Texas Instruments TPS274C65CP User manual

EVM User's Guide: TPS274C65CPEVM
TPS274C65CP Evaluation Module
Description
The Texas Instruments TPS274C65CPEVM is an
evaluation module that is used to demonstrate and
showcase all of the features of the underlying
TPS274C65 industrial high side switch. This
evaluation board provides a seamless way to connect
a set of power supplies to the inputs of the
TPS274C65, connect loads to the output channels,
and switch on and off the device using the control
pins of the chip itself, and easily assert and deassert
logic signals by the use of a set of external
hardware jumpers.. An on-board 3.3-V buck-converter
is included on the EVM to allow for external VDD.
Features
• On-board 3.3-V buck-converter allowing for
external VDD and lower device Iq
• Operating voltage 12 V-36 V
• Programmable current limit with external resistor
• Operating free-air temperature: –40 to 125°C
Applications
•Industrial PLC systems
–Digital output modules
– IOLink ports
– Sensor supplies
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1 Evaluation Module Overview
1.1 Introduction
The TPS274C65CP evaluation module is designed to evaluate the full performance and functionality of the
TPS274C65 high side switch. The TPS274C65CP evaluation module allows the user to isolate the TPS27465
before designing into a larger power system. The TPS274C65CPEVM is compatible with the CP version of
TPS274C65.
This user's guide provides the connectors and test point description, the schematic, bill of materials, and board
layout of the EVM.
Caution
Hot surface
Contact can cause burns
Do not touch!
1.2 Kit Contents
Kit Contents lists the contents of the EVM kit. Contact the Texas Instruments Product Information Center nearest
if any component is missing.
Table 1-1. Kit Contents
Item Quantity
TPS274C65CPEVM 1
1.3 Specification
This EVM is compatible with the TPS27C65CP device. There are other device versions for the TPS27C65 which
can be tested using the TPS27C65EVM. Table 1-2 shows the comparison across different device versions.
Please note that TPS274C65CPEVM supports version CP.
Table 1-2. Device Comparison Table
Device Version Part Number Interface
Reverse
Current
Blocking (RCB)
Integrated LED
Driver Integrated ADC Fault Diagnosis
CP TPS274C65CP GPIO Yes No No Per channel fault output
AS TPS274C65AS SPI Yes Yes Yes Global fault output and
single channel information
available through SPI
BS TPS274C65BS SPI No No No Global fault output and
single channel information
available through SPI
1.4 Device Information
The TPS274C65CP device is a quad-channel smart high-side switch designed to meet the requirements of
industrial control systems. Low 65 mΩ RDSON minimizes device power dissipation even when providing large
output load current. The device integrates protection and diagnostic features to verify system protection even
during harmful events, such as short circuits or load failures. The device protects against faults through a reliable
current limit, which is adjustable from 300 mA to 1.9 A to provide protection regardless of output load current.
The TPS274C65CP has an internal regulator to create voltage for internal rails. Additionally, a VDD pin is
provided to allow the use of external VDD supply, which needs be derived from the VS to reduce the power
dissipation. The comprehensive fault reporting include a dedicated VS_FLT pin to indicate the VS undervoltage,
and separate fault pin STx to indicate the faults happening in each channel. The TPS274C65CP is available in a
small 6 mm × 6 mm QFN package with 0.5 mm pin pitch, which minimizes PCB footprint.
Part Number Package Body Size (nom)
TPS274C65CP QFN (40) 6 mm × 6 mm
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2 Hardware
2.1 Jumper Information
Table 2-1 shows the relevant configuration jumpers of the TPS274C65CPEVM as well as the associated values.
Please refer to the TPS274C65CP data sheet for detailed information on the functionality of each pin.
Note
If the ground network is used (J12 unpopulated), then an external VDD needs to be used at a voltage
greater than 4 V due to the ground shift and minimum VDD undervoltage lockout threshold.
Note
Please note that a white mark on the jumper silkscreen is reflecting the position 1 of the jumper.
Table 2-1. Jumper Configurations
Jumper Function/Settings
J10 Connect to pull the REG_EN signal low.
J11
Connect to use the external 3.3V rail generated by the on-board buck converter to power the VDD of the
device. Connecting this jumper lowers the quiescent current used by the device in comparison to when the
internal VDD is used.
J12 Connect to override.
the ground network and connect IC ground to module ground.
J13 Connect 1 and 2 to power EN1 with VDD Connect 2 and 3 to pull EN1 low.
J14 Connect 1 and 2 to power EN2 with VDD Connect 2 and 3 to pull EN2 low.
