Texas Instruments bq2013HEVM-001 User manual

bq2013HEVMĆ001 GasĆGauge
IC Evaluation Module
November 2000 Advanced Analog Products
User’s Guide
SLUU081

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Copyright 2000, Texas Instruments Incorporated

Running Title—Attribute Reference
iii
Chapter Title—Attribute Reference
Contents
1 Introduction 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Kit Contents 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Ordering Information 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 DM2013H—bq2013H-Based Circuit Module 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Pin Descriptions 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Programming 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.1 Full Capacity 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.2 Self-Discharge Settings for Chemistry 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.3 LED Display Mode 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.4 Charge Efficiency Compensation 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.5 Offset Error Compensation 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.6 Pack Voltage 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.7 Programming Hardware Changes 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 DM2013H Schematic 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Schematic 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4 DM2013H Physical Layouts 4-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1 Board Layout 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5 DM2013H Bill of Materials 5-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Bill of Materials 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6 DM2013H Performance Specification Summary 6-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7 EVM Hardware and Software Setup 7-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1 Software Installation 7-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2 Hardware Connection 7-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.1 Connecting the DM2013H to a Battery Pack 7-2. . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.2 PC Interface Connection 7-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8 Operation 8-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.1 Starting the Program 8-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.2 Initialization 8-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.2.1 Device Program Settings 8-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.2.2 HDQ Port 8-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.2.3 Setup Parameters 8-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.3 Data Screen 8-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.4 Status Screen 8-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.5 Pro Screen 8-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.6 Data Logging 8-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Running Title—Attribute Reference
iv
Figures
3–1 DM2013H Schematic 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4–1 DM2013H Dimensions and Layout 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6–1 Performance Specification Summary 6-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7–1 DM2013H Connection to Cells, Sense Resistor, and System Load/Charger 7-2. . . . . . . . . . .
8–1 Initial Data Screen 8-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8–2 Setup Screen 8-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8–3 bq2013H Data Screen 8-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8–4 Status Screen 8-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8–5 Pro Screen 8-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
1–1 Ordering Information 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 Full Capacity Programming 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 Self-Discharge Programming 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 LED Mode Programming 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–4 Charge Efficiency Programming 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–5 Charge Efficiency Programming 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–6 Pack Voltage Programming 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5–1 Bill of Materials 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7–1 DM2013H-to-EV2200 Connection 7-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8–1 Resistor Designations for Setup Screen Input 8-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1
Introduction
Introduction
The bq2013H EVM is a complete evaluation system for the bq2013H
Gas-Gauge IC for High Discharge Rates. The EVM includes one DM2013H
circuit module, a current sense resistor, an EV2200 PC Interface Board for
Gas-Gauge Evaluation, a PC serial cable, and Windows-based PC software.
The DM2013H circuit module includes one bq2013H IC, five LEDs to display
remaining capacity, and all other components onboard necessary to monitor
capacity and other critical parameters in NiCd, NiMH, or lead-acid-based
battery packs. The DM2013H connects directly across the cells in a battery.
WiththeEV2200interfaceboardandsoftware,theusercanreadthebq2013H
data registers and evaluate the functions of the bq2013H under different
charge and discharge conditions.
Topic Page
1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Kit Contents 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Ordering Information 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1

Features
1-2
1.1 Features
- Complete evaluation system for the bq2013H Gas-Gauge IC
- PreprogrammedDM2013H module for quick setup
- PC software and interface board for easy evaluation
- Software allows data logging for system analysis
1.2 Kit Contents
- DM2013H preconfigured circuit module
- Sense resistor
- EV2200 PC interface board
- Set of evaluation software disks entitled EV2200-HDQ
- PC serial cable
- Set of support documentation
1.3 Ordering Information
Table 1–1.Ordering Information
EVM Part Number Chemistry Pack Voltage Capacity
bq2013HEVM–001 NiCd†14.4 V†4.5 Ah†
†Can be changed by reprogramming.

2-1
DM2013H—bq2013H-Based Circuit Module
DM2013H—bq2013H-Based Circuit Module
The DM2013H circuit module is a complete and compact example solution of
a bq2013H circuit for capacity monitoring of NiCd, NiMH, or lead-acid packs.
The DM2013H incorporates a bq2013H gas-gauge IC and all other compo-
nents necessary to accurately monitor and display the capacity of up to 14
nickel or 12 lead-acid cells.
TheDM2013H includes fiveLEDstodisplay remaining capacityin 20% incre-
ments of the programmed capacity. The LEDs are activated with the onboard
push-button switch.
Contacts on the DM2013H provide direct connection to the battery stack
(BAT+, BAT–), the sense resistor (BAT–, GND), and the serial communica-
tions port (HDQ). The system load and charger connect across BAT+ and
PACK–.
The ACC input provides an option to enable the LED display with an external
(active low) signal, as from a microcontroller.
Topic Page
2.1 Pin Descriptions 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Programming 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 2

