Ublox SARA-G450 Series Quick setup guide

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SARA-G450
Quad-band GSM/GPRS module
System integration manual
Abstract
This document describes the features and the system integration of the SARA-G450 quad-band
GSM/GPRS cellular modules. These modules are a complete and cost efficient solution offering voice
and/or data communication in the compact SARA form factor.

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Document information
Title
SARA-G450
Subtitle
Quad-band GSM/GPRS module
Document type
System integration manual
Document number
UBX-18046432
Revision and date
R08
06-Aug-2020
Disclosure restriction
C1-Public
Product status
Corresponding content status
Functional sample
Draft
For functional testing. Revised and supplementary data will be published later.
In development /
Prototype
Objective specification
Target values. Revised and supplementary data will be published later.
Engineering sample
Advance information
Data based on early testing. Revised and supplementary data will be published later.
Initial production
Early production information
Data from product verification. Revised and supplementary data may be published later.
Mass production /
End of life
Production information
Document contains the final product specification.
This document applies to the following products:
Product name
Type number
Modem version
Application version
PCN reference
Product status
SARA-G450
SARA-G450-00C-00
09.02
A02.01
UBX-18067098
End of life
SARA-G450-00C-01
09.02
A03.17
UBX-20033037
Mass production
SARA-G450-01C-00
09.02
A04.23
UBX-20033037
Initial production
u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this document.
Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only permitted with the
express written permission of u-blox.
The information contained herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or
implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent documents,
visit www.u-blox.com.
Copyright © u-blox AG.

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Contents
Document information................................................................................................................................ 2
Contents ..........................................................................................................................................................3
1System description...............................................................................................................................6
1.1 Overview........................................................................................................................................................ 6
1.2 Architecture ................................................................................................................................................. 7
1.3 Pin-out ........................................................................................................................................................... 9
1.4 Operating modes....................................................................................................................................... 13
1.5 Supply interfaces ...................................................................................................................................... 15
1.5.1 Module supply input (VCC) ............................................................................................................. 15
1.5.2 RTC supply input/output (V_BCKP) ...............................................................................................21
1.5.3 Generic digital interfaces supply output (V_INT).......................................................................22
1.6 System function interfaces ....................................................................................................................22
1.6.1 Module power-on (PWR_ON)..........................................................................................................22
1.6.2 Module power-off..............................................................................................................................24
1.6.3 Module reset ......................................................................................................................................26
1.6.4 Digital I/O interfaces voltage selection (VSEL)...........................................................................26
1.7 Antenna interface .....................................................................................................................................27
1.7.1 Antenna RF interface (ANT)...........................................................................................................27
1.7.2 Antenna detection interface (ANT_DET).....................................................................................28
1.8 SIM interface..............................................................................................................................................28
1.8.1 (U)SIM card interface.......................................................................................................................28
1.8.2 SIM card detection interface (SIM_DET) .....................................................................................28
1.9 Serial interfaces ........................................................................................................................................29
1.9.1 Primary main serial interface (UART)...........................................................................................29
1.9.2 Secondary auxiliary serial interface (AUX UART).......................................................................40
1.9.3 Additional serial interface for FW upgrade and tracing (FT UART) .......................................42
1.9.4 DDC (I2C) interface...........................................................................................................................42
1.10 Audio interfaces ........................................................................................................................................44
1.10.1 Analog audio interface.....................................................................................................................44
1.11 General Purpose Input/Output (GPIO) ..................................................................................................45
1.12 Reserved pins (RSVD) ..............................................................................................................................45
1.13 System features........................................................................................................................................46
1.13.1 Network indication ...........................................................................................................................46
1.13.2 Antenna detection............................................................................................................................46
1.13.3 Jamming detection..........................................................................................................................46
1.13.4 TCP/IP and UDP/IP............................................................................................................................47
1.13.5 FTP.......................................................................................................................................................47
1.13.6 HTTP....................................................................................................................................................47
1.13.7 SSL/TLS..............................................................................................................................................47
1.13.8 Dual stack IPv4/IPv6.........................................................................................................................48

