Technisonic Industries Limited TDFM-600 User manual

TDFM-600/6000
MULTIBAND P25 AIRBORNE TRANSCEIVER
Maintenance Manual
TiL Document No. 06RE376
Revision B
MARCH 2021
Technisonic Industries Limited
240 Traders Boulevard, Mississauga, Ontario L4Z 1W7
Tel: [phone] Fax: [phone]
www.til.ca
Copyright by Technisonic Industries Limited. All rights reserved.

i
REVISION HISTORY
[ 06RE376 ]
REV
SECTION
PAGE
DESCRIPTION DATE EDITED
BY
N/C
Original Issue
JUN 2009
F.M.
A Global New Document template, Title Page layout changed
Rev History page “edited by” column added
Document split, Sections 5 to 8 now 1 to 5
4-A1
Updated MCU Block Diagram to Rev A (CR#09877)
Sect 4&5
Update Schematics & Parts List sections.
Appendice
s
Add appendices K, L & M.
NOV 2012
FM
B
1.5
Added statement to reference Motorola Service
Manual for minor RF module repairs
MAR 2021
JR

ii

iii
INTRODUCTION
Thank you for choosing this product.
This manual provides information on installing, operating and servicing -
the MULTIBAND P25 AIRBORNE TRANSCEIVER Model TDFM-600/6000.
Audience
This service manual is written for Service Technicians responsible for repairing of:
the MULTIBAND P25 AIRBORNE TRANSCEIVER Model TDFM-600/6000
and comes with complete schematics and parts list.
Online Documentation
This document is also found in its PDF format at http://www.til.ca via our maintenance manual
subscription service.
Supporting Documents
•INSTALLATION AND OPERATING INSTRUCTIONS, TiL Document 01RE293.
For the latest document release, refer to the company website under TDFM-600/6000.
Technisonic website http://www.til.ca
Link to the Publication Index for "Repair Manuals and Publications", the “Technical
Information and Service Bulletins” and the software/firmware history index (
login required ).
Getting Help
For assistance with any of the Technisonic products, contact Technisonic Customer Product
Service:
Technisonic Industries Limited
240 Traders Boulevard
Mississauga, Ontario L4Z 1W7
Phone: - 905-890-2113
Fax: - 905-890-5338
RELEASE NOTES
This document includes the following:
•MAINTENANCE MANUAL with parts list, TiL Document 06RE376.
The TDFM-600/6000 Type I offers a maximum of 255 channels programmed in any zone
and a default of 255 channels on all bands and is delivered from the factory with version
TR (nn) Rev (xx) software.
The TDFM-600/6000 Type II can store 1000 channels-per-band using the latest firmware
(850 for older radios) and is capable of simultaneous operation on all available bands.
Radios with FPP (Front Panel Programming) offer 240 channels.
The current software version is TR21 Rev AA from the date when this manual was printed.
However, for the latest software release, refer to the publication list under TDFM-600/6000
for the software/firmware history index (
login required ).

iv
ESD CAUTION
This unit contains static sensitive devices. Wear a grounded wrist strap and/or conductive
gloves when handling printed circuit boards.
FCC COMPLIANCE INFORMATION
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference and (2) this device must accept any
interference received, including interference that may cause undesired operation.
WARNING: For compliance with FCC RF Exposure Requirements the mobile transmitter
antenna installation shall comply with the following two conditions:
1. The transmitter antenna gain shall not exceed 3 dBi.
2. The transmitter antenna is required to be located outside of a vehicle and kept at a separation distance
of 70 cm or more between the transmitter antenna of this device and persons during operation.
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to
radio communications. Operation of this equipment in a residential area is likely to cause harmful
interference, in which case the user will be required to correct the interference at his/her own
expense.
WARNING
Changes or modifications not expressly approved by Technisonic Industries could void the user’s
authority to operate the equipment.
WARRANTY INFORMATION
The Model TDFM-600/6000 Transceiver is under warranty for one year from date of purchase.
Failed units caused by defective parts, or workmanship should be returned to:
Technisonic Industries Limited
240 Traders Boulevard
Mississauga, Ontario L4Z 1W7
Tel: [phone]
Fax: [phone]
NOTICE: The above stated address supersedes all others that may appear otherwise in this
manual.

