Toshiba 42WP27B User manual

PLASMA DISPLAY MONITOR
SERVICE MANUAL
PRINTED IN JAPAN Dec, 2002
FILE NO. 050-200234
42WP27B, 42WP27C
42WP27E, 42WP27F
42WP27R

1 Applicable signals 3
2 Safety Precautions 4
2.1. General Guidelines 4
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 5
4 About lead free solder (PbF) 6
5 PCB Structure sheet of GP5D chassis 7
6 Service Hint 8
7 Location of Lead Wiring 9
8 Adjustment Procedure 10
8.1. +B Set-up 10
8.2. Driver Set-up 10
8.3. Initialization Pulse Adjust 11
8.4. P.C.B. (Printed Circuit Board) exchange 12
8.5. Adjustment Volume Location 12
8.6. Test Point Location 12
9 Service mode 13
9.1. CAT (computer Aided Test) mode 13
9.2. IIC mode structure (following items value is sample data.)
15
10 Alignment 16
10.1. Pedestal setting 16
10.2. NTSC panel white balance 17
10.3. PAL/SECAM panel white balance 18
10.4. PC/RGB panel white balance 20
10.5. HD/ 525i /525p panel white balance 22
10.6. 625i panel balance 24
10.7. Sub brightness setting 25
11 Trouble shooting guide 27
11.1. Self Check 27
11.2. No Power 28
11.3. No Picture 29
11.4. Local screen failure 29
12 Option Setting 30
13 Conductor Views 33
13.1. F-Board 33
13.2. P-Board 34
13.3. HX-Board 37
16.1. Replacement Parts List Notes 99
16.2. Mechanical Replacement Parts List 100
16.3. Electrical Replacement Parts List 101
13.4. Option RTB421 38
13.5. D1-Board 40
13.6. D2-Board 42
13.7. C1-Board 45
13.8. C2-Board 46
13.9. SC-Board 47
13.10. SU-Board 50
13.11. SD-Board 51
13.12. SS, SS2, SS3-Board 52
13.13. Z-Board 55
13.14. H3, S1 and V1-Board 56
14 Block and Schematic Diagrams 57
14.1. Schematic Diagram Notes 57
14.2. Main Block Diagram 58
14.3. F-Board Schematic Diagram 59
14.4. Power Block Diagram 60
14.5. P-Board (1 of 2) Schematic Diagram 61
14.6. P-Board (2 of 2) Schematic Diagram 62
14.7. HX-Board Block Diagram 63
14.8. HX-Board Schematic Diagram 64
14.9. Option RTB421 Block Diagram 65
14.10. Option RTB421 (1 of 2) Schematic Diagram 66
14.11. Option RTB421 (2 of 2) Schematic Diagram 67
14.12. D1-Board Block Diagram 68
14.13. D1-Board (1 of 6) Schematic Diagram 69
14.14. D1-Board (2 of 6) Schematic Diagram 70
14.15. D1-Board (3 of 6) Schematic Diagram 71
14.16. D1-Board (4 of 6) Schematic Diagram 72
14.17. D1-Board (5 of 6) Schematic Diagram 73
14.18. D1-Board (6 of 6) Schematic Diagram 74
14.19. D2-Board Block Diagram 75
14.20. D2-Board (1 of 6) Schematic Diagram 76
14.21. D2-Board (2 of 6) Schematic Diagram 77
14.22. D2-Board (3 of 6) Schematic Diagram 78
14.23. D2-Board (4 of 6) Schematic Diagram 79
14.24. D2-Board (5 of 6) Schematic Diagram 80
14.25. D2-Board (6 of 6) Schematic Diagram 81
14.26. C1 and C2-Board Block Diagram 82
14.27. C1-Board Schematic Diagram 83
14.28. C2-Board Schematic Diagram 84
14.29. SC-Board Block Diagram 85
14.30. SC-Board (1 of 2) Schematic Diagram 86
14.31. SC-Board (2 of 2) Schematic Diagram 87
14.32. SD-Board Block Diagram 88
14.33. SD-Board Schematic Diagram 89
14.34. SU-Board Block Diagram 90
14.35. SU-Board Schematic Diagram 91
14.36. SS-Board Block Diagram 92
14.37. SS, SS2, SS3 and S1-Board Schematic Diagram 93
14.38. Z-Board Block Diagram 94
14.39. H3 and Z-Board Schematic Diagram 95
15 Mechanical Parts Location 97
16 Replacement Parts List 99
17 Specifications 111
CONTENTS Page Page
2

1 Applicable signals
3

2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M9and 5.2M9.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5k9, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
4

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
5

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution


·

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).


