Texas Instruments TLV320AIC1103 User manual

TLV320AIC1103/1109/1110
EVMs
March 2003 Data Acquisition Products
User’s Guide
SLAU092

IMPORTANT NOTICE
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enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
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does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
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Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2003, Texas Instruments Incorporated

EVM IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION
PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided
may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective
considerations, including product safety measures typically found in the end product incorporating the goods.
As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic
compatibility and therefore may not meet the technical requirements of the directive.
Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned
within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE
WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED,
IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY
PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user
indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the products
received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open construction
of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic
discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE
TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not
exclusive.
TI assumesno liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein.
Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM
User’s Guide prior to handling the product. This notice contains important safety information about temperatures
and voltages. For further safety concerns, please contact the TI application engineer.
Persons handling the product must have electronics training and observe good laboratory practice standards.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any
machine, process, or combination in which such TI products or services might be or are used.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2003, Texas Instruments Incorporated

EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 3.3 V described in the EVM
User’s Guide.
Exceeding the specified input range may cause unexpected operation and/or irreversible
damage to the EVM. If there are questions concerning the input range, please contact a TI
field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or
possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to
connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than
60°C. The EVM is designed to operate properly with certain components above 60°C as long
as the input and output ranges are maintained. These components include but are not limited
to linear regulators, switching transistors, pass transistors, and current sense resistors. These
types of devices can be identified using the EVM schematic located in the EVM User’s Guide.
When placing measurement probes near these devices during operation, please be aware
that these devices may be very warm to the touch.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2003, Texas Instruments Incorporated

Related Documentation From Texas Instruments
v
Preface
Read This First
About This Manual
This user’s guide describes the operation and use of the evaluation module
(EVM) for the TLV320AIC1103 /1109 /1110 codec family. A complete circuit
description as well as schematic diagram and bill of materials are also
included.
How to Use This Manual
This document contains the following chapters:
Chapter 1 –EVM Overview
Chapter 2 –Digital and Analog Interface
Chapter 3 –EVM Bill of Materials and Schematic
Related Documentation From Texas Instruments
To obtain a copy of any of the following documents, call the Texas Instruments
literature response center at [phone] or the product information center
(PIC) at [phone]. When ordering, please identify this booklet by its title
and literature number. Updated documents can also be obtained through the
TI website at www.ti.com.
Data Sheets: Literature Number:
TLV320AIC1103 SLAS356
TLV320AIC1109 SLAS358
TLV320AIC1110 SLAS359

Contents
vi
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.

Contents
vii
Contents
1 EVM Overview 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Introduction 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Digital and Analog Interface 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Description 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Codec-to-Development Platform Interface 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Jumper Options 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.1 Default Mode 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3.2 PCM Interface 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Analog Interface 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 EVM Bill of Materials and Schematic 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 EVM Bill of Materials 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 TLV320AIC1103/ 1109/ 1110 EVM Schematic 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures
2-1 Development Platform Mechanical Interface 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
2-1 EVM J3 Connector Pinout 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-2 Jumper Options 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-3 Default Mode—W1 Jumper Options 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-4 PCM Interface—P1 Jumper Options 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contents
viii

1-1
EVM Overview
EVM Overview
This chapter provides an overview of the TLV320AIC1103 / 1109 / 1110 EVM.
Topic Page
1.1 Introduction 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1

Introduction
1-2
1.1 Introduction
This EVM and user’s guide supports the following devices:
TLV320AIC1103
TLV320AIC1109
TLV320AIC1110
These devices are voice-band audio processors, designed to perform
transmit-encoding analog-to-digital (A/D) conversion, receive-decoding
digital-to-analog (D/A) conversion, and transmit and receive filtering for
voice-band communications systems.
The EVM can operate with a DSP development platform to provide the
necessary power requirements and a convenient way to interface with TI’s
range of starter kits via the 80-pin expansion connector located on the DSK.
Alternatively, the EVM can operate without a DSP development platform. In
this case the user is responsible for providing a suitable interface to the host
system.
System-level features for the chip are managed via 2 jumpers. Register
programming is achieved via an I2C interface.
Interfacing with the analog I/O is accomplished via 3 screw terminals.

