Texas Instruments THS7002 User manual

THS7002
ProgrammableĆGain Amplifier
Evaluation Module
July 1999 Mixed-Signal Products
User’s Guide
SLOU037

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Copyright 1999, Texas Instruments Incorporated

iii
Chapter Title—Attribute Reference
Preface
Related Documentation From Texas Instruments
J THS7002 PROGRAMMABLE-GAIN AMPLIFIER (literature
number SLOS214) This is the data sheet for the THS7002
amplifier integrated circuit used on the EVM.
J THS4001 HIGH-SPEED LOW-POWER OPERATIONAL
AMPLIFIER
(literature number SLOS206) This is the data sheet
for the THS4001 amplifier integrated circuit used on the EVM.
J PowerPAD  Thermally Enhanced Package (literature number
SLMA002) This is the technical brief for the special PowerPAD
package in which the THS7002 amplifier IC is supplied.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
testedforcompliancewiththelimitsofcomputingdevicespursuanttosubpart
Jofpart 15ofFCCrules,which aredesignedtoprovidereasonableprotection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
Trademarks
TI is a trademark of Texas Instruments Incorporated.
PowerPAD is a trademark of Texas Instruments Incorporated.

iv

Running Title—Attribute Reference
v
Chapter Title—Attribute Reference
Contents
1 General Information 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Programmable Gain Amplifier Gain Control 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 EVM DIP Switch Functionality 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 EVM Circuit Configuration 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Using the THS7002 EVM 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 THS7002 EVM Performance 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.8 General High-Speed Amplifier Design Considerations 1-16. . . . . . . . . . . . . . . . . . . . . . . . . .
1.9 General PowerPAD t Design Considerations 1-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.10 THS7002 EVM Specifications 1-20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Reference 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 THS7002 Programmable-Gain Amplifier EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . . . . .
2.2 THS7002 EVM Board Layouts 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Running Title—Attribute Reference
vi
Figures
1–1 THS7002 Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–2 THS7002 EVM Power Conditioning Schematic Diagram 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–3 THS7002 EVM Schematic Diagram 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–4 Simplified PGA Section of the THS7002 1-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–5 THS7002 Evaluation Module Block Diagram 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–6 THS7002 EVM Preamplifier Frequency Response 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–7 THS7002 EVM Preamplifier Phase Response 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–8 THS7002 EVM PGA Frequency Response 1-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–9 THS7002 EVM PGA Phase Response 1-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–10 THS7002 EVM Preamplifier + PGA Frequency Response 1-15. . . . . . . . . . . . . . . . . . . . . . . . .
1–11 THS7002 EVM Preamplifier + PGA Phase Response 1-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–12 PowerPAD PCB Etch and Via Pattern 1-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–13 Maximum Power Dissipation vs Free-Air Temperature 1-18. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 THS7002 EVM Component Placement Silkscreen and Solder Pads 2-3. . . . . . . . . . . . . . . . .
2–2 THS7002 EVM PC Board: Top Assembly 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 THS7002 EVM PC Board: Top Layer 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–4 THS7002 EVM PC Board: Bottom Layer 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
1–1 THS7002 EVM PGA Nominal Gain/Attenuation 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–2 EVM DIP Switch Functionality 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–3 THS7002 EVM Jumper Settings 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1–4 THS7002 EVM DIP Switch Settings 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 THS7002 Programmable-Gain Amplifier EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1
General Information
General
Information
This chapter details the Texas Instruments (TI) THS7002
programmable-gainamplifierevaluationmodule(EVM),SLOP136.Itincludes
alistof EVMfeatures,abriefdescriptionofthemoduleillustratedwithpictorial
and schematic diagrams, EVM specifications, details on configuring,
connecting,andusingtheEVM,andadiscussiononhigh-speedamplifier and
PowerPAD package design considerations.
Topic Page
1.1 Features 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Programmable Gain Amplifier Gain Control 1–7. . . . . . . . . . . . . . . . . . . . .
1.4 EVM DIP Switch Functionality 1–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 EVM CIrcuit Configuration 1–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Using The THS7002 EVM 1–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 THS7002 EVM Performance 1–13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.8 General High-Speed Amplifier Design Considerations 1–16. . . . . . . . .
1.9 General PowerPADDesign Considerations 1–17. . . . . . . . . . . . . . . . . .
1.10 THS7002 EVM Specifications 1–20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1

Features
1-2
General Information
1.1 Features
THS7002 programmable-gain amplifier EVM features include:
J Multiple Input Configurations Set Via On-board Jumpers
J DIP Switches Allow Quick and Easy Adjustment of Gain, Shut Down,
Reference Voltage, and Output Clamping
J Includes a THS4001 High-Speed Amplifier as an Inverter
J Standard BNC Connectors Inputs and Outputs
J ±5-V to ±15-V Operation with 5-V Reference Input
J Nominal 50-ΩImpedance Inputs and Outputs
J Includes Test Points for Easy Digital Control of EVM Circuit Gain and
Operating Parameters
J Good Example of PowerPAD Package and High-Speed Amplifier
Design and Layout
1.2 Description
The TI THS7002 programmable-gain amplifier evaluation module (EVM) is a
complete dual-channel low-noise receiver and a highly configurable
programmable-gain amplifier circuit. It consists of the TI THS7002
Programmable-Gain Amplifier IC, a TI THS4001 high-speed, low-power
operational amplifier IC, and a number of passive parts, all mounted on a
multilayer circuit board (Figure 1–1).
Although the THS7002 IC was developed primarily for xDSL receiver
front-ends, there are a large number of different circuits that can benefit from
the many features incorporated into the THS7002. This EVM illustrates a
universal design and can be used for numerous system configurations.
The EVM uses standard BNC connectors for inputs and outputs and also
includes test points for user connections and testing. It is completely
assembled, fully tested, and ready to use — just connect it to power, a signal
source, and a load (if desired).

