Texas Instruments TPS8269 EVM-207 Series User manual

TPS8269xEVM-207
User's Guide
Literature Number: SLVU802
October 2012

Contents
0.1 Introduction .................................................................................................................. 4
0.1.1 Features ............................................................................................................. 4
0.1.2 Applications ......................................................................................................... 4
0.1.3 EVM Ordering Options ............................................................................................ 4
1 TPS8269xEVM Schematic ..................................................................................................... 5
2 Connector and Test Point Descriptions ................................................................................. 6
2.1 Input / Output Connectors: TPS8269xEVM ............................................................................. 6
2.1.1 J1 VIN ................................................................................................................. 6
2.1.2 J2 S+ / S– ........................................................................................................... 6
2.1.3 J3 GND .............................................................................................................. 6
2.1.4 J4 VOUT ............................................................................................................... 6
2.1.5 J5 S+ / S– ........................................................................................................... 6
2.1.6 J6 GND .............................................................................................................. 6
2.2 Jumpers and Switches ..................................................................................................... 6
2.2.1 JP1 ENABLE ....................................................................................................... 6
2.2.2 JP2 MODE .......................................................................................................... 6
3 Test Configuration .............................................................................................................. 7
3.1 Hardware Setup ............................................................................................................. 7
3.2 Procedure .................................................................................................................... 7
4 TPS8269xEVM Test Data ...................................................................................................... 8
4.1 Thermal Performance ...................................................................................................... 8
4.1.1 Thermal Measurement TPS82693 , IOUT = 400 mA ............................................................ 8
4.1.2 Thermal Measurement TPS82693 , IOUT = 800 mA ............................................................ 8
5 TPS8269xEVM Assembly Drawings and Layout ...................................................................... 9
A Appendix .......................................................................................................................... 11
A.1 Bill of Materials ............................................................................................................. 11
A.2 Marking Information ....................................................................................................... 11
2Contents SLVU802–October 2012
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List of Figures
1-1. TPS8269xEVM Schematic................................................................................................. 5
3-1. Hardware Board Connection .............................................................................................. 7
4-1. VIN = 3.6 V, VOUT = 2.85 V, IOUT = 400 mA 80-mW Power Dissipation at Room Temperature..................... 8
4-2. VIN = 3.6 V, VOUT = 2.85 V, IOUT = 800 mA 330-mW Power Dissipation at Room Temperature.................... 8
5-1. TPS8269xEVM Component Placement.................................................................................. 9
5-2. TPS8269xEVM Top Layer................................................................................................. 9
5-3. TPS8269xEVM Internal Layer 1......................................................................................... 10
5-4. TPS8269xEVM Internal Layer 2......................................................................................... 10
5-5. TPS8269xEVM Bottom Layer............................................................................................ 10
List of Tables
0-1. Ordering Information........................................................................................................ 4
A-1. TPS8269xEVM-207 Bill of Materials.................................................................................... 11
A-2. Marking Information....................................................................................................... 11
3
SLVU802–October 2012 List of Figures
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This user’s guide describes the characteristics, operation, and use of the TPS8269xEVM-207 evaluation
module (EVM). The TPS8269xEVM-207 is a fully assembled and tested platform for evaluating the
performance of the TPS8269xSIP high-frequency, synchronous, step-down DC-DC converters optimized
for battery-powered portable applications. This document includes schematic diagrams, a printed circuit
board (PCB) layout, bill of materials, and test data. Throughout this document, the abbreviations EVM and
TPS8269xEVM and the term evaluation module are synonymous with the TPS8269xEVM-207 unless
otherwise noted.
0.1 Introduction
The TPS8269xSIP device family is a high-frequency, synchronous, step-down DC-DC converters
optimized for battery-powered portable applications. Intended for low-power applications, the
TPS8269xSIP supports up to 500mA or 800mA and all TPS8269xSIP devices allow the use of low-cost
chip inductors and capacitors. With a wide input voltage range of 2.3 V to 4.8 V, the devices support
applications powered by lithium-ion (Li-Ion) batteries with extended voltage ranges. Different fixed voltage
output versions of the TPS8269xSIP are available. These converters operate at a regulated 3-MHz
switching frequency and enter a power-save mode operation under light load currents in order to maintain
high efficiency over the entire load current range. A pulse frequency modulation (PFM) mode extends the
battery life by reducing the quiescent current to 23 μA (typ) during light load operation.
