Thundercomm TurboX D845 User manual

Thundercomm TurboX D845 System on Module
Copyright © 2018 All Rights Reserved , Thundercomm Technology Co., Ltd. 1
Thundercomm TurboXTM D845 System on Module
A high performance embedded platform based on Qualcomm® Snapdragon ™845
processor
Description
Thundercomm TurboXTM D845 System on Module(SOM) is a high performance intelligent module, integrating
Android or Linux system, based on Qualcomm SDA845 processor. It integrates the advanced 10 nm Fin FET
process, a customized 64-bit ARM v8-compliant Octacore Qualcomm Kryo 385 applications processor.
TurboX D845 SOM supports short-range wireless communication through Wi-Fi 802.11 a/b/g/n/ac and BT5.0.
This SOM supports 3840*2400@60fps display, it can connect 4 x camera modules, and integrating multiple
audio and video input/output interfaces. This SOM provides a variety of GPIO, I2C, UART and SPI standard
interfaces. In addition, it supports two MIPI-DSI, four MIPI-CSI and SOM common standard protocol
interfaces such as USB3.1, PCIE2.1/3.0, I2S and SLIMBUS.
TurboX D845 SOM provides convenient and stable system solution for IOT field, it can be embedded into the
device on VR/AR, Drone, Robot, Smart Camera, AI devices, and any other connecting fields. The size of
module is 37mm x 60mm x 7.1mm, weight 10.3g, with 336PINs.
Features
The following table shows the detailed features and performance on TurboX D845 SOM.
Processors
Applications
Processor
64-bit applications processor (Kryo 385) with 2 MB L3 cache
Quad high-performance Kryo cores at 2.649 GHz - Kryo Gold cluster with 256 kB L2
cache per core
Quad low-power Kryo cores at 1.766 GHz - Kyro Silver cluster with 128 kB L2 cache
per core
Digital signal
processing Compute DSP with Qualcomm Hexagon Vector Extensions (dual-HVX512) processor

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Sensor core Snapdragon™ sensor core with dedicated sensor DSP and 1.0 MB memory (512 kB
TCM + 512 kB L2) to support always-on low-power use cases
Operating System Android OS 8
Memory
64GB UFS + LPDDR4x 4GB
Four-channel PoP high-speed memory – LPDDR4x SDRAM (4 x 16-bit) designed for a
1866 MHz clock.
Multimedia
Display support
2 x 4-lane DSI DPHY 1.2 and DisplayPort 1.4 data concurrency over USB
Maximum concurrency configurations
3840x2400 at 60Hz primary + 3840 x 2160 or 4096 x 2160 at 60Hz DP
2 x 2560 x 1600 at 60 fps primary + 3840 x 2160 or 4096 x 2160 at 60fps DP
Camera support
Support 3 x 4-lane MIPI_CSI + 1 x 2-lane MIPI_CSI
Dual 14-bit ISP + one Lite ISP
Real-time sensor input resolution: 16 + 16 +2 MP
32 MP 30 fps ZSL with a dual ISP
16 MP 30 ZSL with single ISP
Video
Encode
4K60 encode for H.264 High Profile, H265 Main 10 Profile
4K30 encode for VP8
Decode 4K60 decode for H.264 High Profile, H265 Main 10 Profile and VP9 Profile 2
Graphics Adreno 630 - 4K 60 fps UI or 2x 2k x 2k 90 fps UI

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OpenGL ES 3.2 + AEP, DX next, Vulkan 2
OpenCL 2.0 full profile, RenderScript
Audio (build in TurboX D845 Carrier Board)
Codec
Five DACs, five outputs
five differential analog inputs; four ADCs
Six digital microphones
Open DSP CPE voice activation subsystem for ultra low-power voice wake-up
Native DSD (WCD9341 only), MBHC, and ANC
130 dB dynamic range, 32-bit DAC
Low-power audio Low-power, low-complexity; 7.1 surround sound
Voice codec
support
QCELP, EVS, EVRC, EVRC-B, EVRC-WB; G.7 Gen, G.729A/AB;
GSM-FR, GSM-EFR and GSM-HR; AMR-NB and AMR-WB
Enhanced audio
Surround sound: advanced multichannel
FluenceTM Pro noise cancellation; enhanced speaker protection
Qualcomm enhance 3D audio solution, Qualcomm stereo audio expansion feature,
and Qualcomm intelligent mixing algorithm
Wireless connectivity
WLAN
2.4G/5G, support 802.11 a/b/g/n/ac, 2 X 2 MIMO
Bluetooth
Support Bluetooth 5.0 + HS
BLE
Connectivity

