Yaesu FT-8100R Manual

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YAESU
FT-8100R
Technical Supplement
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2 ~, ~ · "11"000 ~ r2
70 ~ -- -- .-- --- -- ~
r tr " 'I' , ! '!( ' !1 " ! '! 1 "1 ~
VERTEX STANDARD CO., LTD.
4"",-8 NakamegufQ. Meguro-Ku.Toltyo 15:l-8644. Japan
VERTEX STANDARD
usHead qua rters
17210 Edwards Rd.. ~ff ~O' . CA 90703. U,S,A,
Inte
ma lional Div isio n
8350 NW , 52nd Terrace. Sufle 201, Miami, FL 33166, US .A
YAESU EUROPE B.V.
P.O. Box 75525. 1118 ZN Schlphol, The Nelhe r1 i1nds
YAESU UK LTD.
UM 12. Sun Valley Busmess Pari!,. W,nn a!1 ccee
Winchester. Hampshire. S023 OlB , UK.
YAESU GERMANYGmbH
Am Kronberge' Hang 2. 0-6582 4Schwalbach,GofTn.ny
VERTEX STANDARD HK LTD.
UM 5, ZOIF.. Seaview Centre . 139-141 H()IBun Road.
Kwun Tong. Kowloon . Hong Kong

Contents
General Information and Alignment 1
Intro du ction 1 -1
Specifications 1-2
Chip Component Information 1-3
Transceiver Disassembly and PCBAccess 2-1
Lithium B
att ery Replacem ent 2-3
Pilot La
mp Replacem ent 2-4
Resetting the CPU 2-5
Exploded View &Miscellaneous Parts 2-7
Alignment 2-9
Servicing 3
Circuit Description 3-1
Block Dia gr am 3-7
Interconnection Diagram 3-8
Board Units (Circuit Diagram, Parts La yout, Part s li st) .4
144-VCO Unit 4A-I
430-V
CO Unit 4B -1
VR-L Unit 4C-I
VR-R Unit 4D-I
144-Main Unit 4E-I
430-Main Unit 4F-I
Panel Unit 4G-I
CONNEC T-I, -2 Unit 4H-I
Optional Board Unit (Circuit Diagram, Parts layout , Parts Li st> 5
FTS-22 Tone Squelch Unit 5A-l
MH-36
B6) DTMF Mi crophon e 5B-I
MH-42B
6) Hand Scanning Microphone 5C-I
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CU iout the labelatthe right.and placeit behind the
clear plastic window in the spine of the manual.
~ - - - - - - - - - - - - - - - - -
IFT-8100R
: Technical Suppleme nt
L

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-----------------Introduction
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The m anual provid es the technical inf orma-
tion necessary f or se rvicing the IT- Bl OOR Dual -
Band mobile ama teur transceiver.
Servicing this eq uip ment r equir es expe rtise in
ha ndlin gsurface-m ount chip components. At-
te mpts by n on -qu alified pe rso ns to service this
equip
me nt may r esult in p erm an ent dam age not
covered by the wa rranty, and may be illegal in
some countries.
T wo PCB lay out dia gram s provid ed for each
doub le-sided board in this tran sceiver. Each side
of the board is referred to by the type of the ma-
j orit y of components installed on that si de (vl ead -
IT -BJooR Tecl,"ic-al Supplement
ed" or "chip-only" ). In most cases one side has
onl y chip components, and the other has either
a mi
xtur e of b oth chip and l ead ed components
(trim me rs, coils, electrolytic capacitors, ICs, etc.),
or le aded compone nts only.
While we believe the inf
orm ation in this man -
ual to be correct, Yaesu
Mu s en as sum es no lia-
bility f
or d ama ge that may occur as a result of
t
yp ogr aph ical or ot he r er ro rs that may be
pr esent. Y our coopera tio n in p ointin g out any
in con sist en cies in the te chni cal inf orm ation
would be appr eciated.
1-1

