Torex XCL102 Series User manual

1/20
XCL102/XCL103
Series
Inductor Built-in Step-up “micro DC/DC” Converter (micro DC/DC)
■GENERAL DESCRIPTION
The XCL102/XCL103 series is a synchronous step-up micro DC/DC converter which integrates an inductor and a control IC
in one tiny package (2.0mm×2.5mm, h=1.0mm). Astablestep-up power supply is configured using onlytwo capacitors connected
externally. An internal coil simplifies the circuit and enables minimization of noise and other operational trouble due to the circuit
wiring. A wide operating voltage range of 0.9V to 6.0V enables support for applications that require an internally fixed output
voltage (2.2V to 5.5V). PWM control (XCL102) or automatic PWM/PFM switching control (XCL103) can be selected.
During the devices enter stand-by mode, XCL102D/XCL103D types prevent the application malfunction by CLDischarge
Function which can quickly discharge the electric charge at the output capacitor (CL). XCL102/XCL103E types is able to drive
Real Time Clock etc.
■APPLICATIONS
●Portable equipment
●Beauty & health equipment
●Wearable devices
●Game & Hobby
●PC Peripherals
●Devices with 1~3 Alkaline,
1~3 Nickel Hydride, 1 Lithium and 1 Li-ion
■FEATURES
Input Voltage Range
: 0.9V
～
6.0V (Absolute Max. Rating: 7.0V)
Fixed Output Voltage
: 2.2V
～
5.5V (0.1V increments)
Oscillation Frequency
: 3.0MHz (±20%)
Input Current
: 0.8A
Output Current
: 500mA @V
OUT
=5.0V, V
BAT
=3.3V (TYP.)
350mA @VOUT=3.3V, VBAT =1.8V (TYP.)
Control Mode Selection
Load Transient Response
: PWM (XCL102 Series) or
Auto PWM/PFM (XCL103 Series)
:
100mV@VOUT=3.3V,VBAT=1.8V,IOUT=1mA
→200mA
Protection Circuits
: Over-current limit (Integral latch method)
Output short-circuit protection
Functions
: Soft-start
Load Disconnection Function (D type)
C
L
Auto Discharge Function (D type)
Bypass Switch Function (E type)
Output Capacitor
: Ceramic Capacitor
OperatingAmbientTemperature
: -40
℃～
+85
℃
Package
: CL-2025-02
Environmentally Friendly
: EU RoHS Compliant, Pb Free
■
TYPICALAPPLICATION CIRCUIT
ETR28011-002
☆
GreenOperation-Compatible
■TYPICAL PERFORMANCE
CHARACTERISTICS
XCL103D503CR-G/XCL103E503CR-G
C
L
7
8
1
2
34
5
6
Lx
VOUT
VBAT
GND
CE
GND
V
OUT
V
BAT
V
CE
C
IN
L1
L2

2/20
XCL102/XCL103 Series
■BLOCK DIAGRAM
●XCL102D/XCL103D series
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
* XCL102 series chooses only PWM control.
●XCL102E/XCL103E series
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
* XCL103 series chooses only PWM control.
V
DD
MAX
R
FB1
Load Disconnect
Controller
CEController
Logic
PWM
Comparator Buffer
Drive
L
X
V
BAT
V
OUT
Current sense
Short-circuit
protection
Latch Timer
Vref with
Soft Start
C
FB
Inductor
GND
L2 L1
PFM/PWM
Controller Logic
V
DD
CE
V
OUT
C
L
Discharge
Error Amp.
Phase
Compensation
RAMP Wave
Generator OSC
R
FB2
FB
V
OUT
VDD MAX
RFB1
Load Disconnect
Controller
CEController
Logic
PWM
Comparator Buffer
Drive
L
X
V
BAT
V
OUT
Current sense
Short-circuit
protection
Latch Timer
Vref with
Soft Start
CFB
Inductor
GND
L2 L1
PFM/PWM
Controller Logic
VDD
CE
VOUT
Bｙpass SW
Error Amp.
Phase
Compensation
RAMP Wave
Generator OSC
RFB2
FB
VOUT