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USB 2x USB 3.1, one can support Type-C with DisplayPort
PCIe 2x PCIe, one Gen 2 1-lane with PHY 2.1 and one Gen 3 1-lane with PHY 3.0
SDIO SD V3.0 4-bit for SD card
QUP 4 bit each; Multiplexed serial interface functions, can be configured as UART, I2C, SPI
SLIMbus One, highly multiplexed, high-speed, baseline WCD9340/WCD9341
MI2S
Full duplex stereo or up to quad channel Tx/Rx MI2S (x3)
Up to eight channels for multi-channel Tx/Rx audio applications (x1)
GPIO 12+ GPIO ports
Others
ADC Interface
Support ADC interfaces
used for input voltage sense, battery temperature detection and general purpose
ADC
Touchscreen
support Capacitive panels via ext IC (I2C, and interrupts)
Physical size
Size: 37mm x 60mm x7.1mm
Weight: approx. 10.3g
Interface: Connector
Operating
temperature -20~50℃
RoHS All hardware components are fully compliant with EU RoHS directive

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Applications
TurboX D845 SOM is ideal for many applications including (but not limited to): AI, Robotics, Virtual Reality
(VR), Augmented Reality (AR),Drones and Medical Devices.
Revision History:
Version Date Description
V1.0 July 31, 2018 Revised Release
V1.1 Sep 28, 2018 Update the pin definition description
V1.2 Oct 8, 2018 Update format

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Table of Contents
1 Physical Description............................................................................................................................................ 9
1.1 Major Components Location................................................................................................................9
1.2 Connectors Function and Part Number................................................................................................ 10
1.3 Package Drawing and Dimensions.......................................................................................................11
2 Functional Overview.......................................................................................................................................... 12
2.1 DSP(Hexagon v65)...............................................................................................................................12
2.2 Visual Processing Subsystem............................................................................................................... 12
2.3 Secure Processing Unit (SPU)..............................................................................................................13
2.4 ISP(ISP280).......................................................................................................................................... 14
2.5 Connection............................................................................................................................................14
3 Interfaces Description........................................................................................................................................15
3.1 Interfaces Parameter Definitions.......................................................................................................... 15
3.2 Interfaces Detail Description................................................................................................................16
3.2.1 Power Supply Interface................................................................................................................ 16
3.2.2 Touchscreen Interface...................................................................................................................17
3.2.3 Display Interface.......................................................................................................................... 17
3.2.4 Camera Interfaces.........................................................................................................................18
3.2.5 Audio Interface.............................................................................................................................20
3.2.6 USB & DisplayPort Interface.......................................................................................................21
3.2.7 PCIe Interface............................................................................................................................... 22
3.2.8 SSC Interface................................................................................................................................23
3.2.9 SDIO Interface..............................................................................................................................24
3.2.10 QUP Interface............................................................................................................................... 24
3.2.11 Power on Interface........................................................................................................................25
3.2.12 Reset Interface.............................................................................................................................. 26

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3.2.13 Keys Interface...............................................................................................................................27
3.2.14 Sensor Interrupt Interface.............................................................................................................27
3.2.15 Debug UART Interface.................................................................................................................27
3.2.16 Battery Interface........................................................................................................................... 28
3.2.17 ADCs Interface.............................................................................................................................28
3.2.18 PWMs and LED Current Driver Interface................................................................................... 28
3.2.19 Antenna Interface......................................................................................................................... 29
4 Connector PIN Summary......................................................................................................................................30
4.1 CON2401 BTB Connector................................................................................................................... 30
4.2 CON2402 BTB Connector................................................................................................................... 33
4.3 J2 BTB Connector................................................................................................................................ 36
5 Electrical Characteristics.................................................................................................................................. 37
5.1 Absolute Maximum Ratings.................................................................................................................37
5.2 Operating Conditions............................................................................................................................37
5.3 Digital-logic characteristics..................................................................................................................38
5.3.1 Digital GPIO characteristics..................................................................................................... 38
5.3.2 SD card digital I/O characteristics............................................................................................... 39
5.4 MIPI......................................................................................................................................................40
5.5 USB.......................................................................................................................................................40
5.6 PCIe...................................................................................................................................................... 40
5.7 DisplayPort........................................................................................................................................... 41
5.8 SLIMbus............................................................................................................................................... 41
5.9 SDIO..................................................................................................................................................... 41
5.10 I2S.........................................................................................................................................................41
5.11 I2C........................................................................................................................................................ 43
5.12 SPI.........................................................................................................................................................43
5.13 Fuel gauge.............................................................................................................................................44

