VIA Technologies EPIA-SP8000E - VIA Motherboard - Mini ITX User manual

User’s Manual
EPIA-SP
Version 1.12
January 30, 2012

Copyright
Copyright © 2010-2012 VIA Technologies Incorporated. All rights reserved.
No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval
system, or translated into any language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual or otherwise without the prior written permission of VIA
Technologies, Incorporated.
Trademarks
All trademarks are the property of their respective holders. PS/2 is a registered trademark of
IBM Corporation. Award BIOS is a registered trademark of Phoenix Technologies Ltd.
Disclaimer
No license is granted, implied or otherwise, under any patent or patent rights of VIA
Technologies. VIA Technologies makes no warranties, implied or otherwise, in regard to this
document and to the products described in this document. The information provided in this
document is believed to be accurate and reliable as of the publication date of this document.
However, VIA Technologies assumes no responsibility for the use or misuse of the information
in this document and for any patent infringements that may arise from the use of this document.
The information and product specifications within this document are subject to change at any
time, without notice and without obligation to notify any person of such change.

FCC-B Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class B digital device,
pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. Operation of this equipment in a residential area is likely to cause
harmful interference, in which case the user will be required to correct the interference at his
personal expense.
Notice 1
The changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
Notice 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with
the emission limits.
Tested To Comply
With FCC Standards
FOR HOME OR OFFICE USE

Safety Instructions
1. Always read the safety instructions carefully.
2. Keep this User's Manual for future reference.
3. Keep this equipment away from humidity.
4. Lay this equipment on a reliable flat surface before setting it up.
5. The openings on the enclosure are for air convection hence protects the equipment from
overheating. DO NOT COVER THE OPENINGS.
6. Make sure the voltage of the power source and adjust properly 110/220V before
connecting the equipment to the power inlet.
7. Place the power cord in such a way that people cannot step on it. Do not place anything
over the power cord.
8. Always unplug the power cord before inserting any add-on card or module.
9. All cautions and warnings on the equipment should be noted.
10. Never pour any liquid into the opening. Liquid can cause damage or electrical shock.
11. If any of the following situations arises, get the equipment checked by a service personnel:
•The power cord or plug is damaged
•Liquid has penetrated into the equipment
•The equipment has been exposed to moisture
•The equipment has not work well or you cannot get it work according to User's
Manual.
•The equipment has dropped and damaged
•If the equipment has obvious sign of breakage
12. DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT UNCONDITIONED,
STORAGE TEMPERATURE ABOVE 60 C (140F), IT MAY DAMAGE THE
EQUIPMENT.
Caution:
Only use the appropriate battery specified for this product.
Do not reuse, recharge, or reheat an old battery.
Do not attempt to force open the battery.
Do not discard used batteries with regular trash.
Discard used batteries according to local regulations.

i
B OX C ONTENTS
One VIA Mini-ITX mainboard
One Quick Ins alla ion Guide
One ATA-133/100 IDE ribbon cable
One driver and u ili ies CD
One IO bracke

ii
T ABLE OF C ONTENTS
Box Con en s ................................................................................ i
Table of Con en s..........................................................................ii
Chap er 1 .................................................................................... 1
Specifica ions ........................................................................... 1
Mainboard Specifica ions ........................................................... 2
Mainboard Layou ..................................................................... 4
Back Panel Layou .................................................................... 5
Back Panel Por s....................................................................... 6
Slo s ........................................................................................ 6
Onboard Connec ors ................................................................. 7
Onboard Jumpers ..................................................................... 7
Chap er 2 .................................................................................... 9
Ins alla ion ............................................................................... 9
CPU ........................................................................................10
Memory Module Ins alla ion .....................................................14
Connec ing he Power Supply ...................................................17
Back Panel Por s......................................................................19
Connec ors..............................................................................23
Jumpers ..................................................................................38
Slo s .......................................................................................41
Chap er 3 ...................................................................................43
BIOS Se up .............................................................................43
En ering Se up.........................................................................44
Con rol Keys............................................................................45
Naviga ing he BIOS Menus......................................................46
Ge ing Help ............................................................................47
Main Menu ..............................................................................48
S andard CMOS Fea ures .........................................................50
IDE Drives...............................................................................51
Advanced BIOS Fea ures..........................................................52
Hard Disk Boo Priori y.............................................................55
Advanced Chipse Fea ures ......................................................56