0.1.1 Features
• Input Voltage Range: 2.3 V up to 4.8 V
• Fixed Output Voltages
• Up to 800-mA Output Current
• Sub 1-mm Profile Solution
• 3-MHz Regulated Frequency Operation
• Current Overload and Thermal Shutdown (Optional)
• Total Solution Size: < 6.7 mm2
• Low Ripple Light-Load PFM Mode
0.1.2 Applications
• LDO Replacement
• Cell Phones, Smart-Phones
• PoL Applications
0.1.3 EVM Ordering Options
Table 0-1 provides the ordering information for the various EVM options.
Table 0-1. Ordering Information
Orderable EVM Number Device Part Number Output Voltage Maximum Output Current
TPS82693EVM-207 TPS82693 2.85 V 800 mA
All trademarks are the property of their respective owners.
4List of Tables SLVU802–October 2012
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1
3
2
1
3
1
1 1 1
S-
S+
MODE
PWM
OFF
ENABLE
1
GND
S-
GND
PSM
ON
2
1
S+
VOUT
See BOM for IC usage
Not Installed
VIN
2.3V to 4.8V
Refer to device datasheet
for Output Voltage
1
1
1
1
J3
J1
1JP2
J6
J4
J2
+
C1
R1
C3 C4
FB2
C7
C6
R2
J5
FB1 A2 VIN
VIN
B1 MODE
B2 EN C1
GND
C2
GND
C3
GND
A1
VOUT
U1
TPS8269xSIP
1JP1
C2 C5
C8
J8
VIN
VIN
VIN
VIN
VOUT
VOUT
A3
J7
Chapter 1
SLVU802–October 2012
TPS8269xEVM Schematic
Figure 1-1 illustrates the TPS8269xEVM-207 schematic.
NOTE: For reference only; see Table A-1 for specific values.
Figure 1-1. TPS8269xEVM Schematic
5
SLVU802–October 2012 TPS8269xEVM Schematic
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Chapter 2
SLVU802–October 2012
Connector and Test Point Descriptions
2.1 Input / Output Connectors: TPS8269xEVM
2.1.1 J1 VIN
This header is the positive connection to the input power supply. The power supply must be connected
between J1 and J3 (GND). The leads to the input supply should be twisted and kept as short as possible.
The input voltage must be between 2.3 V and 4.8 V.
2.1.2 J2 S+ / S–
J2 S+ / S– are the sense connection for the input of the converter. Connect a voltmeter, sense connection
of a power supply, or oscilloscope to this header.
2.1.3 J3 GND
This header is the return connection to the input power supply. Connect the power supply between J3 and
J1 (VIN). The leads to the input supply should be twisted and kept as short as possible. The input voltage
must be between 2.3 V and 4.8 V.
Capacitor C1 compensates for parasitic inductance as a result of the wires from the DC power supply to
the EVM. It is not required in an actual application circuit.
2.1.4 J4 VOUT
This header is the positive output of the step-down converter. The TPS8269x has fixed output voltages;
refer to the specific device data sheet for detailed information on the device output voltage.
2.1.5 J5 S+ / S–
J5 S+ / S– are the sense connection for the output of the converter. Connect a voltmeter, sense
connection of an electronic load, or oscilloscope to this header.
2.1.6 J6 GND
J6 is the return connection of the converter. A load can be connected between J6 and J4 (VOUT).
2.2 Jumpers and Switches
2.2.1 JP1 ENABLE
This jumper can enable or disable the converter on the EVM. Placing a shorting bar between ENABLE
and ON turns on the converter. Placing a shorting bar between ENABLE and OFF disables the converter.
2.2.2 JP2 MODE
This jumper can enable or disable the power-saving mode (PSM) under light loads. Placing a shorting bar
between MODE and pulse width modulation (PWM) disables the PSM. If the PSM is disabled, the
converter operates in forced PWM mode over the entire load current range.
Placing a shorting bar between MODE and PSM enables the power-saving mode. The device operates in
power-saving mode under light load conditions. See the specific device data sheet for detailed information.