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TABLE OF CONTENTS
Section
Title
Page
SECTION 1 THEORY OF OPERATION
1.1 INTRODUCTION .................................................................................................................. 1-1
1.1.1 TDFM-600/6000 Series Overview ....................................................................................... 1-1
1.1.2 Transceiver Models TDFM-600/6000 Series Type I .......................................................... 1-3
1.1.3 Transceiver Models TDFM-600/6000 Series Type II ......................................................... 1-4
1.1.3 Programming ...................................................................................................................... 1-5
1.1.4 TDFM-600/6000 Models ...................................................................................................... 1-6
1.1.5 System Overview ................................................................................................................ 1-10
1.2 MODULE A1 – MICROCONTROLLER (MCU) BOARD ....................................................... 1-10
1.2.1 The Power Supply ........................................................................................................... 1-12
The MCU-Input Filter and Protection ............................................................................. 1-13
1.2.2 The MCU Audio Section .................................................................................................. 1-13
1.2.3 The MCU ........................................................................................................................... 1-13
1.2.4 The MCU Rear Connector Interface ............................................................................... 1-13
1.2.5 The MCU Motorola Interface(s) ...................................................................................... 1-13
1.2.6 The MCU Front Panel Interface ...................................................................................... 1-13
1.2.7 The Power Modules ......................................................................................................... 1-13
1.3 MODULE A2 (TYPE I), A3 (TYPE I) INTERFACE BOARD ................................................... 1-14
1.3.1 Interface Board, A2 (Type I) dual module ...................................................................... 1-14
1.3.2 Interface Board, A3 (Type I) single module ................................................................... 1-14
MODULE A2 (TYPE II), A3 (TYPE II) INTERFACE BOARD ................................................ 1-14
1.3.3 Interface Board A2 (Type II), XTS-5000 Dual module ................................................... 1-14
1.3.4 Interface Board A2A (Type II), XTS-3000/5000 Dual hybrid module ........................... 1-14
1.3.5 Interface Board A2B (Type II), XTS-5000/3000 Dual hybrid module ........................... 1-14
1.3.6 Interface Board A3 (Type II), XTS-5000 Single module ................................................ 1-14
1.4 MODULE A4 – FRONT PANEL ASSEMBLY ....................................................................... 1-15
1.4.1 Module A4 - The Front Panel Assembly ......................................................................... 1-16
1.4.2 Module A4 - Front Panel Display Board ........................................................................ 1-17
1.4.3 Module A4 - Front Panel (Keypad) Board ...................................................................... 1-17
1.4.4 Module A4 - Front Panel Interconnect Board ................................................................ 1-17
1.5 MODULE A5 – MOTOROLA RF MODULES ....................................................................... 1-17
SECTION 2 TROUBLESHOOTING AND MODULE REPLACEMENT
2.0 INTRODUCTION .................................................................................................................. 2-1
2.1 ISOLATING PROBLEMS TO MODULES ............................................................................ 2-1
2.2 MODULES REPLACEMENT PROCEDURE (TYPE I) .......................................................... 2-1
2.2.1 Removing the Heatsink ................................................................................................... 2-3
2.2.2 Removing Interface Modules A3 – Interface Module ................................................... 2-4
2.2.3 Removing Interface Module A2 – Interface Module ..................................................... 2-7
2.2.4 Removing Module A1 – MCU ......................................................................................... 2-10
2.3 POST REPAIR TESTING ...................................................................................................... 2-12

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Section
Title
Page
SECTION 3 FACTORY TEST PROCEDURES
3.0 FACTORY TEST PROCEDURES .......................................................................................... 3-1
3.1 TEST PROCEDURE REQUIREMENTS ................................................................................ 3-1
3.1.1 Equipment Required ........................................................................................................ 3-1
3.1.2 Documentation Required ................................................................................................ 3-1
3.2 PRODUCTION TEST SEQUENCE ....................................................................................... 3-2
SECTION 4 SCHEMATICS and LAYOUTS
4.1 INTRODUCTION .................................................................................................................. 4-1
4.2 SECTION ORGANIZATION .................................................................................................4-1
4.2.1 Using This Section ........................................................................................................... 4-1
4.2.2 Designated Figures Scheme ........................................................................................... 4-1
4.3 DRAWING INDEX ................................................................................................................ 4-5
4.4 DIAGRAMS SECTIONED BY MODULES ........................................................................... 4-12
SCHEMATICS AND ARTWORK SECTION (Schematic followed by artwork)
This section split into Series Type I and Series Type II (Sectioned by Modules) ......... 4-A
Series Type I Schematics and Layout (A1, A2) ................................................................ 4-A
Series Type II Schematics and Layout (Modules A1, A3) ............................................... 4-A
Series Type I & II Schematics and Layout (Module A4) .................................................. 4-A
SECTION 5 PARTS LIST
5.1 INTRODUCTION .................................................................................................................. 5-1
5.2 BREAKDOWN OF THE TRANSCEIVER SYSTEM .............................................................. 5-1
5.3 CONTENTS OF PARTS BREAKDOWN ............................................................................... 5-1
5.3.1 Parts List Breakdown ....................................................................................................... 5-1
5.3.2 Parts List Enclosed in this Section ................................................................................. 5-2
PARTS LIST SECTION
Parts List (Sectioned by Modules A1, A2, A3, A4) .............................................................. 5-11
APPENDICES for the TDFM-600/6000 TRANSCEIVER
A: Doc # SHI-12-01 TDFM-600/6000 P/N 011210-x SOFTWARE/FIRMWARE HISTORY INDEX
B: Doc # 016310D TDFM-600/6000 FRONT PANEL / MCU ALIGNMENT TEST PROCEDURE
C: Doc # 016312E TDFM-600/6000 FINAL ALIGNMENT PROCEDURE
D: Doc # 046363 TDFM-600/6000 FINAL CHECK PROCEDURE
E: Doc # 016314E TDFM-600/6000 FINAL ACCEPTANCE TEST PROCEDURE
F: Doc # 016315E TDFM-600/6000 ACCEPTANCE TEST DATA SHEET
G: Doc # 04RE336C TDFM-600/6000 TYPE I & II CPS PROGRAMMING QUICK REFERENCE GUIDE
H: Doc # 076447 TDFM-600/6000/7000 QUICK FUNCTIONAL TEST
I: TONE COMPARISION CHART and CTCSS/PL CROSS REFERENCE CHART
J: MODULE BAND SPLITS
K: BOOT LOADER PROGRAM
L: CODEPLUG TEMPLATES
M: FLASH UPGRADES

