1 Evaluation Module Overview
1.1 Introduction
The EVM comes in a USB stick form factor, with an onboard MSP430F5528 microcontroller that interfaces with
both the host computer and the TMP110 device using an I2C interface. The module is designed with perforations
between the sensor and host controller on the EVM board. The perforation allows the user flexibility in their
evaluation:
• The user can connect the TMP110 breakable section to the user's system/host.
• The user can connect the EVM host and software to the user's system with TMP110 devices.
• Small individual boards allow the user to place sensors in the user's system or in a temperature-controlled
environment to evaluate performance.
• Hole spacing is compatible with common 0.1" prototyping breadboards.
• Surface mount connector footprint is compatible with 4-pin JST I2C systems.
This user's guide describes the characteristics, operation, and use of the TMP110EVM evaluation board by
explaining how to set up and configure the software, describing the hardware, and reviewing various aspects
of the software operation. Throughout this document, the terms evaluation board, evaluation module, and EVM
are synonymous with the TMP110EVM. This user's guide also provides information on the operating procedure,
input and output connections, an electrical schematic, printed-circuit board (PCB) layout drawings, and a parts
list for the EVM.
1.2 Kit Contents
Table 1-1 details the contents of the EVM kit. Contact the Texas Instruments Product Information Center nearest
you if any components are missing. TI highly recommends that users check the TI website at http://www.ti.com
to verify that the latest versions of the related software is downloaded.
Table 1-1. EVM Kit Contents
Item Quantity
TMP110EVM 1
1.3 Specification
Table 1-2 defines the absolute maximum thermal conditions of each section of the EVM. The main 2 sections
are the controller section and the sensor breakable section. These limits must be considered when evaluating
the performance of the device at extreme temperatures. In this case, if the setup conditions exceed the controller
absolute maximum thermal specifications, then the sensor breakable section must be detached so that only the
sensor (and not the MCU) is evaluated at these temperatures.
Table 1-2. Thermal Specifications
BOARD SECTION CONDITIONS TEMPERATURE RANGE
Controller board
Recommended operating free-air
temperature, TA
-40°C to 85°C
Absolute maximum junction temperature, TJ95°C
TMP110 breakable board Recommended operating free-air
temperature, TA
-55°C to 150°C
1.4 Device Information
The TMP110 is a digital output temperature sensor that is calibrated in production to achieve high accuracy
in a small X2SON package. This device communicates in a two-wire environment compatible with SMBus and
I2C interfaces. The device can be set to make continuous or one-shot conversions and can be ordered with
an address or an alert pad as needed. This EVM showcases one of the alert devices with the default address
of 0x48. For more information of the IC, please refer to the device data sheet. Table 1-3 includes some of the
parameters of interest of the TMP110 to consider when using this EVM.
Evaluation Module Overview www.ti.com
2TMP110 Evaluation Module SNIU052 – NOVEMBER 2023
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