Texas Instruments TS3A227E User manual

User's Guide
SLVUAD9–December 2014
TS3A227E EVM User's Guide
This document is the EVM user guide for the TS3A227E-EVM which provides an easy evaluation of TI's
autonomous audio jack switch with integrated key-press detection and power off noise removal.
spacer
Contents
1 About this Manual............................................................................................................ 2
2 Information About Cautions and Warnings............................................................................... 2
3 Introduction ................................................................................................................... 3
3.1 Hardware Items for Operation..................................................................................... 3
4 TS3A227E-EVM Connections Overview ................................................................................. 4
4.1 TS3A227E Design Under Test (DUT)............................................................................ 4
4.2 Power................................................................................................................. 5
4.3 Test Points........................................................................................................... 6
4.4 Translator ............................................................................................................ 6
4.5 On-Board MICBIAS Output........................................................................................ 7
4.6 Key-Press Matrix.................................................................................................... 7
4.7 External CODEC Interface......................................................................................... 8
5 LaunchPad Setup ........................................................................................................... 9
6 Installing the GUI........................................................................................................... 11
7 Using the GUI............................................................................................................... 12
7.1 Connecting the LaunchPad to the EVM and PC.............................................................. 12
7.2 GUI Area Descriptions and Use................................................................................. 14
7.3 GUI Operation ..................................................................................................... 16
7.4 Using the TS3A227E to Develop a Headset................................................................... 17
7.5 Power Off Noise Removal Evaluation .......................................................................... 18
7.6 Slow Plug-In Issue ................................................................................................ 18
8 Board Documentation...................................................................................................... 19
8.1 Schematic .......................................................................................................... 19
8.2 Bill of Materials .................................................................................................... 20
8.3 PCB Layout ........................................................................................................ 22
9 Related Documentation.................................................................................................... 25
List of Figures
1 TS3A227E-EVM Block Diagram........................................................................................... 3
2 Connector to TS3A227E.................................................................................................... 4
3 Power Connections ......................................................................................................... 5
4 Breakout Test Point Headers .............................................................................................. 6
5 Translator ..................................................................................................................... 6
6 On-Board MICBIAS Output................................................................................................. 7
7 Key Press Schematic........................................................................................................ 7
8 External CODEC Interface.................................................................................................. 8
9 LaunchPad Header Connections .......................................................................................... 9
10 LaunchPad J5 Header Connections ...................................................................................... 9
11 LaunchPad LED Indicators................................................................................................ 10
LaunchPad, Code Composer Studio are trademarks of Texas Instruments.
1
SLVUAD9–December 2014 TS3A227E EVM User's Guide
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

ATTENTION
STATIC SENSITIVE DEVICES
HANDLE ONLY AT
STATIC SAFE WORK STATIONS
About this Manual www.ti.com
12 Application Install - Security Warning Window ......................................................................... 11
13 TS3A227E-EVM GUI Window............................................................................................ 11
14 COM PORT Detection Error Window.................................................................................... 12
15 LaunchPad to EVM Connection.......................................................................................... 12
16 LaunchPad LED Indicators................................................................................................ 13
17 TS3A227E-EVM GUI ...................................................................................................... 14
18 TS3A227E-EVM GUI Details ............................................................................................. 15
19 MSP430 LaunchPad Warning Window.................................................................................. 16
20 EVM GUI Settings When Using On-Board Keys....................................................................... 17
21 Schematic ................................................................................................................... 19
22 Top Copper ................................................................................................................. 22
23 Ground Plane (Negative Image).......................................................................................... 23
24 Power Plane (Negative Image)........................................................................................... 24
25 Bottom Copper.............................................................................................................. 25
List of Tables
1 Default Jumper Locations................................................................................................. 13
2 Jumper Locations for On-Board Keys ................................................................................... 16
3 TS3A227E-EVM Bill of Materials......................................................................................... 20
1 About this Manual
This user’s guide describes the TS3A227E evaluation module (EVM) and its intended use. This guide
contains the EVM schematics, bill of materials, and board layer information.
2 Information About Cautions and Warnings
The information in a caution or a warning is provided for personal protection. Read each caution and
warning carefully.
CAUTION
This EVM contains components that can potentially be damaged by
electrostatic discharge. Always transport and store the EVM in its supplied ESD
bag when not in use. Handle using an antistatic wristband. Operate on an
antistatic work surface. For more information on proper handling, see the
Electrostatic Discharge (ESD) application note (SSYA008).
2TS3A227E EVM User's Guide SLVUAD9–December 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

