Yamaha EMX66M User manual

SERVICE MANUAL
HAMAMATSU, JAPAN
1,387K-2101 Printed in Japan 2002.03
PA 011626
CONTENTS
SPECIFICATIONS .............................................................................. 3
PANEL LAYOUT.................................................................................. 7
CIRCUIT BOARD LAYOUT & WIRING
.......................................................................................................... 10
DIMENSIONS ....................................................................................11
BLOCK & LEVEL DIAGRAM............................................................. 12
DISASSEMBLY PROCEDURE ......................................................... 14
LSI PIN DESCRIPTION .................................................................... 20
IC BLOCK DIAGRAM........................................................................ 22
CIRCUIT BOARDS ........................................................................... 23
INSPECTION .................................................................................... 33
OVERALL CIRCUIT DIAGRAM
PARTS LIST
EMX66M
This document is printed on chlorine free (ECF) paper with soy ink.
• OPTION
RK-88 RACK MOUNT KIT
EMX66M 20020325-75000
RK88 20020325-2500
本资料由ＯＫＸＩＡ视听皮带资源库ｗｗｗ．ｏｋｘｉａ．ｃｎ提供

2
EMX66M
IMPORTANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed that
basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and understood by the
users, and have therefore not been restated.
WARNING: Failure to follow appropriate service and safety procedures when servicing this product may result in per-
sonal injury, destruction of expensive components and failure of the product to per form as specified. For
these reasons, we advise all Yamaha product owners that all service required should be performed by an
authorized Yamaha Retailer or the appointed service representative.
IMPORTANT: This presentation or sale of this manual to any individual or firm does not constitute authorization, certifica-
tion, recognition of any applicable technical capabilities, or establish a principal-agent relationship of any
form.
The data provided is believed to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and
service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefor, inevitable and
changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to exist, please
contact the distributor's Service Division.
WARNING: Static discharges can destroy expensive components. Discharge any static electricity your body may have
accumulated by grounding yourself to the ground buss in the unit (heavy gauge black wires connect to this
buss).
IMPORTANT: Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power to
the unit.
WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical / electronic and / or plastic (where
applicable) components may also contain traces of chemicals found by the California Health and WelfareAgency (and possibly other
entities) to cause cancer and / or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL / ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FORANY REASON
WHAT SO EVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose eyes to
solder / flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling food.
IMPORTANT NOTICE FOR THE UNITED KINGDOM
Connecting the Plug and Cord
WARNING: THIS APPARATUS MUST BE EARTHED
IMPORTANT: The wires in this main lead are coloured in accor-
dance with the following code:
GREEN-AND-YELLOW: EARTH
BLUE: NEUTRAL
BROWN: LIVE
As the colours of the wires in the main lead of this apparatus may not
correspond with the coloured markings identifying the terminals in your
plug, proceed as follows:
The GREEN-and-YELLOW wire must be connected to the terminal in the
plug that is marked with the letter E or the safety earth symbol (or coloured
GREEN or GREEN-and-YELLOW).
The BLUE wire must be connected to the terminal that is marked with the
letter N (or coloured BLACK).
The BROWN wire must be connected to the terminal that is marked with
the letter L (or coloured RED).
This applies only to products distributed by Yamaha Kemble Music (U. K.) Ltd.
WARNING
Components having special characteristics are marked and
must be replaced with parts having specification equal to those
originally installed.

