TQ TQM E40S Series User manual

TQMxE40S
User's Manual
TQMxE40S UM 0101
30.06.2022

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page i
TABLE OF CONTENTS
1. ABOUT THIS MANUAL................................................................................................................................................................................1
1.1 Copyright and Licence Expenses............................................................................................................................................................1
1.2 Registered Trademarks..............................................................................................................................................................................1
1.3 Disclaimer......................................................................................................................................................................................................1
1.4 Imprint............................................................................................................................................................................................................1
1.5 Service and Support...................................................................................................................................................................................1
1.6 Tips on Safety ...............................................................................................................................................................................................2
1.7 Symbols and Typographic Conventions..............................................................................................................................................2
1.8 Handling and ESD Tips ..............................................................................................................................................................................2
1.9 Naming of Signals .......................................................................................................................................................................................3
1.10 Further Applicable Documents / Presumed Knowledge................................................................................................................3
2. INTRODUCTION............................................................................................................................................................................................4
2.1 Functional Overview ..................................................................................................................................................................................4
2.2 SMARC Specification Compliance..........................................................................................................................................................5
2.3 TQMxE40S Variants.....................................................................................................................................................................................5
2.4 Accessories....................................................................................................................................................................................................5
3. FUNCTION......................................................................................................................................................................................................6
3.1 TQMxE40S Block Diagram ........................................................................................................................................................................6
3.2 Electrical Characteristics............................................................................................................................................................................6
3.2.1 Supply Voltage.............................................................................................................................................................................................6
3.2.2 Power Consumption ..................................................................................................................................................................................7
3.2.2.1 Real Time Clock Power Consumption...................................................................................................................................................8
3.3 Environmental conditions........................................................................................................................................................................8
3.4 System Components..................................................................................................................................................................................9
3.4.1 CPUs ................................................................................................................................................................................................................9
3.4.2 Graphics .........................................................................................................................................................................................................9
3.4.3 Memory....................................................................................................................................................................................................... 10
3.4.3.1 LPDDR4 SDRAM........................................................................................................................................................................................ 10
3.4.3.2 eMMC........................................................................................................................................................................................................... 10
3.4.3.3 SPI Boot Flash ............................................................................................................................................................................................ 10
3.4.3.4 EEPROM....................................................................................................................................................................................................... 10
3.4.4 Real Time Clock......................................................................................................................................................................................... 10
3.4.5 Trusted Platform Module....................................................................................................................................................................... 10
3.4.6 TQ flexible I/O configuration (TQ-flexiCFG) ..................................................................................................................................... 11
3.5 Interfaces .................................................................................................................................................................................................... 11
3.5.1 PCI Express ................................................................................................................................................................................................. 11
3.5.2 Gigabit Ethernet ....................................................................................................................................................................................... 11
3.5.3 Serial ATA.................................................................................................................................................................................................... 11
3.5.4 Digital Display Interface......................................................................................................................................................................... 11
3.5.5 LVDS Interface........................................................................................................................................................................................... 12
3.5.6 USB 2.0 Interfaces..................................................................................................................................................................................... 12
3.5.7 USB 3.0 Interfaces..................................................................................................................................................................................... 12
3.5.8 SD Card Interface...................................................................................................................................................................................... 12
3.5.9 General Purpose Input/Output............................................................................................................................................................ 12
3.5.10 Audio Interfaces........................................................................................................................................................................................ 12
3.5.11 CAN interfaces........................................................................................................................................................................................... 12
3.5.12 I2C Bus .......................................................................................................................................................................................................... 13
3.5.13 SMBus / Power Management I2C Bus................................................................................................................................................. 13
3.5.14 Serial Peripheral Interface...................................................................................................................................................................... 13
3.5.15 eSPI ............................................................................................................................................................................................................... 13
3.5.16 Serial Ports.................................................................................................................................................................................................. 13
3.5.17 Watchdog Timer....................................................................................................................................................................................... 13
3.6 Connectors & LEDs................................................................................................................................................................................... 13
3.6.1 SMARC Connector.................................................................................................................................................................................... 13
3.6.2 Debug LED.................................................................................................................................................................................................. 14
3.7 SMARC Connector Pinout...................................................................................................................................................................... 14
3.7.1 Signal Assignment Abbreviations....................................................................................................................................................... 14
3.7.2 SMARC Connector Pin Assignment .................................................................................................................................................... 15
4. MECHANICS................................................................................................................................................................................................ 21