TS3A227E
TS3A227E Jack
Codec Jack Ring1
RING2
MSP40 LaunchPad
Adjustable
LDO
VDD
VCC
2.2 k
VCC
3.6 V
Translator
VCCB VCCA
TIP
/DET_TRIGGER
RING2_SENSE
SLEEVE
SLEEVE_SENSE
SDA
SCL
/MIC_PRESENT
/INT
MICP
GND_SENSE
GNDA
GND
VDDIO
KP Demo Buttons
www.ti.com Introduction
3 Introduction
The TS3A227E-EVM is an evaluation module for TI's autonomous audio jack switch with integrated key-
press detection and power off noise removal. Designed to interact with the audio jack, the device
automatically detects the presence of 3- or 4-pole audio accessories and also features an integrated
switch matrix for automatic routing of the MICBIAS, codec ground sense, and ground connections.
The device also incorporates a high-resolution ADC for distinguishing from up to four keys in the default
mode. Additionally, the TS3A227E features the ability for on-the-fly key-press bin adjustment and a raw
ADC output mode to add the ability for the system to define non-standard key-press bins, as desired.
The evaluation board is designed both as a demonstration and development board by using the MSP430
LaunchPad™ as a base platform for interacting with the device. There is an example firmware stack and
GUI provided with the EVM. Figure 1 is a block diagram of the EVM structure.
Figure 1. TS3A227E-EVM Block Diagram
3.1 Hardware Items for Operation
The following items are required for EVM evaluation:
• TS3A227E-EVM
• MSP-EXP430G2 LaunchPad Rev 1.5
• MSP430G2553
• USB cable
The following items are optional for EVM evaluation:
• 4-pole headset
• 3-pole headset
• Code Composer Studio™ (CCS)
• Visual Studio 2012
3
SLVUAD9–December 2014 TS3A227E EVM User's Guide
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

/INT
SCL
SDA
GND
VDDIO
MICP
1µF
C1
0.1µF
C2
GND
/MIC_PRESENT
4.7k
R6
4.7k
R5
4.7k
R4
4.7k
R3
VDD
RING1
TIP
TIP
/DET_TRIGGER
RING2
SLEEVE
Connector to TS3A227E
Q1
GND
VDD
10k
R7
10k
R8
GND
TIP
RING1
RING2
SLEEVE
330k
R2
GND 1
GND 2
SDA
3
VDD
4
GND_SENSE
5
MICP
6
RING2_SENSE 7
SLEEVE_SENSE 8
SCL
9
SLEEVE 10
GNDA 11
RING2 12
INT
13
TIP 14
DET_TRIGGER 15
MIC_PRESENT
16
PAD 17
U1
TS3A227ERVA
5
3
2
1
4
J4
GND_SENSE
TS3A227E-EVM Connections Overview www.ti.com
4 TS3A227E-EVM Connections Overview
This section contains information about TS3A227E-EVM design under test, power, test points, translator,
on-board MICBIAS output, key-press matrix, and external codec interface.
4.1 TS3A227E Design Under Test (DUT)
The TS3A227E audio lines are connected to audio jack J4. Plug a headset into audio jack J4 for testing.
The audio jack used on the EVM is normally a closed jack that has the wrong transition polarity for an
insertion event (low to high). The DET_TRIGGER pin has an internal 1-MΩresistor and Q1 is used to
invert the polarity of the insertion event and create a high-to-low transition.
The supply voltage for the TS3A227E is VDD and the digital IO lines are pulled up to VDDIO.
Figure 2. Connector to TS3A227E
4TS3A227E EVM User's Guide SLVUAD9–December 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

VDD input range is 2.5 V to 4.5 V
VDDIO can be separate supply for GPIO pins
VDDIO input range is 1.8 V to VDD
J3 is used to select between a separate VDDIO voltage and
the MSP430 supply being used to power the board
VCC
GND
VCC
J1 VCC
VCC VDD
VCC is the MSP430 supply to the board.
J_VDD can be used to connect the MSP430 supply to the TS3A227E
VDDIO
Blue
D1
1.50k
R1
1
2
3
J3
1 2
J2
J5
www.ti.com TS3A227E-EVM Connections Overview
4.2 Power
The TS3A227E-EVM derives its power from the LaunchPad. The EVM board power is labeled VCC in the
schematic and the power supplied to the TS3A227E is labeled VDD. Header connection explanations
follow:
• Header J1 provides a point to check VCC or to provide the board power if the LaunchPad is not being
used.
• Header J2 provides a means to power the TS3A227E from the board power. Populate this jumper to
connect VDD to VCC. If external power is being applied to the TS3A227E, remove this jumper.
• The blue diode D1 lights up when board power is applied.
• J3 selects the digital IO pull-up voltage. By shorting pins 1 and 2, the digital IO lines are pulled up to
the board supply voltage. Shorting pins 2 and 3 allows an external pull-up voltage to be used (such as
1.8 V) from J5.
• J5 provides a connection for supplying an external IO voltage.
Figure 3. Power Connections
5
SLVUAD9–December 2014 TS3A227E EVM User's Guide
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