3
EMX66M
SPECIFICATIONS
● General specifications
• 0 dB=0.775 Vrms
Maximum output power 300 W + 300 W/4Ω@0.5% THD at 1 kHz (SPEAKERS OUT A, B) 205 W + 205 W/8Ω@0.5% THD at 1 kHz (SPEAKERS OUT A, B)
600 W/8Ω@0.5% THD at 1 kHz (BRIDGE)
Frequency response 20 Hz–20 kHz +1 dB, –3 dB @1 W output into 8Ω(SPEAKERS OUT)
20 Hz–20 kHz +1 dB, –3 dB @+4 dB output into 10 kΩ(MAIN OUT, MONITOR OUT, EFFECT SEND)
Total harmonic distortion Less than 0.5% @20 Hz–20 kHz, 150 W output into 4Ω(SPEAKERS OUT A, B)
Less than 0.3% @20 Hz–20 kHz, +14 dB output into 10 kΩ(MAIN OUT, MONITOR OUT, EFFECT OUT)
Hum & noise
(Average, Rs=150Ω)
(with 20 Hz–20 kHz BPF)
–124 dB equivalent input noise, –65 dB residual output noise (SPEAKERS OUT)
–88 dB residual output noise (MAIN OUT, MONITOR OUT)
–79 dB (83 dB S/N)
MAIN OUT, MONITOR OUT Master level control at nominal level and all channel level controls at minimum.
–69 dB (73 dB S/N)
MAIN OUT, MONITOR OUT Master level control at nominal level and 1 channel level control at nominal level.
–75 dB (79 dB S/N)
EFFECT SEND All channel level controls at minimum.
–69 dB (73 dB S/N)
EFFECT SEND 1 channel level control at nominal level.
Maximum voltage gain
88 dB CH IN (Low-Z) to SPEAKERS OUT (CH1–4)
66 dB CH IN (Low-Z) to MAIN OUT, MONITOR OUT (CH1–4)
72 dB CH IN (Low-Z) to EFFECT OUT (CH1–4)
48 dB CH IN (Low-Z) to REC OUT (CH1–4)
56 dB CH IN (Hi-Z) to MAIN OUT, MONITOR OUT (CH1–4)
26 dB AUX IN to MAIN OUT
24 dB 2TR IN to MAIN OUT
66 dB MIC IN to MAIN OUT, MONITOR OUT (CH5•6)
26 dB LINE IN to MAIN OUT, MONITOR OUT (CH5)
46 dB Super Hi-Z IN to MAIN OUT, MONITOR OUT (CH6)
Crosstalk at 1 kHz 65 dB adjacent input, 65 dB input to output
Input channel equalization
±15 dB Maximum
HIGH 10 kHz shelving*
MID 2.5 kHz peaking
LOW 100 Hz shelving*
*Turn over/roll-off frequency of shelving: 3 dB below maximum variable level.
Meters 5 POINTS LED METER (–10, –5, 0, +3, +6 dB) (MAIN OUT, MONITOR OUT)
Graphic equalizer 7 bands (125, 250, 500, 1 k, 2 k, 4 k, 8 kHz), ±12 dB Maximum (MAIN OUT, MONITOR OUT)
Internal digital effect 8 programs (VO.ECHO 1,VO.ECHO 2,VO.REVERB 1, VO.REVERB 2, HALL 1, HALL 2, ROOM,
PLATE)
Phantom power +15 V is supplied to electrically balanced inputs for powering condenser microphones via 2.4 kΩ
current limiting/isolation resisters.
Limiter Comp. :THD≥0.5% (SPEAKERS OUT)
LIMIT indicators Turns on. :THD≥0.5% (SPEAKERS OUT)
Protection Circuit (Power Amp.) POWER Switch on/off Mute, DC Detection, Temp (Heatsink Temp≥90˚C)
Foot switch (FC5) DIGITAL EFFECT MUTE : on/off
Optional accessories RK-88
, FC5
Power requirement/Power
consumption
USA and Canada 120 V AC 60 Hz/250 W
Europe 230 V AC 50 Hz/300 W
Other 240 V AC 50 Hz/300 W
Dimensions (WxHxD) 482 x 305 x 328 mm
Weight 15 kg
Supplied accessories AC power cord, Owner’s Manual