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page ii
4.1 TQMxE40S Dimensions........................................................................................................................................................................... 21
4.2 Heat Spreader Dimensions.................................................................................................................................................................... 22
4.3 Mechanical and Thermal Considerations ......................................................................................................................................... 23
4.4 Protection against external effects..................................................................................................................................................... 23
4.5 Label placement....................................................................................................................................................................................... 23
5. SOFTWARE.................................................................................................................................................................................................. 24
5.1 System Resources..................................................................................................................................................................................... 24
5.1.1 I2C Bus .......................................................................................................................................................................................................... 24
5.1.2 SMBus .......................................................................................................................................................................................................... 24
5.1.3 Memory Map.............................................................................................................................................................................................. 24
5.1.4 IRQ Map....................................................................................................................................................................................................... 24
5.2 Operating Systems................................................................................................................................................................................... 25
5.2.1 Supported Operating Systems............................................................................................................................................................. 25
5.2.2 Driver Download ...................................................................................................................................................................................... 25
5.3 TQ-Systems Embedded Application Programming Interface (EAPI)........................................................................................ 25
5.4 Software Tools........................................................................................................................................................................................... 25
6. BIOS .............................................................................................................................................................................................................. 26
6.1 Continue Boot Process ........................................................................................................................................................................... 26
6.2 Boot Manager............................................................................................................................................................................................ 26
6.3 Device Manager........................................................................................................................................................................................ 27
6.3.1 Driver Health Manager ........................................................................................................................................................................... 27
6.3.2 Network Device List................................................................................................................................................................................. 27
6.4 Boot From File ........................................................................................................................................................................................... 27
6.5 Administer Secure Boot.......................................................................................................................................................................... 27
6.6 Setup Utility ............................................................................................................................................................................................... 28
6.6.1 Main.............................................................................................................................................................................................................. 28
6.6.2 Advanced.................................................................................................................................................................................................... 28
6.6.2.1 Boot Configuration .................................................................................................................................................................................. 29
6.6.2.2 USB Configuration ................................................................................................................................................................................... 29
6.6.2.3 Chipset Configuration............................................................................................................................................................................. 29
6.6.2.4 ACPI Table/Features Control................................................................................................................................................................. 29
6.6.2.5 RC Advanced Menu ................................................................................................................................................................................. 30
6.6.2.6 SIO TQMx86................................................................................................................................................................................................ 42
6.6.2.7 Console Redirection ................................................................................................................................................................................ 43
6.6.2.8H2OUVE Configuration........................................................................................................................................................................... 44
6.6.2.9 SIO F81214E ............................................................................................................................................................................................... 44
6.6.2.10 NVM Express Information...................................................................................................................................................................... 44
6.6.3 Security........................................................................................................................................................................................................ 44
6.6.4 Power ........................................................................................................................................................................................................... 44
6.6.4.1 CPU Configuration................................................................................................................................................................................... 45
6.6.5 Boot .............................................................................................................................................................................................................. 46
6.6.6 Exit ................................................................................................................................................................................................................ 47
6.7 BIOS Update............................................................................................................................................................................................... 47
6.7.1 Step 1: Preparing USB Stick................................................................................................................................................................... 47
6.7.2 Step 2: Preparing Management Engine (ME) FW for update...................................................................................................... 48
6.7.3 Step 3a: Updating uEFI BIOS via EFI Shell......................................................................................................................................... 49
6.7.4 Step 2b: Updating uEFI BIOS via Windows Operating System................................................................................................... 50
6.7.5 Step 3: BIOS update check on the TQMxE40S Module ................................................................................................................. 51
7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 52
7.1 EMC............................................................................................................................................................................................................... 52
7.2 ESD................................................................................................................................................................................................................ 52
7.3 Shock & Vibration..................................................................................................................................................................................... 52
7.4 Operational Safety and Personal Security ........................................................................................................................................ 52
7.5 Reliability and Service Life..................................................................................................................................................................... 52
8. ENVIRONMENT PROTECTION................................................................................................................................................................ 53
8.1 RoHS ............................................................................................................................................................................................................. 53
8.2 WEEE®.......................................................................................................................................................................................................... 53
8.3 REACH®........................................................................................................................................................................................................ 53
8.4 EuP ................................................................................................................................................................................................................ 53
8.5 Battery.......................................................................................................................................................................................................... 53
8.6 Packaging ................................................................................................................................................................................................... 53
8.7 Other Entries.............................................................................................................................................................................................. 53
9. APPENDIX ................................................................................................................................................................................................... 54
9.1 Acronyms and Definitions..................................................................................................................................................................... 54
9.2 References.................................................................................................................................................................................................. 56

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TABLE DIRECTORY
Table 1: Terms and Conventions ............................................................................................................................................................................2
Table 2: TQMxE40S Power Consumption ............................................................................................................................................................7
Table 3: RTC Current Consumption .......................................................................................................................................................................8
Table 4: Intel®X6000E Series: Comparison of the SKUs...................................................................................................................................9
Table 5: Maximum Resolution.............................................................................................................................................................................. 10
Table 6: PCI Express Configuration Options..................................................................................................................................................... 11
Table 7: LED Boot Messages.................................................................................................................................................................................. 14
Table 8: Abbreviations used.................................................................................................................................................................................. 14
Table 9: SMARC Connector Pin Assignment .................................................................................................................................................... 15
Table 10: I2C Address Mapping on GP I2C Port................................................................................................................................................... 24
Table 11: Acronyms.................................................................................................................................................................................................... 54
Table 12: Further Applicable Documents and Links........................................................................................................................................ 56
FIGURE DIRECTORY
Figure 1: Block Diagram TQMxE40S ........................................................................................................................................................................6
Figure 2: Three-sided drawing TQMxE40S (dimensions in mm) ................................................................................................................. 21
Figure 3: Bottom view drawing TQMxE40S........................................................................................................................................................ 21
Figure 4: Standard Heat Spreader TQMxE40S-HSP (dimensions in mm).................................................................................................. 22
Figure 5: InsydeH2O BIOS Front Page.................................................................................................................................................................. 26
Figure 6: RC Advanced Menu ................................................................................................................................................................................. 48
Figure 7: PCH-FW Configuration menu............................................................................................................................................................... 48
Figure 8: Firmware Update configuration menu.............................................................................................................................................. 48
Figure 9: ME FW Image Re-Flash option ............................................................................................................................................................. 49
Figure 10: EFI Shell ....................................................................................................................................................................................................... 49
Figure 11: EFI Shell uEFI BIOS Update .................................................................................................................................................................... 49
Figure 12: Screen during BIOS Update................................................................................................................................................................... 50
Figure 13: TQMxE40S Debug LED............................................................................................................................................................................ 51
Figure 14: EFI BIOS Main Menu................................................................................................................................................................................. 51
REVISION HISTORY
Rev. Date Name Pos. Modification
0100 29-10-2021 Kreuzer Initial release
0101 30-06-2022 Kreuzer Figure 1 Correction: Ethernet 1 PHY is connected to SGMII

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page 1
1.
ABOUT THIS MANUAL
1.1 Copyright and Licence Expenses
Copyright protected © 2022 by TQ-Systems GmbH.
This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,
machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective
manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
BIOS-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the Operating System and applications are not taken into consideration and must be calculated / declared
separately.
1.2 Registered Trademarks
TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original
or license-free graphics and texts.
All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified
otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present
registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third
party.
1.3 Disclaimer
TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good
quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems
GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this
User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional
or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without
special notification.
1.4 Imprint
TQ-Systems GmbH
Gut Delling, Mühlstraße 2
D-82229 Seefeld
Tel: [phone]
Fax: [phone]
Email: [e-mail]
Web: www.tq-group.com/
1.5 Service and Support
Please visit our website www.tq-group.com for latest product documentation, drivers, utilities and technical support.
Through our website www.tq-group.com you could also get registered, to have access to restricted information and automatic
update services.
For direct technical support you could contact our FAE team by email: [e-mail]
Our FAE team can support you also with additional information like 3D-STEP files and confidential information which is not
provided on our public website.
For service / RMA, please contact our service team by email ([e-mail]) or your dedicated sales team at TQ.