·

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.


·

After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
6

5 PCB Structure sheet of GP5D chassis
Board Name Function Remarks
D1 Format Converter 1
D2 Plasma AI Sub-Field Processor 1
ZAudio out
SS Sustain Out 1
SC Scan out 1
SU Sustain connection (Upper) 1
SD Sustain connection (Lower) 1
C1 Data Drive (Lower Right)
C2 Data Drive (Lower Left)
H3 Speaker terminal
S1 Power switch
SS2 Sustain connection (Upper)
SS3 Sustain connection (Lower)
V1 Front SW. & Remote receiver
FLine filter
PPower supply 1
HX PC_type_Input terminal
RTB421 RCA type_Input terminal
Remarks
1.Recommend PCB´s for initial service for GP5D chassis.
7

6 Service Hint
8
∗D1 board is not used for 42WP27C.

7 Location of Lead Wiring
9

8.1. +B Set-up
8.1.1. Item / Preparation
1.Input a Grey scale signal.
2.Set the picture controls: -
Picture mode: Normal
White balance: Normal
8.1.2. Adjustments
Adjust and confirm indicated test point for the specified voltage.
Adjust
Name Volume Voltage Test Point
Vsus R540 170V ± 1V P1 pin 3
Vda R537 67V ± 0.5V P12 pin 1
Confirm
Name Voltage Test Point
15V 15.3V ± 0.5V P23 pin 2
13V 13.3V ± 0.5V P25 pin 5
15V 15.2V ± 0.5V P25 pin 1
Audio 13V 12.5V ± 0.8V P6 pin 1
Audio-13V -12.5V ± 0.8V P6 pin 3
5V 5.2V ± 0.3V P25 pin 7
STB 5V 5.0V ± 0.3V P27 pin 4
Fan 15V 15.0V ± 0.5V P10 pin 1
Fan 5V 5.2V ± 0.3V P10 pin 4
PFC 380V ± 15V C447(+)
8.2. Driver Set-up
8.2.1. Item / Preparation
1.Input an APL 100 % white signal.
2.Set the picture controls: -
Picture mode: Normal
White balance: Cool
Aspect: 16:9
8.2.2. Adjustments
Adjust driver section voltages referring the panel data on the
panel data label.
Name Test Point Voltage Volume
Vsus TPVSUS
(SS) 170V ± 1V R540 (P)
Vbk TPVBK (SC) 155V ± 5V R6443 (SC)
Ve TPVE (SS) 150V ± 1V R6774 (SS)
Vset TPVSET
(SC) 218V ± 6V ---
Vad TPVAD (SC) -90V ± 1V R6477 (SC)
Vscn TPVSCN
(SC) Vad*+118V ± 2V ---
Vda TPVDA (SS) 67V ± 1V R537 (P)
*See the Panel label.
8 Adjustment Procedure
10

8.3. Initialization Pulse Adjust
1.Input a Cross hatch signal.
2.Set the picture controls: -
Picture mode: Normal
White balance: Cool
Adjust the indicated test point for the specified wave form.
Test point Volume Level
T1 TPSC1 (SC) --- 20 ± 15µ Sec
T2 TPSS1 (SS) R6557 (SC) 170 ± 20µ Sec
TPSC1 SCAN OUTPUT
TPSS1 SUSTAIN OUTPUT
VSET
VSUS
VSUS VBK
VSCN VAD
VE VSUS
INITIALIZE SCAN PRE-INITIALIZE
ADDRESS PERIOD
SUSTAIN
VE2
T2 170±20µs
T1
VSET2 7±3V
5.0±0.6µs
Sca
TPSC1
Sustai
TPSS1
11

8.4. P.C.B. (Printed Circuit Board) exchange
8.4.1. Caution
1. To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.
8.4.2. Quick adjustment after P.C.B. exchange
P.C.B. Name Test Point Voltage Volume
P Board Vsus TPVSUS (SS) 170V ± 1V R540 (P)
Vda TPVDA (SS) 67V ± 1V R537 (P)
SC Board Vbk TPVBK (SC) 155V ± 5V R6443 (SC)
Vad TPVAD (SC) -90V ± 1V R6477 (SC)
SS Board Ve TPVE (SS) 150V ± 1V R6774 (SS)
153V ± 1V
D1 Board White blance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals
*See the Panel label.
8.5. Adjustment Volume Location
8.6. Test Point Location
12
∗D1 board is not used for 42WP27C.