1µF
C5
0.1µF
C6
GNDGND
GND
1µF
C3
0.1µF
C4
GND 1
VREF_A
2
A1
3
A2
4
A3
5
A4
6
A5
7
A6
8
A7
9
A8
10 B8 11
B7 12
B6 13
B5 14
B4 15
B3 16
B2 17
B1 18
VREF_B 19
EN 20
U3
LSF0108PW
200k
R15
SDA
/INT
/MIC_PRESENT
MSP430_/INT
MSP430_/MIC_PRESENT
MSP430_SDA
MSP430_SCL
VCC
4.7k
R16
4.7k
R17
4.7k
R18
4.7k
R19
VDDIO
SCL
1 2
3 4
5 6
7 8
J27
/MIC_PRESENT
SDA
SCL
/INT
RING1
TIP
MICP
SLEEVE
RING2
1
2
3
J17
1
2
3
J14
/DET_TRIGGER
GND_SENSE
VDD
J9
J8
J7
J11
J13
J6
TS3A227E-EVM Connections Overview www.ti.com
4.3 Test Points
The headers in Figure 4 provide breakout test points on the EVM for connecting to external hosts and
systems.
Figure 4. Breakout Test Point Headers
4.4 Translator
Because the TS3A227E VDDIO supply can vary from 1.8 V to 4.5 V, a translator is needed to translate
the VDDIO voltage domain to the LaunchPad 3.6-V domain. U3 provides this functionality.
If the LaunchPad is not used, remove the jumpers on J27.
Figure 5. Translator
6TS3A227E EVM User's Guide SLVUAD9–December 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

41 32
Key1
41 32
Key2
41 32
Key3
41 32
Key4
SLEEVE
R9
DNP
RING2
1
2
MK1
2.2kohm
1.0
R10
143
R11
270
R12
590
R13
1 2
J15
1 2
J20
1
2
J16
GND
2.8 V: R1 = 1.07M
2.5 V: R1 = 866k
2.2 V: R1 = 673k
Feeback Loop Resistors
Vout = (Vref) * (1 + (R1/R2))
Vref = 1.20 V R2= 1M
FB 1 NC
3
IN
4OUT 5
2
GND
U2
TPS71401DCKT
GND
R20
DNP
806k
R24
1.07M
R21
866k
R22
GND
GND GND
33µF
C10
2.2µF
C9
VCC
1µF
C7
0.1µF
C8 2.20k
R14 MICP
680k
R23
12 34 56 78
J22
1 2
J24
www.ti.com TS3A227E-EVM Connections Overview
4.5 On-Board MICBIAS Output
U2 provides the following MICBIAS outputs by moving the jumper position on J22 and shorting different
sets of pins. The EVM also has a spare 0603 resistor and jumper position if a different MICBIAS voltage is
desired.
• Pins 7–8 →2.2 V
• Pins 5–6 →2.5 V
• Pins 3–4 →2.8 V
• Pins 1–2 →user-populated resistor
Figure 6. On-Board MICBIAS Output
4.6 Key-Press Matrix
The TS3A227E EVM features on-board keys for quick evaluation of the key press functionality. Setting up
the EVM for key press is discussed in Section 7.3.1. By placing a jumper on both headers J15 and J20,
the matrix is attached to the TS3A227E SLEEVE and RING2 pins allowing the keys to be used.
The on-board microphone is used to simulate a headset microphone in parallel with the keys and can be
disconnected by removing the jumper on J16. R9 is not populated to allow for headset manufacturers to
develop key resistances that fall accurately into the buckets.
Figure 7. Key Press Schematic
7
SLVUAD9–December 2014 TS3A227E EVM User's Guide
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