3/20
XCL102/XCL103
Series
■PRODUCT CLASSIFICATION
●Ordering Information
XCL102①②③④⑤⑥-⑦PWM control
XCL103①②③④⑤⑥-⑦PWM/PFM automatic switching control
●Selection guides
■PIN CONFIGURATION
■PINASSIGNMENT
■FUNCTION CHART
PIN NAME SIGNAL STATUS
CE L Stand-by
H Active
* Do not leave the CE pin open.
DESIGNATOR ITEM SYMBOL DESCRIPTION
①Type
D
Refer to Selection Guide
E
②③ Output Voltage 22～55
Output Voltage options
e.g.)3.3V → ②=3, ③=3
5.0V →
②
=5,
③
=0
④
Oscillation Frequency
3
3.0MHz
⑤⑥-⑦(*1) Package (Order Unit) CR-G CL-2025-02 (3,000pcs/Reel)
TYPE Output
Voltage Chip Enable Soft-Start CL Auto- Discharge Bypass Switch Load Disconnection Current Limit (with integral latch)
Short
Protection
with latch
D
Fixed
Yes
Fixed
Yes
No
Yes
Yes
Yes
E
Fixed
Yes
Fixed
No
Yes
No
Yes
Yes
PIN NUMBER PIN NAME FUNCTIONS
1
VBAT
Power Input
2
GND
Ground
3
CE
Chip Enable
4
GND
Ground
5
Lx
Switching
6
V
OUT
Output Voltage
7
L1
Inductor Electrodes
8
L2
* If the pad needs to be connected to other pins, it should be connected to the GND.
(*1) The ”-G” suffix indicates that the products are Halogen and Antimony free as well as being fully EU RoHS compliant.
7 L1
8 L2
VO UT 6
Lx 5
GN D 4
1 VBA T
2 GN D
3 CE
(BOTTOM VIEW)

4/20
XCL102/XCL103 Series
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER SYMBOL RATINGS UNITS
VBAT Pin Voltage VBAT -0.3～+7.0 V
Lx Pin Voltage VLx -0.3～+7.0 V
V
OUT
Pin Voltage
V
OUT
-0.3
～
+7.0
V
CE Pin Voltage
V
CE
-0.3
～
+7.0
V
Power Dissipation Pd 1000 (40mm x 40mm Standard board)(*3) mW
Operating Ambient Temperature Topr -40～+85 ℃
Storage Temperature Tstg -55～+125 ℃
*GND are standard voltage for all of the voltage.
(*3) The power dissipation figure shown is PCB mounted and is for reference only.
The mounting condition is please refer to PACKAGING INFORMATION.

