abaco systems SP9 Series Quick user guide

Hardware Reference Manual
CP9*, CR9*, CT9* Celeron M/Pentium M
6U CompactPCI SBC with Hot Swap
Publication No. HRMCP9 Rev. B

2CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
Document History
Revision Date Description
First Oct 2009 Original Release
B July 2017 Rebranded to Abaco Systems.
Waste Electrical and Electronic Equipment (WEEE) Returns
Abaco Systems is registered with an approved Producer Compliance Scheme (PCS) and, subject to
suitable contractual arrangements being in place, will ensure WEEE is processed in accordance
with the requirements of the WEEE Directive.
Abaco Systems will evaluate requests to take back products purchased by our customers before
August 13, 2005 on a case by case basis. A WEEE management fee may apply.

Publication No. HRMCP9 Rev. B About This Manual 3
About This Manual
Conventions
Notices
This manual may use the following types of notice:
WARNING
Warnings alert you to the risk of severe personal injury.
CAUTION
Cautions alert you to system danger or loss of data.
NOTE
Notes call attention to important features or instructions.
TIP
Tips give guidance on procedures that may be tackled in a number of ways.
LINK
Links take you to other documents or websites.
Numbers
All numbers are expressed in decimal, except addresses and memory or register
data, which are expressed in hexadecimal. Where confusion may occur, decimal
numbers have a “D” subscript and binary numbers have a “b” subscript. The prefix
“0x” shows a hexadecimal number, following the ‘C’ programming language
convention. Thus:
One dozen = 12D= 0x0C = 1100b
The multipliers “k”, “M” and “G” have their conventional scientific and engineering
meanings of x103, x106and x109, respectively, and can be used to define a transfer
rate. The only exception to this is in the description of the size of memory areas,
when “K”, “M” and “G” mean x210, x220 and x230 respectively.
In PowerPC terminology, multiple bit fields are numbered from 0 to n where 0 is the
MSB and n is the LSB. PCI terminology follows the more familiar convention that bit
0 is the LSB and n is the MSB.
Text
Signal names ending with a tilde (“~”) denote active low signals; all other signals are
active high. “N” and “P” denote the low and high components of a differential signal
respectively.

4CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
Further Information
Abaco Website
You can find information regarding Abaco products on the following website:
LINK
https://www.abaco.com
Abaco Documents
This document is distributed via the Abaco website. You may register for access to
manuals via the website.
LINK
https://www.abaco.com/products/cp9
https://www.abaco.com/products/cr9
https://www.abaco.com/search/gss/CT9
The following is a list of reference documentation related to CP9, CR9, CT9:
CP9 Datasheet
CR9 Datasheet
CT9 Datasheet
CR9, CT9, CP9, VR9, VP9 User’s Manual for AMIBIOS8 Setup
CR9, CT9, CP9, VR9, VP9 Board Specific Hardware Programmer’s Manual
AMIBIOS8 Check Point and Beep Code List
AMIBIOS8 Error Messages
Intelligent Platform Management Interface for CT9 User’s Manual
Third-party Documents
NOTE
Technical literature describing components used on the CP9, CR9, and CT9 is available from the
manufacturers’ websites.

Publication No. HRMCP9 Rev. B About This Manual 5
Product Properties
Certification
The product or products described in this technical manual cannot be operated by
themselves. They are components for integration into operational systems or add-
ons to such systems. The products have been designed to meet relevant regulatory
standards like FCC and CE. As mandated by these standards, conformance to these
standards can only be certified for complete operational systems. This has to be done
by the end-user or by the systems integrator in their operational systems. Abaco has
tested some products in their own systems. Upon request information is available
which products have been tested and about the specific environment under which
Abaco has tested these components.
Altitude
Altitude, air pressure, and ambient temperature influence the thermal operation of
the components described in this manual. They have been developed and tested at
about 500 m (1650 ft.) above sea level at a typical ambient temperature of 20 °C
(68 °F). Because of only marginal variations within a limited range of altitudes, these
products operate as specified within altitudes from sea level to 1000 m (3300 ft.).
Abaco can assist the user of these components in planning operation outside this
altitude range upon request.
Options
This manual describes the basic product plus all options. Your product may not have
all options implemented. Please verify with your purchase contract which options
are implemented. Descriptions of options which are not implemented obviously do
not apply to your product.

6CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
Technical Support Contact Information
You can find technical assistance contact details on the website Embedded Support
page.
LINK
https://www.abaco.com/embedded-support
Abaco will log your query in the Technical Support database and allocate it a unique
Case number for use in any future correspondence.
Alternatively, you may also contact Abaco’s Technical Support via:
LINK
[email protected]
Returns
If you need to return a product, there is a Return Materials Authorization (RMA)
form available via the website Embedded Support page.
LINK
https://www.abaco.com/embedded-support
Do not return products without first contacting the Abaco Repairs facility.

Publication No. HRMCP9 Rev. B Contents 7
Contents
1 • Introduction ............................................................................................................................ 13
1.1 Board Design ....................................................................................................................................................... 14
1.2 Features ............................................................................................................................................................... 15
1.3 Safety Notices ..................................................................................................................................................... 18
1.3.1 EMI/EMC Regulatory Compliance..................................................................................................................................18
1.3.2 ESD/EMI Issues...............................................................................................................................................................18
1.3.3 CE Conformance Declaration .........................................................................................................................................19
2 • Unpacking and Inspection ..................................................................................................... 20
2.1 Delivery Volume................................................................................................................................................... 20
2.2 Available Accessories......................................................................................................................................... 20
2.3 ESD ....................................................................................................................................................................... 21
2.4 Warning ................................................................................................................................................................ 21
2.5 Initial Inspection.................................................................................................................................................. 21
2.6 Unpacking ............................................................................................................................................................ 22
2.7 Handling............................................................................................................................................................... 23
3 • Installation.............................................................................................................................. 25
3.1 Installation Preparation ...................................................................................................................................... 25
3.1.1 General Advisories ..........................................................................................................................................................25
3.1.2 Advice on CompactPCI Products...................................................................................................................................25
3.2 Required Items .................................................................................................................................................... 26
3.2.1 Backplane and Power Supply.........................................................................................................................................26
3.2.2 Keyboard and Mouse......................................................................................................................................................26
3.2.3 Video Monitor..................................................................................................................................................................27
3.2.4 Advice on Batteries .........................................................................................................................................................27
3.3 Installation of a Plug-in Board............................................................................................................................ 27
3.4 Installation of a Plug-on Module (Mezzanine) .................................................................................................. 27
3.5 Installation of the Rear Transition Module CTM12 .......................................................................................... 28
3.6 Initial Power-On Operation.................................................................................................................................. 29
3.6.1 Entering the BIOS SETUP ...............................................................................................................................................29
4 • Getting Started ....................................................................................................................... 30
4.1 Power Supply....................................................................................................................................................... 30
4.2 Status Indicator, Postcode and Beeps .............................................................................................................. 30
4.3 Booting ................................................................................................................................................................. 31
4.4 Setup .................................................................................................................................................................... 32
4.5 Hot Swap on CR9 ................................................................................................................................................ 32
4.6 Unexpected Results ............................................................................................................................................ 33
5 • Interfaces................................................................................................................................ 34
5.1 Front Panel Interfaces ........................................................................................................................................ 34
5.2 CR9 Connectors................................................................................................................................................... 35
5.2.1 CPCI Connector Reference .............................................................................................................................................35
5.2.2 CompactPCI bus Connector J7001 and J7002.............................................................................................................36
5.2.3 I/O Connector J7003, J7004, and J7005 .......................................................................................................................37
5.2.4 EIDE Connector P1800....................................................................................................................................................39
5.2.5 Keyboard and PS/2 Mouse Interface P2001.................................................................................................................40
5.2.6 Ethernet Interface U5600 and U5650 ............................................................................................................................41

8CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
5.2.7 Serial Port COM1 P2201 .................................................................................................................................................42
5.2.8 VGA Interface P4200.......................................................................................................................................................43
5.2.9 USB Interfaces P1680.....................................................................................................................................................44
5.2.10 PMC1 Connectors P6201, P6202, and P6203 .............................................................................................................44
5.2.11 PMC2 Connectors P7201, P7202.................................................................................................................................46
5.2.12 PMC I/O Connector P6204 and P7204 ........................................................................................................................48
5.3 Transition Module ............................................................................................................................................... 48
6 • Resources............................................................................................................................... 49
6.1 Memory Map........................................................................................................................................................ 49
6.2 Register Set ......................................................................................................................................................... 49
6.2.1 Standard Register Set.....................................................................................................................................................50
6.2.2 Plug and Play Devices.....................................................................................................................................................50
6.3 Interrupts ............................................................................................................................................................. 51
6.4 APIC Controller .................................................................................................................................................... 52
7 • Function Blocks...................................................................................................................... 53
7.1 Processor............................................................................................................................................................. 53
7.2 Memory Controller............................................................................................................................................... 53
7.3 DMA Controller .................................................................................................................................................... 53
7.4 Interrupt Controller.............................................................................................................................................. 53
7.5 Timer .................................................................................................................................................................... 54
7.6 Real Time Clock................................................................................................................................................... 54
7.7 Keyboard and Mouse Controller......................................................................................................................... 55
7.8 EIDE Interface ...................................................................................................................................................... 55
7.9 USB Interface....................................................................................................................................................... 55
7.10 Serial Interface .................................................................................................................................................. 55
7.11 Parallel Interface ............................................................................................................................................... 56
7.12 Floppy Controller ............................................................................................................................................... 56
7.13 Graphics Controller ........................................................................................................................................... 56
7.13.1 Software Installation.....................................................................................................................................................57
7.14 PMC Interface.................................................................................................................................................... 57
7.15 IPMI (CT9).......................................................................................................................................................... 57
7.15.1 IPMB ..............................................................................................................................................................................58
7.15.2 Private I2C ......................................................................................................................................................................58
7.15.3 Software Installation.....................................................................................................................................................58
7.16 Ethernet Interface ............................................................................................................................................. 58
7.16.1 Software Installation.....................................................................................................................................................58
7.17 Additional Devices ............................................................................................................................................ 59
7.17.1 Hot Swap .......................................................................................................................................................................59
7.17.2 SMBus Devices .............................................................................................................................................................60
7.17.3 SMBus External (IPMB) ................................................................................................................................................60
7.17.4 Temperature Sensor LM83...........................................................................................................................................60
7.17.5 Temperature Sensors LM75.........................................................................................................................................61
7.17.6 Serial EEPROM..............................................................................................................................................................61
7.17.7 Power Management Event ...........................................................................................................................................61
7.17.8 INTP, INTS .....................................................................................................................................................................61
7.17.9 ENUM#...........................................................................................................................................................................61
7.17.10 Geographic Addressing ..............................................................................................................................................62
7.17.11 GPIO (0..7) ...................................................................................................................................................................62
7.17.12 Watchdog ....................................................................................................................................................................62
7.17.13 Programmable Timer..................................................................................................................................................62
7.17.14 LEDs.............................................................................................................................................................................62
7.17.15 Reset Button................................................................................................................................................................63
7.17.16 Speaker........................................................................................................................................................................63