Pin Descriptions
2-2
2.1 Pin Descriptions
P1 HDQ/Serial communications port
P2 DONE/Done input
P3 BAT+/Battery positive/pack positive
P4 ACC/Display activation
P5 RBI/Register backup input
P6 GND/Ground
P7 PACK–/Pack negative
P8 BAT–/Battery negative
2.2 Programming
The DM2013H circuit module is preconfigured for battery pack chemistry,
voltage,andpackcapacity. The circuitmodulecanbereprogrammedforpack
chemistry, voltage, capacity, and other operating parameters via the
programming resistors on the board. The resistors are used to set the
programming pins to a high (H), low (L), or float (Z) state on initialization. To
set a high (H) state for a programming pin requires the pullup resistor; a low
(L) state requires the pulldown resistor; and the float (Z) requires no resistors
on the programming pin. The shaded area of the tables indicates the
bq2013HEVM-001configuration.See the bq2013H datasheet for acomplete
description of how the bq2013H is programmed.
2.2.1 Full Capacity
Pins 2 and 3 of the bq2013H determine the full capacity or programmed full
count (PFC) of the DM2013H. Resistors R12–R15 set the pins to a high (H),
low (L), or float (Z) state during board initialization.
Table 2–1.Full Capacity Programming
PFC Input Settings
Pin 2 Pin 3 Sense Resistor MΩCapacity (Ah)
H L 10 3.5
Z Z 10 4.5
Z H 10 5.5
2.2.2 Self-Discharge Settings for Chemistry
Battery chemistries have different self-discharge rates. Pin 4 of the bq2013H
determines the self-discharge factors of the DM2013H. Resistors R17 and
R18setthepintoahigh(H),low(L),orfloat(Z)stateduringboardinitialization.

Programming
2-3
DM2013H—bq2013H-Based Circuit Module
Table 2–2.Self-Discharge Programming
Self-Discharge Setting
Pin 4 Chemistry
H NiMH
Z NiCd
L Lead–acid
Note: Select the self-discharge setting that most closely models the battery pack to be used.
2.2.3 LED Display Mode
TheDM2013H5onboard LEDs indicate remaining battery capacityinrelative
mode (20% increments of the learned battery capacity). Pin 5 of the bq2013H
determines the LED display mode of the DM2013H. Resistors R19 and R20
set the pin to a high (H), low (L), or float (Z) state during board initialization.
Table 2–3.LED Mode Programming
LED Mode Setting
Pin 5 LED Mode
HRelative (20% increments of learned capacity)
ZRelative (20% increments of learned capacity)
LAbsolute (20% increments of programmed capacity)
2.2.4 Charge Efficiency Compensation
The DM2013H is configured to apply no-charge efficiencycompensation. Pin
6 of the bq2013H determines the charge efficiency factors of the DM2013H.
ResistorsR23andR24setthepintoahigh(H),low(L),orfloat(Z)stateduring
board initialization.
Table 2–4.Charge Efficiency Programming
Self-Discharge Setting
Pin 6 Charge Efficiency
HLowest Efficiency
ZHighest Efficiency—100% Efficient
LMedium Efficiency
Note: Selectthechargeefficiencysettingthatmost closelymodelsthebatterypacktobeused.

Programming
2-4
2.2.5 Offset Error Compensation
The DM2013H is configured to apply compensation to correct for –75 µV of
offset error. This is the error typically found using the bq2013H on a
well-designed PCB. Pin 7 of the bq2013H determines the offset error
compensationoftheDM2013H. Resistors R3 andR8set the pin toahigh (H),
low (L), or float (Z) state during board initialization.
Table 2–5.Charge Efficiency Programming
Self-Discharge Setting
Pin 7 Offset Compensation
H –150 µV
Z –75 µV
L 0 µV
2.2.6 Pack Voltage
TheDM2013Hispreconfiguredforpackvoltage(numberofcells).R2,R6and
R7configurethisasshownintheschematicandaresetasshowninTable2–6.
Table 2–6.Pack Voltage Programming
EVM Part Number R2 R18 R19 End-of-Discharge
Level 1 End-of-Discharge Level 2
bq2013HEVM-001 1.5 MΩ1.1 MΩ100 K 12 V 10.8 V
2.2.7 Programming Hardware Changes
The following procedure changes the configuration of DM2013H to other (un-
shaded) options listed in the tables above:
1) Ensure that the DM2013H is disconnected from the battery.
2) Determine the resistors required to achieve the high (H), low (L), or float
(Z) states on the program pin inputs.
3) Remove the 200k resistors where needed.
4) Place required 200k resistors where needed.
5) If required, change the voltage programming resistors as outlined on the
schematic.
6) Reconnect the DM2013H to the battery pack.
The EV2200 and the PC software can be used to confirm the new settings by
reading the PPU and PPD data registers and the Setup screen.