5/20
XCL102/XCL103
Series
■ELECTRICAL CHARACTERISTICS
●XCL102/XCL103 Series Ta=25℃
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT
Input Voltage VIN - - 6.0 V ①
Output Voltage VOUT Voltage to start oscillation while
VOUT=VOUT(T)
×
1.03
→
VOUT(T)
×
0.97
<E-1> <E-2> <E-3> V ⑤
Operation Start Voltage VST1 RL=1kΩ- - 0.90 V ①
Operation Hold Voltage VHLD RL=1kΩ- 0.65 - V ①
Quiescent Current
(XCL103 only) Iq VOUT=VBAT= VOUT(T)+0.5V - 26 40 μA ③
Supply Current
I
DD
V
OUT
=V
BAT
= V
OUT(T)
-0.2V
-
<E-5>
3.0
mA
③
Oscillation Frequency
fOSC
VBAT= VOUT(T)
×
0.5, IOUT=100mA
2.4
3.0
3.6
MHz
①
Maximum Duty Cycle DMAX VBAT=1.2V, VOUT= VOUT(T)-0.2V 88 93 98 % ⑤
Minimum Duty Cycle
D
MIN
V
OUT
=V
BAT
= V
OUT(T)
+0.5V
-
-
0
%
⑤
PFM Switching Current
(XCL103 only) IPFM VBAT=1.5V, RLis selected with VOUT(T), Refer to Table 1 - 165 230 mA ①
Efficiency
（XCL103 only）EFFI
V
BAT
= V
OUT(T)×
0.6, R
L
is selected with
VOUT(T), Refer to Table 1 - 86(*3) - % ①
Efficiency
EFFI
V
BAT
= V
OUT(T)×
0.6,
I
OUT
= 100mA
-
90(*3)
-
%
①
Stand-by Current
ISTB
VBAT=VLx=6.0V,VCE=0V,
(*1)
-
0
1.0
μA
⑦
Lx SW "Pch" ON
Resistance RLXP VBAT=VLx= 6.0V, IOUT=200mA - 0.3(*2) - Ω④
Lx SW "Nch" ON
Resistance RLXN - 0.3(*3) - Ω①
Lx SW”H” Leakage
Current ILXLH VBAT=6.0,VCE=0V, VLx=6.0V,VOUT=0V - 0 1.0 μA ⑦
Current Limit ILIM VBAT= VOUT(T)-0.2V, RLx=1Ω<E-6> <E-7> <E-8> A ⑥
Integral Latch Time tLAT VBAT= VOUT(T)-0.2V, RLx=1Ω,Time from
current limit start to stop Lx oscillation 25 100 365 μs ⑥
Latch Release Voltage VLAT_R RLis selected with VOUT(T), Refer to Table 1 0.9 1.2 1.5 V ①
Short Protection
Threshold Voltage VSHORT VBAT=VOUT(T)-0.2V, RL=1Ω- (*3) - V ①
Soft-Start Time tSS VBAT= VOUT(T)×0.6, VOUT=VOUT(T)× 0.9, After "H" is fed to CE, the time by when
clocks are generated at Lx pin. 0.2 0.5 1.0 ms ⑤
C
L
Discharge Resistance
(Type D only) RDCHG VBAT=3.3V, VOUT=3.3V, VCE=0V 100 180 400 Ω②
Bypass SW
Resistance (Type E only) RBSW VBAT= 3.3V, VOUT=0V, VCE=0V 100 180 400 Ω②
CE "H" Voltage VCEH VOUT= VOUT(T)-0.15V, Applied voltage to VCE,
Voltage changes Lx to be generated.
0.8 - 6.0 V ⑤
CE "L" Voltage VCEL VOUT= VOUT(T)-0.15V, Applied voltage to VCE,
Voltage changes Lx to“H” level
GND - 0.2 V ⑤
CE "H" Current ICEH VBAT=6.0V,VOUT=6.0V, VLx=6.0V VCE=6.0V, -0.1 - 0.1 μA ②
CE "L" Current ICEL VBAT=6.0V,VOUT=6.0V, VLx=6.0V ,VCE=0V -0.1 - 0.1 μA ②
Inductance
L
Test Freq.=1MHz
-
1.5
-
μH
-
Inductor Rated Current ICEL ΔT=+40deg - 1000 - mA -
VOUT(T):Target Voltage
Test Conditions: unless otherwise stated、VBAT=1.5V, VCE=3.3V, Lx:OPEN, RLx=56Ω
(*1) XCL102D/XCL103D: VOUT=0V, XCL102E/XCL103E: VOUT=OPEN
(*2) Design value for the XCL103D
(*3) Designed value