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5.14 LED Current Driver..............................................................................................................................44
5.15 ADC......................................................................................................................................................45
5.16 Power Consumption............................................................................................................................. 46
5.17 Thermal.................................................................................................................................................46

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1.1 Major Components Location
TurboX D845 SOM’s major components as below map.
Figure 1.1- 1 TurboX D845 SOM Key component Location
1 Physical Description

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1.2 Connectors Function and Part Number
Below table indicates connectors detail information.
Part Reference Description Manufacturer Part
Number Manufacturer
CON2401,CON2402 BTB connectors, used for connecting to
Carrier Board. FX10A-168P-SV HIROSE
J2 JTAG connector, used for JTAG Debug AXG7160J7 Panasonic
J3002,J5701,J5801 RF antenna connector, J3002 is for 818000500 ECT
Table 1.2- 1 Connector part number and information

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1.3 Package Drawing and Dimensions
Figure 1.3- 1 Top View
Figure 1.3- 2 Side View
Figure 1.3- 3 Bottom View

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2 Functional Overview
2.1 DSP(Hexagon v65)
Hexagon Coprocessor (HCP) and VMA1.0
Universal Bandwidth Compression(UBWC) and DMA1.0
Vector TCM (VTCM)
Scatter-Gather support
HVX contexts and concurrency
Migrating to 128-byte mode for future forward compatibility
dspCV_init is deprecated
New HAP DCVS v2 APIs for clock and bus voting
dspCV_concurrency is deprecated
Session restart
SDK 3.x
Camera streaming – four tap points
Dedicated bus for camera streaming on the cDSP
Dedicated high-speed bus for data transfer from the DDR to the cDSP
FastCV software development kit with HVX acceleration
2.2 Visual Processing Subsystem
Improved GPGPU
Enhanced image processing for GPGPU use cases
Native MIPI and Bayer texture format support
Enhanced mathematics for machine learning (matrix Mul)
Architectural improvements for performance and power
Efficient multiview rendering for VR/AR

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More efficient, wider Shader microarchitecture
Significant resource (ALU) increase in Shader Processors
Increased texture performance
Memory bandwidth reduction and efficiency improvements
Improved UI with updated 2D rasterization patterns
Improved hidden surface removal to reduce work
Better lossless compression to reduce memory bandwidth and power
Improvements for Vulkan support
Reduced overhead in hardware and driver
2.3 Secure Processing Unit (SPU)
Qualcomm Trusted Execution Environment
Isolates secure and non-secure software operations
Small code base, rigorously reviewed
Based on ARM’s TrustZone architecture
Secure Boot
Deters unauthorized code execution
Tamper resistant root of trust in ROM or e-fuses
Hardware Crypto
FIPS certifiable cryptographic engines and HW keys for more robust and fast encrypt/decrypt
operations
Secure Storage and Key Provisioning
OTP e-fuse memory for storage of keys and configurations
Secure file system for encrypted storage of DRM keys and certificates
Provisioning of Keys
Secure Debug
Prevents JTAG debugger connection in commercial products and reverse engineering
Set by e-fuse, with support for secure RMA

