VIA Technologies VAB-3000 User manual

USER MANUAL
VIA VAB-3000
Fanless low-power plaorm for
Edge AI applicaons with
MediaTek Genio 350 quad-core processor
1.00-22092023

Copyright
Copyright ©2023 VIA Technologies Incorporated. All rights reserved.
No part of this document may be reproduced, transmied, transcribed, stored in a retrieval system, or translated into any language, in any
form or by any means, electronic, mechanical, magnec, opcal, chemical, manual or otherwise without the prior wrien permission of
VIA Technologies, Incorporated.
Trademarks
All trademarks are the property of their respecve holders.
Disclaimer
No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no warranes,
implied or otherwise, in regard to this document and to the products described in this document. The informaon provided in this
document is believed to be accurate and reliable as of the publicaon date of this document. However, VIA Technologies assumes no
responsibility for the use or misuse of the informaon (including use or connecon of extra device/equipment/add-on card) in this
document and for any patent infringements that may arise from the use of this document. The informaon and product specicaons
within this document are subject to change at any me, without noce and without obligaon to nofy any person of such change.
VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any me without prior noce.
Regulatory Compliance
FCC-A Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC rules.
These limits are designed to provide reasonable protecon against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instrucon manual, may cause harmful interference to radio communicaons. Operaon of this equipment in a residenal area is likely to
cause harmful interference, in which case the user will be required to correct the interference at his personal expense.
Noce 1
The changes or modicaons not expressly approved by the party responsible for compliance could void the user's authority to operate
the equipment.
Noce 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.
Noce 3
The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conicts or
damages arising from incompability of the product. Check compability issue with your local sales representaves before placing an
order.

VIA VAB-3000 User Manual
iii
Baery Recycling and Disposal
• Only use the appropriate baery specied for this product.
• Do not re-use, recharge, or reheat an old baery.
• Do not aempt to force open the baery.
• Do not discard used baeries with regular trash.
• Discard used baeries according to local regulaons.
Safety Precauons
• Always read the safety instrucons carefully.
• Keep this User’s Manual for future reference.
• All cauons and warnings on the equipment should be noted.
• Keep this equipment away from humidity.
• Put this equipment on a reliable at surface before seng it up.
• Check the voltage of the power source and adjust to 110/220V before connecng the equipment to
the power inlet.
• Do not place the power cord where people will step on it.
• Always unplug the power cord before inserng any add-on card or board.
• If any of the following situaons arise, get the equipment checked by authorized service personnel:
− The power cord or plug is damaged.
− Liquid has entered into the equipment.
− The equipment has been exposed to moisture.
− The equipment is faulty or you cannot get it work according to User’s Manual.
− The equipment has been dropped and damaged.
− The equipment has an obvious sign of breakage.
• Do not leave this equipment in extreme temperatures or in a storage temperature above 60°C (140°F).
The equipment may be damaged.
• Do not leave this equipment in direct sunlight.
• Never pour any liquid into the opening. Liquid can cause damage or electrical shock.
• Do not place anything over the power cord.
• Do not cover the venlaon holes. The openings on the enclosure protect the equipment from
overheang.

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iv
Ordering Informaon
Part Number SoC Frequency Descripon
10GPE20G20020 MediaTek Genio 350
Quad-Core SoC @
2.0GHz
VAB-3000 3.5" board and SOM board with 2.0GHz MediaTek
Genio 350 Cortex-A53 quad-core SoC, 16GB eMMC, 2GB
LPDDR4 SDRAM, HDMI, CSI, DSI, 2 USB 2.0, Micro USB 2.0 OTG,
DIO, COM, 10/100Mbps Ethernet, Wi-Fi 5 + Bluetooth 5.0,
miniPCIe, SIM card slot, Micro SD card slot, 12V DC-in
Oponal Accessories
Wireless Board Opons
Part Number Descripon
EMIO-2575-00A0 4G LTE mobile broadband miniPCIe board with two antennas and assembly (Japan only)

