Wireless-tag WT32-S2-WROVER User manual

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WT32-S2-WROVER Datasheet
V1.0.0
Sept 16, 2021
Wireless-Tag Technology Co., Ltd

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About this document
This document provides users with the technical specifications for WT32-S2-WROVER.
Document updates
Please visit Wireless-Tag’s official website to download the latest version of the document.
Revision history
Please go to the document revision history page to view the revisions of the document.
Disclaimer and copyright notice
Information in this paper, including URL references, is subject to change without prior notice.
This document is provided “as is” with no warranties whatsoever, including any warranty of
merchantability, non-infringement, fitness for any particular purpose, or any warranty otherwise
arising out of any proposal, specification or sample. All liability, including liability for
infringement of any patent rights, relating to use of information in this document is disclaimed.
No licenses, either express or implied, by estoppel or otherwise, to any intellectual property rights
are granted herein.
All trade names, trademarks and registered trademarks mentioned in this document are property of
their respective owners, and are hereby acknowledged.
Copyright © 2020 Wireless-Tag Technology Co., Ltd. All rights reserved.
Statement
Due to product version upgrade or other reasons, the contents of this manual may be changed. Wireless-Tag
Technology Co., Ltd reserves the right to modify the contents of this manual without any notice or prompt. This
manual is only used as a guide. Wireless-Tag Technology Co., Ltd makes every effort to provide accurate
information in this manual, but it does not guarantee that the contents of the manual are completely free of errors.
All statements, information and suggestions in this manual do not constitute any express or implied guarantee.

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Revision History
No.
Version
Changes
Change (+/-) Descriptions
Author
Date
1
V1.0.0
C
First release
Fiona
Sept 16, 2021
*Changes：C――create, A——add, M——modify, D——delete

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Contents
1 Module Overview.............................................................................................................................1
1.1 Features................................................................................................................................. 1
1.2 Description............................................................................................................................ 1
1.3 Applications ...................................................................................................................... 2
2 Block Diagram................................................................................................................................. 3
3 Pin Definitions................................................................................................................................. 4
3.1 Pin Layout............................................................................................................................. 4
3.2 Pin description...................................................................................................................... 4
3.3 Strapping Pins....................................................................................................................... 5
4 Electrical Characteristics..................................................................................................................7
4.1 Absolute Maximum Ratings................................................................................................. 7
4.2 Recommended Operating Conditions...................................................................................7
4.3 Current Consumption Characteristics...................................................................................7
5 Application Note.............................................................................................................................. 9
5.1 Module Dimensions.............................................................................................................. 9
5.2 Reflow Profile....................................................................................................................... 9
5.3 Peripheral Schematic.......................................................................................................... 10
6 Product Trial................................................................................................................................... 11

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1 Module Overview
1.1 Features
MCU
ESP32-S2 chip embedded, 32-bit LX7 single-core microprocessor, up to 240MHz
■ SRAM 320KB
■ RTC SRAM 16KB
■ ROM 128KB
WIFI
IEEE 802.11b/g/n protocol
Data rate up to 150 Mbps
Frame aggregation (TX/RX A-MPDU, TX/RX A-MSDU)
0.4 µs guard interval
Center frequency range of operating channel: 2400~2483.5 MHz
Hardware
Module interface: GPIO, SPI, LCD interface, UART, I2C, I2S, Camera interface, IR, pulse
counter, LED PWM, TWAITM (compatible with ISO 11898-1), USB 1.1 OTG, ADC, DAC,
touch sensor, temperature sensor
40MHz crystal oscillator
4 MB SPI flash
8 MB PSRAM
Operating voltage/Power supply: 3.0~3.6 V
Operating ambient temperature: -40~85℃
Package size: (18 × 31 × 3.3) mm
1.2 Description
WT32-S2-WROVER is a universal Wi-Fi MCU module with powerful functions and rich
peripheral interfaces, which can be used in scenarios such as wearable electronic devices and
smart homes.
WT32-S2-WROVER adopts IPEX onboard antenna, equipped with 4 MB SPI flash and 8 MB SPI
PSRAM.
WT32-S2-WROVER uses ESP32-S2 chip. The ESP32-S2 chip is equipped with an Xtensa®
32-bit LX7 single-core processor with a working frequency of up to 240 MHz. The user can turn

