Zte MG2618 Installation instructions

Hardware Development Guide of Module
Product
ZTE MG2618
Version 1.0，2015-03-18
Welink Your Smart

Hardware Development Guide of Module Product
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ZTE MG2618
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ZTE MG2618
Revision History
Version
Date
Description
V1.0
2015-03-18
1st released

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ZTE MG2618
Contents
1PRODUCT OVERVIEW............................................................................................................. 1
1.1 TECHNICAL PARAMETERS............................................................................................ 1
1.2 APPLICATION FRAME..................................................................................................... 2
1.3 ABBREVIATIONS.............................................................................................................. 3
2INTERFACES............................................................................................................................... 6
2.1 PIN DESCRIPTION ............................................................................................................ 6
2.2 ANTENNA INTERFACE ................................................................................................... 8
2.3 RF PERFORMANCE OF ANTENNA INTERFACE......................................................... 8
3ELECTRIC FEATURES........................................................................................................... 10
3.1 INTERFACE POWER LEVEL ......................................................................................... 10
3.2 POWER CONSUMPTION................................................................................................ 10
3.3 POWER-ON/OFF TIMING SEQUENCE......................................................................... 11
3.4 RELIABILITY TEST ........................................................................................................ 11
3.5 ESD CHARACTERISTIC................................................................................................. 12
3.6 GPS PERFORMANCE...................................................................................................... 12
4REFERENCE CIRCUIT OF MODULE INTERFACES ....................................................... 13
4.1 RESET AND POWER DESIGNING ................................................................................ 13
4.2 UART INTERFACE.......................................................................................................... 15
4.2.1 DUPLEX UART INTERFACE .............................................................................. 17
4.3 SIM CARD INTERFACE.................................................................................................. 18
4.4 AUDIO INTERFACE........................................................................................................ 19
4.5 LED INDICATOR INTERFACE...................................................................................... 22
4.6 GPS INTERFACE ............................................................................................................. 22
4.7 CONNECTION METHOD OF GPS ACTIVE ANTENNA.............................................. 23
5MECHANIC FEATURES.......................................................................................................... 24
5.1 APPEARANCE DIAGRAM ............................................................................................. 24
5.2 ASSEMBLY DIAGRAM .................................................................................................. 25
5.3 PCB PACKAGE DIMENSIONS....................................................................................... 26

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ZTE MG2618
6SMT PROCESS AND BAKING GUIDE.................................................................................. 28
6.1 STORAGE REQUIREMENTS.......................................................................................... 28
6.2 RECOMMENDED PAD DESIGN.................................................................................... 28
6.3 REQUIREMENTS OF MODULE’S POSITION ON MAIN BOARD............................. 30
6.4 MODULE PLANENESS STANDARD ............................................................................ 31
6.5 PROCESS ROUTING SELECTION................................................................................. 31
6.5.1 SOLDER PASTE SELECTION.............................................................................. 31
6.5.2 DESIGN OF MODULE PAD’S STEEL MESH OPENING ON MAIN BOARD. 31
6.5.3 MODULE BOARD’S SMT PROCESS.................................................................. 32
6.5.4 MODULE SOLDERING REFLOW CURVE ........................................................ 33
6.5.5 REFLOW METHOD .............................................................................................. 34
6.5.6 MAINTENANCE OF DEFECTS ........................................................................... 34
6.6 MODULE’S BAKING REQUIREMENTS....................................................................... 35
6.6.1 MODULE’S BAKING ENVIRONMENT.............................................................. 35
6.6.2 BAKING DEVICE AND OPERATION PROCEDURE........................................ 35
6.6.3 MODULE BAKING CONDITIONS...................................................................... 35
7SAFETY INFORMATION........................................................................................................ 36

