DIG_IN5/OUT5
DIG_IN5/OUT6
Supply Output
GPIO2A
GPIO2B
NC
GND
GPIO2C
GPIO2D
NC
VCC
Port Pin #
GPIO1 Signal
GPIO1 Description
GPIO2 Signal GPIO2 Description Voltage
1
2
3
4
5
6
7
8
1234
5678
RS-XXX:
Boom view:
4
368
10
5
14 1511 12 13 16
2
1
9
7
18 19 20 2117
Supply output for digital I/O Supply output for digital I/O
79
17 19 20 21 18
41 2 3 568
10 11 12 13 14 15 16
3 4
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