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off the power of the CPU and use the low-power coprocessor to monitor the status changes of
peripherals or whether certain analog quantities exceed the threshold. ESP32-S2 also integrates a
wealth of peripherals, including SPI, I2S, UART, I2C, LED PWM, TWAITM, LCD interface,
Camera interface, ADC, DAC, touch sensor, temperature sensor and up to 43 GPIOs, as well as a
full-speed USB 1.1 On-The-Go (OTG) interface.
1.3 Applications
Generic low-power IoT sensor hub
Generic low-power IoT data logger
Camera video streaming
OTT TV box/set-top box equipment
USB device
Voice recognition
Image recognition
Mesh network
Home automation
Smart home control panel
Smart buildings
Industrial Automation
Smart agriculture
Audio equipment
Health/Medical/Nursing
Wi-Fi toys
Wearable electronic products
Retail & Catering
Smart POS application
Smart door lock

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2 Block Diagram
Figure 1 Block Diagram

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3 Pin Definitions
3.1 Pin Layout
Figure 2 Pin Layout
3.2 Pin description
Table 1 Pin Definitions and Descriptions
Pin
Name
Description
1
GND
Ground
2
IO07
RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
3
IO42
MTMS, GPIO42
4
IO45
GPIO45
5
IO46
GPIO46
6
GND
Ground
7
IO33
SPIIO4, GPIO33, FSPIHD
8
TXD
U0TXD, GPIO43, CLK_OUT1
9
RXD
U0RXD, GPIO44, CLK_OUT2
10
IO34
SPIIO5, GPIO34, FSPICS0
11
IO41
MTDI, GPIO41, CLK_OUT1
12
IO40
MTDO, GPIO40, CLK_OUT2
13
IO39
MTCK, GPIO39, CLK_OUT3
14
IO38
GPIO38, FSPIWP
15
IO37
SPIDQS, GPIO37, FSPIQ
16
VCC
Power supply
17
IO36
SPIIO7, GPIO36, FSPICLK
18
IO35
SPIIO6, GPIO35, FSPID

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Pin
Name
Description
19
IO0
RTC_GPIO0, GPIO0
20
IO01
RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
21
IO02
RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
22
IO05
RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
23
IO03
RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
24
IO04
RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
25
IO06
RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
26
IO21
RTC_GPIO21, GPIO21
27
IO20
RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
28
IO19
RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-
29
IO18
RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3
30
IO17
RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1
31
IO16
RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
32
IO15
RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
33
IO14
RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS
34
IO13
RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7
35
IO12
RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6
36
EN
Chip Enable pin:
High level: on, enables the chip.
Low level: off, the chip powers off, low current.
Note: Do not leave the EN pin floating.
37
IO11
RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5
38
IO10
RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4
39
IO09
RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD
40
IO08
RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7
41
GND
Ground
3.3 Strapping Pins
ESP32-S2 series has three strapping pins.
GPIO0 = IO0
GPIO45 = IO45
GPIO46 = IO46
Software can read the strapping values of these pins in “GPIO_STRAPPING” register.
During the chip’s system reset(power-on-reset, RTC watchdog reset, brownout reset, analog super
watchdog reset, crystal clock glitch detection reset), the latches of the strapping pins sample the
voltage level as strapping bits of “0” or “1”, and hold these bits until the chip is powered down or
shut down.

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IO0, IO45, IO46 are connected to internal pull-up/pull-down by default. If these pins are not
connected externally or the connected external circuit is in a high impedance state, the internal
weak pull-up/pull-down will determine the default value of the input level of these pins.
To change the value of strapping, users can apply external pull-down/pull-up resistors, or use the
GPIO of the host MCU to control the strapping pin level of ESP32-S2 during power-on reset.
After reset, the strapping pins work as normal-function pins.
Refer to Table 2 for a detailed boot-mode configuration of the strapping pins.
Table 2 Strapping Pins
VDD_SPI voltage 1
Pin
Default
3.3 V
1.8 V
IO45 2
drop down
0
1
Booting Mode 1
Pin
Default
SPI Boot
Download Boot
IO0
pull up
1
0
IO46
Drop down
N/A
0
Enabling/Disabling ROM Code Print During Booting 3 4
Pin
Default
Print normally
No printing after
power-on
IO46
Drop down
See the description in
Article 4 for details
See the description in
Article 4 for details
Note:
1. The firmware can change the setting of "VDD_SPI voltage" after booting through the
configuration register.
2. GPIO 46 = 1 and GPIO0 = 0 cannot be used.
3. Since the operating voltage of the module's flash is 3.3 V by default (VDD_SPI output), the
internal IO45 pull-up resistor R1 of the module is not loaded by default. At the same time,
please pay attention to ensure that the external circuit will not pull IO45 high when the module
is powered on when using IO45.
4. The ROM Code power-on printing defaults to the TXD0 pin, which can be switched to the
DAC_1 (IO17) pin under the control of the eFuse bit.
5. The UART_PRINT_CONTROL of eFuse is:
When it is 0, it will print normally after power-on, and it is not controlled by IO46.
When 1, IO46 is 0: normal printing when power on; IO46 is 1: no printing when power on.
At 2 , IO46 is 0: no printing when power on; IO46 is 1: normal printing when power on.
At 3 , there is no printing after power on, and it is not controlled by IO46.