6/20
XCL102/XCL103 Series
■ELECTRICAL CHARACTERISTICS (Continued)
Table 1.External Components RL Table
VOUT(T) RL
UNITS:V UNITS：Ω
2.2≦VOUT(T)＜3.1 220
3.1≦VOUT(T)＜4.3 330
4.3≦VOUT(T)≦5.5 470
Table 2.SPEC Table
NOMINAL
OUTPUT
VOLTAGE
VOUT IDD ILIM
<E-1> <E-2> <E-3> <E-5> <E-6> <E-7> <E-8>
UNITS
V
V
V
mA
A
A
A
VOUT(T)
MIN.
TYP.
MAX.
TYP.
MIN.
TYP.
MAX.
2.2
2.156
2.200
2.244
0.705
-
1.11
2.30
2.3
2.254
2.300
2.346
0.736
-
1.14
2.30
2.4
2.352
2.400
2.448
0.767
-
1.17
2.30
2.5
2.450
2.500
2.550
0.797
-
1.19
2.30
2.6 2.548 2.600 2.652 0.828 - 1.22 2.30
2.7 2.646 2.700 2.754 0.858 - 1.24 2.30
2.8 2.744 2.800 2.856 0.889 - 1.26 2.30
2.9 2.842 2.900 2.958 0.919 - 1.28 2.30
3.0 2.940 3.000 3.060 0.950 0.96 1.30 2.30
3.1 3.038 3.100 3.162 0.981 0.97 1.30 2.30
3.2 3.136 3.200 3.264 1.011 0.97 1.30 2.30
3.3 3.234 3.300 3.366 1.042 0.98 1.30 2.30
3.4 3.332 3.400 3.468 1.072 0.98 1.30 2.30
3.5 3.430 3.500 3.570 1.103 0.99 1.30 2.30
3.6 3.528 3.600 3.672 1.134 0.99 1.30 2.30
3.7 3.626 3.700 3.774 1.164 1.00 1.30 2.30
3.8
3.724
3.800
3.876
1.195
1.00
1.30
2.30
3.9
3.822
3.900
3.978
1.225
1.01
1.30
2.30
4.0
3.920
4.000
4.080
1.256
1.01
1.30
2.30
4.1
4.018
4.100
4.182
1.286
1.02
1.30
2.30
4.2
4.116
4.200
4.284
1.317
1.02
1.30
2.30
4.3
4.214
4.300
4.386
1.348
1.03
1.30
2.30
4.4
4.312
4.400
4.488
1.378
1.03
1.30
2.30
4.5
4.410
4.500
4.590
1.409
1.04
1.30
2.30
4.6 4.508 4.600 4.692 1.439 1.04 1.30 2.30
4.7 4.606 4.700 4.794 1.470 1.05 1.30 2.30
4.8 4.704 4.800 4.896 1.501 1.06 1.30 2.30
4.9 4.802 4.900 4.998 1.531 1.06 1.30 2.30
5.0 4.900 5.000 5.100 1.562 1.07 1.30 2.30
5.1 4.998 5.100 5.202 1.592 1.07 1.30 2.30
5.2 5.096 5.200 5.304 1.623 1.08 1.30 2.30
5.3 5.194 5.300 5.406 1.653 1.08 1.30 2.30
5.4 5.292 5.400 5.508 1.684 1.09 1.30 2.30
5.5
5.390
5.500
5.610
1.715
1.09
1.30
2.30

7/20
XCL102/XCL103
Series
■TEST CIRCUIT
< Circuit No.①>
Wave Form Measure Point
R
Lx
=56Ω
Wave Form Measure Point
R
Lx
=1Ω
< Circuit No.②>
< Circuit No.③> < Circuit No.④>
< Circuit No.⑤> < Circuit No.⑥>
※External Components
C
IN
: 10μF( ceramic )
C
L
: 10μF( ceramic )
L : 1.5μH(selected inductor)
A
A
I
CEH
I
CEL
I
LXLL
A
I
STB
A
A
I
OUT
A
< Circuit No.⑦>
Wave Form Measure Point
C
IN
A
L
R
L
C
L
A
Wave Form Measure Point
I
OUT
V
V
A
V
A
I
LXLH
V
BAT
CE
Lx V
OUT
GND
L1 L2
V
BAT
CE
Lx V
OUT
GND
L1 L2
V
BAT
CE
Lx V
OUT
GND
L1 L2
V
BAT
CE
Lx V
OUT
GND
L1 L2
V
BAT
CE
Lx V
OUT
GND
L1 L2
V
BAT
CE
Lx V
OUT
GND
L1 L2
V
BAT
CE
Lx V
OUT
GND
L1 L2

