Toshiba TDP-FF1A User manual

SERVICE MANUAL
FILE NO. 330-200603GR
LED DATA PROJECTOR
TDP-FF1A
The above models are classified as green product (s) (*1), as indicated by the underlined serial number (s).
This Service Manual describes replacement parts for green product (s). When repairing any green product (s), use
the parts described in this manual and lead-free solder (*2).
For (*1) and (*2) , see the next page.
Published in Japan, March 2006GREEN© TOSHIBA CORPORATION

(*1) GREEN PRODUCT PROCUREMENT
The EC is actively promoting the WEEE & RoHS Directives that define standards for recycling
and reuse of Waste Electrical and Electronic Equipment and for the Restriction of the use of
certain Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit any
marketing of new products containing the restricted substances.
Increasing attention is given to issues related to the global environmental. Toshiba Corporation
recognizes environmental protection as a key management tasks, and is doing its utmost to
enhance and improve the quality and scope of its environmental activities. In line with this,
Toshiba proactively promotes Green Procurement, and seeks to purchase and use products,
parts and materials that have low environmental impacts.
Green procurement of parts is not only confined to manufacture. The same green parts used in
manufacture must also be used as replacement parts.
(*2) LEAD-FREE SOLDER
This product is manufactured using lead-free solder as a part of a movement within the consumer
products industry at large to be environmentally responsible. Lead-free solder must be used in
the servicing and repair of this product.
WARNING
This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !
The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to 104°F
(30°C to 40°C). Use of a soldering iron designed for lead-based solders to repair product made
with lead-free solder may result in damage to the component and or PCB being soldered. Great
care should be made to ensure high-quality soldering when servicing this product especially
when soldering large components, through-hole pins, and on PCBs as the level of heat
required to melt lead-free solder is high.

FF1
i
Preface
This manual is applied to FF1 0.55” DMD SVGA (S8) digital projection system. It’s the mode
of single Panel, Osram LED module and 800(H) x 600(V) resolution. The manual gives you a
brief description of basic technical information to help in service and maintaining the product.
Your customers will appreciate the quick response time when you immediately identify prob-
lems that occur with our products. We expect your customers will appreciate the service that
youofferthem.
This manual is for technicians and people who have an electronic background. Send the
product back to the distributor for repairing and do not attempt to do anything that is complex
or is not mentioned in the troubleshooting.
NOTICE :
The information found in this manual is subject to change without prior notice.Any subsequent
changes made to the data herein will be incorporated in further edition.
Copyright 2006, February
All Rights Reserved
Manual Version 1.0

TableofContents
Chapter1Introduction 1-1
Highlight1-1
MechanicalSpecifications1-2
ElectricalSpecifications1-2
BatterySpecifications1-3
OpticalSpecifications1-4
Environmental1-5
CompatibleMode 1-6
Chapter2DisassemblyProcess 2-1
EquipmentNeeded 2-1
DisassembleTop Cover,MainBoard,Fan Module,LEDBoard
and Speaker2-2
DisassembleFrontCover,IRLens,Engine Module,FocusRing
andDMDModule 2-5
DisassembleI/O Board,PowerBoardand BatteryBoard 2-7
Chapter3Troubleshooting 3-1
EquipmentNeeded 3-1
MainProcedure 3-2
LED/Icon Message 3-3
Chapter4Function Testand AlignmentProcedure 4-1
TestEquipmentNeeded 4-1
ServiceMode 4-1
TestCondition 4-2
InspectionProcedure 4-2
Chapter5FirmwareUpgradeProcedure 5-1
EquipmentNeeded 5-1
HardwareSetup Procedure 5-2
FirmwareSoftwareInstallationProcedure 5-2
FirmwareUpgrade Procedure 5-6
Chapter6 Spare Parts 6-1
FF1
ii

1-1 FF1
No Item Description
1 DMD One panel 0.55” DMD SVGA projection system with 15 ANSI
lumens
2 Lamp Osram LE ATB A2A LED module
3 Weight Light weight Approx. 565 Grams, (1.25 lbs)
4 Resolution True 800 x 600 resolution, 16.7M True colors
5Video capabil-
ity
Build-in full screen NTSC/PAL/SECAM/HDTV (480 i/p, 576i/p,
720p, 1080i) video capabilities with a Composite terminal
6 Expandiability UXGA/SXGA/XGA/SVGA/VGA/MAC compatibility with one D-
sub 15-pin input terminal
7 Language On-screen menu with 8 languages
8 Auto function
Auto image re-sizing to 800 x 600 full screen
Auto detection of computer signal input
Auto Image synchronization (Auto-tracking /frequency /posi-
tion adjustment)
Chapter 1
Introduction
1-1 Highlight

