Nokia NSE-6 SERIES Installation instructions

NSE–6 Series Transceivers
PAMS Technical Documentation
Original 08/98
Disassembly &
Troubleshooting
Instructions

PAMS
Technical Documentation
NSE–6
Disassembly & Troubleshooting Instructions
Page 2 Original 08/98
CONTENTS
Page No
Disassembly 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baseband Testing 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Alignments 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trouble Shooting 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phone is totally dead 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash programming doesn’t work 7. . . . . . . . . . . . . . . . . . . . . . .
Flash Programming failure (1) 9. . . . . . . . . . . . . . . . . . . . . . .
Flash Programming failure (2) 10. . . . . . . . . . . . . . . . . . . . . . .
Flash Programming failure (3) 11. . . . . . . . . . . . . . . . . . . . . . .
Flash Programming failure (4) 12. . . . . . . . . . . . . . . . . . . . . . .
Power doesn’t stay on, or phone is jammed 13. . . . . . . . . . . . . .
Display Information: Contact Service 14. . . . . . . . . . . . . . . . . . . .
The phone doesn’t register to the network or phone doesn’t make a call 15.
Phone register failure 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM card related failures 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM Card failure 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio failure 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charger failure 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (1) 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (2) 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (3) 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (4) 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (5) 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (6) 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter Fault (1) 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter Fault (2) 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter Fault (3) 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Appendix A 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Appendix B 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Appendix C 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Appendix D 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Test points 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PAMS
Technical Documentation NSE–6
Disassembly & Troubleshooting Instructions
Page 3
Original 08/98
Disassembly
Remove battery
Remove a–cover
screws (2 pcs)
Turn the phone around and re-
move C–cover screws (2 pcs)
Step 1. Push c–cover edge outwards to re-
lease it behind locking snap
Step 2. Lift up the edge to release c–cover.
Step 3. Repeat the operation on both sides.
Step 1. Open slide cover.
Step 2. Push slide edge outwards.
Step 3. Lift slide up from the edge
and slide will be released.
NOTE: When assembling the
screws, use 17 Ncm torque.
Remove c–cover by
lifting up rear and
pulling cover out.

PAMS
Technical Documentation
NSE–6
Disassembly & Troubleshooting Instructions
Page 4 Original 08/98
Step 1. Lift slide frame from bott-
tom and loosen it from a–cover.
Step 2. Remove slide frame, UI–
board will follow.
Parts can be separated.
Remove shield
screws (2 pcs). Remove shield.
Step 1. Push slide detector
switch to the bottom and hold.
Step 2. Release main pcb by
lifting rear up and pulling.
Remove main pcb.

PAMS
Technical Documentation NSE–6
Disassembly & Troubleshooting Instructions
Page 5
Original 08/98
Baseband Testing
The MCU software enters a local mode at start–up if suitable resistors are
connected to the BTEMP and BSI lines. NOTE! Baseband doesn’t wake up
automatically when the battery voltage is connected. Power must be
switched on via:
1. Pwr key or
2. BTEMP line or
3. Charger
In the local mode the baseband can be controlled through MBUS or FBUS
connections by a PC–locals software. Baseband internal connections are
tested with self tests if possible. By connecting MAD2 pin ROW5 to ground,
MAD2 pins are toggled as a daisy chain, which can be used for detecting
short circuits in MAD2 pins. Test pads are placed on engine pcb for service
and production troubleshooting purposes in some supply voltage and signal
lines.
Alignments
Withinalignmentthoseparametersareadjusted,thatcannotbesetaccurate
enoughbydesignbecauseofcomponenttolerances.Duetouseof5%resis-
tor values, the channels of the CCONT A/D converters need to be aligned
in the production phase. Within battery voltage tuning the MCU software
reads the A/D reading from CCONT at 4.1V and stores this reading to EE-
PROM memory as a reference point. Another reference point is created by
assuming that while the input voltage is zero, A/D reading is also zero. Now
the slope is known and A/D readings can be calibrated. Calibration is in-
cluded in VBAT A/D reading task.
Battery charging voltage VCHAR and current ICHAR are calibrated using
onetest setting.Test jigin production/service musthave aconnection tobat-
tery terminals. ICHAR and VCHAR are supplied fron the jig and service soft-
ware calculates values, which are then stored to EEPROM.