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ZTE MG2618
Figures
Figure 1–1Application Frame...................................................................................................................... 3
Figure 3–1 Power-on/off timing sequence.................................................................................................. 11
Figure 4–1 Reference Circuit of Power Supply & Reset Interface............................................................. 14
Figure 4–2 Reference Circuit of Power Supply Interface........................................................................... 14
Figure 4–3 Reference Circuit 1 of UART Interface ................................................................................... 16
Figure 4–4 Reference Circuit 2 of UART Interface ................................................................................... 16
Figure 4–5 UART Connection between DCE－DTE................................................................................. 17
Figure 4–6Reference Circuit of SIM Card Interface ................................................................................. 19
Figure 4–7 MIC reference circuit ............................................................................................................... 20
Figure 4–8 SPK reference circuit ............................................................................................................... 21
Figure 4–9 Reference Circuit of Status Indicator ....................................................................................... 22
Figure 4–10 Reference Circuit of GPS Interface........................................................................................ 23
Figure 4–11 Active GPS antenna circuit reference design principle diagram............................................ 23
Figure 5–1 Top & bottom & side view of module ..................................................................................... 24
Figure 5–2 The assembly diagram of module ............................................................................................ 25
Figure 5–3 The PCB package dimensions of module (Top View)............................................................. 26
Figure 5–4 Test point of module ................................................................................................................ 27
Figure 6–1 Module’s dimensions ............................................................................................................... 29
Figure 6–2 Recommended PAD dimensions on corresponding main board.............................................. 29
Figure 6–3 Module board’s PAD mounted on main board......................................................................... 30
Figure 6–4 Green oil and white oil at module’s position on main board.................................................... 30
Figure 6–5 Module Board’s Steel Mesh Diagram...................................................................................... 32
Figure 6–6 Material Module Pallet............................................................................................................. 33
Figure 6–7 Module Furnace Temperature Curve Diagram......................................................................... 34

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ZTE MG2618
Tables
Table 1–1 The function information of module............................................................................................ 1
Table 1–2 Major Technical Parameters........................................................................................................ 1
Table 1–3 Abbreviation List......................................................................................................................... 3
Table 2–1 PIN Interface Definition.............................................................................................................. 6
Table 2–2 RF Performance of antenna interface.......................................................................................... 8
Table 3–1 Power Level Range of Digital Signal........................................................................................ 10
Table 3–2 Power Consumption of Module (Typical)................................................................................. 10
Table 3–3 Module testing environment of temperature.............................................................................. 11
Table 3–4 ESD Endurance.......................................................................................................................... 12
Table 3–5 GPS Performance ...................................................................................................................... 12
Table 4–1 Working Condition.................................................................................................................... 13
Table 4–2 UART Interface Definition........................................................................................................ 17
Table 4–3 Definition of SIM Card Signal .................................................................................................. 18
Table 4–4 Audio interface definition.......................................................................................................... 19
Table 4–5 Definition of LED Indicator Status............................................................................................ 22
Table 6–1 Baking parameters..................................................................................................................... 28
Table 6–2 Recommended PAD dimensions of main board........................................................................ 30
Table 6–3 LCC module PAD’s steel mesh opening ................................................................................... 31

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ZTE MG2618
R&TTE Regulation:
In all cases assessment of the final product must be mass against the Essential requirements of the R&TTE
Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3
requirements.
Hereby, ZTE CORPORATION declares that this product is in complies with the essential requirements of
Article 3 of the R&TTE 1999/5/EC Directive.

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ZTE MG2618
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.
End Product Labeling
The final end product must be labeled in a visible area with the following: “Contains FCC ID:
SRQ-ZTEMG2618”. The grantee's FCC ID can be used only when all FCC compliance
requirements are met.The FCC part15.19 staement below has also be available on the
label:The device complies with part 15 of FCC rules,Operation is sugject to the following two
conditions:(1)This device may not cause harmful interference,and(2)this device must accept
any interference received,including interference that may cause undesired operation,to comply
With FCC regulations limiting both maximum RF output power and human exposure to RF
radiation.
A user maual with the end product must clearly indicate the operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure
Guidelines,The end product with an module may also need to pass the FCC part15
unintentional emission testing requirements and be properly authorized for FCC
part15.Note:If thie module is intended for use in a portable device,you are responsinble
For separate approval to satify the SAR requirements of FCC part2.1093
This device is intended only for OEM integrators under the following conditions:
1)The antenna must be installed such that 20 cm is maintained between the antenna and
users, and the maximum antenna gain allowed for use with this device is 3 dBi.
2)The transmitter module may not be co-located with any other transmitter or antenna.