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2.4 ISP(ISP280)
IFE: Image front-end engine
Bayer process for preview/video only
Stats for 3A
Muti-pass outputs feeding to IPE
IPE: Image processing engine, consists of 2 parts
NPS: Noise processing segment
PPS: Post processing segment
BPS: Bayer processing segment
Bayer process and noise reduction for snapshot only
Simple stats for special offline processing
Muti-pass outputs feeding to IPE
2.5 Connection
2 x 2 802.11ac with MU-MIMO
160 MHz & DBS support
Bluetooth 5.0
Optional dedicated BT antenna support concurrent operation for WLAN and BT with and without
dedicated BT antenna
RF performance meets all carrier requirments
Industry leading throughput
Low power island on MSM for lowest Wi-Fi power consumption (up to 61% improvement)
BT/BTLE integration within WCN3990 for lowest BT power consumption (up to 87% improvement)

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3 Interfaces Description
This chapter introduces all the interfaces definition, purpose to guide developer easy to design and
verification on Thundercomm TurboXTM D845 SOM.
3.1 Interfaces Parameter Definitions
Symbol Description
AI Analog input
AO Analog output
B Bidirectional digital with CMOS input
CSI Supply voltage for MIPI_CSI circuits and I/O; (1.8 V only)
DI Digital input(CMOS)
DSI Supply voltage for MIPI_DSI I/O; (1.8 V only)
DO Digital output(CMOS)
H High-voltage tolerant
nppdpukp
Programmable pull resistor. The default pull direction is indicated using capital letters
and is a prefix to other programmable options:
NP: pdpukp = default no-pull with programmable options following the colon (:)
PD: nppukp = default pull-down with programmable options following the colon (:)
PU: nppdkp = default pull-up with programmable options following the colon (:)
KP: nppdpu = default keeper with programmable options following the colon (:)
KP Contains an internal weak keeper device (keepers cannot drive external buses)
MIPI Mobile industry processor interface
NP Contains no internal pull
OD Open drain
PD Contains an internal pull-down device
PI Power input
PO Power output

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PD Contains an internal pull-down device
PU Contains an internal pull-up device
P3 Power group 3, it is 1.8V.
P2 SDC Power group 3, it is 1.8V or 2.96V.
P12 SSC Power group 12, it is 1.8V.
Table 3.1- 1 Interfaces parameter definitions
3.2 Interfaces Detail Description
3.2.1 Power Supply Interface
Below table describes all interfaces of SOM Power Supply. For the detail parameter request, please refer the
chapter on Electrical specifications.
Power Supply
PIN Name Location PIN Type Description Notes
VBATT CON2401
159,160,161,162,1
63,164,165,166,16
7,168
PI Power supply in for SOM all
operations.
USB_VBUS CON2402 159,161,163,165,1
67 PO USB output during USB-OTG
operation.
VREG_LVS2A_1P8 CON2402 147 PO Low voltage switch supply output
for sensor
VREG_S4A_1P8 CON2402 123,125,127 PO
SMPS power output for external
CODEC ; Also can used for 1.8V IO
pull up voltage;
VREG_L21A_2P95 CON2401 152,154,156 PO Power output for SD card
VREG_L19A_3P0 CON2402 149 PO Power output for Sensor
VREG_LVS1A_1P8 CON2401 150 PO Cameras IO power supply
VREG_BOB CON2402 139,141 PO For Codec VDD input
GND CON2401
1,7,8,13,14,19,20,
25,26,31,32,37,38,
42,43,49,55,60,61,
66,67,72,73,78,79,
84,90,93,94,98,10
2,106,114,120,126
,132,155,157,158
GND