J15 Connect 1 and 2 to power EN3 with VDD Connect 2 and 3 to pull EN3 low.
J16 Connect 1 and 2 to power EN4 with VDD Connect 2 and 3 to pull EN4 low.
J17 Connect 1 and 2 to pull LATCH HI to configure the device in latch (on fault) mode Connect 2 and 3 to pull
LATCH LO to configure device in auto-retry on fault.
J18 Connect 1 and 2 to pull DIAG_EN HI to enable diagnostic reporting Connect 2 and 3 to disable.
Diagnostic reporting.
Please refer to Table 2-2 for ILIM DIP switch configuration.
Table 2-2. ILIM DIP Switch Configurations
DIP Switch Position Resistor Value ILIM
Threshold typ
(A)
1 110 kΩ 1.9
2 78.7 kΩ 1.6
3 59 kΩ 1.25
4 44.2 kΩ 1
5 31.6 kΩ 0.72
6 23.7 kΩ 0.56
7 17.8 kΩ 0.4
8 13.3 kΩ 0.25
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2.2 Test Points
Table 2-3 shows the test points populated on the board as well as the signal connectors.
Table 2-3. Connections and Test Points
Connector and Test Point Description
J2, TP1 Supply Voltage VS.
J3, TP2 VDD voltage. Connect a supply if internal VDD is not used.
J4, TP3 Output voltage 1 (VOUT1).
J6, TP7 Output voltage 2 (VOUT2).
J7, TP9 Output voltage 3 (VOUT3).
J8, TP13 Output voltage 4 (VOUT4).
TP4, TP5, TP6, TP8, TP10, TP15,
TP25, TP26, TP26, TP28, J5, J9 Ground.
TP11 ST1 Signal.
TP12 ST2 Signal.
TP17 ST3 Signal.
TP18 ST4 Signal.
TP14 REG_EN Signal.
TP16 DIA_EN Signal.
TP19 Latch Signal.
TP24 FAULT Signal.
TP20 EN1 Signal.
TP21 EN2 Signal.
TP22 EN3 Signal.
TP23 EN4 Signal.
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3 Hardware Design Files
3.1 Schematics
Figure 3-1. TPS274C65CPEVM Schematic
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3.2 PCB Layouts
Figure 3-2. 3D Representation
Figure 3-3. Top Layer
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Figure 3-4. Ground Layer
Figure 3-5. Power Layer
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Figure 3-6. Bottom Layer
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3.3 Bill of Materials (BOM)
Table 3-1. Bill of Materials
Designator Value Description Package Reference Part Number Manufacturer
C1 0.1uF CAP, CERM, 0.1 uF, 50 V, +/-
10%, X7R, 0603 0603 C1608X7R1H104K080AA TDK
C2 0.1uF CAP, CERM, 0.1 uF, 100 V, +/-
10%, X7R, 0805 0805 C0805C104K1RACTU Kemet
C3 2.2uF CAP, CERM, 2.2 uF, 100 V, +/-
10%, X7R, 1210 1210 C1210C225K1RACTU Kemet
C4, C5 22uF CAP, CERM, 22 uF, 10 V, +/-
10%, X7R, 1206 1206 GRM31CR71A226KE15L MuRata
C6 1uF CAP, CERM, 1 uF, 100 V, +/-
10%, X7R, 1210 1210 C3225X7R2A105K200AA TDK
C7 2.2uF
CAP, CERM, 2.2 uF, 50 V, +/-
10%, X7R, AEC-Q200 Grade
1, 0805
0805 CGA4J3X7R1H225K125AB TDK
C8 4700 pF
CAP, CERM, 4700 pF, 100
V, +/- 10%, X7R, AEC-Q200
Grade 1, 0603
0603 CGA3E2X7R2A472K080AA TDK
C9 0.1uF
CAP, CERM, 0.1 uF, 100 V,+/-
10%, X7R, AEC-Q200 Grade
1, 0603
0603 GCJ188R72A104KA01D MuRata
C10, C11, C12,
C13 0.022uF
CAP, CERM, 0.022 uF, 100
V, +/- 10%, X7R, AEC-Q200
Grade 1, 0603
0603 CGA3E2X7R2A223K080AA TDK
D1, D3 200 V Diode, Switching, 200 V, 0.2 A,
SOT-23 SOT-23 BAS21-7-F Diodes Inc.
D2 36 V Diode, TVS, Uni, 36 V, 58.1
Vc, SMB SMB SMBJ36A-13-F Diodes Inc.