Specifications ----------------
General
Fre que ncy Range:
Cha nne l Step :
Fre quency Stability:
Re peate r Shift:
Emission T ype :
Anten na
Impedance :
Supply Voltage:
Current Co nsu mption:
Operating T emp .Range:
Case Size (WHO):
Weig ht (approx.):
Trans mitter
RF Oulput (H /M /U,
Modu lationType:
Max Deviation:
Spurious Emission:
Distortion (@70% MOD .):
Mi cropho ne Imped an ce:
Neceiver
Circuit Type:
IFs:
12 dB S INAD Sensitivity:
Selectivity (-6 /-60 dB),
Image Rejection:
Sque lch Sensitivity:
Af Outpu t:
AF Outpu tIm ped an ce:
1-2
(RX) 110 - 550 MH z, 750 - 1300 MH z '" ... , ulli/a , ItIrKUd
(TX) 144 - 148 MHz, 430 - 450 MH z
5
/10 / 12.5/15 /20/25 /5 0 kHz
±IOppm (-20 °C - +60 °C, VHF)
±5 ppm (_
5° C - +60 -c,UHF)
±600 kHz (VHF)
±1.
6/5. 0/7. 6 MH z (UHF)
F3 (G3E), F2
(l200bp, packet), FI (9600bp, packet)
50 Qunbalanced
IX: 13.8 V ±15 %, Negative G rou nd
Receive: less than 1.0 A
Transmit; 10.0 A
-20 to +60 °C
140 x40 x165 (w /o knob)
1.0 kg
50 /20 /5 W(VHF)
30
/20 /5 W(UHF)
Variable reactance
±5 k
Hz
>60 dB belo v..· carrier
less tha n 3%
2kQ
Double- conve rsion superheter ody ne
45.05 MHz
/45 5 kHz (VHF)
58.525
MH z /4 55 kHz (UHF)
<0.18
~ V (MAIN)
<0.25
~ V (SUB)
12
/2 4 kHz
better than 70 dB
better than O.13IlV
2W@8 Q fo r5 % THD
4 - 16 Q(8 Qint
erna l s pe aker)
Sprcific a t;o llssu bjec t tochd llge witho ll t Iloticeor obligatioll.
Sp«i/icatiollsguaranteed within
amateur ba nds only.
Fr
eqllfrl cy range alld repeater shift vary acco rding to tran scei ver vers ion,
IT -Bl OO R Technical Supplement
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•Chip Component Information
The diagrams below indicate some of the dis-
tin gui shing features of common chip compo-
nents .
Capac itors
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•T antatusn Capacitor s
~~
~-L
~ ~ ~
if
Resistors
(Uniti mm)
T yp" LWH
2125 2.0 1.25 0.35 - 0.5
1608 I. .0.8 0.65 - 0.95
1005 1.0 0.5 0 .45 - 0.55
(Unit " m m)
Type LWH
P2.0 1.25 1.2
A3.2 I. . I..
B3.' 2.8 I.,
e5.8 3.2 2.3
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H
T
Indicated Lett ers
1 2 3 4 5 , , : , 0 •
(Unit· mm)
Type LWH
1 /10 2.0 1.25 0.5
1/1 6 I.. 0.8 0.45
1/165 1.0 0.5 0.35
IT-8IooR Tu hnical Supplement
Marking" 100, 222, 473...
' 73
I I
Tens Ones Multiplier
001
0'
1 1 10'
22 10'
3 3 10'
, , 10'
5 5
1O ~
• • 1
0'
7710'
8810'
9,10'
Examples: 100: 100
222",2.2kQ
473 :47kQ
1-3