4
EMX66M
● Input specificaitons
● Output specificaitons
Input connectors PAD Actual load
impedance Nominal impedance
Input level Connector
type
Sensitivity1
1. Sensitivity is the lowest level that can produce an output of +4 dB (1.23 V) or the nominal output level when the unit is set at maximum gain.
(All level controls are at maximum position.)
2. Balanced
3. Unbalanced
•0 dB=0.775 Vrms, 0 dBV=1 Vrms.
Nominal level Max. before
cliping
CH INPUT (Low-Z)
(CH1–4) OFF 3 kΩ50–600Ω
Mics –62 dB (0.616 mV) –50 dB (2.45 mV) –20 dB (77.5 mV) XLR-3-31 type2
ON 600ΩLines –32 dB (19.5 mV) –20 dB (77.5 mV) +10 dB (2.45 V)
CH INPUT (Hi-Z)
(CH1–4) OFF 10 kΩ50–600Ω
Mics –52 dB (1.95 mV) –40 dB (7.75 mV) –10 dB (245 mV) Phone jack
(TRS)2
ON 600ΩLines –22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V)
MIC INPUT (CH5•6) 3 kΩ50–600Ω
Mics –62 dB (0.616 mV) –50 dB (2.45 mV) –20 dB (77.5 mV) XLR-3-31 type2
LINE INPUT (CH5) (1, 2) 10 kΩ600ΩLines –22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V) Phone jack3
Super Hi-Z (CH6) (1, 2) 470 kΩ1 kΩ–42 dB (6.16 mV) –30 dB (24.5 mV) 0 dB (0.775 V) Phone jack3
AUX IN 10 kΩ600ΩLines –22 dB (61.6 mV) –10 dB (245 mV) +20 dB (7.75 V) Phone jack3
2TR IN (1, 2) 10 kΩ600ΩLines –22 dBV (79.4 mV) –10 dBV (316 mV) +17.8 dBV (7.76V) RCA phono
jack3
•All output jacks are unbalanced.
•0 dB=0.775 Vrms, 0 dBV=1 Vrms.
Output connectors Actual source
impedance Nominal impedance
Output level Connector type
Nominal Max. before cliping
POWER AMP OUT (1•2) (A, B) 0.1Ω4/8ΩSpeaker 60 W/4Ω(300 W/4Ω) Phone jack
BRIDGE OUT 0.1Ω8ΩSpeaker 120 W/8Ω(600 W/8Ω) Phone jack
MAIN OUT 600Ω10 kΩLines +4 dB (1.23V) +20 dB (7.75 V) Phone jack
MONITOR OUT 600Ω10 kΩLines +4 dB (1.23V) +20 dB (7.75 V) Phone jack
EFFECT OUT 600Ω10 kΩLines +4 dB (1.23V) +20 dB (7.75 V) Phone jack
REC OUT (1, 2) 600Ω10 kΩLines –10 dBV (316 mV) +10 dBV (3.16 V) RCA phono jack

5
EMX66M

6
EMX66M

7
EMX66M
PANEL LAYOUT
●CONTROL PANEL
1. CONTROL SECTION
• Channel Control
Equalizer (HIGH, MID, LOW)
MONITOR control
EFFECT control
LEVEL control
PAD switch (CH1-4)
• Digital Effect
EFFECT select switch
ON switch, indicator
1
PAD
—15 +15
1
HIGH
MID
LOW
LEVEL
MONITOR
EFFECT
—15 +15
—15 +15
0+15
0+15
010
1
2
3
4
5
DIGITAL
EFFECT
VOCAL ECHO 1
VOCAL ECHO 2
VOCAL
REVERB 1
VOCAL
REVERB 2
HALL 1
HALL 2
ROOM
PLATE
ON
EFFECT
6
7
1
2
3
4
5
6
7

8
EMX66M
➇Graphic Equalizer
⑨EFFECT RTN control
➉AUX IN control
2TR IN control
MASTER control
Peak Level Indicator
•MAIN
•MONITOR
•PHANTOM switch, indicator
•YAMAHA SPEAKER PROCESSING
Graphic Equalizer
EFFECT RTN control
2TR IN control
MASTER control
Peak Level Indicator
PHANTOM ON/OFF switch, indicator
ON/OFF switchÅ@
10
0
10
0
EFFECT RTN 2TR IN
GEQ
MASTER
+12
6
0
6
12
+12
6
0
6
12
125 250 500 1k 2k 4k 8k
+6
+3
0
-5
-10
10
0
10
0
MAIN
AUX IN
8
910 11
12
13
10
010
0
10
0
EFFECT RTN 2TR IN
GEQ
MASTER
+12
6
0
6
12
+12
6
0
6
12
125 250 500 1k 2k 4k 8k
+6
+3
0
-5
-10
MONITOR
14
15 16
17
18
POWER AMP
LIMITER
MON
MAIN
MAIN
MAIN
MAIN
BRIDGE
AB
19
20
PHANTOM
ON
OFF
21
YAMAHA
SPEAKER
PROCESSING
22
•POWER AMP
LIMITER indicator
POWER AMP select switch
11
12
13
14
15
16
17
18
19
20
21
22