1-2 FF1
No Item Description
1Dimensions
(WxHxD) 140mm x 48mm (min. front view) x 102mm
2Cooling
System
One fan with low system acoustic noise level
Maximum touch temperature follows the UL60950 regulation
3 Cabinet Provides space for PCB boards, fan, optical engine, speaker and
LED
4Keystone
correction +/ -16 degree
No Item Description
1Power
Supply
External adapter: 100--240V AC, 50/60 Hz input; 15V DC, 4A
output.
System power input: 15V DC
2Power
Consumption
< 18W, where USB power(5V, 0.5A) is used to drive an USB-
HDD.
3 Terminals
One D-Sub 15-pin female connector for analog RGB / HDTV /
compoment video
One Phone Jack for audio input
One Phone Jack for headphone out
One RCA Jack for Composite Video Input
USB connector for USB pendrive
4Input signal
spec.
Hsync Frequency: 15 ~ 100 kHz
Vsync Frequency: 43 ~ 85 Hz
Video Signal RGB (PC)
-Analog RGB 0.7 Vp-p, 75 ohms, separate TTL H&V Sync
-Analog RGB 1.0 Vp-p, 75 ohms, Sync on Green
-Analog RGB 0.7 Vp-p, 75 ohms, composite TTL Sync
Video
-Composite video 1.0 Vp-p, 75 ohms
-S-video Luminance 0.714 Vp-p, 75 ohms
-Chrominance 0.286 Vp-p, 75 ohms
1-3 Electrical Specifications
1-2 Mechanical Specifications

1-3 FF1
No Item Description
5System Con-
troller
TI DDP2000 component set,
Micronas VPX3226 Video decoder
ADI AD9883 compatible A/D converter
Atmel AT76C120 Digital Image Processor
6Video Com-
patibility
Standards :
-NTSC: M (3.58MHz), 4.43 MHz
-PAL: B, D, G, H, I, M, N
-SECAM: B, D, G, K, K1, L
-HDTV: 480i/p, 576i/p, 720p, 1080i
7
Wireless
Remote Con-
troller
One IR receiver in front
8 Audio 0ne 4-ohm 0.5W speaker
9
On-Screen
Display
Menu
8 languages selection: Japanese, English, French, German,
Italian, Spanish, Simplified Chinese, Swedish.
1-4 Battery Specifications
No Item Description
1 Battery cell Samsung 18650, 2200mAH, Li-Ion, Rechargable
2 Capacity 4400mAH, 7.4V, 4-cell, 2S2P
3 Battery life ~1.8 hours for operation at 18W.
4 Weight 250g
5Dimentions
(WxDxH)(mm) 140 x 21 x 57
6 Charging time ~3.5 hours, non-operating and operating
7Charging
method CC-CV
8Charging Cur-
rent 2000mA (If thermal test OK, will increase to 2200mA)

1-4 FF1
No Item Description
1Projection
lens F# 2.6, Fixed Lens.
2Focus
Range
40cm to 2.5m with full optical performance
30cm to 4m mechanical travel
3Throw
Ratio 1.8
4 Brightness 15 ANSI Lumens ( Typical ) / 12 ANSI Lumens ( Minimum)
5 Contrast 1500:1 Typical / 1000:1 Minimum (Full on / full off)
6 Uniformity 75% Typical / 60% Minimum (Japan standard)
7White color
uniformity
In white screen, the color coordinate of any two poits of ANSI 13
p ∆x<=0.02, ∆y<=0.02t
8 Lens Offset 110% +/- 10%
9TV distor-
tion <1.0% (at 100% offset condition)
1-5 Optical Specifications

1-5 FF1
No Item Description
1Tempera-
ture
Operating: 5 - 35°C
Storage: -20- 60°C
2Maximum
Humidity
Operating: 5 - 35°C, 80% RH (Max.), non-condensing
Storage: -20 - 60°C, 80%RH (Max.), non-condensing
3Acoustic
noise level 30+/-2 dB(A), typical, at 23 +/-2 degree C.
4 Lamp life >10,000 Hours
5 Altitude
Operating 0~2,500 ft, for 5°C~35°C
2,500~5,000 ft, for 5°C~30°C
5,000~10,000 ft, for 5°C~25°C
Storage 40,000 ft
1-6 Environmental