Chip Component Information ---------
Replacing Chip Components
Chip components are installed. at the factory
by a series of robots . The first one places a small
spot of adhesive resin at the location where each
part is to be installed , and later robots handle
and place parts using vacuum suction.
For single sided boar ds ,solder paste isapplied
and the board is then baked to har den the resin
and flow the solde r. For d ou ble si ded boa rds, no
sol de r pa ste is applied, but the bo ar d is bak ed
(or expose d to ultra-violet light) to cure the re sin
before dip sol de ring.
In our la bor at or ies and service shops, small
quan tities of ch ip components are mou nted man-
ually by applying a spot of resin,placing with
tweezers , and then soldering by very small dual
streams of hot air (without physical contact dur-
ing soldering) . We remove parts by first remov-
ing solder using a vacuum suction iron, which
applies a light steady vacuum at the iron tip, and
then breaking the adhesive with tweezers.
The special vacuum /dcsc ldering equipme nt
is rec omm end ed if you expect to do a lot of chip
replacem
ent s. Otherwise, it is usua lly possible
to r emove and r epla ce chip components with
on ly a tapered, t
empera t ur e-controll ed solder-
ing
iro n, a set of tweezers and brai de d co ppe r
sol de r wick. Sol de ring iron te mpe rature should
be be low 280°C (536 °8 .
1-4
Precautions for Chip Replacement
oDo not disconnect a chip forcefully, or the
foil pattern may peel off the board .
o Never re-usea chip component. Dispose of
all remov
ed chip components immediate-
ly to avoid mixing with new parts .
oLimit soldering time to 3 seconds or less to
avoid
dam aging tileco mpo nent and board .
Removing Chip Components
oRemove the solder at each joint, one joint at a
time, using so
lde r wick w hetted with nona-
cidic fluxes as s
how n be low . Avoid ap plying
pressure , and do not attempt to re move tin-
ning from the chip 's electrode.
oG rasp the chip on both sides with tweezers ,
and gently twist the tweezers back and fort h
(to br
eak the adhesive bond) while alter nate -
ly heating each electrod e. Be careful to avoid
peeling the foil traces f rom the boa rd.
Dis pose of the chip w hen r em ov ed .
oAfter removing tile chip, use the co ppe r braid
and so
lde ring iron to wick away any excess
solder and s
mooth the land for installation of
the replacement part.
IT-B lOOR T uhn icaf SupplemNlt
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Chip Component Information
ln stalling a Replacement Chip
As the value of so me chip com po ne nts is not
indicated
on the b od y of the chip, be careful to
ge t the ri ght part for replac em ent.
o App ly a sma ll am oun t of sol de r to the land
on one si de where the chip is to be installed.
Avo id too mu ch so lde r, wh ich may ca use
br idging (shorting to other part s).
o Hold the chip with tweezers in the de sired
position, and apply the sol de ring iron with a
motion line as ind icated by the ar row in the
dia gr am below. Do not ap ply heat for mor e
than 3 seconds.
oR em ove the twe eze rs and solder the elec trode
on the other side in the m anner just described.
IT -Bl OOR Technical Sllppfemellt1-5

Transceiver Disassembly &PCB Access
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144M-Main Unit Access
oRemove 2 sc rews from each side of the top
and bottom cover and 2 from the top (Fig-
ure 1),
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Figure 1
oTilt the re ar of the top cove r up w ar d. un-
plug the s pea ker wire connector from J IDO l
on the 144M-Main U nit , then sli de it out
from the chassis (Do not use force to remove
the top cover).This exposes the co mpo nent
side of the 144M-Main Unit (Figure 2).
Figure 2
IT-BlOOR Technical Supplement
430M-Main Un it Ac cess
oPlace the set u pside- dow n, and r em ove 2
screws fr
om each s ide of the botto mcover
and 2 from the top (Figure 3).
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Fi gur e 3
oTilt the rear of the bottom cover upw ar d,
then sli de it out from the chassis, to expose
the co mpo nent si de of the 430M-Main Unit.
2-1