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page 2
1.6 Tips on Safety
Improper or incorrect handling of the product can substantially reduce its life span.
1.7 Symbols and Typographic Conventions
Table 1: Terms and Conventions
Symbol Meaning
This symbol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.
A human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and also cause
damage / destruction of the component.
This symbol indicates a possible source of danger. Acting against the procedure described can lead to
possible damage to your health and / or cause damage / destruction of the material used.
This symbol represents important details or aspects for working with TQ-products.
Command
A font with fixed-width is used to denote commands, contents, file names, or menu items.
1.8 Handling and ESD Tips
General handling of your TQ-products
The TQ-product may only be used and serviced by certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is: do not touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring beforehand
that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the TQMxE40S and be dangerous to
your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,
or connect other devices.

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1.9 Naming of Signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.
The identification of the individual functions follows the above conventions.
Example: WE2# / OE#
1.10 Further Applicable Documents / Presumed Knowledge
•
Specifications and manual of the modules used:
These documents describe the service, functionality and special characteristics of the module used.
•
Specifications of the components used:
The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.
They contain, if applicable, additional information that must be taken note of for safe and reliable operation.
These documents are stored at TQ-Systems GmbH.
•
Chip errata:
It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.
The manufacturer’s advice should be followed.
•
Software behaviour:
No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
•
General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
Implementation information for the carrier board design is provided in the SMARC Design Guide (2) maintained by the SGET
(Standardization Group for Embedded Technologies). This Carrier Design Guide includes a very good guideline to design SMARC
carrier board.
It includes detailed information with schematics and detailed layout guidelines.
Please refer to the official SGET documentation for additional information (1).

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2.
INTRODUCTION
The TQ module TQMxE40S is based on the latest generation of Intel®Atom™, Pentium®and Celeron®CPUs (code name
“Elkhart Lake “). It achieves a new level of computing performance, security and media processing performance in a very
compact form factor to empower real-time computing, industrial automation, digital surveillance, aviation, medical, retail and
more.
The TQMxE40S corresponds to the internationally established SGET standard SMARC (V2.1). Six USB ports – including two USB
3.0 – and up to four PCIe lanes natively supported by the CPUs enable high bandwidth communication with peripherals and
additional interfaces on the carrier board. With the latest Intel®graphics processor integrated, the TQMxE40S delivers 4K high
resolution graphics output, immersive 3D processing and also greatly increased video encode and playback performance.
Time coordinated computing capabilities enable time synchronized processes within IoT networks and industrial control
applications. On-board eMMC and the option for LVDS or native eDP enable flexibility and reduce overall BOM cost.
The integrated TQMx86 board controller enables high flexibility through “flexiCFG“ and supports thermal management,
watchdog, 16550 compatible UARTs, I2C controllers, and GPIO handling. Combined with options like conformal coating and
optimized cooling solutions the TQMxE40S perfectly fits for mobile, low power, low profile and battery driven applications in
multiple vertical markets like industrial automation, medical devices, transportation and others.
2.1 Functional Overview
The following key functions are implemented on the TQMxE40S:
CPU:
•Intel®Atom®X6000E Series: „Elkhart Lake“ with different SKUs
•optimized for Embedded, Industrial Functional Safety or PC Client applications
Memory:
•LPDDR4/4x: 4 Gbyte, 8 Gbyte, 16 Gbyte with up to 4267MT/s and optional In Band ECC (IBECC)
•eMMC 5.1 on-board flash
•EEPROM: 32 kbit
Graphics:
•2 × Digital Display Interface (DDI) (DP 1.2/1.3/1.4, HDMI 1.4b/2.0b)
•1 × Embedded Digital Display Interface (eDDI) or LVDS interface (eDP 1.3 or LVDS)
Peripheral interfaces:
•2 × Gigabit Ethernet (Marvell 88E1512)
•1 × SATA 3.0 (up to 6 Gb/s), eSATA capable
•4 × PCIe Gen3 (up to 8 GT/s)
•2 × USB 3.2 (with up to 10Gb/s and USB 2.0 backward compatibility)
•6 × USB 2.0 (incl. USB 3.2 ports)
•1 × Intel®HD audio (HDA) and I2S or 2x I2S
•1 × I2C (General Purpose; master/slave capable)
•1 × SMBus
•1 × SPI (for external uEFI BIOS flash)
•1 x eSPI interface
•4 × Serial port (Rx/Tx, legacy compatible)
•2 × CAN interface
•1 × SD card interface
•14 GPIO signals (multiplexed with fan / camera control and HD audio Reset)
Security components:
•TPM (SLX9670 TPM 2.0)