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LIST OF FIGURES
Figure
Title
Page
1.1 Typical TDFM-600/6000 Transceiver ................................................................................ 1-2
1.2 Functional Similarities of a Typical Portable Radio and the TDFM-600/6000 .............. 1-5
1.3 TDFM-600/6000 Transceiver - Internal Modules ............................................................. 1-7
1.4 The TDFM-600/6000 System Architecture ....................................................................... 1-10
1.5a TDFM-600/6000 Module A1 - The Microcontroller (MCU) Board .................................. 1-11
1.5b TDFM-600/6000 Module A1 – Audio Section ................................................................... 1-11
1.6 Front Panel Assembly Block Diagram .............................................................................. 1-14
TYPE I
2.1 TDFM-600/6000 Transceiver – Exploded View ................................................................ 2-2
2.2.1A Heatsink Fan Mounting Screws ........................................................................................ 2-3
2.2.1B Heatsink 2-Pin Fan Connector Removed ......................................................................... 2-3
2.2.2A Screws Securing the Top Cover ...................................................................................... 2-4
2.2.2B Screws Securing the Bottom Cover ................................................................................. 2-4
2.2.2C The Top and Bottom Covers Removed ............................................................................ 2-5
2.2.3 Screws Securing the Heatsink to the Chassis ................................................................. 2-5
2.2.4A The Heatsink 25-Pin Male DB-Connector ......................................................................... 2-6
2.2.4B Heatsink Side-Mounted Screws ........................................................................................ 2-6
2.2.4C Heatsink Pulled Away from the Chassis .......................................................................... 2-7
2.2.4D Removing the Mini-Coax Connector on the RF Module(s) ............................................ 2-7
2.2.4E Heatsink Removed from Chassis ...................................................................................... 2-8
2.2.5A Remove the Interface Board, Dual Module ..................................................................... 2-9
2.2.5B Removing the Interface Board, Dual Module 26-Pin Header ......................................... 2-9
2.2.6A Remove the Interface Board, Single Module .................................................................. 2-10
2.2.6B Removing the Interface Board, Single Module 26-Pin Header ...................................... 2-10
2.2.7A Removing Transceiver Module(s) Tray (Top) .................................................................. 2-11
2.2.7B Transceiver Modules Tray Removed (top and bottom view) ........................................ 2-11
2.2.8A Removing the Transceiver-MCU Module Tray ................................................................ 2-12
2.2.8B Unplugging the MCU Module Tray Away from the Front Panel ................................... 2-12
2.2.8C Transceiver Module Tray Removed (top and bottom view) .......................................... 2-13
2.2.9 Removing the MCU Module from the Tray ..................................................................... 2-13
2.2.10 Transceiver Modules Tray Removed (top and bottom view) ........................................ 2-14
2.2.11 Removal of the Side Panels from the Front Panel Assembly ........................................ 2-14
2.2.12A Removal of the Front Knobs from the Front Panel Assembly ....................................... 2-15
2.2.12B Removal of the Front Face Plate and Front Panel Chassis Plate ................................... 2-15
2.2.12C The Keypad, Display and Interconnect Board ................................................................. 2-16
2.2.12D Removal of the Keypad board .......................................................................................... 2-16
2.2.12E The Display and Interconnect Board (top and bottom view) ......................................... 2-17

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TYPE II
2.3 TDFM-600/6000 Transceiver – Exploded View ................................................................ 2-20
2.4.1A Heatsink Fan Mounting Screws ........................................................................................ 2-21
2.4.1B Heatsink 2-Pin Fan Connector Removed ......................................................................... 2-21
2.4.2A Screws Securing the Top Cover ...................................................................................... 2-22
2.4.2B Screws Securing the Bottom Cover ................................................................................. 2-22
2.4.2C The Top and Bottom Covers Removed ............................................................................ 2-22
2.4.3 Screws Securing the Heatsink to the Chassis ................................................................. 2-23
2.4.4A The Heatsink 25-Pin Male DB-Connector ......................................................................... 2-24
2.4.4B Heatsink Side-Mounted Screws ........................................................................................ 2-24
2.4.4C Heatsink Pulled Away from the Chassis .......................................................................... 2-25
2.4.4D Removing the Mini-Coax Connector on the RF Module(s) ............................................ 2-25
2.4.4E Heatsink Removed from Chassis ...................................................................................... 2-26
2.4.5A Remove the Interface Board, Dual Module ..................................................................... 2-27
2.4.5B Removing the Interface Board, Dual Module 26-Pin Header ......................................... 2-27
2.4.6A Remove the Interface Board, Single Module .................................................................. 2-28
2.4.6B Removing the Interface Board, Single Module 26-Pin Header ...................................... 2-28
2.4.7A Removing Transceiver Module(s) Tray (Top) .................................................................. 2-29
2.4.7B Transceiver Modules Tray Removed (top and bottom view) ........................................ 2-29
2.4.8A Removing the Transceiver-MCU Module Tray ................................................................ 2-30
2.4.8B Unplugging the MCU Module Tray Away from the Front Panel ................................... 2-30
2.4.8C Transceiver Module Tray Removed (top and bottom view) .......................................... 2-31
2.4.9 Removing the MCU Module from the Tray ..................................................................... 2-31
2.4.10A Side-bracket Screws Labeled (a and b) ............................................................................ 2-32
2.4.10B Transceiver Module, Machined Blocks and Bracket Removed ...................................... 2-32
2.4.11 Removal of the Side Panels from the Front Panel Assembly ........................................ 2-33
2.4.12A Removal of the Front Knobs from the Front Panel Assembly ....................................... 2-33
2.4.12B Removal of the Front Face Plate and Front Panel Chassis Plate ................................... 2-34
2.4.12C The Keypad, Display and Interconnect Board ................................................................. 2-35
2.4.12D Removal of the Keypad board .......................................................................................... 2-35
2.4.12E The Display and Interconnect Board (top and bottom view) ......................................... 2-36
2.5 TDFM-600/6000 Transceiver – Exploded View ................................................................ 2-38
2.6.2A Remove the Interface Board ............................................................................................. 2-39
2.6.2B Removing the Interface Board, 26-Pin Header ................................................................ 2-40
2.6.3 Typical Interface Boards (Hybrid) ..................................................................................... 2-40
3-1 Production Test Sequence ................................................................................................ 3-2
4-1 TDFM-600/6000 Transceiver Exploded View – Internal Modules .................................. 4-2
5-1 TDFM-600/6000 Transceiver - Internal Modules ............................................................. 5-4
5-2 TDFM-600/6000 Transceiver Assembly Family Tree ....................................................... 5-5