iii
In egra ed Peripherals..............................................................59
Super IO Device ......................................................................61
Power Managemen Se up........................................................63
Peripheral Ac ivi ies..................................................................65
IRQs Ac ivi ies .........................................................................68
PNP/PCI Configura ions............................................................69
IRQ Resources.........................................................................71
PC Heal h S a us......................................................................72
Frequency / Vol age Con rol .....................................................73
Load Fail-Safe Defaul s ............................................................76
Load Op imized Defaul s ..........................................................77
Se Supervisor / User Password ................................................78
Save & Exi Se up ....................................................................80
Exi Wi hou Saving..................................................................81
Chap er 4 ...................................................................................83
Driver Ins alla ion ....................................................................83
Driver U ili ies..........................................................................84
CD Con en .............................................................................86

iv
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1
C
HAPTER
1
Specifica ions
The ul ra-compac and highly in egra ed VIA EPIA-SP uses he Mini-
ITX mainboard form-fac or developed by VIA Technologies, Inc. as
par of he company’s open indus ry-wide o al connec ivi y ini ia ive.
The mainboard enables he crea ion of an exci ing new genera ion of
small, ergonomic, innova ive and affordable embedded sys ems.
Through a high level of in egra ion, he Mini-ITX occupy 66% of he
size of FlexATX mainboard form fac or. The mainboard comes wi h
an embedded VIA Processor, boas ing of ul ra-low power
consump ion, cool and qui e opera ion.

Chap er 1
2
M AINBOARD S PECIFICATIONS
CPU
•VIA C3 / Eden EBGA Processor
Chipset
•VIA CN400 Nor h Bridge
•VIA VT8237R-series Sou h Bridge
Graphics
•In egra ed UniChrome™ Pro AGP wi h MPEG-2 decoding
Audio
•VIA VT1617A 6-channel AC'97 Codec
Memor
•1 x DDR 400 / 333 / 266 DIMM socke (up o 1 GB)
Expansion Slot
•1 x PCI slo
IDE
•2 x Ul raDMA 133/100 connec ors, wi h Direc DOM Suppor
LAN
•VIA VT6103 10/100 Base-T E herne PHY
IEEE 1394
•VIA VT6307S IEEE 1394 Fire Wire
TV-Out (optional)
•VIA VT1623 TV Encoder

Specifica ions
3
Back Panel I/O Ports
•1 x PS/2 mouse por and 1 x PS/2 keyboard por
•1 x RJ-45 LAN por
•1 x Serial por
•2 x USB 2.0 por s
•1 x RCA por (SPDIF or TV ou )
•1 x S-Video por
•1 x VGA por
•3 x Audio Jacks: line-ou , line-in and mic-in (Horizon al, Smar 5.1
Suppor )
Onboard I/O Connectors
•3 x USB pin headers for 6 addi ional USB 2.0 por s
•1 x IEEE 1394 pin header
•1 x Serial por pin header for COM2
•1 x VIP pin header
•1 x Fron Panel audio pin header (Mic-in and Line-ou )
•1 x CD audio-in connec or
•1 x FIR pin header
•1 x KBMS pin header (KB/MS or CIR)
•1 x LPT por pin header
•1 x Wake On LAN connec or
•2 x Fan connec ors (CPU Fan and Sys em Fan)
•1 x +12V power connec or
•1 x SMBus connec or
•1 x LVDS (func ion o be suppor ed w/ an addi ional daugh er card)
•1 x WP pin header
BIOS
•Award BIOS wi h 4/8Mbi flash memory capaci y
•ACPI2.0, SMBIOS2.1 and DMI2.2
Form Factor
•Mini-ITX (6 layers)
•17 cm X 17 cm

Chap er 1
4
M AINBOARD L AYOUT
TM
C3 Processor
CN400VT8237R-series
ATXPWR
KBMS
+12V_PWR
USB 3/4
USB 7/8
IDE1 IDE2
J1
Top: COM1
Bottom: VGA port
S-Video port
RCA Jack
Top: RJ45 port
Bottom: USB port
Top: Mouse
Bottom: Keyboard
SPDIF_SEL1
CD_IN
COM2
LPT
F_AUDIO
1394_1
Line-Out
Line-In
Microphone
LVDS
SATA_2SATA_1
SMBus
FIR
CLEAR_CMOS
USB 5/6
VIP_2
BIOS
Socket
CMOS battery
WOL
SPDIF
PCI Slot
SYSFAN
DIMM1
CPUFAN
WP
F_PANEL