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Others:
•TQMx86 board controller with Watchdog and TQ-flexiCFG
Power supply:
•Voltage: 4.75 V to 5.25 V
3 V Battery for RTC
Environment:
•Standard Temperature: 0 °C to +60 °C
•Extended Temperature: –40 °C to +85 °C
Form factor / dimensions:
•SMARC short form factor; 82 mm × 50 mm
2.2 SMARC Specification Compliance
The TQMxE40S is compliant to the SMARC Hardware Specification (Version 2.1).
2.3 TQMxE40S Variants
The TQMxE40S is available in several standard configurations:
Please visit www.tq-group.com/TQMxE40S for a complete list of standard variants.
Other configurations are available on request.
Standard configuration features are:
•eDP or LVDS
•CPU version
•Memory configuration (RAM / eMMC)
•TPM
•Temperature range
Optional hardware and software configuration features:
•Conformal coating can be offered as custom specific add-on
•Custom specific GPIO configuration through TQ-flexiCFG
•Custom specific BIOS configuration
2.4 Accessories
TQMxE40S-HSP: Heat spreader for TQMxE40S according to the SMARC specification
Evaluation platform MB-SMARC-3:
•Mainboard for SMARC modules
•170 mm × 170 mm
•Interfaces: DP++, HDMI 2.0, eDP/LVDS, 2 × GbE, 1 × USB Type C, 1 x USB 3.0, 1 x USB 2.0, HDA and I²S Audio, Micro SD
card, 3 x M.2 socket (Key E, B, M), PCIe socket, up to 6 serial interfaces, 2 × CAN

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3.
FUNCTION
3.1 TQMxE40S Block Diagram
The following illustration shows the block diagram of the TQMxE40S:
Board Control
Power Mgmt
Watchdog
UART
I2C
GPIO
flexiCFG
SMARC 2.1 314-pin Card Edge Connection
eDP / DDI0LVDS/eDP
PCIe0
HSIO[5:2]
Ethernet 1
SPI
SATA 3.0
HSIO[10]
HDA & I2S
SATA
HDA & I2S
SDCard
SPI
PCIE (A:D)
DP++
USB 3.0
SD/SDIO
SDCard
SMB
SMBUS
DDI1
SGMII
USB 3.1
HSIO [1..0]
LPDDR4/4x
SMB
PCIe Gen 3 (4 x1 / 2 x2 / 1 x4)
USB 2.0 host
1x Device / Host; 1x USB 3.1 Host
eSPI
Power & System CTRL
PWM/FAN
Debug / JTAG
eMMC
eMMC
8 - 256 GB
SATA Gen 3 (0)
USB 2.0 (3:0)
HDA/I2S and second I2S
DDI1
eDPeDP/LVDS
SGMII
MDI
DDI2DP++
eMMC 5.1
SPI
4267MT/s
GbE PHY
LVDS-Bridge
CSI 0
CSI 1
EEPROM
FAN Ctrl.
SER (1:0)
Sys/PWR Ctrl
I2C_GP
GPIO
JTAG
USB 2.0
[3:0]
Intel® Atom
TM
Elkhart Lake
DDI0
HSUART
HSUARTSER (2:3)
Ethernet 0 RGMII 0
RGMIIMDI GbE PHY
Programmable
Service Engine
ARM7
Embedded
Controller
USB-C I2C
Power
4.75V – 5.25V
BIOS Flash
TPM 2.0
opt.
PCIe1 / UFS1
HSIO[9:8]
PCIe3 / UFS0
HSIO[7:6]
LPDDR4/4x
4x32 @ 4267 MT/s
up to 16 GB
with IBECC
LPDDR4/4x LPDDR4/4x
LPDDR4/4x LPDDR4/4x
SATA 3.0
HSIO[11]
CAN
CAN[1:0]
I2C_CAM0/11)
USB-C I2C
CAN[1:0]
eSPI
Figure 1: Block Diagram TQMxE40S
3.2 Electrical Characteristics
3.2.1 Supply Voltage
The TQMxE40S supports an input voltage from 4.75 V to 5.25 V.
The following supply voltages are specified at the SMARC connector:
•Main Power Rail: 4.75 V to 5.25 V max input ripple: ±100 mV
•VCC_RTC: 2.0 V to 3.3 V max input ripple: ±20 mV
The input voltages shall rise from 10 % of nominal to 90 % of nominal within 0.1 to 20 ms (0.1 ms ≤ Rise Time ≤ 20 ms).
There must be a smooth and continuous ramp of each DC output voltage from 10 % to 90 % of its final set point within the
regulation band.

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3.2.2 Power Consumption
The values below show voltage and power consumption details for the TQMxE40S.
The values were measured using the TQMxE40S and the MB-SMARC-3 carrier board.
The measurement was done with two power supplies, one for the TQMxE40S and one for the MB-SMARC-3 carrier board.
The power consumption of each TQMxE40S was measured running Windows®10, 64 bit and different LPDDR4x configurations.
All measurements were done at a temperature of +25 °C and an input voltage of +5.0 V.
The power consumption of the TQMxE40S depends on the application, the mode of operation and the operating system.
The power consumption was measured under the following conditions:
•
Suspend mode:
The system is in S5/S4 state, Ethernet port is disconnected.
•
Windows 10, 64 bit, idle:
Desktop idles, Ethernet port is disconnected.
•
Windows 10, 64 bit, maximum load:
These values show the maximum worst case power consumption, achieved by using the Intel®stress test tool to apply
maximum load to the cores only, and cores plus graphics engine, Ethernet port is connected (1000 Mbps Speed)
•
Windows 10, 64 bit, Suspend Mode:
The system is in S5/S4 state, Ethernet port is disconnected.
The following table shows the power consumption with different CPU configurations.
Table 2: TQMxE40S Power Consumption
Module Mode
Suspend (OS shut down) Win10, 64 bit idle Win10, 64 bit max. load
SKU6 Atom® x6413E 1.02 W 5.6 W 11.6 W
SKU7 Atom® x6425E 1.02 W 5.8 W 14.8 W
SKU8 Atom® x6212RE 1.02 W 4.8 W 8.4 W
SKU9 Atom® x6414RE 1.02 W 5.4 W 11.5 W
SKU10 Atom® x6425RE 1.02 W 5.8 W 14.6 W
Note: Power requirement
The power supplies on the carrier board for the TQMxE40S must be designed with enough reserve.
The carrier board should provide at least twice the maximum workload power of the TQMxE40S.
The TQMxE40S supports several low-power states. The power supply of the carrier board has to be
stable even with no load.

