Texas Instruments THS3001 User manual

THS3001
High Speed Current
Feedback
Operational Amplifier
E aluation Module
March 1999 Mixed-Signal Products
User’s Guide
SLOU021A

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Copyright 1999, Texas Instruments Incorporated

iii
Chapter Title—Attribute Reference
Preface
Related Documentation From Texas Instruments
J THS3001 HIGH-SPEED CURRENT-FEEDBACK OPERATIONAL
AMPLIFIER
(literature number SLOS217) This is the data sheet
for the THS3001 operational amplifier integrated circuit that is
used in the THS3001 evaluation module.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
testedforcompliancewiththelimitsofcomputing devices pursuant to subpart
Jofpart 15ofFCCrules,which aredesignedtoprovidereasonableprotection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
Trademarks
TI is a trademark of Texas Instruments Incorporated.

iv

Running Title—Attribute Reference
v
Contents
Contents
1 General Information 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 THS3001 EVM Specifications 1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Using The THS3001 EVM 1-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 THS3001 EVM Performance 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 General High-Speed Amplifier Design Considerations 1-8. . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Reference 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 THS3001 High-Speed Operational Amplifier EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . .
2.2 THS3001 EVM Board Layouts 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 THS3001 Rev. A High-Speed Operational Amplifier EVM Parts List 2-4. . . . . . . . . . . . . . .
2.4 THS3001 Rev. A. EVM Board Layouts 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures
1–1 THS3001 Evaluation Module – Original Version 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–2 THS3001 Rev. A Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–3 THS3001 EVM Schematic – Original Version 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–4 THS3001 Rev. A EVM Schematic 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–5 THS3001 EVM Frequency Response with Gain = 2 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–6 THS3001 EVM Frequency Response with Inverting Gain = 1 1-7. . . . . . . . . . . . . . . . . . . . . . .
2–1 THS3001 EVM Component Placement Silkscreen and Solder Pads 2-2. . . . . . . . . . . . . . . . .
2–2 THS3001 EVM PC Board Layout – Component Side 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 THS3001 EVM PC Board Layout – Back Side 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–4 THS3001 Rev. A EVM Component Placement Silkscreen and Solder Pads 2-4. . . . . . . . . . .
2–5 THS3001 Rev. A EVM PC Board Layout – Component Side 2-5. . . . . . . . . . . . . . . . . . . . . . . .
2–6 THS3001 Rev. A EVM PC Board Layout – Back Side 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
2–1 THS3001 EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 THS3001 Rev. A EVM Parts List 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

vi

1-1
General Information
General Information
This chapter details the Texas Instruments (TI) THS3001 high-speed
operational amplifier evaluation module (EVM), SLOP130. It includes a list of
EVM features, a brief description of the module illustrated with a pictorial and
aschematicdiagram,EVMspecifications,detailsonconnectingandusingthe
EVM, and a discussion on high-speed amplifier design considerations.
Topic Page
1.1 Features 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 THS3001 EVM Specifications 1–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Using The THS3001 EVM 1–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 THS3001 EVM Performance 1–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 General High-Speed Amplifier Design Considerations 1–8. . . . . . . . . . .
Chapter 1