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LIST OF TABLES
Table
Title
Page
1.1 TDFM-600/6000 SERIES TYPE I Transceiver – Configuration Overview ........................ 1-8
1.2 TDFM-600/6000 SERIES TYPE II Transceiver – Configuration Overview ....................... 1-9
1.3 MCU Sockets, Jumpers and Connectors .......................................................................... 1-12
1.4 MIC Level Adjust, Side Tone Adjust and RX Audio ......................................................... 1-12
2.1 Sample of Type I Transceiver Label .................................................................................. 2-1
2.2 Sample of Type II Transceiver Label ................................................................................. 2-19
2.3 Sample of Type II (HYBRID) Transceiver Label ................................................................ 2-37
4.1.a TDFM-600/6000 SERIES TYPE I Transceiver – Configuration Overview ........................ 4-3
4.1.b TDFM-600/6000 SERIES TYPE II Transceiver – Configuration Overview ....................... 4-4
4.2 TDFM-600/6000 Reference Table Schematic and Component Layout Section.............. 4-5
4.3 TDFM-600/6000 SERIES TYPE I Sectioned By Modules .................................................. 4-12
4.4 TDFM-600/6000 SERIES TYPE II Sectioned By Modules ................................................. 4-12
5.1 Index of Parts List Enclosed for the TDFM-600/6000 Series Type I .................................5-2
5.2 Index of Parts List Enclosed for the TDFM-600/6000 Series Type II ............................... 5-3
5.3 Assembly Configuration Listing for the TDFM-600/6000 Series Type I .......................... 5-6
5.4 Assembly Configuration Listing for the TDFM-600/6000 Series Type II ........................ 5-9

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LIST OF FUNCTIONAL, SCHEMATIC AND COMPONMENT LAYOUT DIAGRAMS
Figure No.
Title
Section
4 TDFM-600/6000 Transceiver - Exploded View of Modules 012701 ............................... 4-A
4.0 TDFM-600/6000 Transceiver - System Block Diagram 014803 ...................................... 4-A
A1 MODULE MICROCONTROLLER (MCU) SECTION P/N 013500-1
4.1 A1 Module Microcontroller (MCU) - Block Functional Diagram 014084A .................... 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev N .................................. 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev M ................................. 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev L ................................... 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev K .................................. 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev J ................................... 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev H .................................. 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev G .................................. 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev F ................................... 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev D .................................. 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev C .................................. 4-A1
4.1.1 A1 Module Microcontroller (MCU) - Schematic Diagram, Rev B .................................. 4-A1
4.1.1a A1 Module Microcontroller (MCU) - Component Layout, (Pgs. 2) Rev M .................... 4-A1
4.1.1a A1 Module Microcontroller (MCU) - Component Layout, (Pgs. 2) Rev L ...................... 4-A1
4.1.1a A1 Module Microcontroller (MCU) - Component Layout, (Pgs. 2) Rev K ..................... 4-A1
4.1.1a A1 Module Microcontroller (MCU) - Component Layout, (Pgs. 2) Rev J ...................... 4-A1
4.1.1a A1 Module Microcontroller (MCU) - Component Layout, (Pgs. 2) Rev H ..................... 4-A1
4.1.1a A1 Module Microcontroller (MCU) - Component Layout, (Pgs. 2) Rev E ...................... 4-A1
4.1.1a A1 Module Microcontroller (MCU) - Component Layout, Rev D ................................... 4-A1
4.1.1a A1 Module Microcontroller (MCU) - Component Layout, Rev C ................................... 4-A1
4.1.1a A1 Module Microcontroller (MCU) - Component Layout, Rev B ................................... 4-A1
A1 MODULE Power Board [NFS] P/N 013511-1 and sub Board [NFS] P/N 049515
4.1.2 A1 Module Power Board - Schematic Diagram, ..............................................................4-A1
4.1.2a A1 Module Power Board - Component Layout, Rev C ....................................................4-A1
4.1.2a A1 Module Power Board - Component Layout, Rev B ....................................................4-A1
4.1.2a A1 Module Power Board - Component Layout, ...............................................................4-A1