8/20
XCL102/XCL103 Series
■TYPICAL APPLICATION CIRCUIT
【Typical Examples】
MANUFACTURER PRODUCT NUMBER VALUE
CIN
Taiyo Yuden
LMK107BBJ106MALT
10V/10uF
Taiyo Yuden
TMK107BBJ106MA-T
25V/10uF
TDK
C1608X5R0J106MT0A0E
6.3V/10uF
TDK
C1608X5R1A106M
10V/10uF
CL Taiyo Yuden TMK107BBJ106MA-T 25V/10uF
TDK
C1608X5R0J106MT0A0E
6.3V/10uF
*Select components appropriate to the usage conditions (ambient temperature, input & output voltage).
While selecting a part, please concern about capacitance reduction and voltage durability.
*If VBAT≧2V, VOUT(T)≧3.5V and the load current rises above 200mA, use two or more in a parallel connection.
For the actual load capacitance, use a ceramic capacitor that ensures a capacitance equivalent to or greater than the TMK107BBJ106MA-T
(Taiyo Yuden).
If using tantalum or low ESR electrolytic capacitors please be aware that ripple voltage will be higher due to the larger ESR (Equivalent Series
Resistance) values of those types of capacitors. Please also note that the IC’s operation may become unstable with such capacitors so that
we recommend to test on the board before usage.
C
L
7
8
1
2
34
5
6
Lx
VOUT
VBAT
GND
CE
GND
V
OUT
V
BAT
V
CE
C
IN
L1
L2

9/20
XCL102/XCL103
Series
■OPERATIONAL EXPLANATION
The XCL102/XCL103 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase
compensation circuit, N-channel driver transistor, P-channel synchronous rectification switching transistor and current limiter
circuit.
The error amplifier compares the internal reference voltage with the resistors RFB1 and RFB2. Phase compensation is
performed on the resulting error amplifier output, to input a signal to the PWM comparator to determine the turn-on time of the N-
channel driver transistor during PWM operation. The PWM comparator compares, in terms of voltage level, the signal from the
error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to the buffer driver circuit to cause
the Lx pin to output a switching duty cycle. This process is continuously performed to ensure stable output voltage. The current
feedback circuit monitors the N-channel driver transistor’s turn-on current for each switching operation, and modulates the error
amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even when a low ESR capacitor,
such as a ceramic capacitor, is used, ensuring stable output voltage.
<Reference voltage source, soft start function>
The reference voltage forms a reference that is used to stabilize the output voltage of the IC.
After “H” level is fed to CE pin, the reference voltage connected to the error amp increases linearly during the soft start interval.
This allows the voltage divided by the internal RFB1 and RFB2 resistors and the reference voltage to be controlled in a balanced
manner, and the output voltage rises in proportion to the rise in the reference voltage. This operation prevents rush input current
and enables the output voltage to rise smoothly.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally at 3.0MHz. The Clock generated
is used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage
divided by the internal resistors (RFB1 and RFB2). When the FB is lower than the reference voltage, output voltage of the error
amplifier increases. The gain and frequency characteristics of the error amplifier are optimized internally.
<VDDMAX>
VDD MAX circuit compares the input voltage and the output voltage then it will select the higher one as the power supply for the
IC.
<Shutdown function, load disconnection function>
The IC enters chip disable state byapplying low level voltage to the CE pin. At this time, the N-channel and P-channel synchronous
switching transistors are turned OFF
With the XCL102D/103D types, the orientation of the parasitic diode of the P-channel synchronous switching transistor is fixed
at anode: VOUT and cathode: Lx during shutdown to break conduction from the input side to the output side by the parasitic diode
of the P-channel synchronous switching transistor.
<PWM/PFM control circuit>
When PFM operates, the N-channel driver transistor turns on at the timing of the signal sent from the PWM comparator. The N-
channel driver transistor remains on until the current in the coil reaches a constant current (IPFM). The PWM/PFM control circuit
compares the signal sent from the PWM comparator to the time it takes the current in the coil to reach a constant current (IPFM),
and outputs the pulse that results in a longer on-time of the N-channel driver transistor. This enables smooth switching between
PWM and PFM. The XCL102 series directly outputs the signal that is sent from the PWM comparator.
V
DD
MAX
R
FB1
Load Disconnect
Controller
CEController
Logic
PWM
Comparator Buffer
Drive
L
X
V
BAT
V
OUT
Current sense
Short-circuit
protection
Latch Timer
Vref with
Soft Start
C
FB
Inductor
GND
L2 L1
PFM/PWM
Controller Logic
V
DD
CE
V
OUT
C
L
Discharge
Error Amp.
Phase
Compensation
RAMP Wave
Generator OSC
R
FB2
FB
V
OUT
< BLOCK DIAGRAM (D type) >

