Viking Technology VPFEM6008GZCWMTL User manual

Manual
11/29/2018
PSFEM6xxxxZxxx
Viking Technology
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SATA 6Gb/s
M.2 SATA
Manual
M.2 SATA is a non-volatile, solid-state storage device delivering Serial
ATA performance, reliability and ruggedness for environmentally
challenging applications.

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Revision History
Date
Revision
Description
Checked By
3/10/17
A
Initial Release. Revised based on
PSFEM6XXXGSXXX_D with new PN’s
performance, block diagram, TBW, power
consumption. Add VPFEM6030GZCDMTL
3/19/17
B
Add performance,TBW & power for new PNs
VPFEM6008GZCWMTL
VPFEM6016GZCDMTL
VPFEM6032GZCDMTL
7/24/17
C
Add IOPS and MB/s performance based on
estimated IOMETER06
3/12/18
D
Add IOPS and MB/s performance based on
actual IOMETER06 results
5/17/18
E
Change VVPFEM6032GZCBMTL to
VPFEM6032GZCBMTL
7/1/18
F
Add BiCS3
11/29/18
F
Add VPFEM6016GZC1PT3

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Legal Information
Legal Information
Copyright© 2018 Sanmina Corporation. All rights reserved. The information in
this document is proprietary and confidential to Sanmina Corporation. No part of
this document may be reproduced in any form or by any means or used to make
any derivative work (such as translation, transformation, or adaptation) without
written permission from Sanmina. Sanmina reserves the right to revise this
documentation and to make changes in content from time to time without
obligation on the part of Sanmina to provide notification of such revision or
change.
Sanmina provides this documentation without warranty, term or condition of any
kind, either expressed or implied, including, but not limited to, expressed and
implied warranties of merchantability, fitness for a particular purpose, and non-
infringement. While the information contained herein is believed to be accurate,
such information is preliminary, and should not be relied upon for accuracy or
completeness, and no representations or warranties of accuracy or
completeness are made. In no event will Sanmina be liable for damages arising
directly or indirectly from any use of or reliance upon the information contained in
this document. Sanmina may make improvements or changes in the product(s)
and/or the program(s) described in this documentation at any time.
Sanmina, Viking Technology, Viking Modular Solutions, and Element logo are
trademarks of Sanmina Corporation. Other company, product or service names
mentioned herein may be trademarks or service marks of their respective
owners.

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Ordering Information: M.2 SATA SSD Solid-State Drive
Part Number
Length
(mm)
Interface
Application
User
Capacity
(GB)
NAND
Temperature
(C)
NAND
VPFEM6008GZCWMTL
42
SATA 6GB
Client
8
MLC
0 to 70
TSB 15nm MLC
VPFEM6016GZCDMTL
42
SATA 6GB
Client
16
MLC
0 to 70
TSB 15nm MLC
VPFEM6032GZCBMTL
42
SATA 6GB
Client
32
MLC
0 to 70
TSB 15nm MLC
VPFEM6030GZCDMTL
42
SATA 6GB
Client
30
MLC
0 to 70
TSB 15nm MLC
VPFEM6060GZCBMTL
42
SATA 6GB
Client
60
MLC
0 to 70
TSB 15nm MLC
VPFEM6064GZCBMTL
42
SATA 6GB
Client
64
MLC
0 to 70
TSB 15nm MLC
VPFEM6120GZCAMTL
42
SATA 6GB
Client
120
MLC
0 to 70
TSB 15nm MLC
VPFEM6128GZCAMTL
42
SATA 6GB
Client
128
MLC
0 to 70
TSB 15nm MLC
VPFEM6240GZCZMTL
42
SATA 6GB
Client
240
MLC
0 to 70
TSB 15nm MLC
VPFEM6256GZCZMTL
42
SATA 6GB
Client
256
MLC
0 to 70
TSB 15nm MLC
VPFEM6480GZCFMTL
42
SATA 6GB
Client
480
MLC
0 to 70
TSB 15nm MLC
VPFEM6512GZCFMTL
42
SATA 6GB
Client
512
MLC
0 to 70
TSB 15nm MLC
VPFEM6016GZC1PT3
42
SATA 6GB
Client
16
BiCS3
0 to 70
TSB 3D TLC
VPFEM6032GZC2WT3
42
SATA 6GB
Client
32
BiCS3
0 to 70
TSB 3D TLC
VPFEM6064GZC2WT3
42
SATA 6GB
Client
64
BiCS3
0 to 70
TSB 3D TLC
VPFEM6128GZC5WT3
42
SATA 6GB
Client
128
BiCS3
0 to 70
TSB 3D TLC
VPFEM6240GZCHWT3
42
SATA 6GB
Client
240
BiCS3
0 to 70
TSB 3D TLC
VPFEM6256GZCHWT3
42
SATA 6GB
Client
256
BiCS3
0 to 70
TSB 3D TLC
Notes:
Refer to Product Specifications for Capacity and LBA count