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A2(I) MODULE INTERFACE BOARD, DUAL MODULE SECTION P/N 013510-1
4.2.1 A2(I) Interface, Dual module - Schematic Diagram, Rev D .............................................4-A2
4.2.1 A2(I) Interface, Dual module - Schematic Diagram, Rev B .............................................4-A2
4.2.1 A2(I) Interface, Dual module - Schematic Diagram, ........................................................4-A2
4.2.1a A2(I) Interface, Dual module - Component Layout, Rev B ..............................................4-A2
4.2.1a A2(I) Interface, Dual module - Component Layout, .........................................................4-A2
A3(I) MODULE INTERFACE BOARD, SINGLE MODULE SECTION P/N 013509-1
4.2.2 A3(I) Interface, Single module - Schematic Diagram, Rev D ..........................................4-A2
4.2.2 A3(I) Interface, Single module - Schematic Diagram, Rev C ..........................................4-A2
4.2.2 A3(I) Interface, Single module - Schematic Diagram, Rev B ..........................................4-A2
4.2.2 A3(I) Interface, Single module - Schematic Diagram, .....................................................4-A2
4.2.2a A3(I) Interface, Single module - Component Layout, Rev C ...........................................4-A2
4.2.2a A3(I) Interface, Single module - Component Layout, Rev B ...........................................4-A2
4.2.2a A3(I) Interface, Single module - Component Layout, ......................................................4-A2
A2(II) MODULE INTERFACE BOARD, XTS-5000 DUAL SECTION P/N 033596-1
4.3.1 A2(II) Interface, XTS-5000 Dual - Schematic Diagram, Rev C .........................................4-A3
4.3.1 A2(II) Interface, XTS-5000 Dual - Schematic Diagram, Rev B .........................................4-A3
4.3.1 A2(II) Interface, XTS-5000 Dual - Schematic Diagram, Rev A .........................................4-A3
4.3.1 A2(II) Interface, XTS-5000 Dual - Schematic Diagram, ....................................................4-A3
4.3.1a A2(II) Interface, XTS-5000 Dual - Component Layout, Rev C ..........................................4-A3
4.3.1a A2(II) Interface, XTS-5000 Dual - Component Layout, Rev B ..........................................4-A3
4.3.1a A2(II) Interface, XTS-5000 Dual - Component Layout, Rev A ..........................................4-A3
4.3.1a A2(II) Interface, XTS-5000 Dual - Component Layout, .....................................................4-A3
A3(II) MODULE INTERFACE BOARD, XTS-5000 SINGLE SECTION P/N 033595-1
4.3.2 A3(II) Interface, XTS-5000 Single - Schematic Diagram, Rev D ......................................4-A3
4.3.2 A3(II) Interface, XTS-5000 Single - Schematic Diagram, Rev C ......................................4-A3
4.3.2 A3(II) Interface, XTS-5000 Single - Schematic Diagram, Rev B ......................................4-A3
4.3.2 A3(II) Interface, XTS-5000 Single - Schematic Diagram, Rev A ......................................4-A3
4.3.2 A3(II) Interface, XTS-5000 Single - Schematic Diagram, .................................................4-A3
4.3.2a A3(II) Interface, XTS-5000 Single - Component Layout, Rev D .......................................4-A3
4.3.2a A3(II) Interface, XTS-5000 Single - Component Layout, Rev C .......................................4-A3
4.3.2a A3(II) Interface, XTS-5000 Single - Component Layout, Rev B .......................................4-A3
4.3.2a A3(II) Interface, XTS-5000 Single - Component Layout, Rev A .......................................4-A3
A2A(II) HYBRID INTERFACE BOARD, XTS-3000/5000 DUAL SECTION P/N 043600-1
4.3.3 A2A(II) Interface, XTS-3000/5000 Dual - Schematic Diagram, Rev C .............................4-A3
4.3.3 A2A(II) Interface, XTS-3000/5000 Dual - Schematic Diagram, Rev A .............................4-A3
4.3.3 A2A(II) Interface, XTS-3000/5000 Dual - Schematic Diagram, ........................................4-A3
4.3.3a A2A(II) Interface, XTS-3000/5000 Dual - Component Layout, Rev B ..............................4-A3
4.3.3a A2A(II) Interface, XTS-3000/5000 Dual - Component Layout, Rev A ..............................4-A3
4.3.3a A2A(II) Interface, XTS-3000/5000 Dual - Component Layout, .........................................4-A3
A2B(II) HYBRID INTERFACE BOARD, XTS-5000/3000 DUAL SECTION P/N 043601-1
4.3.4 A2B(II) Interface, XTS-5000/3000 Dual - Schematic Diagram, Rev C ..............................4-A3
4.3.4 A2B(II) Interface, XTS-5000/3000 Dual - Schematic Diagram, Rev A .............................4-A3
4.3.4 A2B(II) Interface, XTS-5000/3000 Dual - Schematic Diagram, ........................................4-A3
4.3.4a A2B(II) Interface, XTS-5000/3000 Dual - Component Layout, Rev B ..............................4-A3
4.3.4a A2B(II) Interface, XTS-5000/3000 Dual - Component Layout, Rev A ..............................4-A3
4.3.4a A2B(II) Interface, XTS-5000/3000 Dual - Component Layout, .........................................4-A3