10/20
XCL102/XCL103 Series
■OPERATIONAL EXPLANATION (Continued)
<Maximum current limit function, short-circuit protection>
The maximum current limit function of XCL102D/E and XCL103D/E typesmonitors the current thatflows in the N-channel driver
transistor connected to the Lx pin, and consists of both maximum current limiting and a latch function. (Fig.1)
Short-circuit protection is a latch-stop function that activates when the output voltage drops below the short-circuit protection
threshold voltage in the overcurrent state. (Fig.2)
①If the current flowing in the N-channel driver transistor exceeds the current limit value (equivalent to the peak coil current),
the N-channel driver transistor turns off, and remains off during the clock interval. In addition, an integral latch timer starts the
count.
②The N-channeldriver transistor turns on at the next pulse. If inthe overcurrent state at this time, the N-channel driver transistor
turns off as in (1). The integral latch timer continues the count.
③If the count of the integral latch timer continues for 100μs (typ.), a function that latches the N-channel driver transistor and P-
channel synchronous switching transistor to the off state activates.
④If no longer in the overcurrent state at the next pulse, normal operation resumes. The integral latch timer stops the count.
⑤If the output voltage VOUT drops below the short-circuit protection threshold voltage VSHORT during the count of the integral
latch timer, a function that latches the N-channel driver transistor and P-channel synchronous switching transistor in the off
state activates. The short-circuit protection threshold voltage VSHORT is a threshold voltage that is linked to the input voltage
VBAT.
⑥In the latched state, either restart by shutting down once with the CE pin, or resume operation by lowering the input voltage
VBAT below the latch release voltage VLAT_R(1.2V typ.). The soft start function operates during restart. During the soft-start
interval tSS, the integral latch timer and latch function are stopped.
⑦When the input voltage VBAT is below the latch release voltage VLAT_R(1.2V typ.), the integral latch timer and latch function
stop, but the current limiting function continues operating.
* Note that the current in the internal N-channel driver transistor is not the same as the output current IOUT.
ILIM
ILx
VBAT
VOUT VSHORT=VBAT
Limit< # μs
VLAT_R
RL
Limit= #μs
Latch
Timer
Latch
CE Restart
tSS
① ④ ① ③ ⑥
② ②
Fig. 1
ILIM
ILx
VBAT
VOUT
Latch
Timer
VSHORT=VBAT
Limit<#μs
VLAT_R
RL
Latch
⑤ ⑥①
② ⑦
Fig. 2
0Ω

11/20
XCL102/XCL103
Series
■OPERATIONAL EXPLANATION (Continued)
<Bypass switch>
At shutdown, XCL102E type and XCL103E type conduct between the BAT pin and VOUT pin by means of a bypass switch. If the
output is shorted to ground, the current is limited by the resistance (RBSW) of the bypass switch.
<CLDischarge>
The XCL102D and XCL103D can discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which
enables a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the VOUT pin and the GND
pin. When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application
malfunction. Discharge time of the output capacitor (CL) is set by the CLauto-discharge resistance (R) and the output capacitor
(CL). By setting time constant of a CLauto-discharge resistance value [RDCHG] and an output capacitor value (CL) as τ (τ = CLx
RDCHG), discharge time of the output voltage after discharge via the N channel transistor is calculated by the following formulas.
However, the CLdischarge resistance [RDCHG] is depends on the VBAT or VOUT, so it is difficult to make sure the discharge time.
We recommend that you fully check actual performance.
V = VOUT x e -t /
τ or t = τ x ln (VOUT / V)
V
: Output voltage after discharge
VOUT(T)
: Target voltage
t
: Discharge time
τ
: C
L
×R
DCHG
C
L
: Capacitance of Output capacitor (C
L
)
RDCHG
: CLDischarge resistance, it depends on supply voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0 2 4 6 8 10 12 14 16 18 20
Output Voltage: VOUT(V)
Discharge Time: t(ms)
--
---
Output Voltage Discharge characteristics
RDCHG = 180Ω(TYP) CL=10μF
VOUT = 3.3V
VOUT = 5.5V