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3.2.2.1 Real Time Clock Power Consumption
The RTC (VCC_RTC) current consumption is shown below.
The values were measured at +25 °C under battery operating conditions.
Table 3: RTC Current Consumption
Integrated RTC Voltage Current
Intel®X6000E Series “Elkhart Lake” 3.0 V 3 μA
The current consumption of the RTC in the Intel®X6000E Series “Elkhart Lake” in the Product Family Datasheet (EDS) is specified
with 6 µA max at room temperature while the system is off. The values measured on several modules were lower than 3µA.
3.3 Environmental conditions
•Operating Temperature Standard: 0 °C to +60 °C
•Operating Temperature Extended: –40 °C to +85 °C
•Storage Temperature: –40 °C to +85 °C
•Relative humidity (operating / storage): 10 % to 90 % (non-condensing)
Attention: Maximum operating temperature
Do not operate the TQMxE40S without heat spreader or without heat sink!
The heat spreader is not a sufficient heat sink!

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3.4 System Components
3.4.1 CPUs
The TQMxE40S supports the Intel®X6000E Series.
The following list shows some key features of these CPUs:
•Quad and dual CPU cores with up to 3GHz
•Intel®64 Architecture
•Intel®Virtualization Technology (VT)
•In-Band ECC support
•Intel®Streaming SIMD Extensions 4.2 (Intel®SSE4.2)
•Intel®Enhanced Intel®SpeedStep®technology
•Intel®UHD Graphics
•4 Mbyte Cache
•Triple independent displays
Table 4: Intel®X6000E Series: Comparison of the SKUs
Mode Atom®
x6211E
Atom®
x6413E
Atom®
x6425E
Atom®
x6212RE
Atom®
x6414RE
Atom®
x6425RE
Atom®
x6200FE
Atom®
x6427FE
Use
Condition Embedded Embedded Embedded Industrial Industrial Industrial Industrial (FuSA)
Industrial
(FuSA)
CPU Cores 2 4 4 2 4 4 2 4
CPU
frequency 1.3 GHz 1.5 GHz 2 GHz 1.2 GHz 1.5 GHz 1.9 GHz 1.0 GHz 1.9 GHz
Burst
frequency 3 GHz 3 GHz 3 GHz -- -- -- -- --
UHD
Graphics
(Execution
Units)
16 EUs 16 EUs 32 EUs 16 EUs 16 EUs 32 EUs None 32 EUs
Temperature
Tjunction
-40 °C to
+105 °C
-40 °C to
+105 °C
-40 °C to
+105 °C
–40 °C to
+110 °C
–40 °C to
+110 °C
–40 °C to
+110 °C
–40 °C to
+110 °C
–40 °C to
+110 °C
Memory
Speed 3200 MT/s 3200 MT/s 3733 MT/s 3200 MT/s 3200 MT/s 4267 MT/s 2400 MT/s 4267 MT/s
Functional
Safety No No No No No No Yes Yes
Thermal
Design
Power (TDP)
6 W 9 W 12 W 6 W 9 W 12 W 4.5 W 12 W
3.4.2 Graphics
The Intel®X6000E Series CPUs includes an integrated Intel®UHD (Gen 11) graphics accelerator. It provides excellent 2D/3D
graphics performance with dual simultaneous display support.
The following list shows some key features of the Intel®X6000E Series CPUs:
•Graphics Technology (Gen 11 LP) with up to 32 Execution Units
•Hardware accelerated video decoding/encoding for H.264, MPEG2, MVC, VC-1, WMV9, H.265/HEVC, VP9, JPEG/MJPEG
•DirectX 12 support
•OpenGL 4.5, OpenCL 1.2 support
The TQMxE40S supports two Digital Display Interface (DDI) one eDP or LVDS interface at the SMARC connector.

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page 10
Table 5: Maximum Resolution
Display Maximum Display Resolution
LVDS 1920 × 1200 at 60 Hz (dual LVDS bus)
eDP 4096 × 2160 at 60 Hz
DP 4096 × 2160 at 60 Hz
HDMI 2.0b 4096 × 2160 at 60 Hz
3.4.3 Memory
3.4.3.1 LPDDR4 SDRAM
The TQMxE40S supports a memory-down 4x32bit LPDDR4x configuration running at up to 4267 MT/s and optional In Band ECC
(IBECC). The maximum memory size is 16 Gbyte. The available memory configuration can be either 4 Gbyte, 8 Gbyte, or 16 Gbyte.
3.4.3.2 eMMC
The TQMxE40S supports up to 256 Gbyte on-board eMMC 5.1 flash. The eMMC interface is not activated in BIOS default settings.
Attention: eMMC OS installation
The on-board eMMC Flash requires pre-configuration via EFI Shell before OS installation
(e.g. diskpart utility)
3.4.3.3 SPI Boot Flash
The TQMxE40S provides a 256 Mbit SPI boot flash. It includes the uEFI BIOS and the Intel®Converged Security Engine (CSE) which
is comparable to Trusted Execution Engine (TXE).
An external SPI boot flash can be used instead of the on-board SPI boot flash.
3.4.3.4 EEPROM
On the TQMxE40S there can be placed a 32 kbit serial EEPROM on the I2C_GP bus. This feature is optional.
3.4.4 Real Time Clock
The TQMxE40S includes a standard RTC (Motorola MC146818B) integrated in the Intel®X6000E Series CPU.
3.4.5 Trusted Platform Module
The TQMxE40S supports the Trusted Platform Module (TPM) 2.0 (Infineon SLB9670 controller).
Intel®X6000E Series CPU supports also a Firmware Trusted Platform Module (FTPM); this is a Trusted Platform Module 2.0
implementation in firmware. This feature can be configured in the BIOS.