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4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Table 3 Absolute maximum ratings
Symbol
Parameter
Min
Max
Unit
VDD33
Power supply voltage
-0.3
3.6
V
TSTORE
Storage temperature
-40
85
℃
4.2 Recommended Operating Conditions
Table 4 Recommended Operating Conditions
Symbol
Parameter
Min
Typ
Max
Unit
VDD33
Power supply voltage
3.0
3.3
3.6
V
I
V DD
Current delivered by external
power supply
0.5
—
—
A
T
Ambient temperature
– 40
—
85
°C
Humidity
Humidity condition
—
85
—
%RH
4.3 Current Consumption Characteristics
With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to the tables below.
Table 5 Current Consumption Depending on RF Modes
Work mode
Description
Peak (mA)
Active(RF working)
TX
802.11b, 1Mbps, @19.5dBm
310
802.11g, 54Mbps, @15dBm
220
802.11n, HT20, MCS7, @13dBm
200
802.11n, HT40, MCS7, @13dBm
160
RX
802.11b/g/n, HT20
63
802.11n, HT40
68
Note:
1. The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.

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2. The current consumption figures in RX mode are for cases when the peripherals are disabled and the
CPU is idle.
Table 6 Current Consumption Depending on Work Modes
Note:
●When measuring Modem-sleep power consumption data, the CPU is in working state and the cache is in
idle state.
●In the scenario where Wi-Fi is turned on, the chip will switch between Active and Modem-sleep modes,
and the power consumption will also change between the two modes.
●In Modem-sleep mode, the CPU frequency changes automatically, and the frequency depends on the CPU
load and peripherals used.
●In Deep-sleep mode, only when the ULP coprocessor is in working state, GPIO and low-power I2C can be
operated.
●When the system is in the ultra-low power sensor monitoring mode, the ULP coprocessor or sensor works
periodically. The touch sensor works with a 1% duty cycle, and the system power consumption is typically
22 µA.
Work mode
Description
Typ
Modem-sleep
CPU is working
240 MHz
22 mA
160 MHz
17 mA
Normal speed：80 MHz
14 mA
Light-sleep
—
550 µA
Deep-sleep
ULP coprocessor is working
235 µA
Ultra-low power sensor monitoring mode
22 µA @1% duty
RTC timer + RTC memory
25 µA
Only the RTC timer is working
20 µA
close
CHIP_PU pin is pulled low, the chip is in the off state
1µA

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5 Application Note
5.1 Module Dimensions
Figure 3 Module Dimensions
5.2 Reflow Profile
Figure 4 Reflow Profile

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5.3 Peripheral Schematic
This is the typical application circuit of the module connected with peripheral components (for example,
power supply, antenna, reset button, JTAG interface, and UART interface).
Figure 5 Module Schematics

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6 Product Trial
Enquiry email：[e-mail]
Technical support email：[e-mail]

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Federal Communication Commission Statement (FCC, U.S.)
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator &
your body.
IMPORTANT NOTES
Co-location warning:
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
OEM integration instructions:
This device is intended only for OEM integrators under the following conditions:
The transmitter module may not be co-located with any other transmitter or antenna. The module shall
be only used with the external antenna(s) that has been originally tested and certified with this module.
As long as the conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed (for example, digital device emissions, PC peripheral requirements,
etc.).
Validity of using the module certification:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC authorization for this module in combination with the host

