Texas Instruments TS3A227E User manual

User's Guide
SLVUAD9–December 2014
TS3A227E EVM User's Guide
This document is the EVM user guide for the TS3A227E-EVM which provides an easy evaluation of TI's
autonomous audio jack switch with integrated key-press detection and power off noise removal.
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Contents
1 About this Manual............................................................................................................ 2
2 Information About Cautions and Warnings............................................................................... 2
3 Introduction ................................................................................................................... 3
3.1 Hardware Items for Operation..................................................................................... 3
4 TS3A227E-EVM Connections Overview ................................................................................. 4
4.1 TS3A227E Design Under Test (DUT)............................................................................ 4
4.2 Power................................................................................................................. 5
4.3 Test Points........................................................................................................... 6
4.4 Translator ............................................................................................................ 6
4.5 On-Board MICBIAS Output........................................................................................ 7
4.6 Key-Press Matrix.................................................................................................... 7
4.7 External CODEC Interface......................................................................................... 8
5 LaunchPad Setup ........................................................................................................... 9
6 Installing the GUI........................................................................................................... 11
7 Using the GUI............................................................................................................... 12
7.1 Connecting the LaunchPad to the EVM and PC.............................................................. 12
7.2 GUI Area Descriptions and Use................................................................................. 14
7.3 GUI Operation ..................................................................................................... 16
7.4 Using the TS3A227E to Develop a Headset................................................................... 17
7.5 Power Off Noise Removal Evaluation .......................................................................... 18
7.6 Slow Plug-In Issue ................................................................................................ 18
8 Board Documentation...................................................................................................... 19
8.1 Schematic .......................................................................................................... 19
8.2 Bill of Materials .................................................................................................... 20
8.3 PCB Layout ........................................................................................................ 22
9 Related Documentation.................................................................................................... 25
List of Figures
1 TS3A227E-EVM Block Diagram........................................................................................... 3
2 Connector to TS3A227E.................................................................................................... 4
3 Power Connections ......................................................................................................... 5
4 Breakout Test Point Headers .............................................................................................. 6
5 Translator ..................................................................................................................... 6
6 On-Board MICBIAS Output................................................................................................. 7
7 Key Press Schematic........................................................................................................ 7
8 External CODEC Interface.................................................................................................. 8
9 LaunchPad Header Connections .......................................................................................... 9
10 LaunchPad J5 Header Connections ...................................................................................... 9
11 LaunchPad LED Indicators................................................................................................ 10
LaunchPad, Code Composer Studio are trademarks of Texas Instruments.
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ATTENTION
STATIC SENSITIVE DEVICES
HANDLE ONLY AT
STATIC SAFE WORK STATIONS
About this Manual www.ti.com
12 Application Install - Security Warning Window ......................................................................... 11
13 TS3A227E-EVM GUI Window............................................................................................ 11
14 COM PORT Detection Error Window.................................................................................... 12
15 LaunchPad to EVM Connection.......................................................................................... 12
16 LaunchPad LED Indicators................................................................................................ 13
17 TS3A227E-EVM GUI ...................................................................................................... 14
18 TS3A227E-EVM GUI Details ............................................................................................. 15
19 MSP430 LaunchPad Warning Window.................................................................................. 16
20 EVM GUI Settings When Using On-Board Keys....................................................................... 17
21 Schematic ................................................................................................................... 19
22 Top Copper ................................................................................................................. 22
23 Ground Plane (Negative Image).......................................................................................... 23
24 Power Plane (Negative Image)........................................................................................... 24
25 Bottom Copper.............................................................................................................. 25
List of Tables
1 Default Jumper Locations................................................................................................. 13
2 Jumper Locations for On-Board Keys ................................................................................... 16
3 TS3A227E-EVM Bill of Materials......................................................................................... 20
1 About this Manual
This user’s guide describes the TS3A227E evaluation module (EVM) and its intended use. This guide
contains the EVM schematics, bill of materials, and board layer information.
2 Information About Cautions and Warnings
The information in a caution or a warning is provided for personal protection. Read each caution and
warning carefully.
CAUTION
This EVM contains components that can potentially be damaged by
electrostatic discharge. Always transport and store the EVM in its supplied ESD
bag when not in use. Handle using an antistatic wristband. Operate on an
antistatic work surface. For more information on proper handling, see the
Electrostatic Discharge (ESD) application note (SSYA008).
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TS3A227E
TS3A227E Jack
Codec Jack Ring1
RING2
MSP40 LaunchPad
Adjustable
LDO
VDD
VCC
2.2 k
VCC
3.6 V
Translator
VCCB VCCA
TIP
/DET_TRIGGER
RING2_SENSE
SLEEVE
SLEEVE_SENSE
SDA
SCL
/MIC_PRESENT
/INT
MICP
GND_SENSE
GNDA
GND
VDDIO
KP Demo Buttons
www.ti.com Introduction
3 Introduction
The TS3A227E-EVM is an evaluation module for TI's autonomous audio jack switch with integrated key-
press detection and power off noise removal. Designed to interact with the audio jack, the device
automatically detects the presence of 3- or 4-pole audio accessories and also features an integrated
switch matrix for automatic routing of the MICBIAS, codec ground sense, and ground connections.