Transceiver Disassembly &PCB Access
Panel Unit Access
oAft er r em ovin g the fr ont p an el fr om the •
tr an sceiv er . r em ove 2sc rews from r ear side
of the front panel (Figure 5).
Connect Unit Access
oAfter rem oving the top and bottom covers ,
to rem ove the fr ont panel by slightly pry-
ing o pe n the latch on the si de of the tran s-
ceiver. Next, sli de the panel out wa rd and
away f rom the transceiver.
oR em ove 2 s crews fr om bo th the t op and
bottom of the front sub panel. And r
em ove
ascrew from f ron t sub panel (Figure 4).
•
Figure 4
oPull the f ront sub panel to slightly fr om the
transceiver, and unplug the connector from
J101 0 0n the 144M-Main Unit, to ex pose the
144M-Main Unit.
2-2
Clips
Figure 5
o Care fully sepa rate the re ar case from the
fron t pa nel
(i tclips at 6 poi nts at bot h the
top and bott om edges) . Disc onn ect the flat
ribbon c ab le from J300t on the DISP Unit
to
expose the DlSP Unit (Figure 6).
Figure 6
IT- SIOOR T uhnicRl Supplement
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Li thium Battery Replacement
J10 05
2-3
unsolder
remove
removeremove J1004
Lithium B att ery Replace
DRemove the top cover. Locate Lithium Bat-
tery BTl 001 (P IN Q9000696) on th e 144M-
Mai n Unit . Note the polarity and correct
mo un ti ng of the cell t ermi nals.
oUnpl ug the wire co nnec tor from J1004,
Jl 005 on the 144M-M ain Unit.
oRemove the 9 screws from 144M-Main Unit.
No te the location of the 9 screws, as ind i-
cate below.
oU nso l de r the 3 stud s from 144M-Main Unit.
Note the location of the 3 s tuds , as indicate
below.
o Unso l de r the battery terminals and r em ove
the old cell.
N ote : Do notdi spo seof the old batt eryin fire ,
ande"su re small child re n ca nnotplaywith,or
possiblyil/s est the cell.
oM ou nt t he replacement cell in the simila r
manner, observing proper polarity when
installi ng it.
unsol
de r ~IGQ [? - IbJ flI !
r-, .. II ..: I unso lde r I~[1j' 'V''"
t - tl ~ f~\l~~- ~ ; il A ;:
'-::!~ -05+t " , "' S"""" tIi 0 ~ ~1f"I!l""" ~ e; ""
IQl
.c !@ ~ I~ IC5' !II . ~ 'i!i""" I " !lilt
BT1001 r- \j ~r~ i£l'F; n';;"'- 11- . ~. -.l'l ... ,
:cD
,.] ~~;" !l& r '''~ J .• ;J: liO I: ;&J D
II ~~~ " ~ ~ ~ ~ ~ I'U 1 ~ · ~ w :-w - t- ~ ~ - - ~~
,--- -- --, JI( 1'":. f:.. = JiJ'fft& .• "'A & IBm .. ~15f1l ,@
~
- I, ., ,,, <0> ill ill - Gt::r
T=_ .. . ~ ~ ;;.,J. w.....w_ . - P II! I!
. . "' l~' 5"_ ~ •
• i mlllU ~, '" i'l 'A~ ,p ;Or.:- "'" _U • re •
!, 1 _, rL CJ - Zi ,:1/':» , ."" ( _ '\l
IT- BlOOR Technical Supplem,,"t
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Pilot Lamp Replacement
P ilot Lamp Replaceme nt
o Remove and separate the front panel as
previou sly described. Note the location of
the 4 lamps , as indicated below.•
•
oTo re move it failed l am p, use a low watt -
age soldering iron and forceps to u nso lder
and free each lead, then gent ly lift
the bulb
ou t of the hole.
oInstall replace me nt bul bs in the reverse
man ner, t hen reass em ble the t ransceiver
case.
2-4
IT -B lOOR Technical Supp lement
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Resetting the CPU
Res etting the CPU de ars all mem or ies, r epe at-
er shifts and other setti ng to th eir d efault s, and
leaves the transceiver CPU in the same state as
when
it left the factory.
Asoft reset can be done by h olding the D /MR
and REV keys while sw itchi ng the tran sceiver
on. If a Cl'Ij-related problem remains after the
soft reset, a hardreset can be d on e as f ollows :
oTum the transceiveroft and di sconn ect all
cables.
oRemove the top cover.
oT emp or arily short "cross capacitor C1470.
Note the location of the C1470, as indi cat-
ed below.
C1470 ---+--'.;1
.~
.. ~
aimmnIi
,
IT -SIOOR Technical SlIpplemfflt
Resetting the CPU
o
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2-5

REF YAESU PiN
D. " ,, ~ ~
""
,U20306001 BINDING HEAD SCREW M
3- &•
2U2J106001 TAPTITE SCREW M
2' 62
3U07
430I01
PAN HEAD SCREW M2 6' J8lI t2
( 4-'
U24205001 TAPTITE SCREW M2 6" 521
SU1
4206001 TAPTITE SCREW M2 6- 6B •
6UJ12001001 OVAL HEAD SCREW 1,126- 48 "
'1
l/3ooI 206001 TAPTITE SCREW
1,1I 2 6- 6•
,
04 3112001 TAPTITE SCREW M2- 129 I
9
04 3116007 TAPTITE SCREW M Z· 16B I
"
U99OOO"
TAPTITE SCREW M2 -68
•
"" 090101
SPEAKER
t9:106433
T92064J8A (Lol 5- 1_
WIRE ASS'Y
' ''- Ma ,n~
R352271Q
KNOB (ENG)
RAOOO7200
FRONT PANEL ASS"Y
R3154210
KNOB (SO ll f2pcs)
R
R
R 3!l2 272Q
KNOetAl
CONNEC T·] UM
/
R3154 20M ~ tf'
KNOB fAF ) {2 pca )_ ~ .
•
R6054387B
SP ECIAL NUT (3(lCIl
IT-BJooR T~ch"i(lrl Supplt'mnrt
•

l- - - - - - - - Exploded View & Miscellaneous Parts
CS15 14001
TOP CASE ASS'y
000
<NEL
I
EL
M2090017
FAN
R3520800
FAN COVER
R7150880
EMRON
430-Ma'" Un~
CS1515O(J1
BonOM CASEASS'V
19206228
WIRE ASS'Y
19206516
WIRE ASS'V (OST USA)
19206225
WIRE ASS'V JOST EXP. AUS)
Non-designated parts are available
only as part of designated assembly.
2-7