9 Service mode
9.1. CAT (computer Aided Test) mode
To exit the CAT mode, access the ID mode and switch off the main power.
9.1.1. IIC mode
Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on
the remote control.
Subject and item are mentioned on page 14.
To exit the IIC mode, press the R button on the remote control.
13

9.1.2. CD mode
Select the CD mode by Up/Down button on the remote control at the front page of CAT mode then press the Mute button on the
remote control more than 5 sec.
Micom software version (IC9354), this version can be upgrade by replace of new version IC.
To exit the CD mode, press the R button on the remote control.
9.1.3. SD mode
Select the SD mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the
remote control.
To exit the SD mode, press the R button on the remote control.
14

9.2. IIC mode structure (following items value is sample data.)
15

10 Alignment
10.1. Pedestal setting
** Adjust at the dark room.
1 Component Picture: PANEL W/B
( 2 i, 2 p, 62 i, Normal R cut off 1) Set R,G and B cut off to " 80 ".
720i or 1080i) White balance: G cut off
Cool B cut off
Gray Scale Aspect: Chroma Control:
Pattern 16:9 Gun off 2) Set Gun off to "5". (Only green pixels can emit.)
RGB Sub Adjust:
G Sub Bright 3) Adjust G Sub bright to start some of green pixels emission
at black 2% area and no emission at black 0% area.
Chroma Control:
Gun off 4) Set Gun off to "3". (Only blue pixels can emit.)
RGB Sub Adjust:
Black 2 % B Sub Bright ) Adjust B Sub bright to start some of blue pixels emission
Black 0 % at black 2% area and no emission at black 0% area.
Chroma Control:
Gun off 6) Set Gun off to "6". (Only red pixels can emit.)
RGB Sub Adjust:
R Sub Bright 7) Adjust R Sub bright to start some of red pixels emission
at black 2% area and no emission at black 0% area.
2 RGB(PC) Picture: 1) Change input to RGB signal.
Gray Scale Normal PANEL W/B
Pattern White balance: R,G,B cut off 2) Repeat procedure 1) to 7) of Component input signal.
Cool PANEL W/B
Aspect: R,G,B Drive
16:9
Black 2 %
Black 0 %
INPUT Alignment menu ProcedureEquipment Setting
16

10.2. NTSC panel white balance
1 NTSC Color Picture: 1) Find the nearest area to brightness of 10 cd/m 2 as Lo
Gray Scale Analyzer Normal Sub Adjust light by color sensor.
Pattern White balance: Sub Bright 2) Adjust Sub bright to set Lo light level to 10 cd/m
2
Cool exactly.
Aspect: PANEL W/B
16:9 G cut off 3) Set G cut off to " 80 ".
PANEL W/B
B cut off 4) Adjust B and R cut off to set color temperature as
R cut off sho n Fig.-01.
High light 75% Sub Adjust
Lo light 15% Sub Bright 5) If Sub Bright is changed re-adjust it to set Lo light
to 10 cd/m
2 .
6)Find 75% of hite area by color sensor.
PANEL W/B
G Drive 7) Set G Drive to " E8 ".
PANEL W/B
B Drive 8) Adjust B and R Drive to set color temperature
R Drive as sho n Fig.-01.
9) Repeat item 4) to 7) to set both Lo light and
high light.
PANEL W/B
R,G,B Drive 10) Increase same steps of R, G and B Drive to set
R,G,B Drive largest level of 3 color drive to "FC".
PANEL W/B
R,G,B cut off 11) Re-adjust Lo light level again.
Color Temp. x y
Cool(Hi) 0.272 0.290
Normal(Mid) 0.288 0.296
Warm(Lo ) 0.313 0.329
Fig. -01
2 Picture: 1) Change hite balance to "Normal".
Normal PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.
Normal PANEL W/B
Aspect: R,G,B Drive
16:9
3 Picture: 1) Change hite balance to "Warm".
Normal PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.
Warm PANEL W/B
Aspect: R,G,B Drive
16:9
4 Picture: Picture Menu 1) Change color templature to "Cool".
Normal Sub Adjust
White balance: Sub Bright 2)Re-set Sub bright to "30"
Cool
Aspect:
16:9
INPUT Alignment menu ProcedureEquipment Setting
17