6Connector and Test Point Descriptions SLVU802–October 2012
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J1
J4
J2
J5
J3
J6
JP2
PWM
MODE
PSM
JP1
ON
EN
OFF
GND
VIN
VOUT
GND
S-
+
S+
S+
-S-
TPS82693EVM-207
DC
Power Supply Load
Oscilloscope
J7
-
+
Chapter 3
SLVU802–October 2012
Test Configuration
3.1 Hardware Setup
Figure 3-1 illustrates a typical hardware test configuration.
Figure 3-1. Hardware Board Connection
3.2 Procedure
Follow these procedures when configuring the EVM for testing.
CAUTION
Many of the components on the TPS8269xEVM-207 are susceptible to damage
by electrostatic discharge (ESD). Customers are advised to observe proper
ESD handling precautions when unpacking and handling the EVM, including
the use of a grounded wrist strap, bootstraps, or mats at an approved ESD
workstation. An electrostatic smock and safety glasses should also be worn.
• Work at an ESD workstation. Make sure that any wrist straps, bootstraps, or mats are connected and
reference the user to earth ground before power is applied to the EVM. Electrostatic smocks and
safety glasses should also be worn.
• Connect a DC power supply between J1 and J3 on the TPS8269xEVM. Note that the input voltage
should range from 2.3 V to 4.8 V. Keep the wires from the input power supply to EVM as short as
possible and twisted.
• Connect a DC voltmeter or oscilloscope to the output sense connection of the EVM.
• A load can be connected between J4 and J6 on the TPS8269xEVM.
• To enable the converter, connect the shorting bar on JP1 between ENABLE and ON on the
TPS8269xEVM.
• The TPS8269xEVM has a feature that allows users to switch between PSM under light loads and
forced PWM mode, with jumper JP2.
7
SLVU802–October 2012 Test Configuration
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T = 38°C
PWB T = 53 C
inductor °
T = 39 C
capacitor °
T = 41 C
capacitor °
T = 27°C
PWB T = 33 C
inductor °
T = 30 C
capacitor °
T = 30 C
capacitor °
Chapter 4
SLVU802–October 2012
TPS8269xEVM Test Data
This section presents typical performance data for the TPS8269xEVM. Actual performance data can be
affected by measurement techniques and environmental variables; therefore, these results are presented
for reference and may differ from actual results obtained by some users.
4.1 Thermal Performance
Figure 4-1 and Figure 4-2 show the typical thermal performance for the TPS82693 for two load scenarios,
respectively.
4.1.1 Thermal Measurement TPS82693 , IOUT = 400 mA
Figure 4-1. VIN = 3.6 V, VOUT = 2.85 V, IOUT = 400 mA
80-mW Power Dissipation at Room Temperature
4.1.2 Thermal Measurement TPS82693 , IOUT = 800 mA
Figure 4-2. VIN = 3.6 V, VOUT = 2.85 V, IOUT = 800 mA
330-mW Power Dissipation at Room Temperature
8TPS8269xEVM Test Data SLVU802–October 2012
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Chapter 5
SLVU802–October 2012
TPS8269xEVM Assembly Drawings and Layout
Figure 5-1 through Figure 5-5 show the design of the show the design of the TPS8269xEVM-207 printed
circuit boards. The EVM was designed using a four-layer, 1-ounce copper-clad PCB with all components
in an active area on the top side of the board. Moving components to both sides of the PCB or using
additional internal layers can offer additional size reduction for space-constrained systems.
NOTE: Board layouts are not to scale. These figures are intended to show how the board is laid out;
they are not intended to be used for manufacturing TPS8269xEVM-207 PCBs.
Figure 5-1. TPS8269xEVM Component Placement
Figure 5-2. TPS8269xEVM Top Layer
9
SLVU802–October 2012 TPS8269xEVM Assembly Drawings and Layout
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Figure 5-3. TPS8269xEVM Internal Layer 1
Figure 5-4. TPS8269xEVM Internal Layer 2
Figure 5-5. TPS8269xEVM Bottom Layer
10 TPS8269xEVM Assembly Drawings and Layout SLVU802–October 2012
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