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1.13.9 Smart temperature management ................................................................................................48
1.13.10 AssistNow clients and GNSS integration .................................................................................... 51
1.13.11 Hybrid positioning and CellLocate® .............................................................................................. 51
1.13.12 Firmware upgrade Over AT (FOAT)...............................................................................................54
1.13.13 Last gasp............................................................................................................................................54
1.13.14 Power saving......................................................................................................................................55
2Design-in................................................................................................................................................ 56
2.1 Overview......................................................................................................................................................56
2.2 Supply interfaces ......................................................................................................................................56
2.2.1 Module supply (VCC)........................................................................................................................56
2.2.2 RTC supply (V_BCKP).......................................................................................................................70
2.2.3 Interface supply (V_INT)...................................................................................................................71
2.3 System functions interfaces ..................................................................................................................72
2.3.1 Module power-on (PWR_ON) ..........................................................................................................72
2.3.2 Module hard power-off (PWR_OFF)..............................................................................................73
2.3.3 Digital I/O interfaces voltage selection (VSEL)...........................................................................74
2.4 Antenna interface .....................................................................................................................................75
2.4.1 Antenna RF interface (ANT)...........................................................................................................75
2.4.2 Antenna detection interface (ANT_DET).....................................................................................82
2.5 SIM interface..............................................................................................................................................85
2.5.1 Guidelines for SIM circuit design ...................................................................................................85
2.5.2 Guidelines for SIM layout design ...................................................................................................90
2.6 Serial interfaces ........................................................................................................................................ 91
2.6.1 Primary main serial interface (UART)........................................................................................... 91
2.6.2 Secondary auxiliary serial interface (AUX UART).......................................................................98
2.6.3 Additional serial interface for FW upgrade and Tracing (FT UART) ......................................99
2.6.4 DDC (I2C) interface.........................................................................................................................100
2.7 Audio interfaces ...................................................................................................................................... 107
2.7.1 Analog audio interface................................................................................................................... 107
2.8 General Purpose Input/Output (GPIO) .................................................................................................112
2.9 Reserved pins (RSVD) .............................................................................................................................113
2.10 Module placement ...................................................................................................................................113
2.11 Module footprint and paste mask ........................................................................................................114
2.12 Schematic for SARA-G450 modules integration ..............................................................................115
2.13 Design-in checklist...................................................................................................................................116
2.13.1 Schematic checklist........................................................................................................................116
2.13.2 Layout checklist............................................................................................................................... 117
2.13.3 Antenna checklist............................................................................................................................ 117
3Handling and soldering .................................................................................................................... 118
3.1 Packaging, shipping, storage and moisture preconditioning .........................................................118
3.2 Handling .....................................................................................................................................................118
3.3 Soldering ....................................................................................................................................................119

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3.3.1 Soldering paste ................................................................................................................................119
3.3.2 Reflow soldering...............................................................................................................................119
3.3.3 Optical inspection........................................................................................................................... 120
3.3.4 Cleaning ............................................................................................................................................ 120
3.3.5 Repeated reflow soldering .............................................................................................................121
3.3.6 Wave soldering ................................................................................................................................. 121
3.3.7 Hand soldering .................................................................................................................................121
3.3.8 Rework ...............................................................................................................................................121
3.3.9 Conformal coating ...........................................................................................................................121
3.3.10 Casting.............................................................................................................................................. 122
3.3.11 Grounding metal covers ................................................................................................................ 122
3.3.12 Use of ultrasonic processes ......................................................................................................... 122
4Approvals..............................................................................................................................................123
4.1 Product certification approval overview............................................................................................. 123
4.2 European conformance.......................................................................................................................... 124
4.3 Chinese compulsory certification ........................................................................................................ 124
5Product testing ..................................................................................................................................125
5.1 u-blox in-series production test ........................................................................................................... 125
5.2 Test parameters for OEM manufacturer........................................................................................... 125
5.2.1 “Go/No go” tests for integrated devices .................................................................................... 126
5.2.2 Functional tests providing RF operation ................................................................................... 126
Appendix ......................................................................................................................................................127
AMigration between SARA modules..............................................................................................127
A.1 Overview.................................................................................................................................................... 127
A.2 Pin-out comparison: SARA-G3, SARA-G4, SARA-U2, SARA-R4, SARA-N2 modules ...............130
A.3 Schematic for SARA modules integration......................................................................................... 136
BGlossary ................................................................................................................................................139
Related documents ..................................................................................................................................142
Revision history.........................................................................................................................................142
Contact.........................................................................................................................................................143