VIA VAB-3000 User Manual
v
Table of Contents
1. Product Overview........................................................................................................................................... 1
1.1 Key Features.......................................................................................................................................... 1
1.2 Product Specicaons........................................................................................................................... 1
1.3 Layout Diagram ..................................................................................................................................... 4
1.4 Product Dimensions ............................................................................................................................. 5
1.5 Height Distribuon................................................................................................................................ 6
2. External I/O Pin Descripons and Funconality ............................................................................................. 8
2.1 HDMI® Port .......................................................................................................................................... 8
2.2 USB 2.0 Port ......................................................................................................................................... 8
2.3 10/100Mbps Ethernet Port .................................................................................................................. 9
2.4 COM Port .............................................................................................................................................. 9
2.5 IR Receiver .......................................................................................................................................... 10
2.6 DC Jack ................................................................................................................................................ 10
2.7 Reset Buon & Reset Pin .................................................................................................................... 10
2.8 Micro USB 2.0 Port.............................................................................................................................. 11
2.9 Headphone Jack.................................................................................................................................. 11
2.10 Microphone Jack................................................................................................................................. 11
2.11 Power Buon ...................................................................................................................................... 12
2.12 MicroSD Slot ....................................................................................................................................... 12
2.13 Power LED ........................................................................................................................................... 13
2.14 DIO Port .............................................................................................................................................. 13
3. On-Board I/O ................................................................................................................................................ 14
3.1 UART Debug Connector ...................................................................................................................... 14
3.2 I-PEX Connector .................................................................................................................................. 15
3.3 miniPCIe Slot....................................................................................................................................... 15
3.4 SIM Card Slot....................................................................................................................................... 16
3.5 Baery Charger Connector ................................................................................................................. 17
3.6 RTC Baery Connector ....................................................................................................................... 18
3.7 Speaker Connectors ............................................................................................................................ 18
3.8 On-Board MIC Connector.................................................................................................................... 19
3.9 MCU Upgrade Pin Header................................................................................................................... 20
3.10 MIPI CSI 4-Lane Connectors ................................................................................................................ 21
3.11 Download Buon & Pin ...................................................................................................................... 22
3.12 I/O Expansion Header ......................................................................................................................... 22
3.13 MIPI DSI 4-Lane Connector ................................................................................................................ 23
3.14 LVDS Connector (ODM Request)......................................................................................................... 24
3.15 7” Touchscreen Connector ................................................................................................................. 25
3.16 6-Pin 1.25mm Pitch 10.1” Touchscreen Connector (ODM Request) .................................................. 26
3.17 6-Pin 0.5mm Pitch 10.1” Touchscreen Connector (ODM Request) .................................................... 27
3.18 MIPI CSI 2-Lane Connectors (ODM request) ....................................................................................... 28
4. Soware and Technical Support ................................................................................................................... 29
4.1 Android and Yocto Support................................................................................................................. 29
4.2 Technical Support and Assistance ....................................................................................................... 29

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Appendix A Installing PCIe Mini Card Accessories ........................................................................................... 30
A.1 Installing a PCIe Mini Card into the miniPCIe Slot .............................................................................. 30