PAMS
Technical Documentation
NSE–6
Disassembly & Troubleshooting Instructions
Page 6 Original 08/98
Trouble Shooting
The following hints should facility finding the cause of the problem when
the circuitry seems to be faulty. This trouble shooting instruction is di-
vided following section.
1. Phone is totally dead
2. Flash programming doesn‘t work
3. Power doesn‘t stay on or the phone is jammed
4. Display information: Contact Service
5. Phone doesn‘t register to the network or phone doesn‘t make a call.
6. SIM card related failures ( insert SIM card or card rejected).
7. Audio fault.
8. Charging fault
The first thing to do is carry out a thorough visual check of the module.
Ensure in particular that:
a) there are not any mechanical damages
b) soldered joints are OK

PAMS
Technical Documentation NSE–6
Disassembly & Troubleshooting Instructions
Page 7
Original 08/98
Phone is totally dead
This means that the phone doesn’t take current at all when the power
switch is pressed or when the watchdog disable pin (X001 pin 11, J111) is
grounded. Used battery voltage must be higher than 3.1 V. Otherwise the
hardware of CCONT (N100) prevents totally power switch–on.
Phone is totally dead
J232 VBAT is 3.6 V
WDDIS (J111)) is
0V, when PWR switch
is pressed
VBB 2.8 V (R115, C107..)
VXO 2.8 V (C149..)
When PWR switch is pressed or
WDDIS is grounded (J111)
Failure in VBAT line
Check L103
Voltage at J111 is 3.6V Faulty CCONT (N100)
See section ”Power doesn’t stay on”
Check PWR switch
to CCONT line: R341,
R118
Faulty CCONT (N100)
Yes No
Yes
Yes
Yes
No
No No
Yes
Flash programming doesn’t work
The flash programming can be done via panel connector X001 or via ded-
icated PCB pads. In production, the first programming is done via panel
connector. After this, the panel connector is cut away, thus the program-
ming must be done via PCB pads visible through the shield under the bat-
tery. The main difference between these is that FLASH programming volt-
age is produced differently.
In flash programming error cases the flash prommer can give some in-
formation about a fault. The fault information messages could be:
– MCU doesn’t boot
– Serial clock line failure
– Serial data line failure
– External RAM fault
– Algorithm file or alias ID don’t find
– MCU flash Vpp error

PAMS
Technical Documentation
NSE–6
Disassembly & Troubleshooting Instructions
Page 8 Original 08/98
In cases of unsuccesful flash programming there is a possibility to check
short circuits between the memories and the MCU (MAD2). It is useful to
do this test, when the fault information is: MCU doesn’t boot, Serial clock
line failure or Serial data line failure. The test procedure is following:
1. Connect testpoint J229 to ground.
2. Switch the power on.
3. If the voltage level in testpoint J225 is 2.8 V (”1”), the interface is OK. If
thereisashortcircuit,thevoltagelevelintestpointJ225stayslowand32kHz
square wave signal can be seen in the lines which are already tested.
It must be remembered that this test can only find short circuits, not open
pins. In addition upper data lines (15:8) of flash memory D220 are not in-
cluded in this test.
( PURX )
( MCUAD0)
CCONT pin 54
MAD pin 38
MAD pin 134
J225 ( ExtSysResX))selftest
passed

PAMS
Technical Documentation NSE–6
Disassembly & Troubleshooting Instructions
Page 9
Original 08/98
Flash Programming failure (1)
Flash programming doesn’t work
via panel connector
If the fault information from prommer is:
a) MCU doesn’t boot
b) Serial data line failure
c) Serial clock line failure
connect watchdog disable (WDDIS, J111)
line to the ground
VBB (R115, C107 upper side) 2.8 V
VXO (C149 upper side ) 2.8 V
J227 master reset (Purx) = ”1” (2.8 V)
RfClk (R213 lower side) 13 MHz sine wave
clock signal: 500 mV
pp min
Check that following lines are correct:
FTX (fbus_tx) line: X001 pin 1 ––> R215
FRX (fbus_rx) line: X001 pin 2 ––> R201
FCLK (MBUS) line: X001 pin 3 ––> R115
Check also pullup and pulldown resistors R115, R201, R215
GND: X001 pin 7 ––> GND
Check C213, R213
RFC (C664) 13 MHz
800 mV min
Check buffer V660 and
VCTCXO G660
See section ”Phone is totally dead”
J228 sleep clock (SCLK)
square wave 32 kHz Check sleep
clock circuitry
(B101, R154..)
Faulty circuit N100
or overloaded PurX line
Enable the selftest function of D200 by connecting
J229 to ground
Connect oscilloscope to testpoint J225
(ExtSysResetX) and switch power on
Voltage level rises to ”1” after power on at testpoint J225
There could be open pins in circuits D200 (D220, D240)
(open joints may be detectable with microscope)
If not, the PCB or D200 (D220, D240) is faulty.
There is a shortcircuit
somewhere in memory control
lines or MCU address lines or
MCU lower (7:0) data lines
YES
NO
OK
YES NO NO
YES
YES
YES
YES
NO
NO
OK
YES
NO