The device also incorporates a high-resolution ADC for distinguishing from up to four keys in the default
mode. Additionally, the TS3A227E features the ability for on-the-fly key-press bin adjustment and a raw
ADC output mode to add the ability for the system to define non-standard key-press bins, as desired.
The evaluation board is designed both as a demonstration and development board by using the MSP430
LaunchPad™ as a base platform for interacting with the device. There is an example firmware stack and
GUI provided with the EVM. Figure 1 is a block diagram of the EVM structure.
Figure 1. TS3A227E-EVM Block Diagram
3.1 Hardware Items for Operation
The following items are required for EVM evaluation:
• TS3A227E-EVM
• MSP-EXP430G2 LaunchPad Rev 1.5
• MSP430G2553
• USB cable
The following items are optional for EVM evaluation:
• 4-pole headset
• 3-pole headset
• Code Composer Studio™ (CCS)
• Visual Studio 2012
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/INT
SCL
SDA
GND
VDDIO
MICP
1µF
C1
0.1µF
C2
GND
/MIC_PRESENT
4.7k
R6
4.7k
R5
4.7k
R4
4.7k
R3
VDD
RING1
TIP
TIP
/DET_TRIGGER
RING2
SLEEVE
Connector to TS3A227E
Q1
GND
VDD
10k
R7
10k
R8
GND
TIP
RING1
RING2
SLEEVE
330k
R2
GND 1
GND 2
SDA
3
VDD
4
GND_SENSE
5
MICP
6
RING2_SENSE 7
SLEEVE_SENSE 8
SCL
9
SLEEVE 10
GNDA 11
RING2 12
INT
13
TIP 14
DET_TRIGGER 15
MIC_PRESENT
16
PAD 17
U1
TS3A227ERVA
5
3
2
1
4
J4
GND_SENSE
TS3A227E-EVM Connections Overview www.ti.com
4 TS3A227E-EVM Connections Overview
This section contains information about TS3A227E-EVM design under test, power, test points, translator,
on-board MICBIAS output, key-press matrix, and external codec interface.
4.1 TS3A227E Design Under Test (DUT)
The TS3A227E audio lines are connected to audio jack J4. Plug a headset into audio jack J4 for testing.
The audio jack used on the EVM is normally a closed jack that has the wrong transition polarity for an
insertion event (low to high). The DET_TRIGGER pin has an internal 1-MΩresistor and Q1 is used to
invert the polarity of the insertion event and create a high-to-low transition.
The supply voltage for the TS3A227E is VDD and the digital IO lines are pulled up to VDDIO.
Figure 2. Connector to TS3A227E
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VDD input range is 2.5 V to 4.5 V
VDDIO can be separate supply for GPIO pins
VDDIO input range is 1.8 V to VDD
J3 is used to select between a separate VDDIO voltage and
the MSP430 supply being used to power the board
VCC
GND
VCC
J1 VCC
VCC VDD
VCC is the MSP430 supply to the board.
J_VDD can be used to connect the MSP430 supply to the TS3A227E
VDDIO
Blue
D1
1.50k
R1
1
2
3
J3
1 2
J2
J5
www.ti.com TS3A227E-EVM Connections Overview
4.2 Power
The TS3A227E-EVM derives its power from the LaunchPad. The EVM board power is labeled VCC in the
schematic and the power supplied to the TS3A227E is labeled VDD. Header connection explanations
follow:
• Header J1 provides a point to check VCC or to provide the board power if the LaunchPad is not being
used.
• Header J2 provides a means to power the TS3A227E from the board power. Populate this jumper to
connect VDD to VCC. If external power is being applied to the TS3A227E, remove this jumper.
• The blue diode D1 lights up when board power is applied.
• J3 selects the digital IO pull-up voltage. By shorting pins 1 and 2, the digital IO lines are pulled up to
the board supply voltage. Shorting pins 2 and 3 allows an external pull-up voltage to be used (such as
1.8 V) from J5.
• J5 provides a connection for supplying an external IO voltage.
Figure 3. Power Connections
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1µF
C5
0.1µF
C6
GNDGND
GND
1µF
C3
0.1µF
C4
GND 1
VREF_A
2
A1
3
A2
4
A3
5
A4
6
A5
7
A6
8
A7
9
A8
10 B8 11
B7 12
B6 13
B5 14
B4 15
B3 16
B2 17
B1 18
VREF_B 19
EN 20
U3
LSF0108PW
200k
R15
SDA
/INT
/MIC_PRESENT
MSP430_/INT
MSP430_/MIC_PRESENT
MSP430_SDA
MSP430_SCL
VCC
4.7k
R16
4.7k
R17
4.7k
R18
4.7k
R19
VDDIO
SCL
1 2
3 4
5 6
7 8
J27
/MIC_PRESENT
SDA
SCL
/INT
RING1
TIP
MICP
SLEEVE
RING2
1
2
3
J17
1
2
3
J14
/DET_TRIGGER
GND_SENSE
VDD
J9
J8
J7
J11
J13
J6
TS3A227E-EVM Connections Overview www.ti.com
4.3 Test Points
The headers in Figure 4 provide breakout test points on the EVM for connecting to external hosts and
systems.