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List of Figures
Figure 01: VIA VAB-3000 board layout (top view)................................................................................................ 4
Figure 02: VIA VAB-3000 board front panel I/O ................................................................................................... 4
Figure 03: VIA VAB-3000 board rear panel I/O..................................................................................................... 4
Figure 04: VIA VAB-3000 board layout (boom view).......................................................................................... 5
Figure 05: Dimensions of the VIA VAB-3000 board (top view)............................................................................. 5
Figure 06: External I/O dimensions of the VIA VAB-3000 board (front panel) ..................................................... 6
Figure 07: External I/O dimensions of the VIA VAB-3000 board (back panel)...................................................... 6
Figure 08: Height distribuon of the VIA VAB-3000 board (top view) ................................................................. 6
Figure 09: Height distribuon of the VIA VAB-3000 board (boom view)........................................................... 7
Figure 10: HDMI port ........................................................................................................................................... 8
Figure 11: USB 2.0 port ........................................................................................................................................ 8
Figure 12: 10/100Mbps Ethernet port ................................................................................................................. 9
Figure 13: COM port............................................................................................................................................. 9
Figure 14: IR receiver.......................................................................................................................................... 10
Figure 15: DC jack............................................................................................................................................... 10
Figure 16: Reset buon & pin ............................................................................................................................ 10
Figure 18: Headphone jack................................................................................................................................. 11
Figure 19: Microphone jack................................................................................................................................ 11
Figure 17: Micro USB 2.0 port ........................................................................................................................... 11
Figure 20: Power buon..................................................................................................................................... 12
Figure 21: MicroSD card slot ............................................................................................................................. 12
Figure 23: DIO port............................................................................................................................................. 13
Figure 22: Power buon..................................................................................................................................... 13
Figure 24: UART debug connector...................................................................................................................... 14
Figure 25: I-PEX connector ................................................................................................................................. 15
Figure 26: miniPCIe slot...................................................................................................................................... 15
Figure 27: SIM card slot...................................................................................................................................... 16
Figure 28: Baery charger connector................................................................................................................. 17
Figure 29: RTC baery connector....................................................................................................................... 18
Figure 30: Speaker connectors........................................................................................................................... 18
Figure 31: On-board MIC connector................................................................................................................... 19
Figure 32: MCU upgrade pin header.................................................................................................................. 20
Figure 33: MIPI CSI 4-lane connectors................................................................................................................ 21
Figure 34: Download buon & pin..................................................................................................................... 22
Figure 35: I/O expansion header........................................................................................................................ 22
Figure 36: MIPI DSI 4-lane connector................................................................................................................. 23
Figure 37: LVDS connector ................................................................................................................................. 24
Figure 38: 7” Touchscreen connector................................................................................................................. 25
Figure 39: 6-pin 1.25mm pitch 10.1” touchscreen connector............................................................................ 26
Figure 40: 6-pin 0.5mm pitch 10.1” touchscreen connector.............................................................................. 27
Figure 41: MIPI CSI 2-lane connectors................................................................................................................ 28
Figure 42: Installing a PCIe Mini Card................................................................................................................. 30
Figure 43: Securing the PCIe Mini Card.............................................................................................................. 31

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viii
List of Tables
Table 01: HDMI port pinouts .............................................................................................................................. 8
Table 02: USB 2.0 port pinouts ........................................................................................................................... 8
Table 04: 10/100Mbps Ethernet port LED color denions ............................................................................... 9
Table 03: 10/100Mbps Ethernet port pinouts .................................................................................................... 9
Table 05: COM port pinouts ............................................................................................................................... 9
Table 06: Micro USB 2.0 port pinouts ............................................................................................................... 11
Table 07: Power buon behavior descripon................................................................................................... 12
Table 08: MicroSD card slot pinouts ................................................................................................................. 12
Table 10: DIO port pinouts................................................................................................................................ 13
Table 09: Power LED behavior .......................................................................................................................... 13
Table 11: UART debug connector pinouts......................................................................................................... 14
Table 12: miniPCIe slot pinouts......................................................................................................................... 16
Table 13: SIM card slot pinouts......................................................................................................................... 16
Table 14: Baery charger connector pinouts.................................................................................................... 17
Table 15: RTC baery connector pinouts.......................................................................................................... 18
Table 16: Speaker connector pinouts................................................................................................................ 19
Table 17: On-board MIC connector pinouts...................................................................................................... 19
Table 18: MCU upgrade pin header pinouts ..................................................................................................... 20
Table 19: MIPI CSI 4-lane connectors pinouts................................................................................................... 21
Table 20: I/O expansion header pinouts........................................................................................................... 23
Table 21: MIPI DSI 4-lane connector pinouts.................................................................................................... 24
Table 22: LVDS connector pinouts .................................................................................................................... 25
Table 23: 7” Touchscreen connector pinouts.................................................................................................... 26
Table 24: 6-pin 1.25mm pitch 10.1” touchscreen connector pinouts............................................................... 26
Table 25: 6-pin 0.5mm pitch 10.1” touchscreen connector pinouts................................................................. 27
Table 26: MIPI CSI 2-lane connector pinouts .................................................................................................... 28