Publication No. HRMCP9 Rev. B Contents 9
8 • Specifications......................................................................................................................... 64
8.1 PCB ....................................................................................................................................................................... 64
8.2 Size....................................................................................................................................................................... 64
8.3 Dimensions .......................................................................................................................................................... 64
8.4 Mechanical Incompatibility ................................................................................................................................ 64
8.5 Weight .................................................................................................................................................................. 64
8.6 RoHS Compliance ............................................................................................................................................... 64
8.7 Power Consumption............................................................................................................................................ 64
8.8 Onboard Lithium Battery..................................................................................................................................... 66
8.8.1 Not Powered by the System...........................................................................................................................................66
8.8.2 Powered by the System..................................................................................................................................................67
8.8.3 Battery Removal and Replacement ...............................................................................................................................68
8.9 External Battery Input ......................................................................................................................................... 68
8.10 Environment Conditions ................................................................................................................................... 69
8.10.1 Card Edge Temperatures for CR9 Style 8....................................................................................................................71
8.11 Electrical Characteristics.................................................................................................................................. 71
8.11.1 Supply Voltage Range ..................................................................................................................................................72
8.11.2 GPIO 0..7........................................................................................................................................................................72
8.11.3 Electrical Clearance ......................................................................................................................................................73
8.11.4 Isolation.........................................................................................................................................................................73
8.12 Placement Plan Component Side CR9 V2....................................................................................................... 74
8.13 Placement Plan Solder Side CR9 V2................................................................................................................ 75
A • Transition Module CTM12 ..................................................................................................... 76
A.1 CTM12 Interfaces................................................................................................................................................ 78
A.1.1 EIDE Connector P1800 ...................................................................................................................................................78
A.1.2 Ethernet Interface 10/100/1000BASE-T P5000 and P5500.........................................................................................79
A.1.3 Parallel Interface LPT1 P2002 .......................................................................................................................................80
A.1.4 Serial Interfaces COM1 P2200 and COM2 P2201/P2203 ............................................................................................80
A.1.5 VGA Interface P4001 ......................................................................................................................................................81
A.1.6 DVI-I Connector P4100 ...................................................................................................................................................81
A.1.7 USB Connector P2005....................................................................................................................................................82
A.1.8 Floppy Connector P2003/P2004 ...................................................................................................................................83
A.1.9 Miscellaneous Connector...............................................................................................................................................84
A.1.10 PMC I/O Connectors.....................................................................................................................................................84
A.1.11 Power Connector P1801...............................................................................................................................................87
A.1.12 Power IN/OUT Connectors P7700, P7701 ..................................................................................................................87
A.2 Placement Plan ................................................................................................................................................... 88
B • PCI Mezzanine Card (PMC).................................................................................................... 89
B.1 Electrical Characteristics ................................................................................................................................... 89

10 CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
List of Figures
Figure 1-1 Block Diagram of CR9 Board....................................................................................................................... 14
Figure 2-1 Board Packaging .......................................................................................................................................... 23
Figure 2-2 Handling the CR9 Board .............................................................................................................................. 24
Figure 3-1 6U Board Insertion into System Box........................................................................................................... 27
Figure 3-2 Installing a PMC on a 6U CPCI Carrier Board............................................................................................. 28
Figure 5-1 Location of Components on Board and Front Panel................................................................................. 34
Figure 5-2 Single Slot Front Panel ................................................................................................................................ 34
Figure 5-3 Dual Slot Front Panel ................................................................................................................................... 35
Figure 5-4 EIDE Connector Location............................................................................................................................. 39
Figure 5-5 Keyboard and Mouse Connector Location................................................................................................. 40
Figure 5-6 Keyboard and Mouse Connector Layout.................................................................................................... 41
Figure 5-7 Ethernet Connector Location ...................................................................................................................... 41
Figure 5-8 Ethernet Connector Layout ......................................................................................................................... 41
Figure 5-9 COM1 Location............................................................................................................................................. 42
Figure 5-10 VGA Connector Location ........................................................................................................................... 43
Figure 5-11 USB Connector Location ........................................................................................................................... 44
Figure 5-12 USB Connector Layout .............................................................................................................................. 44
Figure 8-1 Battery Current Versus Temperature.......................................................................................................... 66
Figure 8-2 Battery Current Versus Time ....................................................................................................................... 67
Figure 8-3 Battery Removal........................................................................................................................................... 68
Figure 8-4 Temperature vs. Airspeed ........................................................................................................................... 70
Figure 8-5 CR9 V2 Component Side Placement Plan.................................................................................................. 74
Figure 8-6 CR9 V2 Solder Side Placement Plan........................................................................................................... 75
Figure A-1 CTM12 Component Locations .................................................................................................................... 77
Figure A-2 CTM12 Ethernet Connector Layout ............................................................................................................ 79
Figure A-3 DVI Connector Layout.................................................................................................................................. 81
Figure A-4 Placement Plan CTM12............................................................................................................................... 88
Figure B-1 Mount PMC Board to CR9 ........................................................................................................................... 90