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page 11
3.4.6 TQ flexible I/O configuration (TQ-flexiCFG)
The module includes a flexible I/O configuration feature, the TQ-flexiCFG.
Using the TQ-flexiCFG feature several I/O interfaces and functions can be configured via a programmable FPGA.
This feature enables the user to integrate special embedded features and configuration options in the TQMxE40S to reduce the
carrier board design effort. Here are some examples of the flexible I/O configuration:
•GPIO interrupt configuration
•Interrupt configuration via LPC Serial IRQ
•Serial Port handshake signals via GPIOs
•Integrate additional I/O functions, e.g. additional Serial, I2C, PWM controller or special power management
configurations
Please contact [e-mail] for further information about the TQ-flexiCFG.
3.5 Interfaces
3.5.1 PCI Express
The TQMxE40S with Intel®X6000E Series CPU supports a very flexible PCI Express configuration with up four PCI Express Gen3
ports.
With a customized BIOS the PCI Express lanes can be configured as follows:
Table 6: PCI Express Configuration Options
COM Express™ Port 0 – 3 Configuration Configuration
0 1 2 3 4 ports x1 Lane Configuration in the BIOS
0 2 3 1 Port X2 Lanes + 2 Ports X1 Lane Configuration via custom BIOS
0 2 1 Port X2 Lanes + 1 Port X2 Lanes Configuration via custom BIOS
0 1 Port X4 Lanes Configuration via custom BIOS
3.5.2 Gigabit Ethernet
The TQMxE40S provides two Marvell 88E1512 Ethernet PHY with 10/100/1000 Mbps speed.
The Ethernet LED functionality defined in the SMARC specification is currently not supported by the TQMxE40S module. Intel is
working on this issue.
3.5.3 Serial ATA
The TQMxE40S supports one SATA Gen3.0 interface which supports up to 6 Gb/s.
The integrated SATA host controller supports AHCI mode, the SATA controller no longer supports legacy IDE mode using
I/O space.
3.5.4 Digital Display Interface
The TQMxE40S supports three Digital Display Interfaces (DDI0, DDI1 & DDI2) at the SMARC connector.
The SMARC Primary Display interface supports either LVDS or eDP as an assembly option.
The SMARC Secondary Display interface (HDMI/DP1) supports DisplayPort (DP++) or HDMI/DVI with an appropriate level shifter
or retimer on the carrier board. Due to signal integrity and flexibility reasons there is no HDMI level shifter realized on the
module.
The SMARC Third Display interface (DP++) DisplayPort (DP++) or HDMI/DVI with an appropriate level shifter or retimer on the
carrier board.
The TQMxE40S supports the following maximum display resolutions:
•DisplayPort 1.4 up to 4096 × 2160 at 60 Hz
•Embedded DisplayPort 1.3 up to 4096 × 2160 at 60 Hz
•HDMI 2.0b up to 4096 × 2160 at 60 Hz
•HDMI 1.4b up to 3840 × 2160 @ 30 Hz
Please contact [e-mail] for further information about the display configuration.

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page 12
3.5.5 LVDS Interface
The TQMxE40S supports an LVDS interface which is provided through an on-board eDP to LVDS bridge.
The eDP to LVDS bridge supports single or dual LVDS signalling with colour depths of 18 bits per pixel or 24 bits per pixel up to
112 MHz and a resolution up to 1920 × 1200 @ 60 Hz in dual LVDS mode. The LVDS data packing can be configured either in
VESA or JEIDA format.
To support panels without EDID ROM, the eDP to LVDS bridge can emulate EDID ROM behaviour avoiding specific changes in
system video BIOS.
Please contact [e-mail] for further information about the LVDS configuration.
3.5.6 USB 2.0 Interfaces
The TQMxE40S supports six USB 2.0 and two USB 3.2 Gen2 ports with data rate up to 10 Gb/s at the SMARC connector. The
default setting for the USB SuperSpeed ports is 5 Gb/s (USB 3.2 Gen1).
If USB 3.2 Gen2 (10 Gb/s) transfer mode is required, SuperSpeed signals must be taken into account when designing a carrier.
3.5.7 USB 3.0 Interfaces
The TQMxE40S supports two SuperSpeed+ ports at the SMARC connector.
Note: USB Port Mapping
The USB 2.0 port 2 must be paired with USB 3.2 SuperSpeed port 2.
The USB 2.0 port 3 must be paired with USB 3.2 SuperSpeed port 3.
3.5.8 SD Card Interface
The TQMxE40S provides an SD card interface for 4-bit SD/MMC cards at the SMARC connector.
3.5.9 General Purpose Input/Output
The TQMxE40S provides 14 GPIO signals at the SMARC connector. These GPIO signals are shared with camera control, fan Control
and HD Audio Reset signals. They can be configured by software.
The GPIO signals are integrated in the TQ-flexiCFG block and can be configured flexible. Therefore the signals can also be used
for several special functions (see 3.4.6).
Please contact [e-mail] for further information about the GPIO configuration and their alternate uses.
3.5.10 Audio Interfaces
The TQMxE40S provides a High Definition Audio (HDA) and an I2S interface, which support Audio codecs at the SMARC
connector. The audio codec on the carrier board should be supported by the BIOS of the TQMxE40S. The HDA interface can also
be used as second I2S interface.
Please contact [e-mail] for further information regarding configuration and supported codecs.
3.5.11 CAN interfaces
The TQMxE40S provides two CAN interfaces. If a CAN interface is required, corresponding transceivers must be implemented on
the carrier.

