abaco systems SP9 Series Quick user guide

Hardware Reference Manual
CP9*, CR9*, CT9* Celeron M/Pentium M
6U CompactPCI SBC with Hot Swap
Publication No. HRMCP9 Rev. B

2CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
Document History
Revision Date Description
First Oct 2009 Original Release
B July 2017 Rebranded to Abaco Systems.
Waste Electrical and Electronic Equipment (WEEE) Returns
Abaco Systems is registered with an approved Producer Compliance Scheme (PCS) and, subject to
suitable contractual arrangements being in place, will ensure WEEE is processed in accordance
with the requirements of the WEEE Directive.
Abaco Systems will evaluate requests to take back products purchased by our customers before
August 13, 2005 on a case by case basis. A WEEE management fee may apply.

Publication No. HRMCP9 Rev. B About This Manual 3
About This Manual
Conventions
Notices
This manual may use the following types of notice:
WARNING
Warnings alert you to the risk of severe personal injury.
CAUTION
Cautions alert you to system danger or loss of data.
NOTE
Notes call attention to important features or instructions.
TIP
Tips give guidance on procedures that may be tackled in a number of ways.
LINK
Links take you to other documents or websites.
Numbers
All numbers are expressed in decimal, except addresses and memory or register
data, which are expressed in hexadecimal. Where confusion may occur, decimal
numbers have a “D” subscript and binary numbers have a “b” subscript. The prefix
“0x” shows a hexadecimal number, following the ‘C’ programming language
convention. Thus:
One dozen = 12D= 0x0C = 1100b
The multipliers “k”, “M” and “G” have their conventional scientific and engineering
meanings of x103, x106and x109, respectively, and can be used to define a transfer
rate. The only exception to this is in the description of the size of memory areas,
when “K”, “M” and “G” mean x210, x220 and x230 respectively.
In PowerPC terminology, multiple bit fields are numbered from 0 to n where 0 is the
MSB and n is the LSB. PCI terminology follows the more familiar convention that bit
0 is the LSB and n is the MSB.
Text
Signal names ending with a tilde (“~”) denote active low signals; all other signals are
active high. “N” and “P” denote the low and high components of a differential signal
respectively.

4CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
Further Information
Abaco Website
You can find information regarding Abaco products on the following website:
LINK
https://www.abaco.com
Abaco Documents
This document is distributed via the Abaco website. You may register for access to
manuals via the website.
LINK
https://www.abaco.com/products/cp9
https://www.abaco.com/products/cr9
https://www.abaco.com/search/gss/CT9
The following is a list of reference documentation related to CP9, CR9, CT9:
CP9 Datasheet
CR9 Datasheet
CT9 Datasheet
CR9, CT9, CP9, VR9, VP9 User’s Manual for AMIBIOS8 Setup
CR9, CT9, CP9, VR9, VP9 Board Specific Hardware Programmer’s Manual
AMIBIOS8 Check Point and Beep Code List
AMIBIOS8 Error Messages
Intelligent Platform Management Interface for CT9 User’s Manual
Third-party Documents
NOTE
Technical literature describing components used on the CP9, CR9, and CT9 is available from the
manufacturers’ websites.

Publication No. HRMCP9 Rev. B About This Manual 5
Product Properties
Certification
The product or products described in this technical manual cannot be operated by
themselves. They are components for integration into operational systems or add-
ons to such systems. The products have been designed to meet relevant regulatory
standards like FCC and CE. As mandated by these standards, conformance to these
standards can only be certified for complete operational systems. This has to be done
by the end-user or by the systems integrator in their operational systems. Abaco has
tested some products in their own systems. Upon request information is available
which products have been tested and about the specific environment under which
Abaco has tested these components.
Altitude
Altitude, air pressure, and ambient temperature influence the thermal operation of
the components described in this manual. They have been developed and tested at
about 500 m (1650 ft.) above sea level at a typical ambient temperature of 20 °C
(68 °F). Because of only marginal variations within a limited range of altitudes, these
products operate as specified within altitudes from sea level to 1000 m (3300 ft.).
Abaco can assist the user of these components in planning operation outside this
altitude range upon request.
Options
This manual describes the basic product plus all options. Your product may not have
all options implemented. Please verify with your purchase contract which options
are implemented. Descriptions of options which are not implemented obviously do
not apply to your product.

6CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
Technical Support Contact Information
You can find technical assistance contact details on the website Embedded Support
page.
LINK
https://www.abaco.com/embedded-support
Abaco will log your query in the Technical Support database and allocate it a unique
Case number for use in any future correspondence.
Alternatively, you may also contact Abaco’s Technical Support via:
LINK
[email protected]
Returns
If you need to return a product, there is a Return Materials Authorization (RMA)
form available via the website Embedded Support page.
LINK
https://www.abaco.com/embedded-support
Do not return products without first contacting the Abaco Repairs facility.

Publication No. HRMCP9 Rev. B Contents 7
Contents
1 • Introduction ............................................................................................................................ 13
1.1 Board Design ....................................................................................................................................................... 14
1.2 Features ............................................................................................................................................................... 15
1.3 Safety Notices ..................................................................................................................................................... 18
1.3.1 EMI/EMC Regulatory Compliance..................................................................................................................................18
1.3.2 ESD/EMI Issues...............................................................................................................................................................18
1.3.3 CE Conformance Declaration .........................................................................................................................................19
2 • Unpacking and Inspection ..................................................................................................... 20
2.1 Delivery Volume................................................................................................................................................... 20
2.2 Available Accessories......................................................................................................................................... 20
2.3 ESD ....................................................................................................................................................................... 21
2.4 Warning ................................................................................................................................................................ 21
2.5 Initial Inspection.................................................................................................................................................. 21
2.6 Unpacking ............................................................................................................................................................ 22
2.7 Handling............................................................................................................................................................... 23
3 • Installation.............................................................................................................................. 25
3.1 Installation Preparation ...................................................................................................................................... 25
3.1.1 General Advisories ..........................................................................................................................................................25
3.1.2 Advice on CompactPCI Products...................................................................................................................................25
3.2 Required Items .................................................................................................................................................... 26
3.2.1 Backplane and Power Supply.........................................................................................................................................26
3.2.2 Keyboard and Mouse......................................................................................................................................................26
3.2.3 Video Monitor..................................................................................................................................................................27
3.2.4 Advice on Batteries .........................................................................................................................................................27
3.3 Installation of a Plug-in Board............................................................................................................................ 27
3.4 Installation of a Plug-on Module (Mezzanine) .................................................................................................. 27
3.5 Installation of the Rear Transition Module CTM12 .......................................................................................... 28
3.6 Initial Power-On Operation.................................................................................................................................. 29
3.6.1 Entering the BIOS SETUP ...............................................................................................................................................29
4 • Getting Started ....................................................................................................................... 30
4.1 Power Supply....................................................................................................................................................... 30
4.2 Status Indicator, Postcode and Beeps .............................................................................................................. 30
4.3 Booting ................................................................................................................................................................. 31
4.4 Setup .................................................................................................................................................................... 32
4.5 Hot Swap on CR9 ................................................................................................................................................ 32
4.6 Unexpected Results ............................................................................................................................................ 33
5 • Interfaces................................................................................................................................ 34
5.1 Front Panel Interfaces ........................................................................................................................................ 34
5.2 CR9 Connectors................................................................................................................................................... 35
5.2.1 CPCI Connector Reference .............................................................................................................................................35
5.2.2 CompactPCI bus Connector J7001 and J7002.............................................................................................................36
5.2.3 I/O Connector J7003, J7004, and J7005 .......................................................................................................................37
5.2.4 EIDE Connector P1800....................................................................................................................................................39
5.2.5 Keyboard and PS/2 Mouse Interface P2001.................................................................................................................40
5.2.6 Ethernet Interface U5600 and U5650 ............................................................................................................................41

8CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
5.2.7 Serial Port COM1 P2201 .................................................................................................................................................42
5.2.8 VGA Interface P4200.......................................................................................................................................................43
5.2.9 USB Interfaces P1680.....................................................................................................................................................44
5.2.10 PMC1 Connectors P6201, P6202, and P6203 .............................................................................................................44
5.2.11 PMC2 Connectors P7201, P7202.................................................................................................................................46
5.2.12 PMC I/O Connector P6204 and P7204 ........................................................................................................................48
5.3 Transition Module ............................................................................................................................................... 48
6 • Resources............................................................................................................................... 49
6.1 Memory Map........................................................................................................................................................ 49
6.2 Register Set ......................................................................................................................................................... 49
6.2.1 Standard Register Set.....................................................................................................................................................50
6.2.2 Plug and Play Devices.....................................................................................................................................................50
6.3 Interrupts ............................................................................................................................................................. 51
6.4 APIC Controller .................................................................................................................................................... 52
7 • Function Blocks...................................................................................................................... 53
7.1 Processor............................................................................................................................................................. 53
7.2 Memory Controller............................................................................................................................................... 53
7.3 DMA Controller .................................................................................................................................................... 53
7.4 Interrupt Controller.............................................................................................................................................. 53
7.5 Timer .................................................................................................................................................................... 54
7.6 Real Time Clock................................................................................................................................................... 54
7.7 Keyboard and Mouse Controller......................................................................................................................... 55
7.8 EIDE Interface ...................................................................................................................................................... 55
7.9 USB Interface....................................................................................................................................................... 55
7.10 Serial Interface .................................................................................................................................................. 55
7.11 Parallel Interface ............................................................................................................................................... 56
7.12 Floppy Controller ............................................................................................................................................... 56
7.13 Graphics Controller ........................................................................................................................................... 56
7.13.1 Software Installation.....................................................................................................................................................57
7.14 PMC Interface.................................................................................................................................................... 57
7.15 IPMI (CT9).......................................................................................................................................................... 57
7.15.1 IPMB ..............................................................................................................................................................................58
7.15.2 Private I2C ......................................................................................................................................................................58
7.15.3 Software Installation.....................................................................................................................................................58
7.16 Ethernet Interface ............................................................................................................................................. 58
7.16.1 Software Installation.....................................................................................................................................................58
7.17 Additional Devices ............................................................................................................................................ 59
7.17.1 Hot Swap .......................................................................................................................................................................59
7.17.2 SMBus Devices .............................................................................................................................................................60
7.17.3 SMBus External (IPMB) ................................................................................................................................................60
7.17.4 Temperature Sensor LM83...........................................................................................................................................60
7.17.5 Temperature Sensors LM75.........................................................................................................................................61
7.17.6 Serial EEPROM..............................................................................................................................................................61
7.17.7 Power Management Event ...........................................................................................................................................61
7.17.8 INTP, INTS .....................................................................................................................................................................61
7.17.9 ENUM#...........................................................................................................................................................................61
7.17.10 Geographic Addressing ..............................................................................................................................................62
7.17.11 GPIO (0..7) ...................................................................................................................................................................62
7.17.12 Watchdog ....................................................................................................................................................................62
7.17.13 Programmable Timer..................................................................................................................................................62
7.17.14 LEDs.............................................................................................................................................................................62
7.17.15 Reset Button................................................................................................................................................................63
7.17.16 Speaker........................................................................................................................................................................63