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CON2402
11,12,17,18,23,24,
29,30,35,36,41,42,
46,54,97,103,104,
109,110,115,116,1
21,122,128,156,15
7,162,168
GND
J2 8 GND
Table 3.2- 1 Power Supply Definition
3.2.2 Touchscreen Interface
Touchscreen panels are supported using I2C buses and GPIOs configured as discrete digital inputs.
Touchscreen
PIN Name Location PIN Voltage Type Description Notes
TP_I2C_SDA CON2402 45 PX3 OD QUP5 I2C signals
TP_I2C_SCL CON2402 43 PX3 OD QUP5 I2C signals
TP_INT_N CON2402 47 PX3 DO TP interrupt signals
TP_RST_N CON2402 49 PX3 DI TP reset signals
Table 3.2- 2 Touchscreen interfaces definition
3.2.3 Display Interface
The SOM supports dual 4-lane MIPI_DSI interfaces. 60fps, Up to 3840 x 2400.
Display
PIN Name Location PIN Voltage Type Description Notes
MIPI_DSI0_LANE3_N CON2402 13 DSI AO
MIPI0 signals for
MIPI LCM.
Compliant with
MIPI Alliance
Specification for
Display Serial
Interface
MIPI_DSI0_LANE3_P CON2402 15 DSI AO
MIPI_DSI0_LANE2_N CON2402 19 DSI AO
MIPI_DSI0_LANE2_P CON2402 21 DSI AO
MIPI_DSI0_CLK_N CON2402 25 DSI AO
MIPI_DSI0_CLK_P CON2402 27 DSI AO
MIPI_DSI0_LANE1_N CON2402 31 DSI AO
MIPI_DSI0_LANE1_P CON2402 33 DSI AO
MIPI_DSI0_LANE0_N CON2402 37 DSI AO
MIPI_DSI0_LANE0_P CON2402 39 DSI AO
MIPI_DSI1_LANE0_N CON2402 14 DSI AO MIPI1 Signals for
MIPI LCM
MIPI_DSI1_LANE0_P CON2402 16 DSI AO

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Compliant with
MIPI Alliance
Specification for
Display Serial
Interface
MIPI_DSI1_CLK_P CON2402 20 DSI AO
MIPI_DSI1_CLK_N CON2402 22 DSI AO
MIPI_DSI1_LANE2_P CON2402 26 DSI AO
MIPI_DSI1_LANE2_N CON2402 28 DSI AO
MIPI_DSI1_LANE3_N CON2402 32 DSI AO
MIPI_DSI1_LANE3_P CON2402 34 DSI AO
MIPI_DSI1_LANE1_N CON2402 38 DSI AO
MIPI_DSI1_LANE1_P CON2402 40 DSI AO
LCD_RST_N CON2402 61 PX3 DO LCD reset signal
LCD_TE0 CON2402 59 PX3 DI LCD TE signal input
Table 3.2- 3 Display interfaces definition
3.2.4 Camera Interfaces
The SOM supports 3 x 4-lane + 1 x 2-lane camera interfaces.
Camera0 Interface
PIN Name Location PIN Voltage Type Description Notes
CCI_I2C_SDA0 CON2401 143 PX3 OD CCI0 Date signal,
already pull up on SOM
CCI_I2C_SCL0 CON2401 141 PX3 OD CCI0 Clock signal,
already pull up on SOM
CAM0_PWDN CON2401 113 PX3 DO Camera power down
signal
CAM0_RSTN CON2401 99 PX3 DO Camera reset signal
CAM0_STROBE CON2401 121 PX3 DI Camera STROBE signal
CAM0_DVDD_EN CON2401 131 LV DO Camera DVDD LDO
enable signal
CAM0_AVDD_EN CON2401 101 PX3 DO Camera AVDD LDO
enable signal
CAM_MCLK0 CON2401 92 PX3 DO Camera main clock
output
MIPI_CSI0_LANE3_P CON2401 3 CSI AI
MIPI Signals of
Camera0
Compliant with MIPI
Alliance Standard
Specification
MIPI_CSI0_LANE3_N CON2401 5 CSI AI
MIPI_CSI0_LANE2_N CON2401 9 CSI AI
MIPI_CSI0_LANE2_P CON2401 11 CSI AI
MIPI_CSI0_LANE1_N CON2401 15 CSI AI
MIPI_CSI0_LANE1_P CON2401 17 CSI AI
MIPI_CSI0_LANE0_N CON2401 21 CSI AI
MIPI_CSI0_LANE0_P CON2401 23 CSI AI
MIPI_CSI0_CLK_P CON2401 27 CSI AI