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page 13
3.5.12 I2C Bus
The TQMxE40S supports a general purpose I2C bus via a dedicated LPC to I2C controller, integrated in the TQ-flexiCFG block.
The I2C host controller supports a clock frequency of up to 400 kHz and can be configured independently.
3.5.13 SMBus / Power Management I2C Bus
The TQMxE40S provides an I2C based System Management Bus (SMBus) interface. This bus is also called Power Management I2C
Bus.
3.5.14 Serial Peripheral Interface
The TQMxE40S provides an SPI interface. The SPI interface can only be used for SPI boot Flash devices.
3.5.15 eSPI
The TQMxE40S provides an eSPI interface where appropriate UARTs or SuperI/Os can be connected.
3.5.16 Serial Ports
The TQMxE40S offers up to four UARTs (Universal Asynchronous Receiver and Transmitter). The register set of SER0 and SER1 is
based on the industry standard 16550 UART. The UART operates with standard serial port drivers without requiring a custom
driver to be installed. The 16 byte transmit and receive FIFOs reduce CPU overhead and minimize the risk of buffer overflow and
data loss.
SER2 and SER3 are connected to the HSUART (High Speed UART) of the Intel®X6000E Series CPU.
TQ recommends preferring the usage of SER0 and SER1. There might be software compatibility or driver problems when using
the Intel®SIO UARTs.
3.5.17 Watchdog Timer
The TQMxE40S supports a freely programmable two-stage watchdog timer, integrated in the TQ-flexiCFG block.
There are four operation modes available for the watchdog timer:
•Dual-stage mode
•Interrupt mode
•Reset mode
•Timer mode
The timeout of the watchdog timer ranges from 125 ms to 1 h.
The SMARC specification does not support external hardware triggering of the watchdog. An external watchdog trigger can be
configured to GPIO pins at the SMARC connector with the TQ-flexiCFG feature.
3.6 Connectors & LEDs
3.6.1 SMARC Connector
A 314 pin 0.5 mm pitch card edge connector is realized on the TQMxE40S PCB. On the carrier board a connector mechanical
compatible to MXM3 graphic cards is used to contact the module. The stacking height is defined by the connector used on the
carrier (e.g. 1.5 mm, 2.7 mm, 5 mm, and 8 mm are available).

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page 14
3.6.2 Debug LED
The TQMxE40S includes a dual colour LED providing boot and BIOS information.
The following table shows some LED boot messages.
Table 7: LED Boot Messages
Red LED Green LED Remark
ON OFF Power supply error
ON ON S4/S5 state
BLINKING BLINKING S3 state
OFF BLINKING uEFI BIOS is booting
OFF ON uEFI BIOS boot is finished
3.7 SMARC Connector Pinout
This section describes the TQMxE40S SMARC connector pin assignment, which is compliant with the SMARC hardware
specification Version 2.1.
3.7.1 Signal Assignment Abbreviations
Table 8 lists the abbreviations used in Table 9.
Table 8: Abbreviations used
Abbreviation Description
GND Ground
PWR Power
I Input
I PU Input with pull-up resistor
I PD Input with pull-down resistor
O Output
OD Open drain output
IO Bi-directional
Note: Unused signals on the carrier board
If the input signals at the SMARC connector are not used, these signals can be left open on the carrier
board, since these signals have a termination on the TQMxE40S.

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page 15
3.7.2 SMARC Connector Pin Assignment
Table 9: SMARC Connector Pin Assignment
Pin Pin-Signal Description Type Level Remark
P1
SMB_ALERT#
SM Bus Alert# (interrupt) signal
I PU
1.8 V
P2
GND
Ground
GND
P3
CSI1_CK+
CSI differential clock input
I
LVDS D-PHY
N/A
P4
CSI1_CK–
CSI differential clock input
I
LVDS D-PHY
N/A
P5
GBE1_SDP
IEEE 1588 Trigger Signal
IO
3.3 V
P6
GBE0_SDP
IEEE 1588 Trigger Signal
IO
3.3 V
P7
CSI1_RX0+
CSI differential data input
I
LVDS D-PHY
N/A
P8
CSI1_RX0–
CSI differential data input
I
LVDS D-PHY
N/A
P9
GND
Ground
GND
P10
CSI1_RX1+
CSI differential data input
I
LVDS D-PHY
N/A
P11
CSI1_RX1–
CSI differential data input
I
LVDS D-PHY
N/A
P12
GND
Ground
GND
P13
CSI1_RX2+
CSI differential data input
I
LVDS D-PHY
N/A
P14
CSI1_RX2–
CSI differential data input
I
LVDS D-PHY
N/A
P15
GND
Ground
GND
P16
CSI1_RX3+
CSI differential data input
I
LVDS D-PHY
N/A
P17
CSI1_RX3–
CSI differential data input
I
LVDS D-PHY
N/A
P18
GND
Ground
GND
P19
GBE0_MDI3–
Gigabit Ethernet Controller: Media Dependent Interface
IO
GBE MDI
P20
GBE0_MDI3+
Gigabit Ethernet Controller: Media Dependent Interface
IO
GBE MDI
P21
GBE0_LINK100#
Link Speed Indication LED for 100 Mbps
OD
3.3 V tolerant
P22
GBE0_LINK1000#
Link Speed Indication LED for 1000 Mbps
OD
3.3 V tolerant
P23
GBE0_MDI2–
Gigabit Ethernet Controller: Media Dependent Interface
IO
GBE MDI
P24
GBE0_MDI2+
Gigabit Ethernet Controller: Media Dependent Interface
IO
GBE MDI
P25
GBE0_LINK_ACT#
Link / Activity Indication LED
OD
3.3 V tolerant
P26
GBE0_MDI1–
Gigabit Ethernet Controller: Media Dependent Interface
IO
GBE MDI
P27
GBE0_MDI1+
Gigabit Ethernet Controller: Media Dependent Interface
IO
GBE MDI
P28
GBE0_CTREF
Center-Tap reference voltage for Carrier Ethernet magnetics
PWR
P29
GBE0_MDI0–
Gigabit Ethernet Controller: Media Dependent Interface
IO
GBE MDI
P30
GBE0_MDI0+
Gigabit Ethernet Controller: Media Dependent Interface
IO
GBE MDI
P31
SPI0_CS1#
SPI0 Master Chip Select 1 output
O
1.8 V
P32
GND
Ground
GND
P33 SDIO_WP SD Card: Write Protect I PU 3.3 V
P34
SDIO_CMD
SD Card: Command line
IO
3.3 V
P35
SDIO_CD#
SD Card: Card Detect
I PU
3.3 V
P36
SDIO_CK
SD Card: Clock
O
3.3 V
P37
SDIO_PWR_EN
SD Card: Power enable
O
3.3 V
P38
GND
Ground
GND
P39
SDIO_D0
SD Card: data path
IO
3.3 V
P40
SDIO_D1
SD Card: data path
IO
3.3 V
P41
SDIO_D2
SD Card: data path
IO
3.3 V
P42
SDIO_D3
SD Card: data path
IO
3.3 V
P43
SPI0_CS0#
SPI0 Master Chip Select 0 output
O
1.8 V
P44
SPI0_CK
SPI0 Master Clock output
O
1.8 V
P45
SPI0_DIN
SPI0 Master Data input (CPU input, SPI device output)
I
1.8 V
P46
SPI0_DO
SPI0 Master Data output (CPU output, SPI device input)
O
1.8 V
P47
GND
Ground
GND
P48
SATA_TX+
Differential SATA transmit data Pair
O
SATA
P49
SATA_TX–
Differential SATA transmit data Pair
O
SATA
P50 GND Ground GND
P51
SATA_RX+
Differential SATA receive data Pair
I
SATA
P52
SATA_RX–
Differential SATA receive data Pair
I
SATA