Publication No. HRMCP9 Rev. B List of Tables 11
List of Tables
Table 1-1 Styles Available ............................................................................................................................................. 17
Table 2-1 Delivery Volume ............................................................................................................................................. 20
Table 2-2 List of Accessory Options............................................................................................................................. 20
Table 3-1 BIOS ID Line ................................................................................................................................................... 29
Table 4-1 Boot Timing.................................................................................................................................................... 32
Table 5-1 Signal Name Groups...................................................................................................................................... 35
Table 5-2 CPCI Connectors J7001, J7002.................................................................................................................... 36
Table 5-3 I/O Connectors J7003, J7004, and J7005 ................................................................................................... 37
Table 5-4 EIDE Connector.............................................................................................................................................. 40
Table 5-5 Keyboard and Mouse Pin Assignments....................................................................................................... 41
Table 5-6 Ethernet Connector Pin Assignments.......................................................................................................... 42
Table 5-7 Ethernet LED Display Definitions.................................................................................................................. 42
Table 5-8 COM1 Pin Assignments ................................................................................................................................ 43
Table 5-9 VGA Connector Pin Assignments................................................................................................................. 43
Table 5-10 USB Connector Pin Assignments............................................................................................................... 44
Table 5-11 PMC1 Connector Pin Assignments............................................................................................................ 45
Table 5-12 PMC2 Connector Pin Assignments............................................................................................................ 47
Table 6-1 Memory Area Assignments .......................................................................................................................... 49
Table 6-2 Standard Register Set ................................................................................................................................... 50
Table 6-3 Interrupt Assignments .................................................................................................................................. 51
Table 7-1 Interval Timer Functions............................................................................................................................... 54
Table 7-2 Parallel Interface Options ............................................................................................................................. 56
Table 7-3 IPMB Backplane Pin Assignments............................................................................................................... 58
Table 7-4 Supported Operating Systems ..................................................................................................................... 58
Table 7-5 SMBus Devices.............................................................................................................................................. 60
Table 7-6 Power Management Events.......................................................................................................................... 61
Table 7-7 BIOS Power-up Status................................................................................................................................... 63
Table 8-1 Power Consumption CPU Dependent .......................................................................................................... 65
Table 8-2 Power Consumption DRAM Dependent....................................................................................................... 65
Table 8-3 Environment Conditions................................................................................................................................ 69
Table 8-4 Shock & Vibration Parameters ..................................................................................................................... 70
Table 8-5 Maximum Height Usage ............................................................................................................................... 70
Table 8-6 Card Edge Temperatures .............................................................................................................................. 71
Table 8-7 Power Supply Parameters ............................................................................................................................ 72
Table 8-8 Supply Voltage Range ................................................................................................................................... 72
Table 8-9 GPIO Input Voltages ...................................................................................................................................... 72
Table 8-10 GPIO Output Voltages ................................................................................................................................. 72
Table A-1 CTM12 EIDE Connector ................................................................................................................................ 78
Table A-2 CTM12 Ethernet Connector Pin Assignments ............................................................................................ 79
Table A-3 CTM12 Ethernet Connector LED .................................................................................................................. 79
Table A-4 Parallel Connector Pin Assignments ........................................................................................................... 80

12 CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
Table A-5 COM1/COM2 Connector Pin Assignments ................................................................................................. 81
Table A-6 VGA Connector Pin Assignments ................................................................................................................ 81
Table A-7 DVI Connector Digital Pin Assignments...................................................................................................... 82
Table A-8 DVI Connector Analog Pin Assignments..................................................................................................... 82
Table A-9 USB Connector (10-pin header) Pin Assignments...................................................................................... 83
Table A-10 Floppy Connector Pin Assignments .......................................................................................................... 83
Table A-11 Miscellaneous Connector Pin Assignments............................................................................................. 84
Table A-12 PMC I/O Onboard PIM Connector Pin Assignments ................................................................................ 85
Table A-13 PMC I/O (64-pin header) Connector Pin Assignments............................................................................. 86
Table A-14 Power Connector Pin Assignments........................................................................................................... 87
Table A-15 Power IN/OUT Connector Pin Assignments ............................................................................................. 87
Table B-1 Electrical Characteristics.............................................................................................................................. 89