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Client SSD’s –Viking’s client SSD contains sophisticated provisions to protect
firmware and data from corruption due to unexpected power loss. However,
should power fail unexpectedly, “in-flight” write data may be lost if the SSD power
is not managed at the system level for these power fail events.

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Table of Contents
1INTRODUCTION 9
1.1 Features 9
1.2 Block Diagram 10
1.3 SATA Interface 11
2PRODUCT SPECIFICATIONS 12
2.1 Capacity and LBA count 12
2.2 Performance 13
2.3 Timing 15
2.3.1 STANDBY IMMEDIATE Command 15
2.4 Electrical Characteristics 15
2.4.1 Absolute Maximum Ratings 15
2.4.2 Supply Voltage 17
2.4.3 Supply Current 18
2.4.4 Power Consumption 18
2.5 Environmental Conditions 19
2.5.1 Temperature and Altitude 19
2.5.2 Shock and Vibration 20
2.5.3 Electromagnetic Immunity 20
2.6 Reliability 21
3MECHANICAL INFORMATION 22
3.1 Dimensions 22
3.2 Card Edge Detail 24
3.3 M.2 SSD Weight 26
4PIN AND SIGNAL DESCRIPTIONS 26
4.1 Signal and Power Description Tables 26

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4.2 Hot Plug Support 27
5COMMAND SETS 27
5.1 ATA Commands 27
5.1.1 48-Bit Address Command Set 28
5.1.2 ATA General Feature Command Set 28
5.1.3 Device Configuration Overlay Command Set 29
5.1.4 General Purpose Log Command Set 29
5.1.5 Host Protected Area Command Set 29
5.1.6 Power Management Command Set 30
5.1.7 Security Mode Feature Set 30
5.1.8 Identify Device Data 31
5.1.1 S.M.A.R.T. Support 35
5.1.2 SATA 3.0 S.M.A.R.T. Command Set 36
5.2 SATA Commands 40
5.2.1 Native Command Queuing (NCQ) 40
6REFERENCES 40
7GLOSSARY 41

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Table of Tables
Table 2-1: Maximum Sustained Read and Write Bandwidth using MLC NAND_____________ 13
Table 2-2: Sequential Read /Write Bandwidth (Iometer 06) using MLC NAND_____________ 13
Table 2-3: Random Read/ Write Input/Output Operations per Second (IOPS) (Iometer 06) using
MLC NAND__________________________________________________________________ 14
Table 2-4: Sequential Read /Write Bandwidth (Iometer 06) using TLC NAND _____________ 14
Table 2-5: Random Read/ Write Input/Output Operations per Second (IOPS) (Iometer 06) using
TLC NAND __________________________________________________________________ 15
Table 2-6: STANDBY IMMEDIATE Timing _________________________________________ 15
Table 2-7: Absolute Maximum Ratings ____________________________________________ 15
Table 2-8: Operating Voltage ____________________________________________________ 17
Table 2-9: Current Draw________________________________________________________ 18
Table 2-10: Typical Power Consumption at 3.3V using MLC NAND _____________________ 18
Table 2-11: Typical Power Consumption at 3.3V using TLC NAND ______________________ 18
Table 2-12: Temperature and Altitude Related Specifications___________________________ 19
Table 2-13: Shock and Vibration Specifications______________________________________ 20
Table 2-14: Reliability Specifications ______________________________________________ 21
Table 3-1: M.2 SSD weight______________________________________________________ 26
Table 4-1: M.2 SATA Connector Pin Signal Definitions________________________________ 26
Table 5-1: Supported ATA Commands ____________________________________________ 27
Table 5-2: List of Device Identification _____________________________________________ 31
Table 5-3: S.M.A.R.T. Command Set______________________________________________ 36
Table 5-4: Extended SMART Attribute Table________________________________________ 36
Table 5-5: Extended SMART Attribute Actual Data ___________________________________ 37
Table 5-6: Supported S.M.A.R.T. EXECUTE OFF-LINE IMMEDIATE Subcommands ________ 40
Table of Figures
Figure 1-1: High-Level Block Diagram _____________________________________________ 10
Figure 3-1: Dimensions ________________________________________________________ 22
Figure 3-2: Dimension Details for M.2 42mm length __________________________________ 23
Figure 3-3: Dimension Details for M.2 card edge_____________________________________ 24
Figure 3-4: Dimension Details for M.2 connector and notch ____________________________ 25

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1 Introduction
Viking’s rugged industrial designed SSD’s offer the highest flash storage
reliability and performance in harsh environments such as shock, vibration,
humidity, altitude, ESD, and extreme temperatures.
1.1 Features
The SSD delivers the following features:
Offers seamless SATA Revision 3.0 interface support for SATA up to
6Gb/s
Low overall SSD power consumption
Supports Native Command Queuing (NCQ) to 32 commands
Compatible with all major SLC and MLC flash technologies
S.M.A.R.T.
Superior wear-leveling algorithm
Efficient error recovery

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1.2 Block Diagram
Figure 1-1: High-Level Block Diagram
Notes:
1.Support for up to 2-channels and 2 CE in the NAND Flash interface
2
2

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1.3 SATA Interface
The Serial ATA (SATA) interface is compliant with the SATA IO Serial
ATA specification, revision 3.0 that supports SATA up to 6 Gbps.
The SATA interface connects the host computer to the SSD subsystem.
The SATA interface runs at a maximum speed of 6 Gbps (Giga-bits per
second). If the host computer is unable to negotiate a speed of 6 Gbps,
the SATA interface automatically renegotiates to a speed of 3 Gbps or 1.5
Gbps.
For a list of supported commands and other specifics, please see Chapter 5.

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2 Product Specifications
2.1 Capacity and LBA count
Raw Capacity
(GB)
User Capacity
(GB)
LBA Count
8
8
15,649,200
16
14
27,370,224
16
16
31,277,232
32
30
58,626,288
32
32
62,533,296
64
60
117,231,408
64
64
125,045,424
128
120
234,441,648
128
128
250,069,680
256
240
468,862,128
256
256
500,118,192
Notes:
1. Per LBA1-03 spec, LBA counts = (97,696,368) + (1,953,504 * (Advertised Capacity in GBytes –50))

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2.2 Performance
Table 2-1: Maximum Sustained Read and Write Bandwidth using MLC
NAND
Capacity
Flash Structure
Performance
Power Consumption
CrystalDiskMark
ATTO
Read
Write
Read
Write
Read
Write
Devslp
(MB/s)
(MB/s)
(MB/s)
(MB/s)
(mW)
(mW)
(mW)
8GB
8GBx1, TSOP, TSB 15nm
320
105
560
540
830
765
4.9
16GB
16GBx1, TSOP, TSB 15nm
320
85
560
540
895
805
4.9
30/32GB
32GBx1, BGA, TSB 15nm
560
165
560
540
1,030
1,210
4.9
60/64GB
32GBx2, BGA, TSB 15nm
560
315
560
540
1,040
1,215
4.9
120/128GB
64GBx2, BGA, TSB 15nm
560
465
560
540
1,065
1,480
4.9
240/256GB
128GBx2, BGA, TSB 15nm
560
465
560
540
1,165
1,535
4.9
480/512GB
256GBx2, BGA, TSB 15nm
560
465
560
540
1,425
1,740
4.9
Notes:
1. Performance measured using CrystalDiskMark.
2. Performance may vary from flash configuration, SDR configuration, and platform.
3. Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology.
4. Data is based on SSD’s using Toshiba A15nm Toggle NAND devices
5. L95A data not currently available
Table 2-2: Sequential Read /Write Bandwidth (Iometer 06) using MLC
NAND
Capacity
Flash Type
Read MB/s
(256K)
Write MB/s
(256K)
8GB
15nm
Up to 537
Up to 199
16GB
15nm
Up to 537
Up to 199
32GB
15nm
Up to 537
Up to 199
64GB
15nm
Up to 537
Up to 199
128GB
15nm
Up to 537
Up to 199
256GB
15nm
Up to 537
Up to 199
512GB
15nm
Up to 537
Up to 199
Notes:
1. Performance measured using Iometer 06 with queue depth set to 32.
2. Write Cache enabled with DDR cache.
3. Tested with VPFEM5256GZIAMTL (Toshiba MLC L die)
4.

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Table 2-3: Random Read/ Write Input/Output Operations per Second (IOPS)
(Iometer 06) using MLC NAND
Capacity
Flash Type
Random Read
IOPS
(4K)
Random Write
IOPS
(4K)
64GB
15nm
Up to 71827
Up to 13800
128GB
15nm
Up to 71827
Up to 13800
256GB
15nm
Up to 71827
Up to 13800
512GB
15nm
Up to 71827
Up to 13800
Notes:
1. Performance measured using Iometer 06 with queue depth set to 32.
2. Write Cache enabled with DDR cache
3. Tested with VPFEM5256GZIAMTL (Toshiba MLC L die)
4. Random IOPS cover the entire range of legal logical block addresses (LBA’s). Measurements are
performed on a full drive (all LBA’s have valid content)
5. Performance may vary by NAND type and host
6. Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology
Table 2-4: Sequential Read /Write Bandwidth (Iometer 06) using TLC
NAND
Capacity
Flash Type
Read MB/s
(256K)
Write MB/s
(256K)
8GB
15nm
Up to 550
Up to 490
16GB
15nm
Up to 550
Up to 490
32GB
15nm
Up to 550
Up to 490
64GB
15nm
Up to 550
Up to 490
128GB
15nm
Up to 550
Up to 490
256GB
15nm
Up to 550
Up to 490
512GB
15nm
Up to 550
Up to 490
Notes:
Write Cache enabled with DDR cache.
5.

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Table 2-5: Random Read/ Write Input/Output Operations per Second (IOPS)
(Iometer 06) using TLC NAND
Capacity
Flash Type
Random Read
IOPS
(4K)
Random Write
IOPS
(4K)
64GB
15nm
Up to 71827
Up to 13800
128GB
15nm
Up to 71827
Up to 13800
256GB
15nm
Up to 71827
Up to 13800
512GB
15nm
Up to 71827
Up to 13800
Notes:
Write Cache enabled with DDR cache
Random IOPS cover the entire range of legal logical block addresses (LBA’s). Measurements are
performed on a full drive (all LBA’s have valid content)
Performance may vary by NAND type and host
Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology
2.3 Timing
2.3.1 STANDBY IMMEDIATE Command
The Power-On-to-Ready time assumes a proper shutdown (power removal
preceded by STANDBY IMMEDIATE command. A STANDBY IMMEDIATE
before power down always performs a graceful shutdown and does not require
the use of the hold-up circuit. Note that SMART attribute 174 "Unexpected Power
Loss" records the number of non-graceful power cycle events.
Table 2-6: STANDBY IMMEDIATE Timing
Power Cycle Endurance
Min
Max
Unit
STANDBY IMMEDIATE to WE completed
-
72.9
Ms
Notes:
1.From Standby Immediate command to NAND Write Protect enable.
2.4 Electrical Characteristics
2.4.1 Absolute Maximum Ratings
Values shown are stress ratings only. Functional operation outside normal
operating values is not implied. Extended exposure to absolute maximum ratings
may affect reliability.
Table 2-7: Absolute Maximum Ratings

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Description
Min
Max
Unit
Maximum Voltage Range for Vin
-0.2
6
V
Maximum Temperature Range
-40
85
C

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2.4.2 Supply Voltage
The operating voltage is 3.3V
Table 2-8: Operating Voltage
Description
Min
Max
Unit
Operating Voltage for 3.3 V (+/- 5%)
3.135
3.465
V

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2.4.3 Supply Current
Table 2-9: Current Draw
Voltage
Mode
8GB
16GB
32GB
64GB
128GB
Unit
3.3V
Read (Average RMS)
N/A
N/A
325
235
395
mA
Writes (Average RMS)
N/A
N/A
300
250
305
mA
Idle
N/A
N/A
63
62
61
mA
Partial
N/A
N/A
11.5
11
11
mA
Slumber
N/A
N/A
6.7
6.4
6.9
mA
DEVSLP
N/A
N/A
0.98
0.98
0.98
mA
Notes:
1.Measured using 128GB MLC Toshiba A19nm NAND
2.4.4 Power Consumption
All onboard power requirements of the SSD are derived from the SATA 3.3V rail.
Table 2-10: Typical Power Consumption at 3.3V using MLC NAND
Capacit
y
Flash
Structur
e
Flash Type
Rea
d
Writ
e
Partia
l
Slumbe
r
Idle
DEVSL
P
8GB
8GB x 1
TSOP, TSB
15nm
830
765
12.5
8
255
4.9
16GB
16GB x 1
TSOP, TSB
15nm
895
805
12.5
8
256
4.9
32GB
32GB x 1
TSOP, TSB
15nm
970
1,10
0
13
9
260
4.9
32GB
32GB x 1
BGA, TSB
15nm
1,03
0
1,21
0
12
7
255
4.9
64GB
32GB x 2
BGA, TSB
15nm
1,04
0
1,21
5
12
7
257
4.9
128GB
64GB x 2
BGA, TSB
15nm
1,06
5
1,48
0
12
7
255
4.9
256GB
128GB
x2
BGA, TSB
15nm
1,16
5
1,53
5
12
7
260
4.9
512GB
256GB
x2
BGA, TSB
15nm
1,42
5
1,74
0
14
10
260
4.9
Notes:
1.Units are mW
2.Measured using Toshiba A15 Toggle MLC NAND
Table 2-11: Typical Power Consumption at 3.3V using TLC NAND

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Capacity
Flash Structure
Performance
Power Consumption
CrystalDiskMark
ATTO
Read
(MB/s)
Write
(MB/s)
Read
(MB/s)
Write
(MB/s)
Read
(mW)
Write
(mW)
DEVSL
(mW)
120/128GB
64GBx2, BGA, TSB 15nm
550
450
560
540
1,130
1,305
4.9
240/256GB
128GBx2, BGA, TSB 15nm
550
450
560
540
1,360
1,780
4.9
14/16GB1
16GBx1, TSOP, TSB Bics2
290
90
560
540
450
400
4.9
30/32GB
32GBx1, TSOP, TSB Bics2
290
90
560
540
920
810
4.9
60/64GB
32GBx2, TSOP, TSB Bics2
550
175
560
540
1,205
1,040
4.9
120/128GB
64GBx2, TSOP, TSB Bics2
550
350
560
540
1,355
1,400
4.9
120/128GB
64GBx2, BGA, TSB Bics2
550
350
560
540
1,355
1,515
4.9
240/256GB
128GBx2, TSOP, TSB Bics2
550
370
560
540
1,360
1,500
4.9
240/256GB
128GBx2, BGA, TSB Bics2
550
490
560
540
1,400
1,700
4.9
30/32GB
32GBx1, TSOP, TSB Bics3
300
125
560
540
950
850
4.9
60/64GB
32GBx2, TSOP, TSB Bics3
550
255
560
540
1,215
1,020
4.9
120/128GB
64GBx2, TSOP, TSB Bics3
550
450
560
540
1,300
1,350
4.9
240/256GB
128GBx2, TSOP, TSB Bics3
550
450
560
540
1,350
1,400
4.9
120/128GB
64GBx2, BGA TSB Bics3
550
450
560
540
1,270
1,360
4.9
240/256GB
128GBx2, BGA TSB Bics3
550
490
560
540
1,360
1,440
4.9
480/512GB
256GBx2, BGA TSB Bics3
550
490
560
540
1,470
1,520
4.9
120/128GB
48GBx1+96GBx1, BGA, Micron
B0KB
500
390
560
540
1,355
1,515
4.9
Notes:
Units are mW
1 estimate
2.5 Environmental Conditions
2.5.1 Temperature and Altitude
Table 2-12: Temperature and Altitude Related Specifications
Conditions
Operating
Shipping
Storage
Commercial
Temperature- Ambient
0 to 70°C
-40 to 85°C
-40 to 85°C
Industrial
Temperature- Ambient
-40 to 85°C
-40 to 85°C
-40 to 85°C
Humidity (non-
condensing)
90% under 40C
93% under 40C
93% under 40C

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2.5.2 Shock and Vibration
SSD products are tested in accordance with environmental specification for
shock and vibration
Table 2-13: Shock and Vibration Specifications
Stimulus
Description
Shock
500G, 2ms
Vibration
20 –80 Hz/1.52mm
80 –2000 Hz/20G
(X,Y,Z axis / 30 min for each)
2.5.3 Electromagnetic Immunity
M.2 is an embedded product for host systems and is designed not to impair with
system functionality or hinder system EMI/FCC compliance.