Specifica ions
5
B ACK P ANEL L AYOUT
PS/2 Mouse
PS/2 Keyboard VGA Out S-Video
RJ45
USB
COM1
Line-InLine-Out Microphone
RCA / SPDIF

Chap er 1
6
B ACK P ANEL P ORTS
Port Description Page
Audio Jacks 3 Audio por s (line-ou , line-in and mic-in) 19-22
COM1 Serial por 1 19
PS/2 Mouse PS/2 mouse por 19
PS/2 Keyboard PS/2 keyboard por 19
RCA/SPDIF RCA por (SPDIF or TV ou ) 19-20
RJ45 RJ45 por 19-20
USB USB 2.0 por s 19-20
VGA VGA por 19
S-Video S-Video por 19-20
S LOTS
Port Description Page
DDR DIMM Memory module slo 14-16
PCI Expansion card slo 41-42

Specifica ions
7
O NBOARD C ONNECTORS
Connector Description Page
+12V_CONN 12V Power connec or 12-13
1394_1 IEEE 1394 connec or 31-32
ATXPWR Power cable connec or 17-18
CD_IN Onboard CD audio cable connec or 31-32
COM 2 COM por 2 connec or 31-32
CPUFAN CPU fan connec or 12
FIR Fas Infrared Radia ion connec or 28
F_AUDIO Fron Audio connec or 33-34
F_PANEL Fron panel connec or 26-27
IDE 1-2 IDE drive connec ors 23-24
KBMS Header Keyboard and Mouse connec or 38, 40
LPT Parallel por connec or 28-29
LVDS LVDS connec or 36-37
SATA1 and 2 Serial ATA 1 and 2 connec ors 25
SMBus_Header SMBus connec or 33
SYSFAN Sys em fan connec or 12
USB 3-4/5-6/7-8 Universal Serial Bus 2.0 connec ors 3-4/5-6/7-8 30
VIP_2 VIP connec or 35
WOL Wake On LAN connec or 31
O NBOARD J UMPERS
Jumper Description Page
CLEAR_CMOS Rese CMOS se ings 38-39
J1 IDE selec or 38, 40
SPDIF_SEL S/PDIF selec or 38, 40
WP BIOS wri e pro ec ion se ing 38, 40

Chap er 1
8
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9
C
HAPTER
2
Ins alla ion
This chap er provides you wi h informa ion abou hardware
ins alla ion procedures. I is recommended o use a grounded wris
s rap before handling compu er componen s. Elec ros a ic discharge
(ESD) can damage some componen s.

Chap er 2
10
CPU
The VIA C3 E-Series Processor
The VIA EPIA-SP Mini-ITX mainboard includes an embedded VIA C3 or Eden
Processor. The VIA C3 Processor provides ul ra-low power consump ion and
advanced hermal dissipa ion proper ies. The VIA C3 Processor requires
hea sink and a CPU fan o provide sufficien cooling. Ensure ha he CPU
fan is correc ly ins alled as shown.

Ins alla ion
11
The VIA Eden Processor
Providing ul ra-low power consump ion and advanced hermal dissipa ion
proper ies, he VIA Eden Processor fea ures a fanless design. The VIA Eden
Processor requires only a hea sink as shown.
Caution:
This mainboard is not designed to support overclocking. Any attempt to
operate beyond product specifications is not recommended. We do not
guarantee the damage or risks caused by inadequate operation or
beyond product specifications.

Chap er 2
12
CPU Fan and System Fan: CPUFAN and SYSFAN
The CPUFAN (CPU fan) and SYSFAN (sys em fan) run on +12V and main ain
sys em cooling. When connec ing he wire o he connec ors, always be
aware ha he red wire is he Posi ive and should be connec ed o he +12V.
The black wire is Ground and should always be connec ed o GND. The CPU
sys em and power fan connec ors have sensors o suppor fan moni oring
excep for +12V_CONN.
TM
C3 Processor
CN400VT8237R
+12V_CONN
CPUFAN
SYSFAN
1
1
1