-----------------Alignment
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The Ff ·8100R is carefully aligned at the facto-
ry f
or the specifi ed perf ormance ac ross the ama -
t
eu r b and s. Re alignm ent should th er efore not be
necessary except in the
eve nt of a component fail-
ur e. All compone nt r epla c ement and ser vice
should be perf ormed only by an aut ho rized Yae-
su r epr esentative, or the w ar ranty policymay be
voided.
The following proced u res c ove r the so me -
tim es critica l and t
edi ou s adj ust ments that are
not n ormall y requir ed once the tran sceiver has
left the fact or y. Ho wever, if d amage occ urs and
so me parts su bseq ue ntly be replaced,reali gn-
ment may be required. If a sud de n pr oblem oc-
c urs dur ing n ormal ope ration, it is likely du e to
com
po nent fai lur e; reali gnm ent should not be
done until after the faulty co mpo nent has been
replac ed .
We rec
omm end that servicing be perform ed
only by au thoriz ed Yaes u ser vice te chni ci an s
who are ex pe rienced with t he circuit ry and fully
equi ppe df or r ep air and alig nm en t. Ther ef or e,
if a fault is suspected, con tact t he deal er f rom
w ho m t he tra nscei ver \ v, 15 pu rr -ch ase d for in-
stru ctions reg ardi ng r ep air. Aut ho rize d Yaesu
serv ice technicians reali gn all circuits and make
complete perf orm an ce checks to ensur e compli-
ance with specifications after replacing any faulty
com
po nents.
Tho se who do un dertake an y of the follo win g
alignments arc cautioned to
pr oc eed at their ow n
risk. Probl em s caused by unauth or ized attempts
at r
ealignm ent are n ot covered by the warranty
poli cy. Also, Y acsu mu st res er ve the ri ght to
change circuits
and ali gnm ent pr ocedure s in the
interest of
impro ved perf orman ce, without n oti -
f
yin g o wn ers .
Un
de r no circu ms tances should an y alignm ent
IT· BlooR Technical Supplement
be att empt ed unl ess the n ormal fun cti on and
op er ati on of the tr an sceiv er are cle arl y und er -
stood, th e ca
use of the ma lfun cti on has b een
cle arly pinpointed and an y f ault y compo ne nts
r
epla c ed , and t he ne ed f or r eali gnm ent det er -
min ed to be ab solut ely nec es sar y.
The foll
owin g test equip me nt ( an d th orou gh
famili arit y with its cor rec t use) is necessary f or
comp lete re alignm ent. C or rec tion of p ro ble ms
ca use d by mis ali gnm ent re sultin g from use of
improper test eq uip me nt is not cove red under
the wa rranty poli cy. Whil e m ost ste ps do not
requir e all of the equip me nt list ed , the inte rac -
ti
on s of so me ad j ust me nts may requir e that m or e
co
mp lex ad ju stm ent s be p erform ed afte rwa r ds.
Do not at te m pt to pe rfo rm only a si ng le st ep
unless it is clea rly is olat ed e lect rically from all
other steps. Rath
er , have all t est equip me nt re ad y
bef or e beg inni ng , and foll ow all of the ste ps in a
sect
ion in the or de r p res ent ed .
Required Test Equipment
oRF Sig nal Gener ator with calib ra ted ou tp ut
level at 500 MH z
oDeviation Met er (Linear Dete ctor )
oAC Voltmet er
oSINAD Met er
o lnline Wattm et er w ith 5% acc u racy at 500
MH z
oRe gulated DC Po wer Supply adj usta ble from
lO' o1 7V ,l S A
o 5Q.. Q Dumm y Load: 100 W att s at 500 MH z
oFre qu ency Co unter: 100 Hz re soluti on and ±
0.2 ppm ac cur acy at 500 MH z
O AF Signal Ge
ne rator
D OC Volt me ter: hi gh imped an ce
oUHF Sampling Co upler
2-9