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1System description
1.1 Overview
SARA-G450 modules are versatile 2.5G GSM/GPRS cellular modules in the miniature SARA 96-pin
LGA (Land Grid Array) form factor (26.0 x 16.0 mm).
Featuring low power consumption, the SARA-G450 modules combine baseband, RF transceiver,
power management unit, and power amplifier in a single solution allowing an easy integration into
compact designs and a seamless drop-in migration between other SARA series modules and to and
from the other u-blox cellular modules families.
SARA-G450 modules provide a fully qualified and certified solution, reducing cost and enabling short
time to market. These modules are ideally suited for M2M applications such as: Automatic Meter
Reading (AMR), Remote Monitoring Automation and Control (RMAC), surveillance and security, road
pricing, asset tracking, fleet management, anti-theft systems and Point of Sales (PoS) terminals.
SARA-G450 modules are full-feature GSM/GPRS quad-band cellular modules with a comprehensive
feature set including an extensive set of internet protocols. The modules are also designed to provide
fully integrated access to u-blox GNSS positioning chips and modules, with embedded A-GPS
(AssistNow Online and AssistNow Offline) functionality. Any host processor connected to the cellular
module through a single serial port can control both the cellular module and the positioning
chip / module.
The SARA-G450 modules’ compact form factor and LGA pads allow fully automated assembly with
standard pick & place and reflow soldering equipment for cost-efficient, high-volume production.
Table 1 describes a summary of interfaces and features provided by SARA-G450 modules.
Model
Data
Rate
Bands
Positioning
Interfaces
Audio
Features
Grade
GPRS multi-slot class 12
GSM/GPRS 4-band
Integrated GNSS receiver
GNSS via modem
AssistNow Software
CellLocate®
UART
SPI
USB 2.0
GPIO
DDC (I2C)
Analog audio
Digital audio
Network indication
Antenna supervisor
Jamming detection
Embedded TCP, UDP stack
Embedded FTP, HTTP
Embedded SSL, TLS
Dual stack IPv4 / IPv6
FW update via serial interface
Standard
Professional
Automotive
SARA-G450
●
●
□
□
□
●
●
□
□
●
●
□
●
●
●
●
●
●
●= supported by all FW versions
□= supported by product version “01” onwards
Table 1: SARA-G450 modules characteristics summary

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Table 2 reports a summary of cellular radio access technologies characteristics of SARA-G450
modules.
Item
SARA-G450
Mobile Station Class
B1
GSM/GPRS protocol stack
3GPP Release 99
GSM/GPRS bands
GSM 850 MHz
E-GSM 900 MHz
DCS 1800 MHz
PCS 1900 MHz
GSM/GPRS Power Class
Class 4 (33 dBm)
for 850/900 bands
Class 1 (30 dBm)
for 1800/1900 bands
Packet Switched Data rate
GPRS multi-slot class 122
Coding scheme CS1-CS4
Up to 85.6 kbit/s DL3
Up to 85.6 kbit/s UL3
Table 2: SARA-G450 modules GSM/GPRS characteristics summary
1.2 Architecture
Figure 1 summarizes the architecture of SARA-G450 modules, illustrating the internal blocks of the
modules, consisting of the RF, baseband and power management main sections, and the available
interfaces.
V_BCKP (RTC)
V_INT (I/O)
26 MHz 32.768 kHz
RF
transceiver
Power
Management
Unit
Baseband
ANT Switch
PA
VCC (supply)
Memory
Power-off
Power-on
SIM card
SIM card detection
UART (primary main)
UART (secondary auxiliary)
DDC (I2C)
Analog audio (MIC & SPK)
GPIOs
Antenna detection
VSEL (I/O voltage selection)
UART (flashing & tracing)
32.768 kHz over GPIO
Figure 1: SARA-G450 modules block diagram
1
Device can be attached to both GPRS and GSM services (i.e. Packet Switch and Circuit Switch mode) using one service at a
time. For example, if an incoming call occurs during data transmission, the data connection is suspended to allow the voice
communication. Once the voice call has terminated, the data service is resumed.
2
GPRS multi-slot class 12 implies a maximum of 4 slots in Down-Link (reception) and 4 slots in Up-Link (transmission) with 5
slots in total. The SARA-G450 modules can be configured as GPRS multi-slot class 10 by means of AT command.
3
The maximum bit rate of the module depends on the current network settings.

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The RF section is composed of the following main elements:
2G RF transceiver performing modulation, up-conversion of the baseband I/Q signals,
down-conversion and demodulation of the RF received signals
2G Power Amplifier, which amplifies the signals modulated by the RF transceiver
RF switch, which connects the antenna input/output pin (ANT) of the module to the suitable
RX/TX path
26 MHz crystal, connected to the digital controlled crystal oscillator to perform the clock reference
in active-mode and connected-mode
The Baseband and Power Management section is composed of the following main elements:
Baseband processor
Memory system
Voltage regulators to derive all the system supply voltages from the module supply VCC
Circuit for the RTC clock reference in low power idle-mode
☞SARA-G450-00C modules, i.e. the “00” product version of the SARA-G450 modules, do not
support the following interfaces, which should be left unconnected and should not be driven by
external devices:
oSecondary auxiliary UART interface
oDDC (I2C) interface
oAnalog audio interface