12/20
XCL102/XCL103 Series
■NOTE ON USE
1) For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or
deteriorated if IC is used beyond the absolute maximum ratings.
2) Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by
external component selection, such as the capacitance values, and board layout of external components. Once the design
has been completed, verification with actual components should be done.
3) The DC/DC converter performance is greatly influenced by not only the ICs' characteristics, but also by those of the external
components. Care must be taken when selecting the external components. Especially for CLload capacitor, it is
recommended to use type B capacitors (JIS regulation) or X7R, X5R capacitors (EIA regulation).
4) Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could
cause the IC operation to become unstable, so reinforce the area around the GND pin of the IC in particular.
5) Please mount each external component as close to the IC as possible. Also, please make traces thick and short to reduce
the circuit impedance.
6) With regard to the current limiting value (ILIM), the actual coil current may at times exceed the electrical characteristics due
to propagation delay inside the product.
7) The CE pin is a CMOS input pin. Do not use with the pin open. If connecting to the BAT pin or ground pin, use the resistor
which is 1MΩ or less. To prevent malfunctioning of the device connected to this product or the input/output due to short
circuiting between pins, it is recommended that a resistor be connected.
8) The maximum current limiter controls the limit of the N-channel driver transistor by monitoring current flow. This function
does not limit the current flow of the P-channel synchronous transistor. When used with the condition VBAT > VOUT (input
voltage higher than the output voltage), the ICmay be destroyed if overcurrentflows to the P-channelsynchronousswitching
transistor due to short-circuiting of the load or other reason.
9) When the device is used in high step-up ratio, the current limit function may not work during excessive load current. In this
case, the maximum duty cycle limits maximum current. In this event, latching may not take place, because the maximum
current limit cannot be detected.
10) On latch types, some boardconditionsmay cause release from the maximum current limit, and the integrated latch time may
become longer or latching may not take place.
11) On latch type, the maximumcurrentlimit may be detected,and this will cause the latch function toactivate and stop operation
after the soft start time elapses. In particular, note that the soft start time becomes shorter when the IC is used at high
temperatures.
12) When the step-up voltage difference is small, the XCL102 series for PWM control may oscillate intermittently.
13) When the voltage boost difference issmall, thecurrent limiting function maynot operate if the on time of the N-channel driver
transistor is shorter than the propagation delay time of the current limit circuit. In this case, latching may not take place on a
latch type because the maximum current limit is not detected.
14) VBAT > VOUT, The case and Pch synchronous rectification switch Tr used in (input voltage more expensive than the output
voltage). But the output voltage will be on and becomes equal to input voltage.
15) When connecting large-volume condenser (100 μF) etc. to the loading capacity, a protection circuit of IC moves, and the
output voltage doesn't stand up.
16) When input voltage and output voltage are low, integral latch function and short-circuit protection may not operate.
We recommend that you fully check actual performance.
17) TOREX places an importance on improving our products and its reliability. However, by any possibility, we would request
user fail-safe design and post-aging treatment on system or equipment.

13/20
XCL102/XCL103
Series
■NOTE ON USE(Continued)
18) Instructions of pattern layouts
The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high,
please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible.
(1) In order to stabilize VBAT voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to
the VBAT pin, GND pin.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents at
the time of switching may result in instability of the IC.
(5) This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-channel and N-
channel MOS driver transistors. Please consider the countermeasures against heat if necessary.
19) Please make the equipped location accuracy within the 0.05mm as a careful point on the mounting.
<Reference pattern layout>
＜
TOP VIEW
＞
＜
BOTTOM VIEW
＞

14/20
XCL102/XCL103 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Output Voltage vs Output Current
(2) Efficiency vs Output Current
XCL102D333CR-G/XCL102E333CR-G
XCL102D503CR-G/XCL102E503CR-G
XCL103D503CR-G/XCL103E503CR-G
XCL102D333CR-G/XCL102E333CR-G
XCL103D333CR-G/XCL103E333CR-G
XCL103D333CR-G/XCL103E333CR-G

15/20
XCL102/XCL103
Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(2) Efficiency vs Output Current (Continued)
(3) Ripple Voltage vs Output Current
XCL102D503CR-G/XCL102E503CR-G
XCL103D503CR-G/XCL103E503CR-G
XCL102D503CR-G/XCL102E503CR-G XCL103D503CR-G/XCL103E503CR-G
XCL102D333CR-G/XCL102E333CR-G XCL103D333CR-G/XCL103E333CR-G