Publication No. HRMCP9 Rev. B Introduction 13
1 • Introduction
The Abaco Systems CR9*, CP9*, CT9* CompactPCI®Single Board Computer (SBC) is
a fully IBM®-AT compatible stand-alone PC equipped with numerous functions and
add-on features on a minimized board size. This technical manual is designed to
provide information regarding the general use and application of the CR9, CP9, CT9
CompactPCI Single Board Computer, as well as detail the hardware design.
Software methods and programming information are also provided.
A number of expansion and add-on products are available for the CR9, CP9 and
CT9. The CTM12* transition module and the PMC module are described in
appendices to this manual. Please observe all safety instructions when handling
Abaco products as outlined in the unpacking and installation chapters.
This chapter describes features, capabilities, and compatibility of the CR9, CP9, and
CT9 CompactPCI SBCs. All three boards are based on the same PCB design. These
three products will be referred to in this manual as the CR9 family. Any further
specification in this document referring to CR9 can be applied to CR9, CP9, and CT9
unless otherwise noted.

14 CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
1.1 Board Design
The CR9‘s minimized board size and the large number of interfaces and functions
allow the CR9 to be used in many applications. See the following block diagram for
the board design.
Figure 1-1 Block Diagram of CR9 Board

Publication No. HRMCP9 Rev. B Introduction 15
1.2 Features
•Microprocessor
- Intel®Pentium®M processor 600 MHz to 1.8 GHz and higher,
- Intel Celeron®M processor 1.3 GHz
•Chipset
- Intel E7501 with ICH4 and a P64H2 PCI bridge
•CMOS RAM
- 114 byte non-volatile RAM
- MC146818 compatible real time clock (RTC) with onboard Lithium battery
•EEPROM (Serial)
- 512 Bytes or 64 KBytes for user information
•DRAM
- 256 MBytes to 2 GBytes DDR 200 MHz with ECC
•Flash BIOS
- Easy updating, in-system programmable
- AMIBIOS
- Intel Ethernet BOOT module
•Keyboard/Mouse
- IBM PC/AT compatible keyboard controller with PS/2 style connector
•LCD/VGA
- Version 2.x uses the NVIDIA®GeForce™ 420 Go series high performance
graphics controller with integrated DDR memory 16 or 32 MByte, max.
resolution at DVI port 1024x768, at CRT 1600x1200
- Version 3.x (RoHS version) uses the ATI Mobility™ Radeon™ graphics
controller with 128/256 bit 2D, 3D and multimedia graphics accelerator,
16 MByte to 64 MByte DDR memory, max. resolution 1600 x 1200 analog and
1024 x 768 DVI
•USB
- One front and 4 rear USB 2.0 ports
•Watchdog
- Watchdog implemented in ICH4 chipset and National PC87417 Super I/O
•High Resolution Timer
- User programmable timer, allows ‘Real Time Functions’ implemented in
chipset
•Fast Ethernet
- Two 10/100/1000BASE-T high speed Ethernet channels either front or rear
(PICMG®2.16) with Intel 82546GB Ethernet controller
•Hard/Flash Disk
- Onboard mountable 2.5” IDE hard disk or Flash Drive
•Floppy
- Supported formats: 3.5 inch, 720 KByte - 1.44 MByte