1-6 FF1
1-7 Compatible Mode
Analog
Compatibility Resolution V-Sync[Hz] H-Sync[KHz]
VGA 640x350 70 31.5
640x350 85 37.9
640x400 85 37.9
640x480 60 31.5
640x480 72 37.9
640x480 75 37.5
640x480 85 43.3
720x400 70 31.5
720x400 85 37.9
SVGA 800x600 56 35.2
800x600 60 37.9
800x600 72 48.1
800x600 75 46.9
800x600 85 53.7
XGA 1024x768 60 48.4
1024x768 70 56.5
1024x768 75 60
1024x768 85 68.7
SXGA 1152x864 70 63.8
1152x864 75 67.5
1152x864 85 77.1
1280x1024 60 63.98
1280x1024 75 79.98
SXGA+ 1400x1050 60 63.98
UXGA *Note(1) 1600x1200 60 75
MAC LC 13” 640x480 66.66 34.98
MAC II 13” 640x480 66.68 35
MAC 16” 832x624 74.55 49.725
MAC 19” 1024x768 75 60.24
MAC 1152x870 75.06 68.68
MAC G4 640x480 60 31.35
i Mac DV 1024x768 75 60
i Mac DV 1152x870 75 68.49
i Mac DV 1280x960 75 75

2-1
FF1
Item Photo Item Photo
Screw Bit
(+) :107
Hex Sleeves
5mm
Hex
Sleeves
6mm
Tweezers
2-1 Equipment Needed
Chapter 2
Disassembly Process

2-2
FF1
FF1
2-2 Disassemble Top Cover, Main Board, Fan Module, LED
Board and Speaker
No Procedure Photo
1 Unscrew 2 screws to re-
move VGA Cover.
2
Unscrew 6 screws to re-
move Top Cover.
Note: Please remove Top Cover
rightwards.
Left Side
Rear Side
Bottom Side
Left Side
Move rightwards
Top Cover

2-3
FF1
No Procedure Photo
3Unscrew 3 screws and un-
plug 1 connector to remove
Main Board.
Main Board Fan Module

2-4
FF1
FF1
No Procedure Photo
4Unscrew 3 screws, 1 hex
screw and unplug 1 connec-
tor to remove LED Board
5Remove Speaker, Rubber
and Mesh directly
Hex screw
LED Board
Speaker Rubber
Mesh

2-5
FF1
No Procedure Photo
1Loosen 3 tenons to remove
Front Cover and IR Lens.
2
Unscrew 4 screws to re-
move Engine Module and
unplug 1 connector from En-
gine Module.
Front Cover
IR Lens
Engine Module
Connector
2-3 Disassemble Front Cover, IR Lens, Engine Module,
Focus Ring and DMD Module

2-6
FF1
FF1
No Procedure Photo
3Unscrew 3 screws to re-
move Focus Ring
4
Unscrew 4 hex screws to
remove DMD Board, DMD
Chip and so on.
Note: please re-assemble
the parts in the diagonal
way.
Focus Ring
DMD Mask
DMD Board
DMD Antidusk
Rubber
DMD Chip
DMD
Rubber
DMD Plate
DMD Socket

2-7
FF1
No Procedure Photo
1Unscrew 2 screws to re-
move I/O Board
2Unscrew 4 hex screws to
remove Power Board
I/O Board I/O Board Bracket
2-4 Disassemble I/O Board, Power Board and Battery
Board
Power Board

2-8
FF1
FF1
No Procedure Photo
3
1. Unscrew 3 screws and 2
hex screws
2. Use a tweezers to take
off Battery Connector Cover
while lifting Battery Board.
3. Remove Battery Board in
the upper right direction.
Notice: please set “Power Switch” button to “OFF”
status before disassembling Battery Board.
1
2
3
Battery Connector Cover
Battery Board

2-9
FF1
No Procedure Photo
4
Unscrew 1 screw to remove
Micro Switch and Micro
Switch Frame
5Loosen Elevator Foot Rub-
ber
Micro Switch Micro Switch Frame
Elevator Foot Rubber

3-1 FF1
3-1 Equipment Needed
- PC or Pattern Generator
- DVD Player (Video, S-Video, Audio)
- Quantum Data 802B or CHROMA 2327
3-2 Main Procedure
No Symptom Procedur
1No Power
- Check Battery or Power source (DC 15V)
- Ensure all connectors are securely connected and aren’t
broken
- Check Battery Board
- Check Power Board
- Check Main Board
2Auto Shut
Down
Please refer to page 3-3 note LED/Icon Message.
3No Image
- Ensure the Signal Cable and Source work
(If you connect multiple sources at the same time, use the
“Input” button on the control panel to swtich)
- Ensure all connectors are securely connected and aren’t
broken
- Check Main Board (VGA/USB), or IO Board (Video)
- Check LED Board
- Check DMD Board
- Check DMD Chip
- Check Engine Module
4No Light
On
- Ensure all connectors are securely connected and aren’t bro-
ken
- Check Battery Board
- Check Power Board
- Check Main Board
- Check LED Board
- Check Engine Module
Chapter 3
Troubleshooting