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ZTE MG2618
1Product Overview
MG2618 is a GSM/GPRS wireless industrial module, and it contains three variants V2A, V2B and
V2C. Customer can choose the dedicated type based on the wireless network configuration. The following
table shows the entire configuration of MG2618 series.
Table 1–1 The function information of module
SN
PID
BAND
GPS
1
V2A
GSM 900/1800
Not support
2
V2B
GSM 850/900/1800/1900
Not support
3
V2C
GSM 850/900/1800/1900
Support
MG2618 is a wireless Internet module with 49 pin LCC interface. It is widely applied to but not
limited to the various products and equipment such as laptops, vehicle-mounted terminals, and electric
devices, by providing data services, transceiver Email, web browsing, high speed download and so on.
In places with GSM network coverage, you can send and receive SMS, use high-speed data access
service, voice calls and other functions under the mobile environment. The module provides users with a
high degree of freedom, convenient solution to realize mobile office dreams.
This section describes the basic functions and logic diagram of the module.
1.1 Technical Parameters
Table 1–2Major Technical Parameters
Items
Parameters
Basic Features
Bands
GSM850/EGSM900/DCS1800/PCS1900(Optional)
Dimensions
22.00mm*20.00mm*2.0mm
Weight
About 1.9g
Normal Working Temperature
-35~75°C
Extreme Working Temperature
-40~85°C
Storage Temperature
-50~90°C
Humidity
0% ~ 95%
Performance
Power Supply
The range of voltage supply is 3.4V-4.2V, typical value: 3.8V
Max. Transmitter Power
33±2dBm @ GSM850/GSM900

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ZTE MG2618
Items
Parameters
30±2dBm @ DCS1800/PCS1900
Receiving sensitivity
-108dBm @ GSM850/GSM900
-106dBm @ DCS1800/PCS1900
Interface
Encapsulation type
49 Pin LCC
Antenna interface
LCC pad
UART Interface
AT commands, data transmission
SIM card Interface
1.8V/3V
Data Service
Service
GPRS, Class A or B, Class 10 or 12
GPRS Mobile station
Class C
GPRS class
Class 12
Max. DL Data rate
85.6Kbps
Max. UL Data rate
42.8Kbps
Protocols
Embedded TCP/IP and UDP/IP protocol stack
TCP Server, UDP Server
Embedded FTP
SMS
Support TEXT/PDU mode
Point-to-point MO/MT
SMS Cell Broadcast
AT Commands
Static AT commands set
Extended AT commands set
1.2 Application Frame
The application frame of module is as follows:

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ZTE MG2618
Figure 1–1Application Frame
Note: Only the modules which support GPS function have the function of GPS as shown in Blue
Block Diagram above.
1.3 Abbreviations
Table 1–3Abbreviation List
A
ADC
Analog-Digital Converter
模数转换
AFC
Automatic Frequency Control
自动频率控制
AGC
Automatic Gain Control
自动增益控制
ARFCN
Absolute Radio Frequency Channel Number
绝对射频信道号
ARP
Antenna Reference Point
天线参考点
ASIC
Application Specific Integrated Circuit
专用集成电路
B
BER
Bit Error Rate
比特误码率
BTS
Base Transceiver Station
基站收发信台
C
CDMA
Code Division Multiple Access
码分多址
CDG
CDMA Development Group
CDMA 发展组织
Main Chip
GPS Chip

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ZTE MG2618
CNR
Carrier Noise Ratio
载噪比
CSD
Circuit Switched Data
电路交换数据
CPU
Central Processing Unit
中央处理单元
D
DAC
Digital-to-Analog Converter
数模转换
DCE
Data Communication Equipment
数据通讯设备
DSP
Digital Signal Processor
数字信号处理
DTE
Data Terminal Equipment
数据终端设备
DTMF
Dual Tone Multi-Frequency
双音多频
DTR
Data Terminal Ready
数据终端准备好
E
EFR
Enhanced Full Rate
增强型全速率
EGSM
Enhanced GSM
增强型 GSM
EMC
Electromagnetic Compatibility
电磁兼容
EMI
Electro Magnetic Interference
电磁干扰
ESD
Electronic Static Discharge
静电放电
ETS
European Telecommunication Standard
欧洲通信标准
F
FDMA
Frequency Division Multiple Access
频分多址
FR
Full Rate
全速率
G
GPRS
General Packet Radio Service
通用分组无线业务
GSM
Global Standard for Mobile Communications
全球移动通讯系统
H
HR
Half Rate
半速率
I
IC
Integrated Circuit
集成电路
IMEI
International Mobile Equipment Identity
国际移动设备标识
ISO
International Standards Organization
国际标准化组织
ITU
International Telecommunications Union
国际电信联盟
L
LCD
Liquid Crystal Display
液晶显示器
LED
Light Emitting Diode
发光二极管
M
MCU
Machine Control Unit
机器控制单元
MMI
Man Machine Interface
人机交互接口/人机界面
MS
Mobile Station
移动台
P
PCB
Printed Circuit Board
印刷电路板
PCL
Power Control Level
功率控制等级
PCS
Personal Communication System
个人通讯系统