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1
1. Product Overview
Accelerate your me-to-market for groundbreaking Edge AI devices with the VIA VAB-3000 Edge AI board.
Driven by the high performance and power-ecient MediaTek Genio 350 Edge AI plaorm, the board combines
advanced AI technology for display, object recognion, and voice with rich wireless and I/O connecvity
features.
The VIA VAB-3000 board’s mulmedia capabilies include high-speed graphics processing, hardware-
accelerated H.265/H.264 Full HD video decoding, and support for MIPI/HDMI/touch panel displays and
cameras – making it the ideal soluon for an unlimited array of home, commercial, industrial, and educaonal
applicaons.
The VIA VAB-3000 board harnesses the power of the MediaTek Genio 350 Edge AI plaorm to deliver blistering
edge processing and mulmedia performance. Besides quad-core ARM Cortex-A53 processors, the Genio 350
plaorm also features an integrated AI processor for deep learning, neural network acceleraon, and computer
vision applicaons, including facial recognion, object idencaon, and OCR.
Based on the 3.5" SBC 14.6cm x 10.2cm form factor, the VIA VAB-3000 board oers a wealth of network
connecvity opons, including an integrated SIM card slot for 4G LTE, dual-band 802.11ac Wi-Fi, a 10/100Mbps
Ethernet port, and Bluetooth 5.0. The board also features a USB 2.0 port, a Micro USB 2.0 OTG port, as well as
HDMI, MIPI DSI display, MIPI CSI camera, and touch panel support with mul-funcon pins for I²C, SPI and GPIO
connecvity. On-board storage is provided by 16GB eMMC 5.1 ash memory.
1.1 Key Features
• Compact 3.5" SBC form factor
• High-performance quad-core MediaTek Genio 350 processor
• Integrated AI processor for Edge AI applicaons
• Full HD hardware accelerated H.265/H.264 video decoding
• Dual-band 802.11a/b/g/n/ac Wi-Fi with Bluetooth 5.0 and on-board SIM card slot
• 16GB onboard eMMC Flash memory
• MIPI DSI/HDMI/touch panel display and MIPI CSI camera support
• Supports Android 10 and Yocto 3.1 operang systems
• Fanless and low power consumpon
1.2 Product Specicaons
Processor
• MediaTek Genio 350 Quad-Core Cortex A53 @ 2.0 GHz
System Memory
• 2GB (1GB/4GB Oponal) LPDDR4 SDRAM
Storage
• 16GB eMMC 5.1 ash memory
Graphics
• ARM Mali-G52 3EE MC1 GPU
• 3D graphic accelerator capable of processing 1600M pixel/sec @ 800MHz
• Supports OpenGL® ES 3.0, OpenCL ES 1.1, and Vulkan 1.1

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• Supports H.265 and H.264 video decoding up to 1080p@60fps
• Supports Cadence Tensilica Vision P6 and HiFi4
Wireless Connecvity
• MediaTek MT6631
− Dual band (2.4GHz & 5GHz ) single stream Wi-Fi 802.11 a/b/g/n/ac RF
− Bluetooth 5.0
Audio
• MediaTek MT6357/MT6390
Onboard I/O
• 2 x MIPI CSI 4-lane connectors (1st for front camera, 2nd for rear camera by ODM request)
• 2 x MIPI CSI 2-lane connectors (by ODM request)
• 1 x MIPI DSI 4-lane 7" LCD connector
• 2 x 6-pin 10.1" touchscreen connectors (by ODM request)
• 1 x 10.1" LVDS LCD connector (by ODM request)
• 1 x 15-pin 7" touchscreen connector
• 1 x I/O expansion connector (supports GPIO x 14)
• 1 x UART connector (for debugging)
• 1 x miniPCIe slot for 4G with GNSS
• 1 x SIM card slot
• 1 x RF I-PEX antenna connector (for Wi-Fi and Bluetooth)
• 1 x RTC baery connector
• 1 x Baery charger connector
• 2 x Speaker connectors
• 1 x MIC connector
• 1 x Download buon
• 1 x MCU upgrade connector
• 1 x Download buon
Front Panel I/O
• 1 x Micro SD card slot
• 1 x Micro USB 2.0 OTG port
• 1 x DIO port supporng 10 GPIO with 3.3V power
• 2 x Audio jacks: Line-out and Mic-in
• 1 x Power LED
• 1 x Power buon

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Back Panel I/O
• 1 x HDMI port
• 2 x USB 2.0 ports
• 1 x COM port for RS-232 (TX/RX)
• 1 x 10/100Mbps Ethernet port
• 1 x IR receiver
• 1 x DC-in jack
• 1 x Reset buon
Power Supply
• 1 x 12V DC-in (supports 9V~15V)
• 1 x 2-cell 8.4V Li-on baery (oponal)
Operang System
• Android 10
• Yocto 3.1
Operang Temperature
• -40°C ~ 85°C
Operang Humidity
• 5% ~ 85% (relave humidity ; non-condensing)
Form Factor
• 3.5" SBC 14.6cm x 10.2cm (5.75" x 4.02")
Compliance
• CE, FCC, TELEC, UKCA
Notes:
1. As the operang temperature provided in the specicaons is a result of tesng performed in a tesng
chamber, a number of variables can inuence this result. Please note that the working temperature may
vary depending on the actual situaon and environment. It is highly recommended to execute a solid tesng
program and take all variables into consideraon when building the system. Please ensure that the system is
stable under the required operang temperature in terms of the target applicaon.
2. Please note that the lifespan of the onboard eMMC memory chip may vary depending on the amount of
access. More frequent and larger data access on the eMMC memory will shorten its lifespan. It is highly
recommended to use a replaceable external storage (e.g., MicroSD card) for large data access.