RING1
TIP
GND
MICP
5
3
2
1
4
J10
1 2
3 4
J12
TS3A227E-EVM Connections Overview www.ti.com
4.7 External CODEC Interface
J10 provides a means to connect an external codec to the TS3A227E-EVM through a 3.5-mm jack. J12 is
provided to switch the microphone and ground of the EVM between the SLEEVE and RING2 pins.
Shorting pins 1-2 and pins 3-4 connects MICP to RING2 and SLEEVE to ground. Shorting pins 2–4 and
1–3 connects MICP to SLEEVE and RING2 to ground.
Figure 8. External CODEC Interface
8TS3A227E EVM User's Guide SLVUAD9–December 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com LaunchPad Setup
5 LaunchPad Setup
Use the following steps to set up the LaunchPad:
1. With the LaunchPad unplugged, configure the headers on the LaunchPad to match the yellow box in
Figure 9.
The right 3 headers are vertical and the left are horizontal.
Figure 9. LaunchPad Header Connections
2. With the LaunchPad still unplugged, remove the right-most jumper on the J5 header to match the
yellow box in Figure 10.
Figure 10. LaunchPad J5 Header Connections
3. Connect the LaunchPad to a computer with a USB-to-mini cable. A green LED and a red LED now turn
on as shown in Figure 11.
9
SLVUAD9–December 2014 TS3A227E EVM User's Guide
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

LaunchPad Setup www.ti.com
Figure 11. LaunchPad LED Indicators
This is sufficient to setup the LaunchPad to interact with the EVM. If using CCS to do firmware
development, continue the following steps:
4. Download Code Composer Studio.
5. Extract the TS3A227E_GUI_Fimware.zip to any folder.
Example: C:\Users\USER\Documents \TS3A227E
6. Open Code Composer Studio and create a new workspace. Select the Project drop-down menu and
click on Import existing CCS/CCE Eclipse Project. Select Browse on the Select-search directory option
and select the location where the source code is stored. Click the Finish button and select debug
launch to load the code to the MSP430G2553 microcontroller. Once completed, disconnect the USB
cable from the LaunchPad.
7. CCS can also be used as a firmware development/experimentation platform and the EVM/GUI will
work while using the debugging functionality of Code Composer Studio.
8. If the LaunchPad is running and the TS3A227E-EVM daughter board is disconnected, the I2C
communication fails. Pause the debugger, reset the MSP430, and then rerun the code.
10 TS3A227E EVM User's Guide SLVUAD9–December 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com Installing the GUI
6 Installing the GUI
Install the GUI using the following steps:
1. Extract the TS3A227E_GUI_Fimware.zip contents to any destination folder.
2. Double click setup.exe located in the /TS3A227E_GUI_Firmware/TS3A227E_GUI folder that was
extracted in step 1.
3. The Application Install - Security Warning window pops up. Click the Install button.
Figure 12. Application Install - Security Warning Window
4. After the installation finishes, the GUI opens. The GUI is illustrated in Figure 13.
Figure 13. TS3A227E-EVM GUI Window
If the window shown in Figure 14 appears, verify that the EVM is plugged into the PC.
11
SLVUAD9–December 2014 TS3A227E EVM User's Guide
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

Using the GUI www.ti.com
Figure 14. COM PORT Detection Error Window
5. When launching the GUI in the future, open it by double clicking the TS3A227E.application file.
7 Using the GUI
This section includes instructions for connecting the LaunchPad to the EVM and PC, GUI window
descriptions, GUI operation, headset development, power off noise removal evaluation, and slow plug-in
issues.
7.1 Connecting the LaunchPad to the EVM and PC
Use the following steps to connect the LaunchPad to the EVM and PC.
1. Connect the MSP430 LaunchPad to the EVM as shown in Figure 15. The EVM sits on top of the
LaunchPad so there is minimal overlap.
Figure 15. LaunchPad to EVM Connection
2. The jumper locations for default operation are listed in Table 1.
12 TS3A227E EVM User's Guide SLVUAD9–December 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com Using the GUI
Table 1. Default Jumper Locations
Reference Designator Jumper Locations
J2 Populated
J3 Pins 1–2
J12 Pins 1–2
Pins 3–4
J15 Not Populated
J16 Populated
J20 Not Populated
J22 Pins 7–8 only
No jumper on other pins
J24 Populated
J27 Pins 1–2
Pins 3–4
Pins 4–5
Pins 7–8
3. Connect the LaunchPad to the PC. A blue LED now lights up along with the red and green LEDs on
the LaunchPad.
Figure 16. LaunchPad LED Indicators
13
SLVUAD9–December 2014 TS3A227E EVM User's Guide
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

