VIA Technologies EPIA-PD Mini-ITX User manual

User’s Manual
EPIA-PD
Mini-ITX Mainboard
P/N: 99-51-012811-11
Version 1.21
September 25, 2008

Copyright
Copyright by VIA Technologies Inc. (“VIA”). No part of this manual may be reproduced or
transmitted in any form without express written authorization from VIA.
Trademarks
All trademarks are the property of their respective holders.
PS/2 is a registered trademark of IBM Corporation.
Windows 95/98/98SE/ME/2000/NT and Windows XP are registered trademarks of Microsoft.
AwardBIOS is a registered trademark of Phoenix Technologies Ltd.
Data protection
All data should be backed-up prior to the installation of any drive unit or storage peripheral.
VIA will not be responsible for any loss of data resulting from the use, disuse or misuse of this
or any other VIA product.
No Warranty
VIA has made every effort to ensure the accuracy of the content of this manual. However, it is
possible that it may contain technical inaccuracies or typographical or other errors. Our
products are under continual improvement and we reserve the right to make changes without
notice. VIA will assume no liability for any inaccuracy found in this publication, nor for
damages, direct, indirect, incidental, consequential or otherwise, that may result from such an
inaccuracy, including without limitation loss of data or profits.
VIA provides this manual “as is”, and does not issue a warranty of any kind, express or
implied, including without limitation implied warranties of merchantability or fitness for a
particular purpose.
The information provided in this manual is subject to change without notice. VIA reserves the
right to alter product designs, layouts or drivers without notification.

FCC-B Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class B digital
device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. Operation of this equipment in a residential area is likely to cause
harmful interference, in which case the user will be required to correct the interference at his
personal expense.
Notice 1
The changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
Notice 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with
the emission limits.
Tested To Comply
With FCC Standards
FOR HOME OR OFFICE USE

Safety Instructions
1. Always read the safety instructions carefully.
2. Keep this User's Manual for future reference.
3. Keep this equipment away from humidity.
4. Lay this equipment on a reliable flat surface before setting it up.
5. The openings on the enclosure are for air convection hence protects the equipment from
overheating. DO NOT COVER THE OPENINGS.
6. Make sure the voltage of the power source and adjust properly 110/220V before
connecting the equipment to the power inlet.
7. Place the power cord in such a way that people cannot step on it. Do not place anything
over the power cord.
8. Always unplug the power cord before inserting any add-on card or module.
9. All cautions and warnings on the equipment should be noted.
10. Never pour any liquid into the opening. Liquid can cause damage or electrical shock.
11. If any of the following situations arises, get the equipment checked by a service personnel:
•The power cord or plug is damaged
•Liquid has penetrated into the equipment
•The equipment has been exposed to moisture
•The equipment has not work well or you cannot get it work according to User's
Manual.
•The equipment has dropped and damaged
•If the equipment has obvious sign of breakage
12. DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT UNCONDITIONED,
STORAGE TEMPERATURE ABOVE 60 C (140F), IT MAY DAMAGE THE
EQUIPMENT.
Caution:
Only use the appropriate battery specified for this product.
Do not reuse, recharge, or reheat an old battery.
Do not attempt to force open the battery.
Do not discard used batteries with regular trash.
Discard used batteries according to local regulations.

i
B OX C ONTENTS
•1 x VIA Mainboar
•1 x User’s Manual
•1 x ATA-33/66/100/133 IDE Ribbon Cable
•1 x I/O Bracket
•1 x Driver Utilities CD