PAMS
Technical Documentation
NSE–6
Disassembly & Troubleshooting Instructions
Page 10 Original 08/98
Flash Programming failure (2)
Flash programming doesn’t work
via panel connector
If the fault information is:
External RAM fault
Check control lines of SRAM (D230):
RamSelX (J235)..
There could be open joints in SRAM
Flash programming doesn’t work
via panel connector
If the fault information is:
Algorithm file or alias ID don’t find,
ID is unknown etc.
Check control lines of Flash (D220):
ROM1SelX (J234)..
Fault could be open joints in Flash or
In upper data lines (15:8)
Flash programming doesn’t work
via panel connector
If the fault information is:
MCU flash Vpp error
Check connections between X001;10
––> R211 upper side
Check components C212, R211
Faulty component D220

PAMS
Technical Documentation NSE–6
Disassembly & Troubleshooting Instructions
Page 11
Original 08/98
Flash Programming failure (3)
Flash programming doesn’t work
If the fault information from prommer is:
a) MCU doesn’t boot
b) Serial data line failure
c) Serial clock line failure
connect watchdog disable (WDDIS, J111)
line to the ground
VBB (R115, C107 upper side) 2.8 V
VXO (C149 upper side ) 2.8 V
J227 master reset (Purx) = ”1” (2.8 V)
RfClk (R213 lower side) 13 MHz sine wave
clock signal: 500 mV
pp min
Check that following lines are correct:
FTX (fbus_tx) line: X001 pin 1 ––> R215
FRX (fbus_rx) line: X001 pin 2 ––> R201
FCLK (MBUS) line: X001 pin 3 ––> R115
Check also pullup and pulldown resistors R115, R201, R215
GND: X001 pin 7 ––> GND
Check C213, R213
RFC (C664) 13 MHz
800 mV min
Check buffer V660 and
VCTCXO G660
VBAT is correct 3.6 V
J228 sleep clock (SCLK)
square wave 32 kHz Check sleep
clock circuitry
(B101, R154..)
Faulty circuit N100
or overloaded PurX line
Enable the selftest function of D200 by connecting
testpoint J229 to ground
Connect oscilloscope to testpoint J225
(ExtSysResetX) and switch power on
Voltage level rises to ”1” after power on at testpoint J225
There could be open pins in circuits D200 (D220, D240)
(open joints may be detectable with microscope)
If not, the PCB or D200 (D220, D240) is faulty.
There is a shortcircuit
somewhere in memory control
lines or MCU address lines or
MCU lower (7:0) data lines
YES
NO
OK
YES NO NO
YES
YES
YES
YES
NO
NO
NO
OK
YES
Faulty circuit N100
YES

PAMS
Technical Documentation
NSE–6
Disassembly & Troubleshooting Instructions
Page 12 Original 08/98
Flash Programming failure (4)
Flash programming doesn’t work
If the fault information is:
External RAM fault
Check control lines of SRAM (D230):
RamSelX..
There could be open joints in SRAM
Flash programming doesn’t work
If the fault information is:
Algorithm file or alias ID not found,
ID is unknown etc.
Check control lines of Flash (D220):
ROM1SelX (J234)..
Fault could be open joints in Flash or
In upper data lines (15:8)
Flash programming doesn’t work
If the fault information is:
MCU flash Vpp error
Vpp > 2.8 V (C212)
Check components C212, R211
Vpp > 2.8 V in J221
Check UI connector X303
Check regulator N202
Faulty component D220
YES
NO
YES
YES
YES
OK
NO