2-1
Digital and Analog Interface
Digital and Analog Interface
This chapter describes the digital and analog interface for the TLV320AIC1103
/ 1109 /1110 EVM.
Topic Page
2.1 Description 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Codec-to-Development Platform Interface 2-2. . . . . . . . . . . . . . . . . . . . . . .
2.3 Jumper Options 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Analog Interface 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 2

Description
2-2
2.1 Description
The digital signals required to operate this codec originate from the 40-pin
connector—J1. There are two methods to drive the digital interface:
Create a custom interface between the codec EVM and the host system.
Alternatively, if a TI DSP starter kit (DSK) is the host system, a develop-
ment platform is available from TI. This platform provides the additional
functions that the codec requires in a convenient form factor.
2.2 Codec-to-Development Platform Interface
The EVM mates with TI’s DSP starter kit systems (DSKs) via the development
platform.
The development platform mates with the DSK, through which all the
necessary power is provided. RESET can be manually furnished to the EVM
via a switch on the development platform, or by the RESET signal on the DSK
via the development platform.
Figure 2-1.Development Platform Mechanical Interface
AIC1103 /09 /10
DSK
Development
Platform
Electrical interface to the development platform is via a 40-pin connector on
the TLV320AIC1103/1109/1110 EVM. The connector mates with the
development platform connector (Samtec part number, TSM-120-01-T-DV-P).
Consult Samtec at www.samtec.com or 1-800-SAMTEC-9 for more
information.
The pinout for the 40-pin connector is given in Table 2-1.

Codec-to-Development Platform Interface
2-3
Digital and Analog Interface
Table 2-1.EVM J1 Connector Pinout
Pin Number Signal Description
J1.1 MCLK Master system clock
J1.2 DGND Digital ground
J1.3 SCLK Serial data clock
J1.4 DGND Digital ground
J1.5 DIN Data in
J1.6 DGND Digital ground
J1.7 DOUT Data out
J1.8 N/A Reserved
J1.9 FS Frame sync
J1.10 N/A Reserved
J1.11 SCL I2C Serial bus clock
J1.12 N/A Reserved
J1.13 SDA I2C Serial bus address / data
J1.14 N/A Reserved
J1.15 N/A Reserved
J1.16 N/A Reserved
J1.17 RESET Reset
J1.18 N/A Reserved
J1.19 N/A Reserved
J1.20 N/A Reserved
J1.21 N/A Reserved
J1.22 N/A Reserved
J1.23 N/A Reserved
J1.24 N/A Reserved
J1.25 3.3V_D Digital 3.3 V
J1.26 N/A Reserved
J1.27 3.3V_D Digital 3.3 V
J1.28 DGND Digital ground
J1.29 N/A Reserved
J1.30 DGND Digital ground
J1.31 N/A Reserved
J1.32 DGND Digital ground
J1.33 N/A Reserved
J1.34 AGND Analog ground
J1.35 N/A Reserved
J1.36 AGND Analog ground
J1.37 3.3V_A Analog 3.3 V
J1.38 AGND Analog ground
J1.39 3.3V_A Analog 3.3 V
J1.40 AGND Analog ground

Jumper Options
2-4
The development platform supports a number of functions required by the
codecs:
Manual reset generation
Power options
Convenient mechanical interface to TI’s DSK
Refer to SLAU090 for details regarding the development platform.
2.3 Jumper Options
There are two jumpers on the EVM board that can be configured in various
ways, depending upon the user’s requirements. Their functions are briefly pre-
sented in the following tables.
Table 2-2.Jumper Options
Jumper Function
W1 Default mode selected
P1.1 - P1.3 MCLK = PCMCLK (SCLK)
2.3.1 Default Mode
Default mode permits the codec to operate from power up without program-
ming any registers via I2C.
Table 2-3.Default Mode—W1 Jumper Options
W1
Description 1-2 2-3
Default mode is selected Inserted Not inserted
Power-down mode Not inserted Inserted
See the appropriate data sheet for information regarding the default settings.
2.3.2 PCM Interface
The PCM interface transmits and receives data at the PCMO (DOUT) and
PCMI (DIN) terminals respectively. The data is transmitted or received at the
PCMCLK (SCLK) speed once every PCMSYN cycle (FS). The PCMCLK can
be tied directly to a master 2.048 MHz clock (MCLK).
Table 2-4.PCM Interface—P1 Jumper Options
P1
Description P1.1 - P1.3
MCLK = SCLK Inserted
2.4 Analog Interface
To make it as easy as possible to connect to a wide range of input and output
devices, the analog interface features simple screw terminals—J2 and J3 for
microphone inputs, and J4 for earphone output.