9
EMX66M
•POWER switch, indicator
POWER ON/OFF switch, indicator
2. INPUT/OUTPUT SECTION
●REAR PANEL
INPUT terminal (Hi-Z, Low-Z)
(CH1-4)
INPUT terminal (LINE, MIC, Super Hi-Z)
(CH5-6)
EFFECT OUT terminal
FOOT SW terminal
INPUT TO MAIN terminal (AUX IN, 2TR IN)
OUTPUT terminal (REC OUT, MAIN, MONI-
TOR)
SPEAKERS terminal
AC IN socket
ON / OFF
power
23
EEEngine
SEE REAR PANEL CAUTION
Hi-Z Hi-Z Hi-Z Hi-Z
Low-Z Low-Z Low-Z Low-Z
LINE
MIC MIC
Super Hi-Z
EFFECT OUT
FOOT SW AUX IN
INPUT TO MAIN OUT PUT
2TR
IN REC
OUT
MAIN
MONITOR
ON / OFF
1234
56
1
2
1
2
1
1
2
2
BBRIDGE
AC IN
2 12 1
SPEAKERS
BA
1
2
23
1
2
3
4
5
6
1
2

10
EMX66M
CIRCUIT BOARD LAYOUT & WIRING
PWR 3/4
PWR 4/4
PWR 2/4
MIX66
PWR 1/4
DSP
CN106
CN107
CN902
CN104
CN901 CN301
CN101
CN105
PowerTransformer
AC INLET
DC Fan
POWER
ON/OFF
1
2
3
4
Location Connector Assembly Remarks Parts No.
1 MIX66-PWR1/4
24185&2426 15P L=700 V842620
2 MIX66-DSP 100mm P=1.25 MF12710
3 PWR1/4-PWR2/4 B&B4P (V827270)
4 PWR3/4-PWR4/4 PSW V827290
2P
6P
3P
3P
15P
15P
27P 27P
MIX66
PWR 3/4
PWR 4/4
DSP
PowerTransformer
PWR 2/4
PWR 1/4

11
EMX66M
DIMENSIONS
305mm
481.5mm
448.5mm
327.6mm
62mm
●Front View ●Side View
●Front View with Rack Mount Adaptor

12
EMX66M
BLOCK & LEVEL DIAGRAM
INPUT TO MAIN
FOOT SW
CH INPUT
[CH 6]
CH INPUT
[CH 1-4]
CH INPUT
[CH 5]
Low-Z
Hi-Z
Super Hi-Z
MIC
MIC
LINE
AUX IN
2TR IN
MIX66
DSP
12
3
1
2
34
12
3
12
3
1
2
34
1
2
34
1
2
34
1
2
34
1
2
34
1
2
34
IC101,301
IC501
IC601
IC603
IC603
IC501 IC502
IC502
IC703
IC703
IC901
IC704
IC704
IC601
IC706
IC306
IC102,302
CN901-27PIN
CN901-27PIN
CN301-27PIN
CN301-27PIN
7
14
21 7
20 8
5
6
14
21
12
13
16
15
3,5 1,7
2,6
SW101-401
SW702
2
3157
2
31
5757
31
57
67
67
21
67
21
A
A’

13
EMX66M
+ +
+ +
PWR 1/4
PWR 2/4
EFFECT OUT
MONITOR
MAIN
REC OUT
SPEAKERS
BRIDGE
1
2
A
1
2
B
1
2
34
1
2
34
1
2
34
IC901
IC705 IC805,806
IC705
IC702
IC903
IC903
SW701
SW910
IC802
IC706
IC803,804
CN902-15PIN CN101-15PIN
W101RE1
W101BE1
W101RE2
W101BE2
31
21
31
57
31
57
91,2,3,4,6
9
1,2,3,4,6
38CA1-8822111
PA
PA
A
A’