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1.3 Layout Diagram
Reset Buon IR Receiver
DIO Micro USB
MicroSD
MIC1
Line-out
2x20 Pin I/O Expander
SIM Card Slot
MIPI 4-Lane CSI for
Rear Camera (ODM
Request Only)
miniPCIe for 4G
MIPI 4-Lane CSI for
Front Camera
COM (RS-232)
LAN
2x USB HostHDMI
DC-in
Power LED
Power Buon
MIC0
Speakers
RTC Baery
Download Buon
2-Cell Li-on Baery
I-PEX Connector
UART to Debug Port
MCU Connector
MediaTek
Genio 350 SoC
Figure 01: VIA VAB-3000 board layout (top view)
COMLAN
2x USB Host
HDMI
Reset Buon IR Receiver
DC-in
Figure 02: VIA VAB-3000 board front panel I/O
DIO
Micro USB
MicroSDMIC1
Line-out Power LED
Power Buon
Figure 03: VIA VAB-3000 board rear panel I/O

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7" Touchscreen Connector
2 x MIPI 2-Lane CSI
Connectors (ODM request)
10.1" Touchscreen 0.5mm
Connector (ODM request)
10.1" Touchscreen 1.25mm
Connector (ODM request)
7" MIPI DSI LCD Connector
10.1" LVDS
LCD Connector
(ODM request)
Figure 04: VIA VAB-3000 board layout (boom view)
1.4 Product Dimensions
102mm
6.9mm
146mm
67.5mm
134.2mm
95.2mm 95.2mm
3.1mm
3.1mm
3mm
3mm
Figure 05: Dimensions of the VIA VAB-3000 board (top view)

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25.4mm
55.5mm
75.7mm
88.9mm
102.4mm
120.7mm
120.7mm
1.6mm
Figure 06: External I/O dimensions of the VIA VAB-3000 board (front panel)
25.4mm
55.5mm
75.7mm
88.9mm
102.4mm
120.7mm
Figure 07: External I/O dimensions of the VIA VAB-3000 board (back panel)
1.5 Height Distribuon
2mm
10mm 3mm 13mm
7mm
7mm
5mm
10mm
6mm
7mm6mm
16mm14mm13mm
5mm
7mm
Figure 08: Height distribuon of the VIA VAB-3000 board (top view)

VIA VAB-3000 User Manual
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4mm
5mm
5mm
Figure 09: Height distribuon of the VIA VAB-3000 board (boom view)

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2. External I/O Pin Descripons and
Funconality
2.1 HDMI® Port
The VIA VAB-3000 board is equipped with one HDMI port on the back panel. The HDMI port Type-A receptacle
connector provides connecon to High Denion video and digital audio using a single cable. The pinouts of
the HDMI port are shown below.
Pin Signal Pin Signal
1D2+ 11 GND
2GND 12 CLK-
3D2- 13 CEC
4 D1+ 14 NC
5GND 15 DDC_CLK
6 D1- 16 DDC_DATA
7D0+ 17 GND
8GND 18 HDMI_5V
9D0- 19 PLUG_DET
10 CLK+
Table 01: HDMI port pinouts
Figure 10: HDMI port
2.2 USB 2.0 Port
The VIA VAB-3000 board is equipped with teo USB 2.0 ports on the back panel. The USB 2.0 ports provide
complete Plug and Play and hot swap capabilies for external devices. The pinouts of the USB 2.0 ports are
shown below.
Pin Signal
1VCC
2USB data -
3USB data+
4 GND
Table 02: USB 2.0 port pinouts
Figure 11: USB 2.0 port