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''''''''
TCU02
NO h':Signal level s ;/1 dB n it'Tred toin thealignmcnt
procedure are based on0dBp =05 dBpV.
time f or eq ualiza tio n w ith the e nvi ron me nt be-
f ore alignment.
Wh
en ev er p ossibl e, a lig n me nts s ho uld be
mad e
with osc illato r shiel ds and circ ui t board s
firmly affixed in place. Also, the test
eq uip me nt
mu st be th or ou ghl y warm ed up be fore begin -
mn g.
Most
alignm ent pr ocedur es call f or tunin g the
trans ceiver to the high or 10w band ed ge , or to
band center. The a ctual frequen cy diff ers be-
twe
en different versions,so the technician should
make s ur e of the band limits of each set to be
aligned before be ginn ing.
UHF Pll & Transmitter Alignment Po ints
VHF Pl l & Tra nsmi ner Ali gnment Points
VR1002
VR1006
VR1005
VR1001
Alignment -------------- --
Alignment Preparation &Precautions
A so-o dum my load a nd inli ne wa tt mete r
must be co nnected to the a nten na jack in all pro-
ced u res that call for tr an sm ission, except where
specified othe rw ise . Co rrect alig n me nt is not
possible with
an antenna.
After completing 0 0(' step. wad the foll owing
step to det ermine whether the sa me t est equip-
men t will be r equir ed . If not , r em ove the test
equipment (except power supply, dumm y load
and wa ttmeter, if connected) before proceeding.
Cor rect align me nt re qu ires that th e ambient
tem pera t ure be the sa me .15 t hat of the tr an sceiv-
cr and test equipment, and tha t this tem per atur e
t'ot. ' held co nstant betwee n 20 and 30 °C (68 - 86
"F). If the tr an sceiv er is broug ht i nto the sh op
from hot or co ld air it s hou ld be allowed some
2-10
rT ..slOOR T uhn iclII Sllpplement

Alignment
PLL &Transmitter Transmitters
•Set
up the test equipment as shown for trans-VHF
Power Output
nutter alignment. Maintain the supply voltage oCouple the frequency counter to sample the
at I3.8V IX: for all steps. RFoutput.
I Regul ;l1~ ~
S~mp " ng
1" lIne
-~ Io
Tune to band center (for the version being
138VPSU
'"" .. '
wanmel,",
DummyLoad aligned),
and press the lOW button if neces-
~ F'eq CouM.f I
sary , to select low power output.
L- .-i Dev1~toon Mt'!e<IoKey
the transmitter and adju st TC1001 on the
I144-Main Unit to
mat ch the display to the
Lf '" G<~ ,".
counter frequency ( within 100 Hz).
~ I\C von me1er I
AI; VoIlm01tet Io
Tune to band center (f or the version being
•aligned),
and pre ss the LOW button ,if neces-
Transmitte r Alignment Setup
sary , to select high power output.
oKey the tran smitter and adjust VR1001 on the
PLL VCV (Varactor Cont ro i Voltage) 144-Main Unit for 50
watts on the wattmeter .
VHF Band o
Press the lOW button to select MID powe r,
oConnect Voltmeter between VCV test point
key the transmitter, and confirm 15 to 25 watts
on the 144-Main Unit and chassis ground .on
the wattmeter.
•oRefer to
the chart below, transmit and adjust
oPress the lOW button to select lOW power ,
TC4302 on the 144-VCO Unit for the indi cat- key
the transmitter and adjust VR1002 on the
ed volta ge at that li sted frequency . Adjust
144-Main Unit for 4 to 6 watt s on the wattme-
TC4301 as necessary for the required voltage ter.
while receiving. VHF
Tran smitter Deviatio n
R" 4< T" VCV A lignmmt Dala oWhile
tuned to the center of the band ,adjust
•Main Band Sub
Band
the AF generator attenuator for 50 mVoutput
FK'\j uency Voltag... Frequency Voltage at 1
kHz to the MIC jack.
R, T, R, T, R,
r.
""
T, oKey
the transmitter and adjust VR1006 on the
I.... I.... 35V 2.0V HO .2 5V
.144-Main Unit for
±45 kHz IV ers . USA ±4.0
H" HIJ
aov
4,OV 1% .JO V .kHz)
deviation on the deviation meter .
UHF Ban do
Redu ce the AF inje ction until the d e viation
o Connect Voltmeter between VCV test point
meter sho ws ±3.0 kHz (Vers. USA: ±2.7 kHz)
on
the 430-Main Unit and chassis g round .deviation, and confirm that
the injection level
o Tun e to the required channel, t ransmit and
is 55 mV.
adjust TC4402 on the 430-VCO Unit for the
vo
ltage indicated in the table.
•oWhile receiving,adjust TC4401 for
the corre-
sponding voltage for that f requen cy.
2-11
IT-B lOOR Technical Supplement