Publication No. HRMCP9 Rev. B Contents 9
8 • Specifications......................................................................................................................... 64
8.1 PCB ....................................................................................................................................................................... 64
8.2 Size....................................................................................................................................................................... 64
8.3 Dimensions .......................................................................................................................................................... 64
8.4 Mechanical Incompatibility ................................................................................................................................ 64
8.5 Weight .................................................................................................................................................................. 64
8.6 RoHS Compliance ............................................................................................................................................... 64
8.7 Power Consumption............................................................................................................................................ 64
8.8 Onboard Lithium Battery..................................................................................................................................... 66
8.8.1 Not Powered by the System...........................................................................................................................................66
8.8.2 Powered by the System..................................................................................................................................................67
8.8.3 Battery Removal and Replacement ...............................................................................................................................68
8.9 External Battery Input ......................................................................................................................................... 68
8.10 Environment Conditions ................................................................................................................................... 69
8.10.1 Card Edge Temperatures for CR9 Style 8....................................................................................................................71
8.11 Electrical Characteristics.................................................................................................................................. 71
8.11.1 Supply Voltage Range ..................................................................................................................................................72
8.11.2 GPIO 0..7........................................................................................................................................................................72
8.11.3 Electrical Clearance ......................................................................................................................................................73
8.11.4 Isolation.........................................................................................................................................................................73
8.12 Placement Plan Component Side CR9 V2....................................................................................................... 74
8.13 Placement Plan Solder Side CR9 V2................................................................................................................ 75
A • Transition Module CTM12 ..................................................................................................... 76
A.1 CTM12 Interfaces................................................................................................................................................ 78
A.1.1 EIDE Connector P1800 ...................................................................................................................................................78
A.1.2 Ethernet Interface 10/100/1000BASE-T P5000 and P5500.........................................................................................79
A.1.3 Parallel Interface LPT1 P2002 .......................................................................................................................................80
A.1.4 Serial Interfaces COM1 P2200 and COM2 P2201/P2203 ............................................................................................80
A.1.5 VGA Interface P4001 ......................................................................................................................................................81
A.1.6 DVI-I Connector P4100 ...................................................................................................................................................81
A.1.7 USB Connector P2005....................................................................................................................................................82
A.1.8 Floppy Connector P2003/P2004 ...................................................................................................................................83
A.1.9 Miscellaneous Connector...............................................................................................................................................84
A.1.10 PMC I/O Connectors.....................................................................................................................................................84
A.1.11 Power Connector P1801...............................................................................................................................................87
A.1.12 Power IN/OUT Connectors P7700, P7701 ..................................................................................................................87
A.2 Placement Plan ................................................................................................................................................... 88
B • PCI Mezzanine Card (PMC).................................................................................................... 89
B.1 Electrical Characteristics ................................................................................................................................... 89

10 CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
List of Figures
Figure 1-1 Block Diagram of CR9 Board....................................................................................................................... 14
Figure 2-1 Board Packaging .......................................................................................................................................... 23
Figure 2-2 Handling the CR9 Board .............................................................................................................................. 24
Figure 3-1 6U Board Insertion into System Box........................................................................................................... 27
Figure 3-2 Installing a PMC on a 6U CPCI Carrier Board............................................................................................. 28
Figure 5-1 Location of Components on Board and Front Panel................................................................................. 34
Figure 5-2 Single Slot Front Panel ................................................................................................................................ 34
Figure 5-3 Dual Slot Front Panel ................................................................................................................................... 35
Figure 5-4 EIDE Connector Location............................................................................................................................. 39
Figure 5-5 Keyboard and Mouse Connector Location................................................................................................. 40
Figure 5-6 Keyboard and Mouse Connector Layout.................................................................................................... 41
Figure 5-7 Ethernet Connector Location ...................................................................................................................... 41
Figure 5-8 Ethernet Connector Layout ......................................................................................................................... 41
Figure 5-9 COM1 Location............................................................................................................................................. 42
Figure 5-10 VGA Connector Location ........................................................................................................................... 43
Figure 5-11 USB Connector Location ........................................................................................................................... 44
Figure 5-12 USB Connector Layout .............................................................................................................................. 44
Figure 8-1 Battery Current Versus Temperature.......................................................................................................... 66
Figure 8-2 Battery Current Versus Time ....................................................................................................................... 67
Figure 8-3 Battery Removal........................................................................................................................................... 68
Figure 8-4 Temperature vs. Airspeed ........................................................................................................................... 70
Figure 8-5 CR9 V2 Component Side Placement Plan.................................................................................................. 74
Figure 8-6 CR9 V2 Solder Side Placement Plan........................................................................................................... 75
Figure A-1 CTM12 Component Locations .................................................................................................................... 77
Figure A-2 CTM12 Ethernet Connector Layout ............................................................................................................ 79
Figure A-3 DVI Connector Layout.................................................................................................................................. 81
Figure A-4 Placement Plan CTM12............................................................................................................................... 88
Figure B-1 Mount PMC Board to CR9 ........................................................................................................................... 90