Description
1-3
General Information
Figure 1–1.THS7002 Evaluation Module
PGA – A
Output
R45
PGA – B
Output
C21L2C5C4L1
+VCC GND +5 V–VCC
Pre-AmpA
Output
Pre-Amp B
Output
Input B
J7
B
J8
C20
JP5
J10
J9
C3
R4
R3
U2
C2
R1C1 R2 R9
InputA J6
J5
R24
R26
R28
R30
R32
C18
C19 R34
R36
R38
R40
R42
R44
R18 R5
U1
AG2
(3)
AG1
(2)
AG0
(1)
S1
S2
VH
(6)
BVREF
(5)
BS/D
(4)
AS/D
(4)
AVREF
(5)
VL
(6)
BG2
(1)
BG1
(2)
BG0
(3)
JP4JP3
R16 R17
C17
JP1
R6
C6
R20
C7
C11
C12
R12 C13
C10
R11
R15
R14
R13
R35
R37
R39
R41
R23
R25
R27
R29
R11
R33
R10
C9
JP2
C14
1998
Texas Instruments
J4J3
J2
J1
SLOP136
Rev. B THS7002 EVM Board
+++
R7
R8
C8
GND
U2 Out
1
1
11
1
InputpowerisappliedtotheEVMthroughbananajacksJ1,J2,J3, and J4. An
LC filter on each power bus isolates the EVM circuits from the external supply
(Figure 1–2). J4 provides a reference point for numerous circuit functions and
draws relatively little current. The schematic for the EVM amplifiers appears
in Figure 1–3.
Figure 1–2.THS7002 EVM Power Conditioning Schematic Diagram
–15 V
L1
0.22 µHC4
6.8 µF
15 V
J1
VCC
+
J2
GND
+
J3
–VCC
+
J4
5 V
5 V
L2
0.22 µH
C5
6.8 µFC21 6.8 µF
TP1

Description
1-4
General Information
+ –
C11
0.1 µF
R9 49.9 Ω
15 V
U1-A
THS7002
8
5
6
–15 V
C12, 0.1 µF
4
J6
Input A
C8, TBD
7R5
49.9 ΩJ5
Pre-amp A Out
3 2
1
R8
499 Ω
R7
499 Ω
+ –
R16 49.9 Ω
15 V
U2
THS4001
7
2 3
–15 V
5
C1, TBD
4
R4
22 Ω
3
2
1
R1
1 kΩ
R2
1 kΩ
C2, 0.1 µF
JP1
TP12
U2-Out
J7
Input B
3
2
JP3
JP2
+ –
U1-C
10
9
11
R3 TBD
R13
TBD
C3, 0.1 µF
C9
TBD
C10, TBD
R11
499 Ω
R10
499 Ω
3 2
1
R17
49.9 ΩJ8
Pre-amp B Output
JP4
C14, TBD
R14
0 Ω
C6, TBD
R6
0 Ω
R20
TBD C7
TBD
R12
TBD C13
TBD
G2
G1
G0
VREF
SID
–Vcc VCC
VH
VL
VO
GND
VIN–
26
28
21
27
C18, 0.1 µF–15 V
13
14
25
22
R29 330 ΩR18
49.9 Ω
R30
3.3 kΩ
5 V
S1-D S1-E
AVREF TP8
AS/D
TP7
C19, 0.1 µF
15 V
R23, 330Ω
R25, 330Ω
R27, 330Ω
R24, 3.3 kΩ R26, 3.3 kΩ R28, 3.3 kΩ3
2
1
S2-F
TP5
VH
R41
49.9 ΩR42
4.7 kΩ
R31
49.9 ΩR32
4.7 kΩ
R44
100 ΩJ9
PGA-A Output
VL
TP6 S1-F
–15 V
5 V15 V JP5
AG2, TP3
C17, 0.1 µF
5 V
G0
G1
G2
15
17
16
R35, 330Ω
R37, 330Ω
R39, 330Ω
20 24
23
3
VIN–
VREF
SID
GND
12 R45
100 ΩJ10
PGA-B Output
19
R33 330 ΩR15
49.9 Ω
R34
3.3 kΩ
5 V
S2-D S2-E
BVREF TP14
BS/D
TP13
2
1
R36, 3.3 kΩ R38, 3.3 kΩ R40, 3.3 kΩ
BG2, TP9
C20, 0.1 µF5 V
S2-A
S2-B
S2-C
BG1, TP10
BG0, TP11
VO
TP2, AG0 TP4, AG1
U1–B
U1–D
18
Figure 1–3.THS7002 EVM Schematic Diagram