User's Manual l TQMxE40S UM 0101 l © 2022, TQ-Systems GmbH Page 16
3.7.2 SMARC Connector Pin Assignment (continued)
Table 9: SMARC Connector Pin Assignment (continued)
Pin Pin-Signal Description Type Level Remark
P53
GND
Ground
GND
P54
ESPI_CS0#
ESPI master chip select
O
1.8 V
P55
ESPI_CS1#
ESPI master chip select
O
1.8 V
P56
ESPI_CK
ESPI master clock output
O
1.8 V
P57
ESPI_IO_1
ESPI master data I/O
IO
1.8 V
P58
ESPI_IO_0
ESPI master data I/O
IO
1.8 V
P59
GND
Ground
GND
P60
USB0+
USB differential pair
IO
USB
P61
USB0–
USB differential pair
IO
USB
P62
USB0_EN_OC#
USB over-current input / enable output (both OD)
IO PU
3.3 V
(1)
P63
USB0_VBUS_DET
Host power detection (when port is used as device)
I PD
5 V
P64
USB0_OTG_ID
USB OTG ID input, active high (high device)
I PU
3.3 V
P65
USB1+
USB differential pair
IO
USB
P66
USB1–
USB differential pair
IO
USB
P67
USB1_EN_OC#
USB over-current input / enable output (both OD)
IO PU
3.3 V
(1)
P68
GND
Ground
GND
P69
USB2+
USB differential pair
IO
USB
P70
USB2–
USB differential pair
IO
USB
P71
USB2_EN_OC#
USB over-current input / enable output (both OD)
IO PU
3.3 V
(1)
P72
RSVD
Reserved
P73
RSVD
Reserved
P74
USB3_EN_OC#
USB over-current input / enable output (both OD)
IO PU
3.3 V
(1)
P75
PCIE_A_RST#
PCIe Port reset output
O
3.3 V
P76
USB4_EN_OC#
USB over-current input / enable output (both OD)
IO PU
3.3 V
(1)
P77
PCIE_B_CKREQ#
PCIe Port B clock request (can be pulled low by TQMxE40S)
IO PU
3.3 V
P78
PCIE_A_CKREQ#
PCIe Port A clock request (can be pulled low by TQMxE40S)
IO PU
3.3 V
P79
GND
Ground
GND
P80
PCIE_C_REFCK+
Differential PCIe Link reference clock output
O
PCIe
P81
PCIE_C_REFCK–
Differential PCIe Link reference clock output
O
PCIe
P82
GND
Ground
GND
P83
PCIE_A_REFCK+
Differential PCIe Link reference clock output
O
PCIe
P84
PCIE_A_REFCK–
Differential PCIe Link reference clock output
O
PCIe
P85 GND Ground GND
P86
PCIE_A_RX+
Differential PCIe Link receive data pair
I
PCIe
P87
PCIE_A_RX–
Differential PCIe Link receive data pair
I
PCIe
P88
GND
Ground
GND
P89
PCIE_A_TX+
Differential PCIe Link transmit data pair
O
PCIe
P90
PCIE_A_TX–
Differential PCIe Link transmit data pair
O
PCIe
P91
GND
Ground
GND
P92
HDMI_D2+ / DP1_LANE0+
TMDS / HDMI data differential pair / DP data pair
O
DP++
DP++ only
P93
HDMI_D2– / DP1_LANE0–
TMDS / HDMI data differential pair / DP data pair
O
DP++
DP++ only
P94
GND
Ground
GND
P95
HDMI_D1+ / DP1_LANE1+
TMDS / HDMI data differential pair / DP data pair
O
DP++
DP++ only
P96
HDMI_D1– / DP1_LANE1–
TMDS / HDMI data differential pair / DP data pair
O
DP++
DP++ only
P97
GND
Ground
GND
P98
HDMI_D0+ / DP1_LANE2+
TMDS / HDMI data differential pair / DP data pair
O
DP++
DP++ only
P99
HDMI_D0– / DP1_LANE2–
TMDS / HDMI data differential pair / DP data pair
O
DP++
DP++ only
P100
GND
Ground
GND
P101
HDMI_CK+ / DP1_LANE3+
HDMI differential clock output pair / DP data pair
O
DP++
DP++ only
P102 HDMI_CK– / DP1_LANE3– HDMI differential clock output pair / DP data pair O DP++ DP++ only
P103
GND
Ground
GND
P104
HDMI_HPD / DP1_HPD
HDMI / DP Hot Plug Detect input
I PD
1.8 V
1: Configurable through TQ-flexiCFG.