14
EMX66M
DSP
[160] [130]
[130]
[240]
DISASSEMBLY PROCEDURE
1. Front Panel Assembly
(Time required: about 3 min)
1-1. Remove the seven (7) screws marked [80] and the
screw marked [90]. (Fig.1)
1-2. old volume knobs and pull the panel to the front.
(Fig.1)
1-3. Remove the screw marked [100]. The front panel
assembly can then be removed. (Fig.1)
(Fig. 1)
[80]: Bind Head Screw 4.0X12 MFZN2BL (VB132700)
[90]: Bind Head Screw 4.0X20 MFZN2BL (VB403600)
[100]: Bind Head Screw A4.0X8 MFZN2BL (VP156800)
(Fig. 2)
2. DSP-ZFX Circuit Board
(Time required: about 4 min)
2-1. Remove the front panel assembly. (See Procedure 1)
2-2. Remove the two (2) screws marked [160] to
remove the shield case. (Fig.2)
2-3. Remove the four (4) screws marked [130]. The
DSP-ZFX circuit board can then be removed. (Fig.2)
[130]: Bind Head Tapping Screw-B 3.0X6 MFZN2BL (EP600230)
[160]: Bind Head Tapping Screw-B 3.0X6 MFZN2BL (EP600230)
[240]: Cord Binder TS-0708 KSS (VZ765100)
[80]
[80]
[90] [100]
Body Assembly
Front Panel Assembly

15
EMX66M
3. MIX66 Circuit Board
(Time required: about 18 min)
3-1. Remove the front panel assembly. (See Procedure 1)
3-2. Remove the cable from the cord binder marked
[240]. (Fig.2)
3-3. Remove the shield case. (See Procedure 2-2)
3-4. Pull out the connector assembly from CN301 on
the DSP-ZFX circuit board. (Fig.4)
3-5. Remove the six (6) screws marked [230] to remove
the shield plate. (Fig.3)
3-6. Remove the fifteen (15) screws marked [40], the
thirteen (13) screws marked [41], and the thirteen
(13) hexagonal nuts marked [A]. (Fig.5)
3-7. Remove the eighteen (18) knobs marked [50], eight
(8) knobs marked [60], the nine (9) knobs marked
[70], and the eight (8) knobs marked [80].
The mix66 circuit board can then be removed.
(Fig.5)
Note: When placing the front panel assembly on
the table, take care not to weight the PWR circuit
board 4/4. (Fig.6)
[230] Head Tapping Screw-B 3.0X6 MFZN2BL (EP600230)
(Fig. 4)
(Fig. 5)
[230]
Top View
Bottom View
DSP
PullPull
[70]
[60]
[80]
[50]
[40] [40] [40] [40] [40]
[60] [70] [90]
[A] [A][41][41]
(Fig. 6)
[40]: Screw 3X25 MFZNBL (V3289800)
[41]: Bonding Tapping Screw-B 3.0X8 MFZN2BL (VN413300)
[50]: Knob GREEN/M-GRAY (V6225300)
[60]: Knob L-GRAY/M-GRAY (V6225600)
[70]: Knob BLUE/M-GRAY (V6225400)
[80]: Knob L-GRAY/D-GRAY (V6225700)
[90]: Bind Head Screw 3.0X8 MFZN2BL (VB659000)
(Fig. 3)

16
EMX66M
4. PWR Circuit Board 4/4
(Time required: about 4 min)
4-1. Remove the front panel assembly. (See Procedure 1)
4-2. Pinch slightly the stopper of the power switch
escutcheon with a plyer, and pull it to the front to
remove. (Fig.7-1)
4-3. Remove the two (2) screws marked [90]. (Fig.7-2)
4-4. Remove the power switch knob marked [110]. The
PWR circuit board 4/4 can then be removed.
(Fig.7-2)
[44]: Bind Head Tapping Screw-B 4.0X8 MFZN2BL (EG340190)
[60]: Bind Head Screw 4.0X12 MFZN2BL (VB132700)
[130]: Bind Head Screw 4.0X30 MFZN2BL (VT229100)
[140]: Bind Head Tapping Screw-B 3.0X12 MFZN2BL (VQ074600)
[150]: Bonding Head Tapping Screw-B 3.0X8 MFZN2BL (VN413300)
(Fig. 7-2)
(Fig. 8)
[90]: Bind Head Screw 3.0X8 MFZN2BL (VB659000)
[110]: Power Switch Knob MX12/4 (VU859000)
[90]
[110]
[90]
[110]
[60]
[60][44]
[140][150b]
[130]
[150a]
[C]
[44]
(Fig. 7-1)
PullPull
PushPush
PushPush
PWR 4/4
5. Rear Panel Assembly
(Time required: about 2 min)
5-1. Remove the front panel assembly. (See Procedure 1)
5-2. Remove the eight (8) screws marked [60] and the
two (2) screws marked [44]. (Fig.8)