Using the GUI www.ti.com
7.2 GUI Area Descriptions and Use
This section describes the various sections of the GUI. Figure 17 shows the TS3A227E-EVM GUI.
Figure 17. TS3A227E-EVM GUI
• The blue section of the GUI denotes the Register Address,Register Name, and the current stored Reg
Value at that register in Hex. These fields cannot be edited and clicking them has no effect.
• The green section of the Register Map indicates Read-only registers. These values are only updated
with data from the MSP430 LaunchPad
• The red section of the Register Map indicates Read/Write registers. Clicking on any bit of these
registers not labeled Reserved toggles that bit. If Auto Write on Click is checked, clicking on a bit also
sends a command to the MSP430 to write the value entered to the TS3A227E.
– For example, if register 0x03 currently has the value 0x01 and bit 1 of that register is clicked, bit 1
toggles from a value of ‘0’ to a new value of ‘1’. The GUI then sends the new register value of 0x03
to the LaunchPad to write to the TS3A227E.
– Bits that a colored in yellow are == 1. Bits that are colored gray are == 0.
• The pink section of the GUI denotes the Read/Write buttons.
– Clicking a Read button reads the value of the corresponding register it is adjacent to (for example,
clicking the top-most Read button reads register 0x01 and updates the GUI contents).
– Clicking a Write button writes the currently shown value for the adjacent register in the GUI to the
TS3A227E.
– Clicking the Read All button reads the entire register map and also updates the pin status.
14 TS3A227E EVM User's Guide SLVUAD9–December 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com Using the GUI
Figure 18. TS3A227E-EVM GUI Details
Figure 18 highlights areas of the EVM GUI that are explained in the following:
• The orange section runs algorithms to determine the real-world values corresponding to the output of
the TS3A227E, that is, the Accessory Detection box in the top left monitors the Accessory Type
register (0x08) to determine what is attached.
• The purple section of the GUI denotes the current status of the MSP430 GPIOs, in addition to
indicating when a key is pressed:
– Green indicates an active(true) GPIO
– Gray indicates an inactive(false) GPIO
• The green section of the GUI are user input controls for the EVM:
– Un-checking Auto Write on Click disables the auto-write feature when a bit is clicked. Use the 5
Write buttons to write to the device instead of a simple click of a bit cell.
–Auto Read on /INT controls whether the firmware automatically reads the TS3A227E device
registers and sends the values back to the GUI when an Interrupt occurs. Unchecking this box
makes the firmware only update the GUI that an interrupt has occurred.
– The Flash Firmware button installs the default firmware that comes with the GUI onto the
LaunchPad without opening CCS.
15
SLVUAD9–December 2014 TS3A227E EVM User's Guide
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

Using the GUI www.ti.com
7.3 GUI Operation
The GUI automatically searches to see if the LaunchPad is connected upon startup and immediately
attempts to read the register values from the LaunchPad. If the message in Figure 19 appears, the GUI
was unable to detect the LaunchPad and starts up without reading the registers. Ensure that the
LaunchPad is connected to the PC correctly.
Figure 19. MSP430 LaunchPad Warning Window
If there are no connection issues, try unplugging the LaunchPad and plugging it back in, since windows
sometimes encounters errors with COM Ports. Try to read from the device when the LaunchPad is
plugged back in, there is no need to restart the GUI. If not connected, the GUI tries to connect every time
a read or write is attempted on the LaunchPad. This allows the LaunchPad to be unplugged without
having to close the GUI.
If Auto Write on Click is enabled and a Reserved register bit in one of the R/W registers is clicked, the GUI
does not populate that bit as a ‘1’ in the register map. The GUI still writes the existing value to the register.
If Auto Write on Click is disabled, nothing happens.
7.3.1 Using the TS3A227E-EVM On-Board Keys
Make sure nothing is inserted into the EVM jack.
1. Setup the jumpers on the EVM to the positions listed in Table 2:
Table 2. Jumper Locations for On-Board Keys
Reference Designator Jumper Location
J2 Populated
J3 Pins 1-2
J12 Not Populated
J15 Populated
J16 Populated
J20 Populated
J22 Pins 7-8 only
No jumper on other pins
J24 Populated
J27 Pins 1-2
Pins 3-4
Pins 4-5
Pins 7-8
2. Enable the following switches by clicking on the appropriate bits in the GUI:
• S3GR
• S3PS
• RING2 GNDFET
• Manual switch control
3. Enable key press by pressing the Key Press Enable bit.
4. The GUI should now appear as shown in Figure 20.
16 TS3A227E EVM User's Guide SLVUAD9–December 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com Using the GUI
Figure 20. EVM GUI Settings When Using On-Board Keys
5. Now press any of the keys and watch the various interrupts fire. The Auto Read on /INT checkbox can
be unclicked to view what occurs if the interrupt is not read after numerous key presses.
For more information on key press operation, refer to the datasheet (SCDS358).
7.4 Using the TS3A227E to Develop a Headset
If the EVM is being used to test/develop headset keys by a manufacturer, there are multiple ways to test
this:
Method One
If there is an existing headset that the manufacturer is looking to add keys to without changing the
microphone, insert the headset into audio jack J4. Place jumpers on J15 and J20 and remove the jumper
on J16. Enable key-press detection in the GUI and enable raw data mode. Enabling raw data mode shows
the exact detected resistance instead of the bin the resistor falls in.
Once setup, attach the parallel or resistor between the SLEEVE and RING2 pins, not between one of the
SLEEVE/RING2 pins and ground. The TS3A227E sees this drop in voltage on the MIC line and detects
the parallel resistance combination.
Method Two
Creating a new headset with a prototype microphone.
If the headset is in development and testing the key resistance values is needed, use the following
method:
1. Enable Manual Switch control
2. Set the S3 matrix so the ground and microphone are routed to the appropriate pin:
• S3PS →MIC on SLEEVE
• S3PR →MIC on RING2
• S3GS →ground on SLEEVE
• S3GR →ground on RING2
3. Turn on the appropriate GNDFET for the location of the ground pin.
4. Place jumpers on J15 and J20 and remove the jumper on J16.
17
SLVUAD9–December 2014 TS3A227E EVM User's Guide
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