10.3. PAL/SECAM panel white balance
1 PAL Color Picture: 1) Find the nearest area to brightness of 10 cd/ 2 as Low
Gray Scale Analyzer Nor al Sub Adjust light by color sensor.
Pattern White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/ 2
Cool exactly.
Aspect: PANEL W/B
16:9 G cut off 3) Set G cut off to " 80 ".
PANEL W/B
B cut off 4) Adjust B and R cut off to set color te perature as
R cut off shown Fig.-02.
High light 75% Sub Adjust
Low light 15% Sub Bright 5) If Sub Bright is changed re-adjust it to set Low light
to 10 cd/ 2.
6)Find 75% of white area by color sensor.
PANEL W/B
G Drive 7) Set G Drive to " E8 ".
PANEL W/B
B Drive 8) Adjust B and R Drive to set color te perature
R Drive as shown Fig.-02.
9) Repeat procedure 4) to 7) to set both Low light and
high light.
PANEL W/B
R,G,B Drive 10) Increase sa e steps of R, G and B Drive to set
R,G,B Drive largest level of 3 color drive to "FC".
PANEL W/B
R,G,B cut off 11) Re-adjust Low light level again.
Color Te p. x y
Cool(Hi) 0.272 0.290
Nor al(Mid) 0.288 0.296
War (Low) 0.313 0.329
Fig. -02
2 Picture: 1) Change white balance to "Nor al".
Nor al PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool ode.
Normal PANEL W/B
Aspect: R,G,B Drive
16:9
3 Picture: 1) Change white balance to "War ".
Nor al PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool ode.
Warm PANEL W/B
Aspect: R,G,B Drive
16:9
4 Picture: Picture Menu 1) Change color te plature to "Cool".
Nor al Sub Adjust
White balance: Sub Bright 2)Re-set Sub bright to "30"
Cool
Aspect:
16:9
INPUT Align ent enu ProcedureEquip ent Setting
18

Picture: 1) Write down each color temaparature of R,G,B drive and
Normal Cut off data as follows.
Aspect:
16:9
White balance:
White
Balance Cool Normal Warm
Cool R Drive
Normal G Drive
Warm B Drive
R Cut off
G Cut off
B Cut off
SECAM signal 2) Input SECAM signal.
3) Copy PAL R,G,B drive and cut off data of each white
balance mode to SECAM position.
Alignment menu ProcedureEquipment Setting
19

10.4. PC/RGB panel white balance
1 PC Color Picture: 1) Find the nearest area to brightness of 10 cd/ 2 as Low
Gray Scale Analyzer Nor al Sub Adjust light by color sensor.
Pattern White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/
2
Cool exactly.
Aspect: PANEL W/B
16:9 G cut off 3) Set G cut off to " 80 ".
PANEL W/B
B cut off 4) Adjust B and R cut off to set color te perature as
R cut off shown Fig.-03.
High light 75% Sub Adjust
Low light 15% Sub Bright 5) If Sub Bright is changed re-adjust it to set Low light
to 10 cd/
2 .
6)Find 75% of white area by color sensor.
PANEL W/B
G Drive 7) Set G Drive to " E8 ".
PANEL W/B
B Drive 8) Adjust B and R Drive to set color te perature
R Drive as shown Fig.-03.
9) Repeat ite 4) to 7) to set both Low light and
high light.
PANEL W/B
R,G,B Drive 10) Increase sa e steps of R, G and B Drive to set
R,G,B Drive largest level of 3 color drive to "FC".
PANEL W/B
R,G,B cut off 11) Re-adjust Low light level again.
Color Te p. x y
Cool(Hi) 0.272 0.290
Nor al(Mid) 0.288 0.296
War (Low) 0.313 0.329
Fig. -03
2 Picture: 1) Change white balance to "Nor al".
Nor al PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool ode.
Normal PANEL W/B
Aspect: R,G,B Drive
16:9
3 Picture: 1) Change white balance to "War ".
Nor al PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool ode.
Warm PANEL W/B
Aspect: R,G,B Drive
16:9
4 Picture: Picture Menu 1) Change color te plature to "Cool".
Nor al Sub Adjust
White balance: Sub Bright 2)Re-set Sub bright to "30"
Cool
Aspect:
16:9
INPUT Align ent enu ProcedureEquip ent Setting
20