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TDFM-600 FRONT PANEL and TDFM-6000 FRONT PANEL
A4 FRONT PANEL ASSEMBLY
4.4.0 A4 Module Front Panel - Functional Block Diagram 014085 ...........................................4-A4
A4 Front Panel Board
4.4.1.1 A4 Front Panel Board 28v PN 003496-1,-2 - Schematic Diagram, Rev C .......................4-A4
4.4.1.1 A4 Front Panel Board 28v PN 003496-1,-2 - Schematic Diagram, Rev B .......................4-A4
4.4.1.1a A4 Front Panel Board 28v - Component Layout, Rev D ...................................................4-A4
4.4.1.2 A4 Front Panel Board 5v PN 013543-1,-2 - Schematic Diagram, Rev B .........................4-A4
4.4.1.2a A4 Front Panel Board 5v - Component Layout, Rev B .....................................................4-A4
4.4.1.3 A4 Front Panel Board 28v NV PN 013544-1,-2 - Schematic Diagram, Rev A .................4-A4
4.4.1.3a A4 Front Panel Board 28v NV - Component Layout, Rev B ............................................4-A4
4.4.1.4 A4 Front Panel Board 5v NV PN 013545-1,-2 - Schematic Diagram, Rev A ...................4-A4
4.4.1.4a A4 Front Panel Board 5v NV - Component Layout, Rev C ...............................................4-A4
4.4.1.4a A4 Front Panel Board 5v NV - Component Layout, Rev B ...............................................4-A4
A4A2 Module Display Board PN 983372-1,-2
4.4.2 A4A2 Module Display Board - Schematic Diagram, ........................................................4-A4
4.4.2a A4A2 Module Display Board - Component Layout, Rev B ..............................................4-A4
4.4.2a A4A2 Module Display Board - Component Layout, .........................................................4-A4
A4A3 Module Interconnect Board PN 003497-1
4.4.3 A4A3 Module Interconnect Board - Schematic Diagram, Rev A ....................................4-A4
4.4.3 A4A3 Module Interconnect Board - Schematic Diagram ................................................4-A4
4.4.3a A4A3 Module Interconnect Board - Component Layout, Rev C .....................................4-A4
4.4.3a A4A3 Module Interconnect Board - Component Layout, ................................................4-A4

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SECTION 1 – THEORY OF OPERATION
1.1 INTRODUCTION
TDFM-600/6000 series Type I transceivers have Part Numbers 011210-1 and 011210-2.
TDFM-600/6000 series Type II transceivers have Part Numbers 011210-3 and 011210-4. The
"-1,3" configuration denotes a green LED-matrix display, while the "-2,4" configuration
denotes a red LED-matrix display.
This section describes the theory of operation of the TDFM-600/6000 transceiver. It first
shows the basic system architecture and then describes the operation of each component
or module separately. The schematic diagrams mentioned here are available in section 4.
1.1.1 TDFM-600/6000 SERIES OVERVIEW
Project 25 Airborne FM compliant
The Technisonic TDFM-600/6000 series multiband transceivers are Project 25 compliant;
they function in conventional and trunked modes; they support digital and analog
operation; and they support the functions and features of most Industry Standard Public
Safety communications systems.
TDFM-600 Supports
The TDFM-600 supports two transceiver modules which can be configured with any
combination of the following: VHF (136 to 174 MHz), UHF Low Band (403 to 470 MHz), UHF
High Band (450 to 512 MHz) and the 800 MHz Band.
TDFM-6000 Supports
The TDFM-6000 supports operation on any three of the above transceiver modules. It is
possible to utilize two or more modules operating in the same band in either the TDFM-600
or TDFM-6000 series radios. The TDFM-600/6000 radio supports independent and
simultaneous operation on all installed transceiver modules. Each of the modules can be
fitted with optional features such as SmartNetTM / SmartZoneTM trunking, DES-OFB, DES, or
DVI encryption formats and Multi-Key.
Available bands
The TDFM-600/6000 series multiband transceivers are also available with type II modules in
the following bands: VHF (138 to 174 MHz), UHF (380 to 470 MHz) and the 700/800 MHz
Bands. Type II modules support SmartNet, SmartZone and P25 trunking protocols on all of
the available bands (extra cost option on VHF and UHF). In addition, encryption protocols
such as AES and DES-OFB with P-25 OTAR and Multi-Key can be supplied as options.
These advanced P25 features ensure that the TDFM-600/6000 series II transceivers are
compatible with modern FM land mobile systems utilizing the latest digital technology. All
TDFM-600/6000 series transceivers are FCC and Industry Canada approved and are
airworthiness approved and listed on Technisonic's rotorcraft and fixed wing STCs.
Combined or separate modes
The now available AMS-6000 Audio Mode Selector panel allows the separate modules
within the TDFM-600/6000 transceiver to operate in "combined" or "separate" modes, (via a
single audio controller input position) and it supports simulcast as well as cross band
repeat. A front panel connector on the AMS-6000 provides for PC programming and
encryption key loading.
Industry Canada (IC) and FCC approved. Airworthiness approved.