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2.3 10/100Mbps Ethernet Port
The VIA VAB-3000 board comes with a 10/100Mbps Ethernet port on the back panel which uses an 8 Posion
and 8 Contact (8P8C) receptacle connector commonly known as RJ-45. It is fully compliant with the IEEE 802.3
(10BASE-T) and 802.3u (100BASE-TX) standards. The pinouts of the 10/100Mbps Ethernet port are shown
below.
LAN
Pin Signal
1TD+
2TD-
3RD+
4NC
5 NC
6 RD-
7 NC
8 NC
Table 03: 10/100Mbps Ethernet port pinouts
Figure 12: 10/100Mbps Ethernet port
The 10/100Mbps Ethernet port has two individual LED indicators located on the front side to show its Acve/
Link and Speed status.
Link LED (Le LED on RJ-45 port) Acve LED (Right LED on RJ-45 port)
Link o LED is o LED is o
Speed_10Mbit LED is o Orange ash
Speed_100Mbit Green is on Orange ash
Table 04: 10/100Mbps Ethernet port LED color denions
2.4 COM Port
The VIA VAB-3000 board is equipped with a COM (RS-232) port on the back panel. The COM port supports RS-
232 (TX/RX) mode and is used to control peripheral equipment. The pinouts of the COM port are shown below.
Pin Signal Pin Signal
1 NC 6NC
2RXD 7 NC -
3TXD 8 NC
4NC 9 MCU_RESET
5GND
Table 05: COM port pinouts
Figure 13: COM port

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2.5 IR Receiver
The VIA VAB-3000 board comes with an IR receiver located on the rear I/O panel. The IR receiver is used for
receiving IR signals from infrared remote controllers. The diagram of the IR receiver is shown below.
Figure 14: IR receiver
2.6 DC Jack
The VIA VAB-3000 board comes with a DC Jack located on the rear I/O panel. The DC Jack is used for suppling
12V-DC power from a compliant adapter. The diagram of the DC Jack is shown below.
Figure 15: DC jack
2.7 Reset Buon & Reset Pin
The VIA VAB-3000 board comes with a reset buon on the back I/O panel labeled ‘SW3’, which allows users to
reboot or reset the system forcibly. The VIA VAB-3000 board also comes with an MCU reset pin located in the
COM connector 'J12' pin-9. The system will power down when the 'J12' pin-5 & pin-9 are shorted. The diagram
of the reset buon and reset pin are shown below.
Figure 16: Reset buon & pin

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2.8 Micro USB 2.0 Port
The VIA VAB-3000 board is equipped with a Micro USB 2.0 port on the front panel. The Micro USB 2.0 port is
used for downloading the OS image. The pinouts of the Micro USB 2.0 port are shown below.
Pin Signal
1 VBUS
2D-
3D+
4 ID
5GND
Table 06: Micro USB 2.0 port pinouts
Figure 17: Micro USB 2.0 port
2.9 Headphone Jack
The VIA VAB-3000 board comes with a 3.5mm headphone jack located on the front side panel. The headphone
jack is used for connecng to external speakers or headphones. The diagram of the headphone jack is shown
below.
Figure 18: Headphone jack
2.10 Microphone Jack
The VIA VAB-3000 board comes with a 3.5mm microphone jack located on the front I/O panel. The microphone
jack is used for connecng to external microphones. The diagram of the microphone jack is shown below.
Figure 19: Microphone jack

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2.11 Power Buon
The VIA VAB-3000 board comes with a power buon located on the front I/O panel. The power buon can
support two funcons: Power On/O and System Suspend/Resume. The diagram of the power buon is shown
below.
Figure 20: Power buon
Power Buon Behavior
Power On/O Press and hold the buon for more than 2 seconds to power on. To power
o, press and hold the buon for more than 4 seconds.
System Suspend/Resume Quickly press the power buon once to suspend the system. While in
suspend mode, quickly press the buon once to resume.
Table 07: Power buon behavior descripon
2.12 MicroSD Slot
The VIA VAB-3000 board is equipped with a MicroSD Slot on the front I/O panel. The MicroSD Slot is used for
storage data, pictures, video, audio, documents and so on. The pinouts of the MicroSD Slot are shown below.
Pin Signal
1DAT2
2DAT3
3CMD
4VCC
5 CLK
6 GND
7DAT0
8DAT1
9Card detect
Table 08: MicroSD card slot pinouts
Figure 21: MicroSD card slot