17
EMX66M
(Fig. 9)
5-3. old the cord holder and pull the rear panel to the
front to remove. (Fig.9)
Note: When reinstalling, install the rear panel
assembly and the front panel assembly in that order
to connect the power supply connector easily.
(Fig. 10)
[220]
Rear Panel Assembly
6. PWR Circuit Board 2/4
(Time required: about 4 min)
6-1. Remove the rear panel assembly. (See Procedure 5)
6-2. Remove the screw marked [150a] and the five (5)
hexagonal nuts marked [C]. The PWR circuit board
2/4 can then be removed. (Fig.8)
7. PWR Circuit Board 3/4
(Time required: about 3 min)
7-1. Remove the rear panel assembly. (See Procedure 5)
7-2. Remove the two (2) screws marked [140] and the
screw marked [150b]. (Fig.8)
7-3. Remove the screw marked [220]. The PWR circuit
board 3/4 can then be removed. (Fig.10)
[220]: Bind Head Screw A4.0X6 MFZN2BL (VP156800)
Pull UpPull Up
Rear Panel AssemblyRear Panel Assembly
Body AssemblyBody Assembly

18
EMX66M
8. PWR Circuit Board 1/4
(Time required: about 10 min)
8-1. Remove the rear panel assembly. (See Procedure 5)
8-2. Remove the PWR circuit board 2 4. (See Procedure 6)
8-3. Remove the PWR circuit board 3 4. (See Procedure 7)
8-4. Remove the sixteen screws marked [90] to remove
the TR holder A and the TR holder B. (Fig.11)
8-5. Remove the six (6) screws marked [40]. The PWR
circuit board 1 4 can then be removed. (Fig.12)
Upper Side View Bottom Side View
PWR 1/4 PWR 1/4
[90][90] [90]
[90]
[90]
[40] Rear Panel
(Fig. 11)
(Fig. 12)
[90]: Bind Head Tapping Screw-B 3.0X12 MFZN2BL (VQ0746000)
[40]: Bind Head Screw SP 3.0X8 MFZN2Y (EG330290)

19
EMX66M
9. Fan (Time required: about 3 min)
9-1. Remove the rear panel assembly. (See Procedure 5)
9-2. Remove the two (2) screws marked [130]. The fan
can then be removed. (Fig.8)
10. Power Transformer
(Time required: about 4 min)
10-1. Remove the front panel assembly. (See Procedure 1)
10-2. Remove the bolt marked [D]. The power trans-
former can then be removed. (Fig.13)
PowerTransformer
FRONTVIEW
[D]
11. Front Frame (Time required: about 6 min)
11-1. Remove the front panel assembly. (See Procedure 1)
11-2. Remove the four (4) screws marked [50] to remove
the handle assembly. (Fig.14)
11-3. Remove the ten (10) screws marked [40]. The front
frame can then be removed. (Fig.15)
Body Assembly
Handle
[50] [50]
Body Assembly
Handle
[50] [50]
[40]
[40]
[40][40]
Body Assembly
[50]: Bind Head Screw 4.0X16 MFZN2BL (EG340110)
[40]: Bind Head Tapping Screw-P 4.0X30 MFZN2BL (V8322700)
(Fig. 14)
(Fig. 15)