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In General
Each TDFM-600/6000 series radio may contain one, two or three separate RF band
modules. The TDFM-600 series may have one or two bands installed and the TDFM-6000
will have three band modules installed. The TDFM-600 and 6000 series radios are designed
to have different combinations of RF modules installed as required by the end user. RF
bands supported are VHF, UHF-LO, UHF-HI and 700-800 MHZ.
The TDFM-6000 can be considered as three (3) separate transceivers mounted in a single
chassis. The front panel keypad and display act like a remote control that “talks” to each
band module one at a time. TDFM-6000 series radios are delivered from the factory with a
set of test frequencies in each band. These test frequencies are used to verify the operation
of the radio after installation.
Custom programming of channel information in each band is accomplished by using
programming software and serial programming cable.
For demonstration purposes, a typical TDFM-6148 radio is shown for instruction. TDFM-600
series radios look almost identical to the 6000 series, except the third band knob is omitted.
Each TDFM-6000 has its model name on the top right hand side of the front bezel. The
model name contains the RF bands that are installed.
Example: On the TDFM-6148 pictured here, the 3 digits after the '6' are the bands in
ascending order, so a TDFM-6148 has 3 bands: the first is a '1' for VHF, the second is a '4'
for UHF low and the third is an '8' for 800 MHZ. If the unit has an optional Night Vision
display, then the model number will show an 'NV' at the end. The front panel has a 2 line
display, a 16 button keypad and 3 rotary encoders with push button action.
TDFM-618 (VHF and 800 MHz)
TDFM-6148 (VHF, UHF Lo and 800 MHz)
Figure 1.1 Typical TDFM-600/6000 Transceivers
NOTE: Series Type I and Series Type II may be referred to also as Type I and Type II in this
manual.

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1.1.2 Transceiver Models TDFM-600/6000 Series Type I
- Supports up to three bands (TDFM-6000) or two bands (TDFM-600) customized to your
requirement.
RF Modules available to cover VHF, UHF and 800 MHz bands.
APCO Project 25 compliant – Conventional and Trunked.
Supports SmartNetTM and SmartZoneTM Trunking protocols.
Supports DES, DES-XL, DVI, DVP, DES-OFB and AES Encryption.
P25 CAI allows digital communications with backward compatibility to both narrow and
wide band analog channels.
Flash upgradeable architecture allows new features and options to be subsequently
implemented on the existing transceiver platform.
Optional AMS-6000 (Audio Mode Selector) panel allows operation of multiple RF
modes in either “combined” or “separate” transceiver configuration. Also supports
simulcast and cross-band repeat.
Optional RC-6000 Remote control available. Allows for remote operation of TDFM-
600/6000 transceiver.
Configurable Multi-band Airborne Transceivers.
Each transceiver can store 255 channels per band and is capable of simultaneous operation
on all available bands. The TDFM-600 and 6000 must be programmed with a laptop
utilizing the Motorola Customer Programming Software (CPS)TM ensuring total
compatibility with existing fleet deployment. For maximum ease of Installation,
programming and operation including ancillary features such as Cross Band Repeat and
Simulcast, the optional AMS-6000 mode selector should be used in conjunction with the
TDFM-600/6000 series transceivers.
TDFM-600 series transceivers support dual band operation in two of the following bands:
VHF (136 to 174 MHz)
UHF Lo (403 to 470 MHz)
UHF Hi (450 to 512 MHz)
800 (806 to 870 MHz)
NOTE: For TDFM 600/6000 Type I Band Splits, refer to Appendix J.
TDFM-6000 series transceivers support three-band operation in the above configurations.
Technisonic 600/6000 transceivers provide digital or conventional analog communications
on the Project 25 Common Air Interface (CAI) and support P25 conventional and trunked
communications as well as Motorola ASTROTM trunking. SmartNet and SmartZone
trunking protocols are also supported along with encrypted communications including
Project 25 AES, DES, DES-XL, DES-OFB in some applications.
TDFM-600/6000 series architecture supports provides a 2-line, 24-character display and a
multifunction front panel keypad, Night Vision compliant display and panel optional. The
small size (no remote box) and light weight (3 pounds) of these compact panel-mount
multi-band airborne FM transceivers make them ideal for helicopter installation.
Protocols Supported
Optional Encryption Formats Supported
Conventional Analog
DES, DES-XL, DVI, DVP
Conventional P25
AES (includes DES Formats), DES-OFB
Type II SmartNet
Multiple Encryption keys (Multi-Key)
SmartZone
Conventional OTAR
P25 Trunking (800 MHz)
P25 OTAR (Available for limited applications)