3-1
DM2013H Schematic
DM2013H Schematic
TheDM2013Hschematicshowsallpossiblecomponentsontheboardforvar-
ious configurations, including all configuration resistors. Only those resistors
thatset the desired configuration should be installed. The schematic notes in-
dicate where variations exist.
Topic Page
3.1 Schematic 3–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 3

Schematic
3-2
3.1 Schematic
Figure 3–1 shows the DM2013H schematic diagram.
Figure 3–1.DM2013H Schematic

4-1
DM2013H Physical Layouts
DM2013H Physical Layouts
This chapter contains the board layout and assembly drawings for the
DM2013H.
Topic Page
4.1 Board Layout 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 4

Board Layout
4-2
4.1 Board Layout
Figure 4–1 shows the dimensions, PCB layers, and assembly drawing for the
DM2013H.
Figure 4–1.DM2013H Dimensions and Layout

5-1
DM2013H Bill of Materials
DM2013H Bill of Materials
This chapter contains the bill of materials required for the DM2013H.
Topic Page
5.1 Bill of Materials 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 5

Bill of Materials
5-2
5.1 Bill of Materials
Table 5–1 lists materials requdred for the DM2013H.
Table 5–1.Bill of Materials
Ref Des Qty
–001 Description MFG MFG PART# Size
PCB 1Printed Circuit Board, 0.031,
FR4, SMOBC, HASL Any bq2113 REV.A See FAB DWG
C1,C5 2Capacitor, Ceramic, 1 µF, 25
V, ±20%, X7R Panasonic ECJ–3YB1E105K 3216
C2,C3,C4 3Capacitor, Ceramic, 0.1 µF, 25
V, ±20%, X7R Venkel C0805X7R250–104MNE 2012
R1,R9,R25,R28 4Resistor, 100 Ω, 1/10 W, 5% Venkel CR0805–10 W101JT 805
R2 1Resistor, 1.5 MΩ, 1/10 W, 1% Venkel CR0805–10 W1504FT 805
R3, R8, R12,
R13, R14, R15,
R17, R18, R19,
R20, R23,R24
NOT USED 805
R4,R5,R11 3Resistor, 100 KΩ, 1/10 W, 5% Venkel CR0805–10 W104JT 805
R6 1Resistor, 1.1 MΩ, 1/10 W, 1% Venkel CR0805–10 W1104FT 805
R7 1Resistor, 100 KΩ, 1/10 W, 1% Venkel CR0805–10 W1003FT 805
R10†1Resistor, 0.010 Ω, 3 W, 1%,
LVR–3, AXIAL Dale LVR–3 R010 1% 3 W, TH
R16,R21,R22 3Resistor, 330 Ω, 1/10 W, 5% Venkel CR0805–10 W331JT 805
R26 1Resistor, 300 KΩ, 1/10 W, 5% Venkel CR0805–10 W304JT 805
R27 1Resistor, 10 KΩ, 1/10 W, 5% Venkel CR0805–10 W103JT 805
D1,D2,D3,D4,D5 5LED, green, S Type Panasonic LN1371G–(TR)
D6,D8 2Diode,dual series switching,
SOT–23 Zetex BAV99 SOT–23
D7,D10,D11 3Diode, Zener, 5.6V , .30 W,
(BZX84C5V6), SOT–23 Motorola BZX84C5V6 SOT–23
D9 1Diode, TVS, 33 V, 600 W Diodes Inc. SMBJ26A SMBJ
Q1 1Transistor, MOSFET N–Ch Zetex BSS138 SOT–23
S1 1Switch, Momentary, N.O.,
5mmx1.5mm thk. Panasonic EVQ–PLHA15 5 mm
†Included, but not installed on board.

6-1
DM2013H Performance Specification Summary
DM2013H Performance Specification Summary
This chapter summarizes the performance specifications of the DM2013H.
Table 6–1 gives the performance specifications of the circuit.
Figure 6–1.Performance Specification Summary
Specification Min Typ Max Units
Charge and Discharge Current 0.05 15 A
Note: Charge and discharge maximums are limited by the power dissipation of the 10 mΩ3 W
sense resistor included in the kit.
Chapter 6

6-2

7-1
EVM Hardware and Software Setup
EVM Hardware and Software Setup
This section describes how to install the bq2013H EVM PC software and how
to connect the different components of the EVM.
Topic Page
7.1 EVM Hardware and Software Setup 7-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2 Hardware Connection 7-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 7

Software Installation
7-2
7.1 Software Installation
The following steps install the EV2200–HDQ software:
1) Insert disk 1 into a 3 1/2 inch floppy drive.
2) Select the 3 1/2 inch drive using My Computer or File Manager.
3) Double-click the Setup.exe icon.
The setup program prompts for the remaining disks and installs a Windows
application group.
7.2 Hardware Connection
There are three hardware components to the bq2013H EVM: The DM2013H
circuit module, the EV2200 PC interface board, and the PC.
7.2.1 Connecting the DM2013H to a Battery Pack
Figure 7–1 shows how to connect the DM2013H to a stack of cells, the sense
resistor, and the system load/charger.
Figure 7–1.DM2013H Connection to Cells, Sense Resistor, and System Load/Charger
Battery Pack Battery Pack
PACK– PACK+ PACK– PACK+
Charger
Load
DM2013H
Charger
Load
DM2013H
P8
P7 P8 P7
P3
RSNS RSNS
CellsCells
<20 V
(b) Setup for >20 V Battery Packs(a) Setup for <20 V Battery Packs
P3