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equipment is no longer considered valid and the FCC ID of the module cannot be used on the final
product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.
End product labeling:
The final end product must be labeled in a visible area with the following: “Contains Transmitter Module
FCC ID: 2AFOS-WT32S2WROVER”.
Information that must be placed in the end user manual:
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user's manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
Integration instructions for host product manufactures according to KDB 996369 D03 OEM
Manual v01
2.2 List of applicable FCC rules
FCC Part 15 Subpart C 15.247 & 15.207 & 15.209
2.3 Specific operational use conditions
The module is a Bluetooth module with WiFi 2.4G function.
WiFi Specification：
Operation Frequency: 2412~2462MHz
Number of Channel: 11
Modulation: DSSS, OFDM
Type: PCB Antenna
Gain: 2 dBi
The module can be used for mobile or applications with a maximum 2dBi antenna. The host
manufacturer installing this module into their product must ensure that the final composit product
complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including
the transmitter operaition. The host manufacturer has to be aware not to provide information to the end
user regarding how to install or remove this RF module in the user's manual of the end product which
integrates this module. The end user manual shall include all required regulatory information/warning as
show in this manual.
2.4 Limited module procedures
Not applicable.
2.5 Trace antenna designs
Not applicable. The module has its own antenna, and doesn’t need a host’s printed board microstrip
trace antenna etc.

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2.6 RF exposure considerations
The module must be installed in the host equipment such that at least 20cm is maintained between the
antenna and users’body; and if RF exposure statement or module layout is changed, then the host
product manufacturer required to take responsibility of the module through a change in FCC ID or new
application. The FCC ID of the module cannot be used on the final product. In these circumstances, the
host manufacturer will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC authorization
2.7 Antennas
Antenna Specification are as follows:
Type: PCB Antenna
Gain: 2 dBi
This device is intended only for host manufacturers under the following conditions: The transmitter
module may not be co-located with any other transmitter or antenna; The module shall be only used with
the internal antenna(s) that has been originally tested and certified with this module. The antenna must
be either permanently attached or employ a ‘unique’antenna coupler.
As long as the conditions above are met, further transmitter test will not be required. However, the host
manufacturer is still responsible for testing their end-product for any additional compliance requirements
required with this module installed (for example, digital device emissions, PC peripheral requirements,
etc.)
2.8 Label and compliance information
Host product manufacturers need to provide a physical or e-label stating “Contains Transmitter Module FCC
ID: 2AFOS-WT32S2WROVER” with their finished product.
2.9 Information on test modes and additional testing requirements
WIFI
Operation Frequency: 2412~2462MHz
Number of Channel: 11
Modulation: DSSS, OFDM
Host manufacturer must perfom test of radiated & conducted emission and spurious emission, etc
according to the actual test modes for a stand-alone modular transmitter in a host, as well as for multiple
simultaneously transmitting modules or other transmitters in a host product. Only when all the test
results of test modes comply with FCC requirements, then the end product can be sold legally.
2.10 Additional testing, Part 15 Subpart B disclaimer
The modular transmitter is only FCC authorized for FCC Part 15 Subpart C 15.247 & 15.207 & 15.209
and that the host product manufacturer is responsible for compliance to any other FCC rules that apply
to the host not covered by the modular transmitter grant of certification. If the grantee markets their
product as being Part 15 Subpart B compliant (when it also contains unintentionalradiator digital circuity),
then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B
compliance testing with the modular transmitter installed.

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Manufacturer's Name: Wireless-Tag Technology Co., Ltd
Sample Description: WIFI Module
Trade Mark: wireless-tag
Model number: WT32-S2-WROVER
This device was tested for operations. To comply with RF exposure requirements, a minimum separation
distance of 20cm must be maintained between the user’s body and the product, including the antenna
.
Accessories that do not meet these requirements may not comply with RF exposure requirements and
should be avoided. Use only the supplied or an approved antenna.
This device in compliance with the essential requirements and other relevant provisions of Directive
2014/53/EU. All essential radio test suites have been carried out. This restriction will be applied to all
Member States of European Union.
1. The device complies with RF specifications when the device used at 20cm form your body
Declaration of Conformity
Hereby, Wireless-Tag Technology Co., Ltd declares that the product type WT32-S2-WROVER is in compliance
with Directives 2014/53/EU.
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RF specification:
Function Operation Frequency
Max RF
Outputpower
(dBm)
Limit
(dBm)
2.4G WIFI 2412-2462MHz 18.70 20