Using the GUI www.ti.com
5. Attach the external microphone between the SLEEVE and RING2 and match the microphone ground
to the location of the ground chosen in step 3.
6. Enable Key Press Detection and Raw Data.
7. Attach the key and the GUI now reports the detected resistance.
7.5 Power Off Noise Removal Evaluation
The depletion FETs of the TS3A227E provide a ground connection when the device is unpowered,
eliminating the humming noise phenomenon associated with previous-generation audio jack switches. The
EVM provides an easy means to evaluate this performance with the following procedure:
1. Remove both jumpers from J12. This floats the ground lines of the codec audio jack J10 and simulates
what the TS3A227E would be like without the depletion FETs.
2. Insert the speakers into jack J10.
3. Turn on the speakers and turn the volume up until a humming noise appears.
4. Turn off the speakers.
5. Remove the jumper from J2. This removes power from the TS3A227E.
6. Insert the speakers into the TS3A227E audio jack J4.
7. Turn on the speakers and turn the volume up and the humming noise is no longer present.
7.6 Slow Plug-In Issue
Any system which utilizes an audio jack must overcome the slow plug-in issue to deliver a positive
end-user experience. On the TS3A227E-EVM, the audio jack follows the guideline of having the detection
mechanism on the tip pin but the mechanical structure of the jack trips too early for a standard insertion.
This causes an incorrect detection because the RING2 pin is not making contact when the detection
algorithm runs, resulting in a false OMTP detection when a 4-pole standard or 3-pole is inserted.
To remove this issue, there are two immediate options:
• Increase the insertion de-bounce period to compensate for the mechanical shortcomings of the jack:
– This option can be tested with the TS3A227E-EVM and GUI. Increase the insertion de-bounce
incrementally and observe how the detection passes. At 150 ms de-bounce, the slow plug-in issue
is eliminated.
– Conversely, the de-bounce can be reduced to observe the effects of having a shorter de-bounce.
• Change the audio jack to a better mechanical structure:
– This is the best option, by choosing a jack with the detection mechanism further inside the jack it
would ensure that the headset is fully inserted and is entirely reliant on the de-bounce
TI recommends developers that use the TS3A227E utilize the EVM test points for the audio jack pins and
connect the EVM to the audio jack that is planned for implementation. This allows the system designer to
test how the TS3A227E and the audio jack perform together and makes changes as necessary.
18 TS3A227E EVM User's Guide SLVUAD9–December 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