3-1
EVM Bill of Materials and Schematic
EVM Bill of Materials and Schematic
This chapter provides a bill of materials and schematic for the TLV3201103/
1109 / 1110 EVM.
Topic Page
3.1 EVM Bill of Materials 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 EVM Schematic 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 3

EVM Bill of Materials
3-2
3.1 EVM Bill of Materials
The following table contains a complete bill of materials for the
TLV320AIC1103 /1109 /1110 EVM. The schematic diagram is also provided for
reference. For further information contact the product information center (PIC)
or E-mail questions regarding this EVM to [email protected].
Quantity Reference Description
4C1, C2, C3, C4 Capacitor, 0.22 µF 16 V ceramic X7R 1206
2C5, C6 Capacitor, 10 µF 16 V tantalum TE series
2C7, C8 Capacitor, 0.1 µF 16 V ceramic X7R 1206
2R1, R2 Resistor, 10 kΩ1/8 W 5% 1206 SMD
3R3, R4, R5 Resistor, 2 kΩ1/8W 5% 1206 SMD
1 R6 Resistor, 100 kΩ1/8W 5% 1206 SMD
2 R7 Resistor, 4.7 kΩ1/8W 5% 1206 SMD
1 R8 Resistor, 0 Ω1/8W 5% 1206 SMD
1 U1 TLV320AIC1110 IC, PCM codec, Prog. MIC
AMP 32TQFP
Alternate TLV320AIC1109 IC, PCM codec, Prog. MIC
AMP 32TQFP
Alternate TLV320AIC1103 IC, PCM codec, Prog. MIC
AMP 32TQFP
1TLV320AIC1110 PWB
1 J1 40-Pin SMT socket
1 P1 40-Pin SMT plug
3J2, J3, J4 2 Terminal screw connector
1 W1 2 Position jumper
5 BUZZCON1 0.025 Inch test point
EAR1
MUXIN1
MUXOUT1
MUXOUT2
2See assembly drawing 1.000/4-40, nylon, hex thread, SP
2See assembly drawing 4-40 ×1/4 inch, machine screw,
panhead SS
3.2 EVM Schematic
The schematic is on the following page.

123456
A
B
C
D
654321
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A
12500 TI Boulevard. Dallas, Texas 75243
Title:
SHEET: OF:
FILE: SIZE:DATE:
REV:
29-Aug-2002
Drawn By:
Engineer:
Revision History
REV ECN Number Approved
AIC1110 Rev A
DOCUMENTCONTROL #
3.3V_A
3.3V_A
3.3V_D
3.3V_D
DGND
AGND
FS_1
GBL_SYNC_RESET*
GBL_DIN
GBL_DOUT
GBL_SCLK
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
33 34
35 36
37 38
39 40
J1
40-PIN SOCKET
DGND
DGND
DGND
3.3V_A
AGND
3.3V_A
3.3V_A
3.3V_D
3.3V_D
DGND
AGND
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
33 34
35 36
37 38
39 40
P1
40-PIN PLUG
DGND
DGND
DGND
GBL_SYNC_RESET*
GBL_DIN
GBL_DOUT
GBL_SCLK
DGNDAGND
GBL_DIN
FS_1
GBL_SYNC_RESET*
GBL_DOUT
DGND
3.3V_D
GBL_SCLKAGND
C1
0.22uF
BUZZCON1
PWRUPSEL
W1
3.3V_D
R7
4K7
FS_1
1
2
J3
1
2
J2
DGND
+
C5
10uF
3.3V_D
DGND
+
C6
10uF
Joe Purvis
Joe Purvis
TLV320AIC1103/ 09 / 10 Schematic
6437740
1
A
1
C7
0.1uF C8 0.1uF
MBIAS
1
MIC1P
2
MIC1N
3
MIC2P
4
MIC2N
5
REXT
6
MUXIN
7
AVss
8
MUXOUT1
9
MUXOUT2
10
SDA
11
SCL
12
DVdd
13
DVss
14
PCMI
15
PCMO
16
PCMCLK 17
PCMSYN 18
BUZZCON 19
PWRUPSEL 20
RESET* 21
MCLK 22
Vss 23
PLLVss 24
PLLVdd 25
EARVss 26
EAR1ON 27
EARVdd 28
EAR1OP 29
EARVss 30
EAR2O 31
AVdd 32
U1
TLV320AIC1110/09/03
GBL_MCLK GBL_MCLK
GBL_MCLK
GBL_SDA
GBL_SCL
GBL_SDA
GBL_SCL
GBL_SDA
GBL_SCL
PWRUPSEL
AGND
3.3V_D
AGND
R6
100K
AGND
R4
2K
C2
0.22uF
C3
0.22uF
C4
0.22uF
R5
2K
AGND
R3
2K
AGND
MBIASBIAS
BIAS
BIAS
3.3V_A
EAR1OP
EAR2O
EAR1ON
DGND
BUZZCON
1
2
J4
MIC1P
MIC1N
MIC2P
MIC2N
MIC1N
MIC1P
MIC2N
MIC2P
EAR1ON
EAR1OP
EAR1 EAR2O
3.3V_D
R1
10K
3.3V_D
R2
10K
GBL_SDA
GBL_SCL
MUXIN
MUXOUT1
MUXOUT2
MUXOUT1
MUXOUT2
MUXIN
MUXIN1
R8
0R