20
EMX66M
LSI PIN DESCRIPTION
PIN
No. NAME I/O FUNCTION
PIN
No. NAME I/O FUNCTION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
ED2
ED3
ED4
ED5
ED6
ED7
VSS
VDD
CLKM0
CLKM1
TMS
TDI
TCK
CLKIN
VSS
VDD
CLKO
EA12/ED8
EA13/ED9
EA14/ED10
EA15/ED11
VSS
VDD
EA16/ED12
EA17/ED13
EA18/ES14
EA19/ED15
EA4/ED16
EA5/ED17
EA6/ED18
EA7/ED19
VSS
VDD
EA8/ED20
EA9/ED21
EA10/ED22
EA11/ED23
TEST0
TEST1
TEST2
TEST3
/BIO
/INT1
ARBC1
ARBC2
AX1
AX2
AX3
VSS
VDD
HX/SDA
/EMPTY
AXLR2
AR1
AR2
HRBCK/SA0
HR/SA1
HRS/SA2
VSS
VDD
HXBCK/SCL
HXS/SA3
/CS/SA4
HBCKS/SA5
I2CSEL
VSS
VDD
AXBC1
AXBC2
AXLR1
DIVS
/LAV
/LMV
/DRDY
EMU0
EMU1
TDO
DIV512
ARLR1
ARLR2
HDIR/SA6
SEL5V3V
/MUTE
/TRST
/RS
VSS
VDD
/IOE
/RAS/SRCS
/CAS/SROE
/ROME
/WE
EA0
EA1
EA2
EA3
VSS
VDD
ED0
ED1
I/O
I/O
I/O
I/O
I/O
I/O
S
S
I
I
I
I
I
I
S
S
O
I/O
I/O
I/O
I/O
S
S
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
S
S
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
O
O
O
S
S
I/O/Z
O/Z
I
I
I
I
I
I
S
S
I
I
I
I
I
S
S
I
I
I
O
O
O
O/Z
I/O/Z
I/O/Z
O/Z
O
I
I
I
I
I
I
I
S
S
O
O
O
O
O
O
O
O
O
S
S
I/O
I/O
ZFX-2 (XY297A00)CPU DSP-ZFX: IC306
External Memory and I/O Data Bus
Ground
Power Supply
Clock Mode
TAP(Test Access Port) Mode Select
TAP Data Input
TAP Clock
Master Clock
Ground
Power Supply
Machine Clock Output
External SRAM and ROM Address Bus/
External DRAM and I/O Data Bus
Ground
Power Supply
External SRAM and ROM Address Bus/
External DRAM and I/O Data Bus
External Memory Address Bus/ External I/O
Data Bus
Ground
Power Supply
External Memory Address Bus/ External I/O
Data Bus
Test Mode Control
Separate Control Input
Interrupt 1
Audio Data Receive Unit 1 bit Clock
Audio Data Receive Unit 2 bit Clock
Audio Data Transmitt Unit 1 Data Output
Audio Data Transmitt Unit 2 Data Output
Audio Data Transmitt Unit 3 Data Output
Ground
Power Supply
Host Interface Data Output/I2C Bus Data
CMEM Update Buffer and HR Resistor Empty Flag Output
Audio Data Transmitt Unit 2/3 Left and
Right Channel Frame Frequency Signal
Audio Data Receive Unit 1 Data Input
Audio Data Receive Unit 2 Data Input
Host Interface Receive Clock / I2C Bus Address 0
Host Interface Data Input/ I2C Bus Address 1
Host Interface Receive Data Frame
Frequency Signal/ I2C Bus Address 2
Ground
Power Supply
Host Interface Transmitt Clock/ I2C Bus Clock
Host Interface Transmitt Data Frame
Frequency Signal/ I2C Bus Address 3
Host Interface Chip Select/ I2C Bus Address 4
HRBCK/HXBCK Active Edge Select/ I2C Bus Address 5
Host Interface Mode Select
Ground
Power Supply
Audio Data Transmitt Unit 1 bit Clock
Audio Data Transmitt Unit 2/3 bit Click
Audio Data Transmitt Unit 1 Left and Right
Channel Frame Frequency Signal
Machine Clock Output then 8 min.
Ruch ALU Overflow Frag Output
Ruch MAC Overflow Frag Output
Host Interface Transmitt Data Ready Frag Output
Emurator Interrupt 0
Emurator Interrupt 1
TAP(Test Access Port) Data Output
Machine Clock then512 min.
Audio Data Receive Unit 1 Left and Right
Channel Frame Frequency Signal
Audio Data Receive Unit 2 Left and Right
Channel Frame Frequency Signal
Host Interface Data Format Select/ I2C Bus Address 6
Input Level Control
Mute Control
TAP(Test Access Port) Reset
Hardware Reset
Ground
Power Supply
External I/O Enable
External DRAM Low Address Strove/External
SRAM Chip Select
External DRAM Culumn Address Strove/External
SRAM Output Enable
External ROM Enable
External Memory and I/O Wright Enable
External Memory and I/O Address Bus
Ground
Power Supply
External Memory and I/O Data Bus
CLKM0
CLKM1
1
0
0
3
1
0
6
0
1
PLL BYPASS
1
1