Features
1-2
General Information
1.1 Features
THS3001 operational amplifier EVM features include:
J High Bandwidth — 340 MHz, –3 dB at ±15 VCC & Gain = 2
J ±5-V to ±15-V Operation
J Inverting and Noninverting Single-Ended Inputs
J ModuleGainSetto+2(Noninverting)and–1(Inverting)—Adjustable
Through Component Change.
J Nominal 50-ΩImpedance Inputs and Outputs
J Standard SMA Miniature RF Connectors
J Good Example of High-Speed Amplifier Design and Layout
1.2 Description
The TI THS3001 high-speed current-feedback operational amplifier
evaluationmodule(EVM)isacompletehigh-speedamplifiercircuit.Itconsists
of the TI THS3001 high-speed current-feedback operational amplifier IC,
along with a small number of passive parts, mounted on a small circuit board
measuring approximately 1.7 inch by 1.4 inch. The EVM uses standard SMA
miniatureRF connectors forinputs and outputsand is completelyassembled,
fully tested, and ready to use — just connect it to power, a signal source, and
a load (if desired).
Two versions of the THS3001 EVM are available. The original appears in
Figure 1–1 and the Rev. A version appears in Figure 1–2.
Figure 1–1.THS3001 Evaluation Module – Original Version
NONINVERTING
+ +
R1
R4
+VCC
C3
R5
C2
C1
GND
–VCC
R2
C4
R3
U1
J3
–IN
GND
J2
J1
+IN
GND
INVERTING
LITERATURE NO
SLOP 130
009957 THS3001 EVM
OUT
GND

Description
1-3
General Information
Figure 1–2.THS3001 Rev. A Evaluation Module
NONINVERTING
+
R4
R2
+VCC
C1
R1 C3
C2
GND
–VCC
R5
C4
R3 U1
J2
–IN
GND
J4
OUT
GND
J3
+IN
GND
INVERTING
SLOP130 Rev A
THS3001 EVM Board
J1
INSTRUMENTS
+TEXAS
Rev. A
The THS3001 EVM is equipped with both noninverting and inverting inputs.
The noninverting input is set for a gain of 2 and the inverting input is set for a
gain of 1. Each input is terminated with a 50-Ωresistor to provide correct line
impedance matching (Figure 1–3 for original version and Figure 1–4 for Rev.
A). The amplifier IC output is routed through a 50-Ωresistor both to provide
correct line impedance matching and to help isolate capacitive loading on the
output of the amplifier. Capacitive loading directly on the output of the IC
decreases the amplifier’s phase margin and can result in peaking or
oscillations.
Figure 1–3.THS3001 EVM Schematic – Original Version
Non-
Inverting
Input
Inverting
Input
VCC
Output
R3
49.9 Ω
R1
1 kΩ
C4
0.1 µF
R5
1 kΩ
R4
49.9 Ω
C3
6.8 µF/35 V
–VCC
2
3
4
6
7
+
–
U1
THS3001 R2
49.9 Ω
J1
J2
+
C2
0.1 µF+
C1
6.8 µF/35 V
J3

Description
1-4
General Information
Figure 1–4.THS3001 Rev. A EVM Schematic
–IN
Inverting
+IN
Noninverting
Out
R1
49.9 Ω
R3
49.9 Ω
–VCC
2
3
4
6
7
+
–U1
THS3001
J2
J4
+
C2
6.8 µF
J3
R2
1 kΩR4 1 kΩ
R5
49.9 Ω
C4
0.1 µF
C1
6.8 µF
+
C3
0.1 µF
VCC
–VCC
VCC
GND
J1 1–VCC
2
3VCC
Rev. A
EventhoughtheTHS3001isacurrent-feedbackamplifier,thegainoftheEVM
can easily be changed to support a particular application by simply changing
the ratio of resistors R1, R4, and R5 (R1, R2, and R4 for Rev. A) as described
in the following equations:
Inverting Gain +*
RF
RG
+*
R1
R5
+*
R4
R2(Rev.A)
Noninverting Gain + 1 )
RF
RG
+ 1 )
R1
R4 ) R5
+ 1 )
R4
R2 ) R1(Rev.A)
In addition, some applications, such as those for video, may require the use
of 75-Ωcable and 75-ΩEVM input termination and output isolation resistors.
Any of the resistors on the EVM board can be replaced with a resistor of a
different value; however, care must be taken because the surface-mount
solder pads on the board are somewhat fragile and will not survive many
desoldering/soldering operations.
Because of the current feedback architecture, extra care must be taken to
ensure that a feedback resistor is always included in the design. In addition,
there must never be a capacitor directly in the feedback path between the
amplifier output and the noninverting input. Disregarding this guideline will
likely result in a part that oscillates.