Alignment ----------------
UHF Power Output
o Co uple the frequency co unte r to sampl e the
RF output.
o Tun e to band center (for the version being
align
ed ), and press the LOW butto nif neces-
sary , to select low power output.
oKey the tr an smitt er and adjust TC2002 on the
430-M ain Unit to match the d isplay to the
cou nter fr equen cy (within 100 Hz).
oTu ne to ba nd center (for the version bein g
alig ned ), and pr ess the LOW butto n , if ncc es-
sary, to select high powe r output.
oKey the transmitter and a dju st VR2004on the
430-M
ain Unit for 35 watts on the watt mete r.
o Pr ess the LOW bu tton to select MID power,
key the transmitt er , and confirm 15 to 25watts
on the wattmeter.
oPress the LOW butt on to select LOW power,
key the t ran sm itt er and adjust VR2005 on the
430-Main Unit for 4 to 6 watts on the wattme-
ter.
UHFTransnuttcr Deviation
oWhile tuned to the ce nte r of the band, adjust
the AF gener ato ratte nuator for 50 mVout put
at 1 kHz to the MIC jack.
oKey the transmitter and ad just VR1005 on the
144-M
ain Unit for ±4.5 kHz (Vers. USA ±4.0
kHz) deviati
on on the deviati on meter.
oRed uce the AF injection un til the deviati on
mete r s hows ±3.0 kHz IVers. USA: ±2.7 kHz)
deviatio n, and confirm that till' injec tion level
is 5.5 mV.
2-12
Receivers
Set up the test equipment as sh ow n h er e for
receiv
er alignment.
Reg ulalecl
13 8'-'PSU
RF Sill ....i
GeneralOt
Receiver Alignment Setup
VHF Inferstage Transformers
oConnect Voltmeter be twee nS mater test point
on the 144-Main Unit and chassis
gro und.
o Tun e the tr an sceiv er and RF signa l gene rato r
to the center of the VHF b
and . M od ulate the
RF signal ge
ner ator with ±3.5 k Hz dev iation
of a 1 kHz t
on e.
DAdjust 11 003 and T1 005 - T1 008 on the 144-
Main Unit for max
imum volt age on the volt-
met er .
oConfirm -8 dB ,", or better 12 dB S INAD at the
high and low band
edges .
UHF Illterstage Transformers
oConnect voltmeter between Sm eter test poin t
on the 43O-Main Unit and chassis
gro und.
o Tun e the tran scei ver and RF signa l gene rator
to the ce nte r of the U HF band . Modul ate the
RF signal
generat or with ±3.5 k Hz devia ti on
of a 1 kHz tone .
DAdjust T2004 on the 430-Main Unit for maxi-
mum voltage on the voltmeter.
oConfirm -8 dB ,", or better 12 dB SINA D at the
high and low
ban dedges.
IT -8looR Techniclll Supplement
•
•
•
•
•

----------------Alignment
•
•
VHF Squelch Preset
oTune to the ce nte r of the VHF b and .With no
signal at the a
nte nna jack.
oSet the SQl contro l to the 10-0' clock posi-
tion,
and adjust VR1003 0n the 144 ·M ain Unit
so the squelch just closes.
UHF Squelch Preset
oTune to the center of the U HF band. With no
signal at the antenna jack.
oSet the SQl control to the 10·0' clock po si-
tion, a
nd ad just VR 2002 so the squelch j ust
closes.
VHF S-Meter Calibration
oAt the cen ter of the VHF band, inject 25 dBfl
RF mod ulat ed wit h ±3.5 kHz deviati on of a 1
kHz tone to the ante nna connector. Adj ust
VR1004 on the 144-Main Unit so th at all S-
meter segments are j ust on.
UHFS-Meter Ca librat ion
oTune the transceiver and RF signal ge nera tor
to the center of the UHF ban d and with the
sa me injection level a nd mod u lation , adjust
VR2003 so t hat all 5-me ter segmen ts are just
on.
•
•
•
VHF Receiver Alignment Points
UHF Receiver Alignment Points
VR2002
S-meter
T .. tP olnl
2-13