H1, H2, H3, H4 Machine Screw, Round, #4-40
x 1/4, Nylon, Philips panhead Screw NY PMS 440 0025 PH B&F Fastener Supply
H5, H6, H7, H8 Standoff, Hex, 0.5"L #4-40
Nylon Standoff 1902C Keystone
J1, J13, J14,
J15, J16, J17,
J18
Header, 2.54mm, 3x1, Gold,
TH
Header, 2.54mm,
3x1, TH HMTSW-103-07-G-S-240 Samtec
J2, J3, J4, J6,
J7, J8
Standard Banana Jack,
insulated, 10 A, red 571-0500 571-0500 DEM Manufacturing
J5, J9 Standard Banana Jack,
insulated, 10 A, black 571-0100 571-0100 DEM Manufacturing
J10, J11, J12 Header, 100mil, 2x1, Gold, TH Header, 2.54mm,
2x1, TH HMTSW-102-07-G-S-240 Samtec
L1 15uH
Inductor, Shielded Drum Core,
Ferrite, 15 uH, 1.1 A, 0.08
ohm, SMD
SMD, 2-Leads,
Body 6.8x6.8mm 744062150 Wurth Elektronik
R1, R2, R7, R8,
R15, R26 4.7k RES, 4.7 k, 5%, 0.1 W, AEC- Q200 Grade 0, 0603 0603 ERJ-3GEYJ472V Panasonic
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Table 3-1. Bill of Materials (continued)
Designator Value Description Package Reference Part Number Manufacturer
R3, R4, R5, R6,
R9, R10, R11,
R12, R13, R14,
R16, R17
7.50k RES, 7.50 k, 1%, 0.1 W, 0603 0603 ERJ-3EKF7501V Panasonic
R18 13.3k RES, 13.3 k, 1%, 0.1 W, AEC-
Q200 Grade 0, 0402 0402 ERJ-2RKF1332X Panasonic
R19 17.8k RES, 17.8 k, 1%, 0.063 W,
AEC-Q200 Grade 0, 0402 0402 CRCW040217K8FKED Vishay-Dale
R20 23.7k RES, 23.7 k, 1%, 0.1 W, AEC-
Q200 Grade 0, 0402 0402 ERJ-2RKF2372X Panasonic
R21 31.6k RES, 31.6 k, 1%, 0.063 W,
AEC-Q200 Grade 0, 0402 0402 CRCW040231K6FKED Vishay-Dale
R22 44.2k RES, 44.2 k, 1%, 0.063 W,
AEC-Q200 Grade 0, 0402 0402 CRCW040244K2FKED Vishay-Dale
R23 59.0k RES, 59.0 k, 1%, 0.063 W,
AEC-Q200 Grade 0, 0402 0402 CRCW040259K0FKED Vishay-Dale
R24 78.7k RES, 78.7 k, 1%, 0.063 W,
AEC-Q200 Grade 0, 0402 0402 CRCW040278K7FKED Vishay-Dale
R25 110k RES, 110 k, 1%, 0.063 W,
AEC-Q200 Grade 0, 0402 0402 CRCW0402110KFKED Vishay-Dale
SH-J1, SH-J2,
SH-J3, SH-J4,
SH-J5, SH-J6,
SH-J7, SH-J8,
SH-J9, SH-J10
1x2 Shunt, 100mil, Gold plated,
Black Shunt SNT-100-BK-G Samtec
SW1
Dip Switch SPST 8 Position
Through Hole Slide (Standard)
Actuator 10 mA 5VDC
DIP8 STV08 TE Connectivity
TP1, TP2, TP3,
TP7, TP9, TP13
Test Point, Multipurpose, Red,
TH
Red Multipurpose
Testpoint 5010 Keystone Electronics
TP4, TP5, TP6,
TP8, TP10,
TP15, TP25,
TP26, TP27,
TP28
Test Point, Multipurpose,
Black, TH
Black Multipurpose
Testpoint 5011 Keystone Electronics
TP11, TP12,
TP14, TP16,
TP17, TP18,
TP19, TP20,
TP21, TP22,
TP23, TP24
Test Point, Multipurpose,
Green, TH
Green Multipurpose
Testpoint 5126 Keystone Electronics
U1
LMR36503/06-Q1 Wide Input
60-V Synchronous, DC-DC
Buck Converter, RPE0009A
(VQFN-9)
RPE0009A LMR36506R3RPET Texas Instruments
U2
65-mΩ Quad-Channel Smart
High-Side Switch with
Diagnostics
VQFN40 TPS274C65CPWRHAR Texas Instruments
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