ii
T ABLE OF C ONTENTS
Box Contents............................................................................ i
Table of Contents .................................................................... ii
Chapter 1 ............................................................................... 1
Specifications ....................................................................... 1
Mainboar Specifications ....................................................... 2
Mainboar Layout ................................................................. 4
Back Panel Ports ................................................................... 5
Slots.................................................................................... 5
Onboar Connectors an Jumpers........................................... 6
Chapter 2 ............................................................................... 7
Installation........................................................................... 7
CPU ..................................................................................... 8
Memory Mo ule Installation ................................................. 10
Connecting the Power Supply ............................................... 12
Back Panel Ports ................................................................. 13
Connectors......................................................................... 17
Jumpers............................................................................. 24
Slots.................................................................................. 25
Chapter 3 ............................................................................. 27
BIOS Setup ........................................................................ 27
Entering Setup ................................................................... 28
Control Keys....................................................................... 28
Getting Help ....................................................................... 29
Main Menu ......................................................................... 30
Stan ar CMOS Features ..................................................... 32
IDE Primary Master/Slave, Secon ary Master/Slave ................ 33
A vance BIOS Features...................................................... 34
A vance Chipset Features .................................................. 37
Integrate Peripherals ......................................................... 39
Power Management Setup.................................................... 43
PNP/PCI Configurations ....................................................... 48
PC Health Status................................................................. 51
Frequency / Voltage Control ................................................. 52
Loa Fail-Safe Defaults........................................................ 55

iii
Loa Optimize Defaults ...................................................... 56
Set Supervisor / User Passwor ............................................ 57
Save & Exit Setup ............................................................... 59
Exit Without Saving............................................................. 60
Chapter 4 ............................................................................. 61
Driver Installation ............................................................... 61
Driver Utilities .................................................................... 62
CD Content ........................................................................ 63

iv
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1
C
HAPTER
1
Specifications
The ultra-compact an highly integrate VIA EPIA-PD Mini-ITX
Mainboar is the smallest form factor mainboar specification
available to ay, evelope by VIA Technologies, Inc. as part of
the company’s open in ustry-wi e total connectivity initiative.
The mainboar enables the creation of an exciting new
generation of small, ergonomic, innovative an affor able
embe e systems. Through high level of integration, mini-ITX
only occupy 66% of the size of FlexATX mainboar form factor.
The mainboar comes with an embe e VIA Processor, boasting
ultra low power consumption an cool, quiet operation.

Chapter 1
2
M AINBOARD S PECIFICATIONS
CPU
•VIA C3 / EDEN EBGA Processor (onboar )
•Enhance Ball Gri Array Package (EBGA)
•Internal L1 128KB an L2 64KB cache memory
Chipset
•VIA CLE266 North Bri ge
•VT8235 South Bri ge
Memor
•1 x DDR266 DIMM socket (up to 1 GB)
Expansion Slots
•1 x PCI
Graphics
•Integrate VIA UniChrome AGP graphics
Audio
•VT1612A, two-channel AC’97 Co ec
USB
•USB 2.0 Support inclu e in South Bri ge
LAN
•Dual LAN
•VIA VT6105 LOM 10 / 100 Base-T Ethernet
•VT6103 PHY
IDE
•2 X UltraDMA 66/100/133 Connector

Specifications
3
Back Panel I/O Ports
•1 x PS2 mouse port
•1 x PS2 keyboar port
•1 x VGA port
•1 x Parallel port
•2 x RJ-45 LAN ports
•4 x USB 2.0/1.1 ports
•1 x Serial port
•3 x Au io jacks: line-out, line-in an mic-in
Onboard I/O Connectors
•1 x USB 2.0 connector
•1 x Front Au io connector
•1 x FIR connector
•1 x KB/MS connector
•1 x Wake-on-LAN connector
•3 x Fan connectors (CPU Fan, System Fan, Power Fan)
•1 x Digital I/O Pin-hea er
•1 x I²C connector
•1 x LVDS connector (optional)
•3 x Serial port connectors for COM2, COM3 an COM4
BIOS
•Awar BIOS on 2/4Mbit flash memory
Form Factor
•17 cm X 17 cm Mini-ITX (4 layer)

Chapter 1
4
M AINBOARD L AYOUT
Back Panel

Specifications
5
B ACK P ANEL P ORTS
Port Description
Au io Jacks Line-Out, Line-In, Microphone
COM 1 Serial port
LPT1 Parallel port
PS2-MS PS2 mouse port
PS2-KB PS2 keyboar port
RJ45_1 & RJ45_2 10/100 NIC port
USB1, USB2,
USB3, & USB4
Universal Serial Bus ports 1 - 4
VGA Out VGA out port
S LOTS
Slot Description
DIMM Memory mo ule slot
PCI Expansion car slot