PAMS
Technical Documentation NSE–6
Disassembly & Troubleshooting Instructions
Page 13
Original 08/98
Power doesn’t stay on, or phone is jammed
If this kind of fault has come after flash programming, there are most
probably open joints in ICs. The solder joints of ICs: MAD2 (D200), Flash
(D220) and SRAM (D230) are to be checked at the extent possible (by
microscope from the side of PCB and lightly pressing components while
switching power on).
Normally the power will be switched off by CCONT (N100) after 30 se-
conds if the watchdog of the CCONT can not be served by software. This
updating can be seen with an oscilloscope at CCONTCSX (J236). In nor-
mal case there is a short pulse from “1” to “0” every 8 seconds. The pow-
er off function can be prevented by connecting WDDIS (J111) to ground.
Power doesn’t stay on or phone is jammed
CCONT watchdog is served?
(J236 pulses 1 ––> 0 every 8 sec)
Connect J111 (WDDIS) to GND
VBB (C107 upper side) 2.8 V
VXO (C149 upper side) 2.8 V
Software is able to run
If power is switched off after
few seconds, check BSI and
BTEMP lines
Master reset PURX (J227) 2.8 V
RfClk (R213 lower side) 13 MHz sine wave
clock signal: 500 mVpp min
Open pins or faulty circuit:
D200, D220, D230, N100, R215
VBAT is 3.6 V N100 faulty
Sleep clock SCLK (J228)
square wave 32 kHz Check sleep clock
circuitry (B101, R154..)
RFC (C664) 13 MHz
800 mV min
Check C213, R213
Check buffer V660
and VCTCXO G660
N100 faulty or
overloaded PurX line
YES
NO
YES
OK NO YES
YES
YES
YES
YES
NO NO
NO
NO
YES
Flashing can give information in deciding
which IC to change. Changed Flash ID
for example indicates Flash failure

PAMS
Technical Documentation
NSE–6
Disassembly & Troubleshooting Instructions
Page 14 Original 08/98
Display Information: Contact Service
This fault means that software is able to run and thus the watchdog of
CCONT (N100) can be served. Selftest functions are run when power is
switched on and software is executed from flash. If any of the selftests
fails, a “contact service” text is shown on display.
MCU self tests are devided to those executed while power up (start up
tests) and ones that can be executed with connected PC. The tests and
included items are as follows:
1. MCU ROM checksum
Calculates 16 bit checksum out of Flash code and compares it to one
found in Flash. Items being checked are:
MAD2 <––> Flash data– and address lines, CE0,CE1, WE, BYTE, Vcc,
GND, Flash internal functionality
2. MCU RAM interface
3. MCU RAM component
4. MCU EEPROM interface
5. MCU EEPROM component
6. RTC battery
7. CCONT interface
8. A/D converter
9. SW reset
A Power off
B. Security data
C. EEPROM tune checksum
D. PPM checksum
E MCU download DSP
F. DSP alive
G. COBBA serial
H COBBA parallel
I. EEPROM sec checksum
K. PPM validity

PAMS
Technical Documentation NSE–6
Disassembly & Troubleshooting Instructions
Page 15
Original 08/98
The phone doesn’t register to the network or phone
doesn’t make a call
If the phone doesn’t register to the network or the phone doesn’t make a
call, the reason could be either on baseband or RF. The phone can be set
to wanted mode with WinTesla service software in order to find out wheth-
er the fault is in RF or in baseband (RF interface measurements).
The control lines for RF are supplied both by the System Asic (inside of
MAD2;D200) and the RFI (inside of Cobba; N250). MAD2 handles digital
control lines (like SENA, TxP etc.) and Cobba handles analog control
lines (like AFC, TxC etc.). The DSP software is constructed so that opera-
tion states of DSP (MAD2) can be seen in external flag, DSPXF (J222).
After power up, DSP will signal all the completed functions by changing
the state of the XF pin.
1. DSP initialization done
2. Synchronization to network done
3. Registration to network done
DSPXF (J222)
321

PAMS
Technical Documentation
NSE–6
Disassembly & Troubleshooting Instructions
Page 16 Original 08/98
1
DSP
constants
download
Iinitialization
done
Patch code
download
init inialize
channel
scan
starts
2
Sycronization
OK
Last PSW OKPSW
search
Send RACH
RACH OK
(transmitter on)
Go SDCCH immediate
assignment OK
(phone in serve state)
3