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1.1.2 Transceiver Models TDFM-600/6000 Series Type II
The TDFM-600/6000 Type II series of transceivers offer the most up-to-date, maximum
performance technology including P25 CAI, P25 Trunking and AES with P25 OTAR. Note:
Some features are extra cost options. Supports up to three bands (TDFM-6000) or two
bands (TDFM-600) customized to your requirement.
RF Modules available to cover VHF, UHF and 800 MHz bands. Type II RF modules
available for the VHF, UHF and 700/800 MHz bands
APCO Project 25 compliant – Conventional or Trunked.
Supports Project 25, SmartNetTM and SmartZoneTM Trunking protocols (optional)
Supports AES, DES, DES-XL, DES-OFB and ADP hardware and software.
P25 CAI allows digital communications with backward compatibility to both narrow and
wide band analog operation.
Flash upgradeable architecture allows new features and options to be subsequently
implemented on the existing transceiver platform.
Optional AMS-6000 (Audio Mode Selector) panel allows operation of multiple RF
modes in either “combined” or “separate” transceiver configuration. Also supports
simulcast and cross-band repeat.
Optional RC-6000 Remote control available. Allows for slaved operation of any TDFM-
600/6000 transceiver.
Configurable Multi-band Airborne Transceivers.
Each transceiver can store 1000 channels-per-band using the latest firmware (850 for older
radios) and is capable of simultaneous operation on all available bands. The TDFM-600 and
6000 must be programmed with a laptop utilizing the Motorola Customer Programming
Software (CPS)TM ensuring total compatibility with existing fleet deployment. For
maximum ease of Installation, programming and operation including ancillary features
such as Cross Band Repeat and Simulcast, the optional AMS-6000 mode selector is
recommended for use in conjunction with the TDFM-600/6000 series transceivers.
TDFM-6000 series transceivers support dual band operation in two of the following bands:
VHF (136 to 174 MHz)
UHF Lo (380 to 470 MHz)
700/800 (764 to 870 MHz)
UHF Hi (450 to 520 MHz)
NOTE: For TDFM 600/6000 Type II Band Splits, refer to Appendix J.
TDFM-6000 series transceivers support three band operation in all of the above bands. It is
also possible to specify configurations using two or more of the same bands. Technisonic
600/6000 Type II transceivers provide digital or conventional analog communications on
the Project 25 Common Air Interface (CAI) and support P25 conventional and trunked
communications as well as Motorola ASTROTM trunking. SmartNet II and SmartZone
trunking protocols along with encrypted communications including Project 25 DES-OFB,
AES, DES, DES-XL and OTAR.
TDFM-600/6000 series architecture supports provides a 2-line, 24-character display and a
multifunction front panel keypad. Night Vision compatible display and panel are optional.
The small size (no remote box) and light weight (4 pounds) of these compact panel mount
multi-band airborne FM transceivers make them ideal for helicopter installation.
Protocols Supported
Optional Encryption Formats Supported
Conventional Analog
DES, DES-XL
Conventional P25
AES (includes DES Formats), DES-OFB and ADP
SmartNet II
Multiple Encryption keys (48)
SmartZone
Conventional OTAR
P25 Trunking (800 MHz)
OTAR and P25 OTAR (Over the air re-keying)

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1.1.3 Programming
The TDFM-600/6000 transceivers must be programmed with Motorola CPS software.
Additional options can be ordered to support operation within existing Motorola radio
systems. Contact Technisonic sales department for further information.
If you are familiar with the Motorola portable radio (XTS 3000), then this picture will show
the similarities that exist with the TDFM-600/6000 front panel.
Figure 1.2 Functional Similarities of a Typical Portable Radio
and the TDFM-600/6000 Transceivers
Display
Information
F4 Button
Channel Selector
“TSW” Switch
“ESW” Switch
F1 Button
F2 Button
F3 Button
SOFTMENU keys
Numeric keypad
(Numlock mode)
“5/UP” key (Scroll right)
“8/DN” key
(Scroll left)
“HOME” key

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1.1.4 TDFM-600/6000 Models
The TDFM-600/6000 Models contain four modules which are housed in a single chassis
(see Figure 1.3). These modules and their sub-modules are described in the following
paragraphs (Schematics and Layouts are also referenced, see Section 4):
(A1) Microcontroller Board (MCU):
(MCU), Module A1, Part Number (P/N) 013500-1, is described in section 1.2.
Power Board Module, P/N (Part Number) 013511-1, is described in section 1.2.
The current software version is TR21 Rev AA when this manual was prepared.
A2/A3 Interface Boards:
Interface Board, dual module A2(I), P/N 013510-1 is described in section 1.3.1
Interface Board, single module A3(I), P/N 013509-1 is described in section 1.3.2
XTS-5000 dual module A2(II), P/N 033596-1 is described in section 1.3.3
XTS-3000/5000 dual module A2A(II), P/N 043600-1 is described in section 1.3.4
XTS-5000/3000 single module A2B(II), P/N 043601-1 is described in section 1.3.5
XTS-5000 single module A3(II), P/N 033595-1 is described in section 1.3.6
(A4) Front Panel Modules A4 Series TYPE I and II are described in section 1.4.1 to 1.4.4
and are comprised of the following listed below.
Series 600
Series 6000
Front Panel Assembly 28v (Green)
013527-1
013535-1
Front Panel Assembly 28v (Red)
013527-2
013535-2
Front Panel Assembly 5v (Green)
013529-1
013537-1
Front Panel Assembly 5v (Red)
013529-2
013537-2
Front Panel Assembly 28v ( NV )
013531-1
013539-1
Front Panel Assembly 5v ( NV )
013533-1
013541-1
FRONT PANEL BOARD 28v
003496-1
003496-2
FRONT PANEL BOARD 5v,
013543-1
013543-2
FRONT PANEL BOARD 28v NV (new)
FRONT PANEL BOARD 28v28v NV (old)
003496-1
013544-1
003496-2
013544-2
FRONT PANEL BOARD 5v28v NV (new)
FRONT PANEL BOARD 5v28v NV (old)
013543-1
013545-1
013543-2
013545-2
DISPLAY (Green)
983372-1
DISPLAY (Red)
983372-2
INTERCONNECT BOARD
003497-1
(A5) Top tray, P/N 018569,
Bottom tray, P/N 018568,
Chassis left-side panel, P/N 018570,
Chassis right-side panel, P/N 018571.
NOTE: Heat Sink Assembly P/N 013526-2: 3-Band (3 Antennas)
Heat Sink Assembly P/N 013526-1: 2-Band (2 Antennas)
Heat Sink Assembly P/N 013526-3: 1-Band (1 Antenna)