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ZTE MG2618
PDU
Protocol Data Unit
协议数据单元
PPP
Point-to-point protocol
点到点协议
R
RAM
Random Access Memory
随机访问存储器
RF
Radio Frequency
无线频率
ROM
Read-only Memory
只读存储器
RTC
Real Time Clock
实时时钟
S
SIM
Subscriber Identification Module
用户识别卡
SMS
Short Message Service
短消息服务
SRAM
Static Random Access Memory
静态随机访问存储器
T
TA
Terminal adapter
终端适配器
TDMA
Time Division Multiple Access
时分多址
TE
Terminal Equipment also referred it as DTE
终端设备，也指 DTE
TTFF
Time To First Fix
首次定位时间
U
UART
Universal asynchronous receiver-transmitter
通用异步接收/发送器
UIM
User Identifier Management
用户身份管理
USB
Universal Serial Bus
通用串行总线

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ZTE MG2618
2Interfaces
The MG2618 module connects externally through a 49 PIN stamp-hole interface.
2.1 PIN Description
Table 2–1PIN Interface Definition
PIN
Type
Signal Definition
I/O
Description
Remark
1
GND
GND
--
--
--
2
POWER
RSSI_LED
O
Working status
indicator
Active High
3
POWER
ON/OFF
I
Module
power-on/off
control
Valid at low level; pull-up
internally, more information please
refer to 4.1
4
GND
GND
--
--
--
5
AUDIO
HSED BIAS
O
MIC bias
Default is 1.9V
6
AUDIO
MIC1_P
I
Differential audio
input channel 1,
anode
--
7
AUDIO
MIC1_N
I
Differential audio
input channel 1,
cathode
--
8
AUDIO
MIC2_P
I
Single-end audio
input channel 2
--
9
AUDIO
SPK2_P
O
Single-end audio
output channel 2
--
10
AUDIO
SPK1_P
O
Differential audio
output channel 1,
anode
--
11
AUDIO
SPK1_N
O
Differential audio
output channel 1,
cathode
--
12
GND
GND
--
--
--
13
POWER
/RESET
I
Resetting signal
Active low
14
POWER
VREG_MSME1
O
2.8V output
Recommend to use this pin for
pull-up when level matching
15
GND
GND
--
--
--
16
ANT
RF_ANT
I/O
GSM antenna
interface
--
17
GND
GND
--
--
--

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ZTE MG2618
PIN
Type
Signal Definition
I/O
Description
Remark
18
GND
GND
--
--
--
19
POWER
VBAT
I
GSM Power supply
3.4V~4.2V
20
GND
GND
--
--
--
21
SIM
VREG_SIM
O
Power supply for
SIM card.
1.8/3V
22
SIM
SIM_DATA
I/O
Data signal of SIM
card
--
23
SIM
SIM_CLK
O
Clock signal of SIM
card.
--
24
SIM
SIM_RST
O
Reset signal of SIM
card.
--
25
UART
/RTS
O
Request to send
2.8V，active low
26
UART
/CTS
I
Clear to send
2.8V，active low
27
UART
TXD
O
Transmitting data to
serial port
2.8V，active low
28
UART
RXD
I
Receiving data from
serial port
2.8V，active low
29
NC
NC
--
--
--
30
GND
GND
--
--
--
31
UART
DCD
O
Carrier detection
2.8V，active low
32
UART
/DSR
O
Data is ready
2.8V，active low
33
UART
RI
O
Ring tone
2.8V，active low
34
UART
/DTR
I
Data terminal is
ready
2.8V，active low
35
NC
NC
--
--
--
36
GND
GND
--
--
--
37
GND
GND
--
--
--
38
ANT
GPS_ANT
I
GPS antenna
Module without GPS function, this
pin should not be connected.
39
GND
GND
--
--
--
40
POWER
VGPS_MAIN
I
GPS power supply
Voltage range: 2.8V~4.2V,
recommended 3.3V
Module without GPS function, this
pin should not be connected.
41
ADC
ADCIN
I
ADC voltage
detection
42
GND
GND
--
--
--
43
USB
USB_DP
--
USB differential
data (+)
Using USB and RI to download
firmware, calibration and
measurement. Not support data
transmitting yet.
44
USB
USB_DM
--
USB differential
data (-)