41 32
Key1
41 32
Key2
41 32
Key3
GND
2.8 V: R1 = 1.07M
2.5 V: R1 = 866k
2.2 V: R1 = 673k
Feeback Loop Resistors
Vout = (Vref) * (1 + (R1/R2))
Vref = 1.20 V R2= 1M
41 32
Key4
VDD input range is 2.5 V to 4.5 V
RING1
TIP
GND
/INT
SCL
SDA
GND
FB 1 NC
3
IN
4OUT 5
2
GND
U2
TPS71401DCKT
GND
R20
DNP
806k
R24
1.07M
R21
866k
R22
GND
GND GND
33µF
C10
2.2µF
C9
VDDIO
VCC
Connector to interface with Codec
SLEEVE
1µF
C7
0.1µF
C8
1µF
C5
0.1µF
C6
GND
2.20k
R14
R9
DNP
MICP
MICP
RING2
Key 1-4 resistance are calculated so that when in parallel with a 2.2 kohm mic the equivalent resistance seen by the TS3A227E is within
the bins shown above
GND
GND
1µF
C3
0.1µF
C4
1µF
C1
0.1µF
C2
GND
GND 1
VREF_A
2
A1
3
A2
4
A3
5
A4
6
A5
7
A6
8
A7
9
A8
10 B8 11
B7 12
B6 13
B5 14
B4 15
B3 16
B2 17
B1 18
VREF_B 19
EN 20
U3
LSF0108PW
200k
R15
SDA
/INT
/MIC_PRESENT
/MIC_PRESENT
MSP430_/INT
MSP430_/MIC_PRESENT
/MIC_PRESENT
SDA
SCL
/INT
MSP430_/MIC_PRESENT
MSP430_/INT
MSP430_SDA
MSP430_SCL
VCC
VCC
MSP430_SDA
MSP430_SCL
4.7k
R16
4.7k
R17
4.7k
R18
4.7k
R19
4.7k
R6
4.7k
R5
4.7k
R4
4.7k
R3
VDDIO can be separate supply for GPIO pins
VDDIO input range is 1.8 V to VDD
J3 is used to select between a separate VDDIO voltage and
the MSP430 supply being used to power the board
VCC
VDDIO
VDD
GND
VCC
J1 VCC
VCC VDD
VCC is the MSP430 supply to the board.
J_VDD can be used to connect the MSP430 supply to the TS3A227E
VDDIO
MSP430 LaunchPad Jumper connectors
RING1
TIP
TIP
/DET_TRIGGER
RING2
SLEEVE
Connector to TS3A227E
Q1
GND
VDD
RING1
TIP
10k
R7
10k
R8
GND
1
2
MK1
2.2kohm
1.0
R10
143
R11
270
R12
590
R13
J21
J23
J25
J26
GND
Blue
D1
5
4
1
2
3
6
7
8
9
10
J18
5
4
1
2
3
6
7
8
9
10
J19
TIP
RING1
RING2
SLEEVE
330k
R2
SCL
MICP
GND
MICP
GND 1
GND 2
SDA
3
VDD
4
GND_SENSE
5
MICP
6
RING2_SENSE 7
SLEEVE_SENSE 8
SCL
9
SLEEVE 10
GNDA 11
RING2 12
INT
13
TIP 14
DET_TRIGGER 15
MIC_PRESENT
16
PAD 17
U1
TS3A227ERVA
1.50k
R1
680k
R23
5
3
2
1
4
J4
5
3
2
1
4
J10
SLEEVE
RING2
1 2
3 4
5 6
7 8
J27
1
2
3
J3
12 34 56 78
J22
1 2
3 4
J12
1
2
3
J17
1
2
3
J14
/DET_TRIGGER
GND_SENSE
GND_SENSE
VDD
1 2
J15
1 2
J20
1 2
J2
1 2
J24
J9
J8
J7
J11
J13
1
2
J16
J5
J6
www.ti.com Board Documentation
8 Board Documentation
This section includes the TS3A227E-EVM schematic, BOM, and board layouts.
8.1 Schematic
Figure 21 illustrates the TS3A227E-EVM schematic.
Figure 21. Schematic
19
SLVUAD9–December 2014 TS3A227E EVM User's Guide
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