•
•
•
•
•
The Fr -Sl 00R circuitry consists of three ma-
jor board s: the 144 and 430-Main Units, the Pan-
el Unit
and numerous min or board s that mount
on these. The Main Unit includes the receiv er
front en ds , IF and Pl l subsystem ICs, and sup-
p ort s daughter bo ards for transmit st ages , local
ve Os , suppl y re gulati on and swit ching circuits,
the mi cr opro cessors, and tone ge nerator / decod -
cr chips. Whilt.' re ading this description, you C. lO
refer to the blo ck diagram for an overview of the
major circuit blocks,
and to the schematic d ia-
grams f
or component details.
All tem.tI Duplexer
In com ing RF from the antenna jack p .1S Sl 'S
throu gh a high-pass and I OW -P.1 SS filter n etwork
on the "30-M ain Unit before application to two
band-switching n
et w orks : coil L2031, diodes
02 005, 0 2014 ,0203 0 and capacitors C2 146,
C2 l47, C2148, C2152, and
resistor R2115 on the
" 30-1\.1 ain Unit for UHF signals; and coil Ll 025,
di
odes 01 012, 0101 9, and 01064 on the 144-Main
Unit, and capacitors C l l..7, C I148, C1120, resis-
tor RI106 on till.' I....-Main Unit for VHF signals.
These networks filter VHF signals from the UHF
receiver and UHF signals from the VHF receiv-
er , allowing each band to operate independent-
ly
wh ile shari ng the same ante nna connection.
VHF Rece pt ion
VHF signals pas sed by the duplexer are ap-
plied to a vara ctor -tuned band-pass filter con-
sisting of
Tt OO6 ,Tl OO7 ,01 008 and 01 009, aft er
RF amplification by Ql OO2 (S GM2016M). The
amplified RF is passed through another RF am-
plifier Ql OOI (3SK131-V12), then band -pass fil-
t ered again by varact or-tuned resonators TlDOS ,
TI OO 8, Dl OIO, and DI Oll ,th en fed through di-
ode swit ch 01 003 (MA80WK) to the FET Bal-
an ced Mixer TI002 /TI003 and Q1100 /Qll01
IT -B lOOR Tl'chn ictll Suppll' mm t
Circuit Description
(2SK302GR).
Buffered 155.05 - 219.05 MHz output from the
144-VCO Unit is amplified by QlOO7(2SC3120)
and applied to the Ist mixer. The resulting 45.05-
MHz 1st mixer product i...passed through mono-
lithic crystal filters
XFtOOt and XFl002 to strip
away all but the de sired signal , which is then
amplified by QlOO3(2SC2714Y)beforedelivery
to FM IF subsy stem Ie Ql009 (TK10930V), con-
taining the 2nd mixer, 2nd local oscillator, limit-
er a mp lifier, noise a mp lifier, Scmeter a mp lifier
and squelch gates. A 2nd local signal is generat-
ed from 45.505 MH z crystal XlOOl, whi ch pro-
du ces the 455 kl lz 2nd IF when mixed with the
1st IF signal within QI OO9 . The 2nd IF is passed
throu gh ceramic filt er C FlOO l to strip awa y un-
wanted mixer produ cts, and is then applied to
the limiter amp in QI OO9 , wh ich r emov es ampli -
tude variations in the " 55 kHz IF bef ore det ec-
ti on of the speec h by ceramic dis criminator
C DlOO I.
VHF Squelch CO lltrol
When no carrier is re ceived ,noise at the out-
put of the dete ctor stage in Q l009 is amplified
and b an d-pass filtered by the noise a mp section
of
Ql009 and the netw or k be twee n pin 19 and
20,
and then rectified by 0 1014. The resu lting
IX: squelch control voltage is passed to pin 79 of
CPU Qll04 .While no carrier is received, pin 8
on QII04 remains "Lo w," signaling pin 8 of CPU
QIHH (M3 17 02E4l which prodo ces the BUSY
indication on the displa y wh en the squelch is
o pe n.
VHF AF Output
Detected audi ofrom pin 12 of Ql 009 passes
through the d e-empha sis network consisting of
RIMS
and CI078, and high -pass filter consisting
of Q1114-3 (NJ M2902M)
and associated circuit-
3-1