Figure 4. Breakout Test Point Headers
4.4 Translator
Because the TS3A227E VDDIO supply can vary from 1.8 V to 4.5 V, a translator is needed to translate
the VDDIO voltage domain to the LaunchPad 3.6-V domain. U3 provides this functionality.
If the LaunchPad is not used, remove the jumpers on J27.
Figure 5. Translator
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41 32
Key1
41 32
Key2
41 32
Key3
41 32
Key4
SLEEVE
R9
DNP
RING2
1
2
MK1
2.2kohm
1.0
R10
143
R11
270
R12
590
R13
1 2
J15
1 2
J20
1
2
J16
GND
2.8 V: R1 = 1.07M
2.5 V: R1 = 866k
2.2 V: R1 = 673k
Feeback Loop Resistors
Vout = (Vref) * (1 + (R1/R2))
Vref = 1.20 V R2= 1M
FB 1 NC
3
IN
4OUT 5
2
GND
U2
TPS71401DCKT
GND
R20
DNP
806k
R24
1.07M
R21
866k
R22
GND
GND GND
33µF
C10
2.2µF
C9
VCC
1µF
C7
0.1µF
C8 2.20k
R14 MICP
680k
R23
12 34 56 78
J22
1 2
J24
www.ti.com TS3A227E-EVM Connections Overview
4.5 On-Board MICBIAS Output
U2 provides the following MICBIAS outputs by moving the jumper position on J22 and shorting different
sets of pins. The EVM also has a spare 0603 resistor and jumper position if a different MICBIAS voltage is
desired.
• Pins 7–8 →2.2 V
• Pins 5–6 →2.5 V
• Pins 3–4 →2.8 V
• Pins 1–2 →user-populated resistor
Figure 6. On-Board MICBIAS Output
4.6 Key-Press Matrix
The TS3A227E EVM features on-board keys for quick evaluation of the key press functionality. Setting up
the EVM for key press is discussed in Section 7.3.1. By placing a jumper on both headers J15 and J20,
the matrix is attached to the TS3A227E SLEEVE and RING2 pins allowing the keys to be used.
The on-board microphone is used to simulate a headset microphone in parallel with the keys and can be
disconnected by removing the jumper on J16. R9 is not populated to allow for headset manufacturers to
develop key resistances that fall accurately into the buckets.
Figure 7. Key Press Schematic
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RING1
TIP
GND
MICP
5
3
2
1
4
J10
1 2
3 4
J12
TS3A227E-EVM Connections Overview www.ti.com
4.7 External CODEC Interface
J10 provides a means to connect an external codec to the TS3A227E-EVM through a 3.5-mm jack. J12 is
provided to switch the microphone and ground of the EVM between the SLEEVE and RING2 pins.
Shorting pins 1-2 and pins 3-4 connects MICP to RING2 and SLEEVE to ground. Shorting pins 2–4 and
1–3 connects MICP to SLEEVE and RING2 to ground.
Figure 8. External CODEC Interface
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www.ti.com LaunchPad Setup
5 LaunchPad Setup
Use the following steps to set up the LaunchPad:
1. With the LaunchPad unplugged, configure the headers on the LaunchPad to match the yellow box in
Figure 9.
The right 3 headers are vertical and the left are horizontal.
Figure 9. LaunchPad Header Connections
2. With the LaunchPad still unplugged, remove the right-most jumper on the J5 header to match the
yellow box in Figure 10.
Figure 10. LaunchPad J5 Header Connections
3. Connect the LaunchPad to a computer with a USB-to-mini cable. A green LED and a red LED now turn
on as shown in Figure 11.
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LaunchPad Setup www.ti.com
Figure 11. LaunchPad LED Indicators
This is sufficient to setup the LaunchPad to interact with the EVM. If using CCS to do firmware
development, continue the following steps:
4. Download Code Composer Studio.
5. Extract the TS3A227E_GUI_Fimware.zip to any folder.
Example: C:\Users\USER\Documents \TS3A227E
6. Open Code Composer Studio and create a new workspace. Select the Project drop-down menu and
click on Import existing CCS/CCE Eclipse Project. Select Browse on the Select-search directory option
and select the location where the source code is stored. Click the Finish button and select debug
launch to load the code to the MSP430G2553 microcontroller. Once completed, disconnect the USB
cable from the LaunchPad.
7. CCS can also be used as a firmware development/experimentation platform and the EVM/GUI will
work while using the debugging functionality of Code Composer Studio.
8. If the LaunchPad is running and the TS3A227E-EVM daughter board is disconnected, the I2C
communication fails. Pause the debugger, reset the MSP430, and then rerun the code.
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