Board Documentation www.ti.com
8.2 Bill of Materials
Table 3 lists the TS3A227E-EVM BOM.
Table 3. TS3A227E-EVM Bill of Materials
Designator Quantity Value Description Package Reference Part Number Manufacturer
!PCB1 1 Printed Circuit Board HVL094 Any
C1, C3, C5, C7 4 1uF CAP, CERM, 1uF, 6.3V, +/-10%, X7R, 0603 0603 GRM188R70J105KA01D MuRata
C2, C4, C6, C8 4 0.1uF CAP, CERM, 0.1uF, 6.3V, +/-10%, X7R, 0603 0603 GRM188R70J104KA01D MuRata
C9 1 2.2uF CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0603 0603 C0603C225K8PACTU Kemet
C10 1 33uF CAP, CERM, 33uF, 6.3V, +/-20%, X5R, 1210 1210 GRM32DR60J336ME19L MuRata
D1 1 Blue LED, Blue, SMD Blue LED SMLP12BC7TT86 Rohm
J1, J5, J6, J7, J8, J9, J11, J13, 12 Header, TH, 100mil, 1pos, Gold plated, 230 mil above insulator Testpoint TSW-101-07-G-S Samtec
J21, J23, J25, J26
J2, J15, J16, J20, J24 5 Header, 100mil, 2x1, Gold with Tin Tail, SMT 2x1 Header TSM-102-01-L-SV Samtec
J3, J14, J17 3 Header, 100mil, 3x1, Gold, SMT Samtec_TSM-103-01-X-SV TSM-103-01-L-SV Samtec
J4, J10 2 Audio Jack, 3.5mm, Stereo, R/A, SMT 3.5 mm Audio Jack Connector, Body 17 SJ-43515TS-SMT-TR CUI Inc.
x 6 mm
J12 1 Header, 100mil, 2x2, Tin, SMT 2x2 100mil Tin Header 15-91-2040 Molex
J18, J19 2 Receptacle, 100mil, 10x1, Tin, TH Receptacle, 10x1, 100mil, Tin PPTC101LFBN-RC Sullins Connector Solutions
J22, J27 2 Header, 100mil, 4x2, Gold, SMT Header, 100mil, 4x2, SMT 0015910080 Molex
Key1, Key2, Key3, Key4 4 SWITCH TACTILE SPST-NO 0.02A 15V, TH 6x4.3x6mm EVQ-PAD04M Panasonic
MK1 1 Microphone, Omnidirectional, -38DB, TH TH, 2-Leads, Dia 5.8mm, Pitch 1.9mm ROM-2238P-NF-R PUI Audio
Q1 1 60V MOSFET, N-CH, 60 V, 0.24 A, SOT-23 SOT-23 2N7002E-T1-E3 Vishay-Siliconix
R1 1 1.50k RES, 1.50 k, 1%, 0.1 W, 0603 0603 CRCW06031K50FKEA Vishay-Dale
R2 1 330k RES, 330 k, 5%, 0.1 W, 0603 0603 CRCW0603330KJNEA Vishay-Dale
R3, R4, R5, R6, R16, R17, R18, 8 4.7k RES, 4.7 k, 5%, 0.1 W, 0603 0603 CRCW06034K70JNEA Vishay-Dale
R19
R7, R8 2 10k RES, 10 k, 5%, 0.1 W, 0603 0603 CRCW060310K0JNEA Vishay-Dale
R10 1 1.0 RES, 1.0, 5%, 0.1 W, 0603 0603 CRCW06031R00JNEA Vishay-Dale
R11 1 143 RES, 143, 1%, 0.1 W, 0603 0603 CRCW0603143RFKEA Vishay-Dale
R12 1 270 RES, 270, 1%, 0.1 W, 0603 0603 RC0603FR-07270RL Yageo America
R13 1 590 RES, 590, 1%, 0.1 W, 0603 0603 CRCW0603590RFKEA Vishay-Dale
Designator Quantity Value Description PackageReference PartNumber Manufacturer
R14 1 2.20k RES, 2.20 k, 1%, 0.1 W, 0603 0603 RC0603FR-072K2L Yageo America
R15 1 200k RES, 200 k, 1%, 0.1 W, 0603 0603 RC0603FR-07200KL Yageo America
R21 1 1.07Meg RES, 1.07 M, 1%, 0.1 W, 0603 0603 CRCW06031M07FKEA Vishay-Dale
R22 1 866k RES, 866 k, 1%, 0.1 W, 0603 0603 RC0603FR-07866KL Yageo America
R23 1 680k RES, 680 k, 1%, 0.1 W, 0603 0603 RC0603FR-07680KL Yageo America
R24 1 806k RES, 806 k, 1%, 0.1 W, 0603 0603 RC0603FR-07806KL Yageo America
SH-J1, SH-J2, SH-J3, SH-J4, 13 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M
SH-J5, SH-J6, SH-J7, SH-J8,
SH-J9, SH-J10, SH-J11, SH-J12,
SH-J13
20 TS3A227E EVM User's Guide SLVUAD9–December 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated