VINATech EDLC Series User manual

※The document is the guidance when soldering VINATech's EDLC onto a PCB board.
SOLDERING GUIDANCE
(EDLC Series)

1. Note
•If the soldering temperature is too high or soldering time is too long, the characteristic
of the product can be deteriorated or swollen.
•If the soldering temperature is high or soldering time is long, sleeve can be cracked,
dented, or melted.
•The soldering process must be proceeded after connecting the PCB and the product.
•Also, when connecting PCB and the product, the product must be covered up the sleeve.
•Do not dip the product into melted solder.
•During the soldering process, melted lead must be contacted with terminal of the product
only.
2. Wave soldering
Recommended condition
•Solder composition : 99.3Sn–0.7Cu
•Solder pot temperature : 250~270°C
•Max. Exposure time : 10 sec
•Max. preheat temperature (PCB bottom) : 160°C
•Max. preheat time (above temperature 100°C) : 60 sec
3. Manual soldering
Recommended condition
•Temperature of the soldering rod tip : 350°C (Pb solder) and 400°C (Pb-free solder)
•Max. soldering duration : 5sec
Do not touch the product with the soldering rod.
4. Reflow soldering
Do not use reflow soldering of the product.
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