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MIPI_CSI0_CLK_N CON2401 29 CSI AI
Camera1 Interface
PIN Name Location PIN Voltage Type Description Notes
CCI_I2C_SDA0 CON2401 143 PX3 OD CCI0 Date signal,
already pull up on SOM
CCI_I2C_SCL0 CON2401 141 PX3 OD CCI0 Clock signal,
already pull up on SOM
CAM1_PWDN CON2401 119 PX3 DO Camera power down
signal
CAM1_RSTN CON2401 95 PX3 DO Camera reset signal
CAM1_STROBE CON2401 115 PX3 DI Camera STROBE signal
CAM1_DVDD_EN CON2401 129 LV DO Camera DVDD LDO
enable signal
CAM1_AVDD_EN CON2401 97 PX3 DO Camera AVDD LDO
enable signal
CAM_MCLK1 CON2401 96 PX3 DO Camera main clock
output
MIPI_CSI1_LANE3_N CON2401 33 CSI AI
MIPI Signals of
Camera1
Compliant with MIPI
Alliance Standard
Specification
MIPI_CSI1_LANE3_P CON2401 35 CSI AI
MIPI_CSI1_LANE2_P CON2401 39 CSI AI
MIPI_CSI1_LANE2_N CON2401 41 CSI AI
MIPI_CSI1_LANE1_N CON2401 45 CSI AI
MIPI_CSI1_LANE1_P CON2401 47 CSI AI
MIPI_CSI1_LANE0_N CON2401 51 CSI AI
MIPI_CSI1_LANE0_P CON2401 53 CSI AI
MIPI_CSI1_CLK_N CON2401 57 CSI AI
MIPI_CSI1_CLK_P CON2401 59 CSI AI
Camera2 Interface
PIN Name Location PIN Voltage Type Description Notes
CCI_I2C_SDA1 CON2401 145 PX3 OD CCI0 Date signal,
already pull up on SOM
CCI_I2C_SCL1 CON2401 147 PX3 OD CCI0 Clock signal,
already pull up on SOM
CAM2_PWDN CON2401 105 PX3 DO Camera power down
signal
CAM2_RSTN CON2401 123 PX3 DO Camera reset signal
CAM2_STROBE CON2401 117 PX3 DI Camera STROBE signal
CAM2_DVDD_EN CON2401 109 PX3 DO Camera DVDD LDO
enable signal
CAM2_AVDD_EN CON2401 103 PX3 DO Camera AVDD LDO
enable signal

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CAM_MCLK2 CON2401 100 PX3 DO Camera main clock
output
MIPI_CSI2_LANE1_P CON2401 63 CSI AI
MIPI Signals of
Camera2
Compliant with MIPI
Alliance Standard
Specification
MIPI_CSI2_LANE1_N CON2401 65 CSI AI
MIPI_CSI2_LANE2_P CON2401 69 CSI AI
MIPI_CSI2_LANE2_N CON2401 71 CSI AI
MIPI_CSI2_LANE3_P CON2401 75 CSI AI
MIPI_CSI2_LANE3_N CON2401 77 CSI AI
MIPI_CSI2_CLK_P CON2401 62 CSI AI
MIPI_CSI2_CLK_N CON2401 64 CSI AI
MIPI_CSI2_LANE0_N CON2401 68 CSI AI
MIPI_CSI2_LANE0_P CON2401 70 CSI AI
Camera3 Interface
MIPI_CSI3_LANE1_N CON2401 74 CSI AI MIPI Signals of
Camera3
Compliant with MIPI
Alliance Standard
Specification
MIPI_CSI3_LANE1_P CON2401 76 CSI AI
MIPI_CSI3_LANE0_P CON2401 80 CSI AI
MIPI_CSI3_LANE0_N CON2401 82 CSI AI
MIPI_CSI3_CLK_N CON2401 86 CSI AI
MIPI_CSI3_CLK_P CON2401 88 CSI AI
CAM_MCLK3 CON2401 104 PX3 DO Camera main clock
output
CAM3_PWDN CON2401 111 PX3 DO Camera power down
signal
CAM3_RSTN CON2401 125 PX3 DO Camera reset signal
CAM3_DVDD_EN CON2401 127 PX3 DO Camera DVDD LDO
enable signal
CAM3_AVDD_EN CON2401 107 PX3 DO Camera AVDD LDO
enable signal
Table 3.2- 4 Camera interface definition
3.2.5 Audio Interface
The SOM provide SLIMBUS and I2S interfaces for audio. SLIMBUS interface is dedicate for external codec IC,
which can build system’s audio functions. I2S interface can connect audio devices.
Audio Interface
PIN Name Location PIN Voltage Type Description Notes
CODEC_SLIMBUS_DATA0 CON2402 48 PX3 IO Slimbus, connect to
COEDC