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1.3 Pin-out
Table 3 lists the pin-out of the SARA-G450 modules, with pins grouped by function.
Function
Pin Name
Pin No
I/O
Description
Remarks
Power
VCC
51, 52, 53
I
Module supply
input
All VCC pins must be connected to external supply.
VCC supply circuit affects the RF performance and
compliance of the device integrating the module with
applicable required certification schemes.
See section 1.5.1 for description and requirements.
See section 2.2.1 for external circuit design-in.
GND
1, 3, 5, 14, 20, 22,
30, 32, 43, 50, 54,
55, 57-61, 63-96
N/A
Ground
GND pins are internally connected to each other.
External ground connection affects the RF and thermal
performance of the device.
V_BCKP
2
I/O
Real Time Clock
supply
input/output
V_BCKP = 3.1 V (typical).
V_BCKP is generated by internal low power linear
regulator when a valid VCC supply is present.
See section 1.5.2 for functional description.
See section 2.2.2 for external circuit design-in.
V_INT
4
O
Generic Digital
Interfaces supply
output
V_INT supply output, rail of the Digital I/O Interfaces,
generated by internal linear regulator when the module
is switched on.
V_INT = 1.8 V (typical), if VSEL is connected to GND.
V_INT = 3 V (typical), if VSEL is unconnected.
Test-Point recommended for diagnostic purpose.
See section 1.5.3 for functional description.
See section 2.2.3 for external circuit design-in.
System
PWR_ON
15
I
Power-on input
Internal 28 kactive pull-up to 2.5 V internal supply.
Test-Point recommended for diagnostic purpose.
See section 1.6.1 for functional description.
See section 2.3.1 for external circuit design-in.
PWR_OFF
18
I
Power-off input
Internally connected to 1.5 V internal supply.
Test-Point recommended for diagnostic purpose.
See sections 1.6.2, 1.6.3 for functional description.
See section 2.3.2 for external circuit design-in.
VSEL
21
I
Voltage selection
Input to select the operating voltage of the digital I/O
interfaces of the module (the UART interfaces, I2C
interface and GPIO pins).
See section 1.6.4 for functional description.
See section 2.3.3 for external circuit design-in.
Antenna
ANT
56
I/O
RF input/output for
antenna
50 nominal characteristic impedance.
Antenna circuit affects the RF performance and
compliance of the device integrating the module with
applicable required certification schemes.
See section 1.7 for description and requirements.
See section 2.4 for external circuit design-in.
ANT_DET
62
I
Input for antenna
detection
ADC input for antenna detection function.
See section 1.7.2 for functional description.
See section 2.4.2 for external circuit design-in.

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Function
Pin Name
Pin No
I/O
Description
Remarks
SIM
VSIM
41
O
SIM supply output
VSIM = 1.8 V (typical) or 2.8 V (typical) automatically
generated according to the connected SIM type.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_IO
39
I/O
SIM data
Internal 4.7 kpull-up to VSIM.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_CLK
38
O
SIM clock
3.25 MHz clock output for 1.8 V / 3 V SIM.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_RST
40
O
SIM reset
Reset output for 1.8 V / 3 V SIM.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_DET
42
I
SIM detection
SIM presence detection function.
See section 1.8.2 for functional description.
See section 2.5 for external circuit design-in.
UART
RXD
13
O
UART data output
Circuit 104 (RxD) in ITU-T V.24, for AT command, data,
Mux, and FOAT.
It operates at V_INT voltage level.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
TXD
12
I
UART data input
Circuit 103 (TxD) in ITU-T V.24, for AT command, data,
Mux, and FOAT.
It operates at V_INT voltage level.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
CTS
11
O
UART clear to send
output
Circuit 106 (CTS) in ITU-T V.24.
It operates at V_INT voltage level.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
RTS
10
I
UART request to
send input
Circuit 105 (RTS) in ITU-T V.24.
It operates at V_INT voltage level.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
DSR
6
O
UART data set
ready output
Circuit 107 (DSR) in ITU-T V.24.
It operates at V_INT voltage level.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
DTR
9
I
UART data
terminal ready
input
Circuit 108/2 (DTR) in ITU-T V.24.
It operates at V_INT voltage level.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
RI
7
O
UART ring
indicator output
Circuit 125 (RI) in ITU-T V.24.
It operates at V_INT voltage level.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
DCD
8
O
UART data carrier
detect output
Circuit 109 (DCD) in ITU-T V.24.
It operates at V_INT voltage level.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.