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ZTE MG2618
PIN
Type
Signal Definition
I/O
Description
Remark
45
I2C
I2C_SCL
--
I2C serial clock
2.8V, Not supported currently
46
I2C
I2C_SDA
--
I2C serial data
2.8V, Not supported currently
47
GND
GND
--
--
--
48
BT
BT_ANT
I/O
Bluetooth antenna
interface
Not supported currently
49
GND
GND
--
--
--
2.2 Antenna Interface
Regarding the antenna of module, proper measures should be taken to reduce the access loss of
effective bands, and good shielding should be established between external antenna and RF connector.
Besides, external RF cables should be kept far away from all interference sources such as high-speed
digital signal or switch power supply.
According to mobile station standard, stationary wave ratio (SWR) of antenna should be between1.1
to 1.5, and input impedance is 50 ohm. Different environments may have different requirements on the
antenna’s gain. Generally, the larger in-band gain and smaller out-band gain, the better performance the
antenna has. Isolation among ports must more than 30dB when multi-ports antenna is used. For example,
between two different polarized ports on dual-polarized antenna, or two different frequency ports on
dual-frequency antenna, or among four ports on dual-polarized dual-frequency antenna, the isolation
should be more than 30dB.
RF_ANT, GPS_ANT (PIN16, PIN38) are respectively used as the input pin for GSM and GPS
antenna. when using these pin pads as the antenna feed pins, customers need pay attention to the following:
(1)The feed connected to PIN38 or PIN 16 is 50ohm micro-strip or strip line. To approach the module,
put π shape or Inverted-F shape matching network for later debugging.
(2)The RF wires must be kept away from the GND, and generally the distance should be 3 times of the
width of RF wires.
(3)It’s forbidden to put some interference sources such as DC to DC, WIFI module, SIM card around RF
wires or RF port.
2.3 RF Performance of antenna interface
The RF performance of antenna interface is shown in Table 2-2:
Table 2–2RF Performance of antenna interface

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ZTE MG2618
Band
Uplink Frequency
Band
(MS->BTS)
Downlink Frequency
Band
(BTS->MS)
Max.
Transmitter
Power(dBm)
Receiving
sensitivity(T
ypical)
GSM850
824MHz-849MHz
869MHz-894MHz
33±2 dBm
-108dBm
EGSM900
880MHz-915MHz
925MHz-960MHz
33±2 dBm
-108dBm
DCS1800
1710MHz-1785MHz
1805MHz-1880MHz
30±2 dBm
-106dBm
PCS1900
1850MHz-1910MHz
1930MHz-1990MHz
30±2 dBm
-106dBm

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ZTE MG2618
3Electric Features
This chapter mainly describes the module’s electrical characteristics, including the level, power
consumption, reliability of module’s interfaces.
3.1 Interface Power Level
Table 3–1Power Level Range of Digital Signal
Interface
High/Low level
Min.
Typ.
Max.
Remark
UART
0
0
0
0.3* UART1
2.8V
0.7* UART1
2.8V
1.1*UART1
SIM
0
0
0
0.3*VREG_SIM
1.8V/3.0V
0.7*VREG_SIM
VREG_SIM
1.1*VREG_SIM
The high power level of UART1 is 2.8V, VREG_SIM is 1.8V/3V( automatic adaptation).
3.2 Power Consumption
Table 3–2Power Consumption of Module (Typical)
Test Items
Test condition(Test duration
1min)
Test result
Unit
GSM
GPS
Max.
Min.
Average
Standby/sleep current
Standby
The kernel is
running, but not
working properly
47.46
30.32
31.16
mA
Standby
ON
69.19
44.45
46.35
mA
Standby
OFF
39.45
21.96
22.87
mA
Sleep
ON
75.2
23.68
27.2
mA
Sleep
OFF
28.55
0.93
2.45
mA
Working current
Turn on the module, GSP
kernel is running, not sleep or
work
123.44
54.27
72.55
mA
Network lock current
PGSM，62，PCL5
239.4
174.68
242.68
mA

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ZTE MG2618
(Instrument Network,
GPS sleep)
PGSM，62，PCL10
157.13
120.65
145.4
mA
PGSM，62，PCL19
94.41
32.71
82.01
mA
DCS，698，PCL0
195.42
147.47
180.7
mA
DCS，698，PCL5
146.32
113.48
135.2
mA
DCS，698，PCL15
87.68
70.53
79.08
mA
Note: As the GPS can’t work independently, when the module sleep in the condition of GPS working,
in fact , the module is in the state of part dormant, and the part related to GPS is still working.
3.3 Power-on/off timing sequence
The timing sequence of module shows entire process of power-on/off.
Figure 3–1Power-on/off timing sequence
3.4 Reliability Test
The reliability test of module includes the items as follows: High/low temperature operation, high/low
temperature storage, thermal shock, alternating temperature humidity, etc. The test results must conform to
the industrial requirements. Module testing environment of temperature is shown as the Table below.
Table 3–3Module testing environment of temperature