Chapter 1
6
O NBOARD C ONNECTORS AND J UMPERS
Connector/Jumper Description
ATXPWR ATX power cable connector
CLEAR_CMOS Jumper to reset CMOS settings to efault
COM2, COM3 & COM4 Serial port connectors
F_AUDIO Front Au io connector (Mic an Line-out)
F_PANEL Case connectors
Fans CPU, System an Power fans
FIR Infrare Ra iation connector
I²C I²C connector
IDE1 & IDE2 IDE har isk rive connectors
J1 Digital I/O Pin-hea er
J3, J4 COM3/COM4 voltage selector
KBMS CIR/PS2(EXT_KBMS) connector
LVDS LVDS connector
USB 5/6 Front Universal Serial Bus connectors
WOL Wake On LAN connector

7
C
HAPTER
2
Installation
This chapter provi es you with information about har ware setup
proce ures. While installing the mainboar , carefully hol the
components an closely follow the installation proce ures. Some
components may be amage if they are installe incorrectly.
It is recommen e to use a groun e wrist strap before han ling
computer components. Static electricity can amage some
components.

Chapter 2
8
CPU
The VIA EPIA-PD Mini-ITX Mainboar inclu es an embe e VIA E en
Processor or VIA C3 E-Series Processor. The CPUFAN (CPU fan) an SYSFAN
(system fan) run on +12V an maintain system cooling. When connecting the
wire to the connectors, always be aware that the re wire is the Positive an
shoul be connecte to the +12V. The black wire is Groun an shoul be
connecte to GND. The CPU, System an Power fan connectors have sensors
to etect fan spee .
The VIA C3 E-Series Processor
With low power consumption an a vance
thermal issipation properties, the embe e
VIA C3 E-Series requires only a small fan to
guarantee performance an reliability. Ensure
that the CPU Fan Connector is correctly installe
as shown.

Installation
9
The VIA Eden Processor
Provi ing ultra-low power consumption an
a vance thermal issipation properties, the
VIA E en Processor features a fanless esign.
The VIA E en Processor requires only a
heatsink as shown.
Caution:
This motherboard is not designed to support overclocking. Any attempt to
operate beyond product specifications is not recommended. We do not
guarantee the damages or risks caused by operation beyond product
specifications.

Chapter 2
10
M EMORY M ODULE I NSTALLATION
The VIA EPIA-PD Mini-ITX mainboar provi es one DIMM slot for DDR266
memory mo ules.
CLE266
DDR Module Installation Procedures
1. Push the white retaining latches at either en of the DIMM slot outwar s.
2. Align the DDR mo ule with the correspon ing notches on the DIMM slot.
The mo ules will only fit if place in the correct position.
3. With both han s, press the DDR mo ule own into the DIMM slot so that
the white retaining latches rotate up an secure the mo ule in place
(see picture below).

Installation
11
Available DDR Configurations
Refer to the table below for available DDR configurations on the mainboar .
Slot Memor Module Total Memor
DIMM
(Bank 0 & 1) 64MB, 128MB, 256MB, 512MB, an 1GB 64MB – 1GB
Maximum System Memory Supporte 64MB – 1GB

Chapter 2
12
C ONNECTING THE P OWER S UPPLY
The VIA EPIA-PD Mini-ITX Mainboar requires an ATX power supply to be
connecte . Before inserting the power supply connector, always make sure
that all components are installe correctly to ensure that no amage will be
cause .
ATX 20-Pin Power Connector
To connect the ATX power supply, make sure the plugs of the power supply
are inserte in the proper orientation an the pins are correctly aligne . Then,
push own the power supply plug firmly into the connector.
Pin Signal
1 3.3V
2 3.3V
3 GND
4 5V
5 GND
6 5V
7 GND
8 PW_OK
9 5V_SB
10 12V
11 3.3V
12 -12V
13 GND
14 PS_ON
15 GND
16 GND
17 GND
18 NC
19 5V
20 5V
1
10
20
11