16/20
XCL102/XCL103 Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(4) Output Voltage vs Ambient Temperature
(5) Frequency vs Ambient Temperature (6) Stand-by Current vs Ambient Temperature
XCL102D333CR-G/XCL102E333CR-G
XCL102D503CR-G/XCL102E503CR-G
0.0
1.0
2.0
3.0
4.0
5.0
-50 -25 025 50 75 100
Stand-by Curret: I
STB
[uA]
Ambient Temperature : Ta [℃]
Vin=1.5V
Vin=3.0V
Vin=4.2V
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
-50 -25 025 50 75 100
Frequency: Fosc [MHz]
Ambient Temperature : Ta [℃]
Vin=3.6V
Iout=1mA
XCL102D503CR-G/XCL102E503CR-G XCL102D503CR-G/XCL102E503CR-G
3.20
3.22
3.24
3.26
3.28
3.30
3.32
3.34
3.36
3.38
3.40
-50 -25 025 50 75 100
Output Voltage: VOUT [V]
Ambient Temperature : Ta [℃]
Iout=1mA
Iout=10mA
Iout=50mA
Vin=1.5V
4.90
4.92
4.94
4.96
4.98
5.00
5.02
5.04
5.06
5.08
5.10
-50 -25 025 50 75 100
Output Voltage: V
OUT
[V]
Ambient Temperature : Ta [℃]
Iout=1mA
Iout=100mA
Iout=300mA
Vin=3.6V

17/20
XCL102/XCL103
Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(7) Load Transient Response
Iout 200mA/div
Iout=1.0mA
Iout=300mA
Iout=1.0mA
200us/div
Vout 200mV/div
・
XCL102D503CR-G, V
IN
=3.7V, V
OUT
=5.0V, I
OUT
= 1.0mA
⇔
300mA , Ta=25
℃
Iout 200mA/div
Iout=1.0mA
Iout=300mA
Iout=1.0mA
1.0ms/div
Vout 200mV/div
・XCL103D503CR-G, VIN=3.7V, VOUT=5.0V, IOUT= 1.0mA ⇔300mA , Ta=25℃

18/20
XCL102/XCL103 Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE OUTLIN / LAND PATTERN THERMAL CHARACTERISTICS
CL-2025-02 CL-2025-02 PKG Standard Board CL-2025-02 Power Dissipation

19/20
XCL102/XCL103
Series
■MARKING RULE
●CL-2025-02
①represents products series
②represents integer and oscillation frequency of the output voltage
③represents the decimal part of output voltage
④,⑤represents production lot number
01～09、0A～0Z、11～9Z、A1～A9、AA～AZ、B1～ZZ in order.
(G, I, J, O, Q, W excluded)
Note: No character inversion used.
MARK
PRODUCT SERIES
2
XCL102******-G
3
XCL103******-G
MARK Type
OUTPUT
VOLTAGE(V)
Oscillation
Frequency(MHz)
PRODUCT SERIES
2
D
2.x
3.0
XCL102/3D2*3**-G
3
3.x
XCL102/3D3*3**-G
4
4.x
XCL102/3D4*3**-G
5
5.x
XCL102/3D5*3**-G
C
E
2.x
3.0
XCL102/3E2*3**-G
D
3.x
XCL102/3E3*3**-G
E
4.x
XCL102/3E4*3**-G
F
5.x
XCL102/3E5*3**-G
OUTPUT
VOLTAGE(V)
MARK PRODUCT SERIES
X.0
0
XCL102/3**03**-G
X.1
1
XCL102/3**13**-G
X.2
2
XCL102/3**23**-G
X.3
3
XCL102/3**33**-G
X.4
4
XCL102/3**43**-G
X.5
5
XCL102/3**53**-G
X.6
6
XCL102/3**63**-G
X.7
7
XCL102/3**73**-G
X.8
8
XCL102/3**83**-G
X.9
9
XCL102/3**93**-G
⑤
④
①
②
1
2
3
6
5
4
③

20/20
XCL102/XCL103 Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail witha certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.