16 CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
•EIDE/ATAPI
- UDMA 100 EIDE/ATAPI interface within ICH4 with two IDE channels
(primary IDE off-board and secondary IDE onboard). Transfer rate with up to
100 MByte/s, for two external devices (master/slave) and one onboard 2.5”
hard/flash disk. The onboard (secondary) interface is limited in speed to
UDMA 2 (33.3 MByte/s) because of cable/connector restrictions.
•Serial I/O
- National PC87417 Super I/O with two asynchronous 16550 compatible
channels with 16 byte FIFO, Transfer rates up to 115.2 KBaud user selectable
RS232/422/485
•Parallel I/O
- Fully bidirectional IEEE 1284 enhanced parallel port support ECP and EPP
modes
•PMC slots
- One 64 Bit/66 MHz (3.3 V IO voltage signaling) and one 32 Bit/33 MHz (5 V IO
voltage signaling) PCI mezzanine connector for standard PMC with front and
rear I/O
- I/O signals available at the rear connectors
- With PCB version V2 the 64 bit PMC lot is PCI-X capable with 66/100/133 MHz
•CPCI System slot
- Up to 7 peripheral slots 64 Bit CPCI/33 MHz with Hint HB6 bridge (Up to 4
peripheral slots 64 Bit/66 MHz). Standard backplanes can be used. Onboard
Pull-up resistors are optimized for 3.3 V I/O voltage, but 5 V I/O can also be
used for 33 MHz.
•CPCI I/O Slot
- CR9 works as peripheral board 64 Bit or 32 Bit with 66 MHz or 33 MHz and
Hot Swap functionality.
•IPMI (CT9)
- Hitachi controller for support of Intelligent Peripheral Management Interface.
•Temperature Sensors
- Measure temperatures of CPU-die and in three onboard locations. The sensors
are software readable in 1 °C increments from -55 °C to +125 °C.
•Front panel I/O
- 2 x Ethernet, VGA, PMC I/O, COM1, KB/MS, USB1, Reset, 3xLED (blue: Hot
Swap; green, red: user definable) depending on the board configuration.
•Back panel I/O
- TMDS, VGA, LCD, IDE (Master/Slave), FDC, COM1-2, LPT, USB2-5,
2x PMC I/O, KB, MS, speaker, reset, ext. Battery, SMBus, IPMB, GPIO[0...7],
2x Ethernet. Transition modules with 1:1 PC compatible connectors are
available.

Publication No. HRMCP9 Rev. B Introduction 17
•Power supply Usage
- +5 V and +3.3 V for board supply
- +12 V for PMC and Hot Swap controller supply
- -12 V optional, if needed on PMC
NOTE
IMPORTANT: The CR9 boards shows a height violation which is to be checked if a PMC mezzanine module
needs to be installed into the central area of the board (PMC1).
•Approval
- Designed to meet standard UL1950, CE class A, FCC-A
•H110 Backplanes
- The CT9 can be optionally ordered without connector J7004 (=CPCI J4)
assembled for backplanes providing H110 functionality. As a consequence
some rear I/O will not be available. Please check in Chapter 5 • Interfaces
for more details.
Styles available:
Table 1-1 Styles Available
CR9 (non-ROHS) C D I H R N
CR9 (RoHS) 1 2 3 4 6 8
Front panel x x x x x
Extended temp. x x x x
Parts soldered
x
x
Middle stiffener bar x x
Wedge locks x
Conformal coating x x x x
Conduction cooling x
Onboard battery x x x x
Onboard speaker x x x x x
CT9 and CP9 can only be ordered in C-, 1- or I-, 3-style.