PAMS
Technical Documentation NSE–6
Disassembly & Troubleshooting Instructions
Page 17
Original 08/98
Phone register failure
Phone doesn’t register to network or
phone doesn’t make a call
Analog supply voltage VCOBBA is > 2.7 V
at C280 (C281, C282..) Check CCONT (N100)
Analog reference voltage Vref is 1.5 V
at C251 (R253 lower side)
– During the receiving slot:
Supply voltage VCP (J220) > 4.8V
Supply voltage VRX (C148, C543..) > 2.7 V
Supply voltage VSYN_1 (C144, C505..) > 2.7 V
Supply voltage VSYN_2 (C143, C641..) > 2.7 V
– During the transmitting slot:
Supply voltage VTX (C145, C746..) > 2.7 V
Synthesizer lines:
SEna: Summa N540 pin 7
SClk: Summa N540 pin 5
SData: Summa N540 pin 6
pulses 0 ––> 1 during receiving slot
RF control lines:
RxC (R263 upper side) 0 ––> 2.3 Vmax
AFC (R660 upper side) 0 –– 1.2 Vtyp
during receiving slot
Analog data signals RxIP and RxIN (R544 upper sides)
0 ––> 1.5 V DC during receiving slot
Used benefit signal is biased to DC and its amplitude
is 50 mVpp nominal and frequency is 13 MHz
RF control lines:
TxC (R740 upper side) 0 ––> 2.3 Vmax
TxP (Summa N540 pin 32) 0 –– 2.8 V
during transmitting slot
Analog data signals TxIN, TxIP, TxQN, TxQP
(R749, R748, R746, R745 upper sides respectively)
0 ––> 0.8 V DC during transmitting slot
Used benefit signal is biased to DC and its amplitude
is 300 mVpp nominal and frequency is 64 kHz
Check R253, R251
Check CCONT, MAD2
(N100, D200)
Check MAD2 (D200)
Check COBBA (N250)
Check COBBA (N250) if DC failed
Check RF if benefit signal failed
Check COBBA (N250) if TxC failed
Check RF if benefit signal failed
Check COBBA (N250)
Check RF
NO
YES
YES
YES
YES
YES NO
NO
NO
NO
NO
NO
YES
YES
YES NO
YES

PAMS
Technical Documentation
NSE–6
Disassembly & Troubleshooting Instructions
Page 18 Original 08/98
SIM card related failures
The hardware of the SIM interface from MAD2 (D200) to the SIM connec-
tor (X451) can be tested without a SIM card. When the power is switched
on and the BSI line (J122) is grounded by a resistor, all the used lines
(VSIM, RST, CLK, DATA) rise up to 5 V four times. Thus “Insert SIM card”
faults can be found without SIM card.
The fault information “Card rejected” indicates that ATR message (the first
message is always sent from card to the phone) is sent from card but the
message is somehow corrupted, data signal levels are wrong etc. or fac-
tory set values (stored to the EEPROM) are not correct.
Insert SIM card failure
Voltage < 1.5 V at C120 when
BSI resistor is connected Check R120. R122, C120,
Battery connector
VSIM, DATA, RESET and CLOCK lines
(J252, J116, J118, J117) rise up to 5V
after power on Check SIM card and SIM
reader connectors
YES
YES NO
VSIM, DATA_O,SIMRST_O and SIMCLK_O lines
rise up to 5V after power on at pins of SIM card
SIMPWR, SIMRST_A, SIMCLK, SIMIO_C
lines (J112, J113, J114, J115) rise up to 2.8 V
after power on
MAD2 (D200) or PCB is faulty
YES
NO
Check
R124, R125, R128, X451
YES
NO
NO
Faulty circuit
N100 (CCONT)
YES

PAMS
Technical Documentation NSE–6
Disassembly & Troubleshooting Instructions
Page 19
Original 08/98
SIM Card failure
Card rejected fault
VSIM (J252):
2.8 V min (with 3 V SIM card)
4.5 V min (with 5 V SIM card) CCONT (N100) faulty
The ATR data can be seen at J116
YES
YES NO
YES
SIMIOControl line (J115) is ”1”
during the ATR message
Check R124, X451
NO
Check MAD2 (D200)
NO
Check MAD2 (D200)
YES

PAMS
Technical Documentation
NSE–6
Disassembly & Troubleshooting Instructions
Page 20 Original 08/98
Audio failure
Uplink (microphone) and downlink
(earphone) are disfunctional
Voltage at HOOKDET (C260)
2.8 V (without headset)
Voltage at HEADDET (C261)
2.8 V (without headset)
YES
YES NO
YES
Frequency at J257 is square
wave 8 kHz 2.8 Vpp
Check R259, R260
NO
Check Cobba (N250)
NO
Check R256, R257, R261
Uplink (microphone) is
disfunctional
Voltages at J261 and J262 are
1.8 V and 0.3 V during call
DC voltage at C262 and C263
(on Cobba side) are 1.4 V
during a call
YES
YES NO
YES
Analog audio signal (few mV) at
C262 and C263 (on Cobba side)
during a call
YES
Check slide connector, V701, V250..
If OK, check that micbias line
(R267 upper side) is ”1” during call
NO
Check Cobba (N250)
NO Check C262, C263 and PCB
routings
Check Cobba (N250)
Change slide
NOT OK
Downlink (earphone) is
disfunctional
DC voltage at C291 and C292
are 1.4 V during a call
YES
YES
Analog audio signal (some ten mV)
at C291 and C292 during a call
NO
NO
Check Cobba (N250)
Check Cobba (N250)
and MAD2 (D200)