18 CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
1.3 Safety Notices
The following general safety precautions represent warnings of certain dangers of
which Abaco Systems is aware. Failure to comply with these or with specific
Warnings and/or Cautions elsewhere in this manual violates safety standards of
design, manufacture and intended use of the equipment. Abaco Systems assumes no
liability for the user’s failure to comply with these requirements.
Also follow all warning instructions contained in associated system equipment
manuals.
WARNING
Use extreme caution when handling, testing, and adjusting this equipment. This device may operate in an
environment containing potentially dangerous voltages.
Ensure that all power to the system is removed before installing any device.
To minimize shock hazard, connect the equipment chassis and rack/enclosure to an electrical ground. If AC
power is supplied to the rack/enclosure, the power jack and mating plug of the power cable must meet IEC
safety standards.
1.3.1 EMI/EMC Regulatory Compliance
Products sold or transferred between companies or operated on company premises
(factory floor, laboratory) do not need CE, FCC or equivalent certification. Boards or
subsystems which cannot provide a useful function on their own do not need
certification.
Certification can only be granted to complete and operational systems. There are
authorized testing agencies, regulatory organizations and laboratories who will issue
certificates of compliance after system testing.
Abaco designs and tests all their products for EMI/EMC conformance. Where Abaco
supplies a complete/functional system for use by end users a certificate will be cited
in the manuals/documents which are provided with the products.
Products manufactured by Abaco should normally be suitable for use in properly
designed and produced customer equipment (system boxes or operational systems)
without any major redesign or additional filtering. However, the systems might not
conform to specific regulations once assembled and used. The system integrator or
installer must test for compliance as required in his country or by the intended
application and certify this to the end user.
1.3.2 ESD/EMI Issues
ESD (Electro-Static Discharge) and EMI (Electro-Magnetic Interference) issues may
show up in complete and operational systems. There are many ways to avoid
problems with these issues.
Any operational system with cables for I/O signals, connectivity or peripheral
devices provides an entry point for ESD and EMI. If Abaco does not manufacture the
complete system, including enclosure and cables, it is the responsibility of the

Publication No. HRMCP9 Rev. B Introduction 19
system integrator and end user to protect their system against potential problems.
Filtering, optical isolation, ESD gaskets and other measures might be required at the
physical point of entry (enclosure wall of box or rack). For example it is state-of-the-
art that protection can not be done at the internal connector of an RTM if a cable is
attached and routed outside the enclosure. It has to be done at the physical entry
point as specified above.
Products manufactured by Abaco should normally be suitable for use in properly
designed and produced customer equipment (system boxes or operational systems)
without any major redesign. However, the systems might be subject to problems and
issues once assembled, cabled and used. The end user, system integrator or installer
must test for possible problems and in some cases show compliance to local
regulations as required in his country or by the intended application.
1.3.3 CE Conformance Declaration
CE certification is required in EU countries for equipment which is used or operated
by the end user. Products sold or transferred between companies or operated on
company premises (factory floor, laboratory) do not need CE certification.
CE certification can only be granted to complete and operational systems. Boards or
subsystems which cannot provide a useful function on their own do not need CE
certification.
Abaco designs and tests all their products for EMI/EMC conformance. Products
manufactured by Abaco should normally be suitable for use in properly designed
and produced customer equipment (system boxes or operational systems) without
any major redesign or additional filtering. The system integrator or installer must, in
any case, test for CE compliance and certify this to the end user.
Where Abaco supplies a complete/functional system for use by end users in EU
countries a CE certificate will be cited in the manuals/documents which are provided
with the products. The CE (and year of certification) symbol is shown on the
equipment, typically on the type or S/N label or close to the power cable entry.
Abaco has tested their boards using their own card cages (chassis). Test results of
these tests are available upon request.

20 CP9*, CR9*, CT9* Celeron M/Pentium M Publication No. HRMCP9 Rev. B
2 • Unpacking and Inspection
This chapter covers the suggested inspection and preparation considerations and
background information necessary prior to using the CR9. Unpacking, initial
inspection, and first-time operation of the CR9 are covered. Following the
procedures given in the chapter is recommended, since they will verify proper
operation after shipping and before the product is integrated into your system.
2.1 Delivery Volume
Please check that the delivered package contains the following items:
Table 2-1 Delivery Volume
Qty. Item Purpose
1
CR9 or
CP9 or
CT9
CompactPCI Single Board Computer
1 CDROM
Technical Product Information
with driver software and manuals in Adobe Acrobat
(PDF) format
The manual files are also available through our website:
https://www.abaco.com
2.2 Available Accessories
The following table lists accessory options which are available for the CR9:
Table 2-2 List of Accessory Options
Item Purpose
ZKAAPS2SPLIT Front panel Y-cable for keyboard and mouse
CTM12 Transition module, 6U x 4HE/HP
VGA2DVI
DVI to standard VGA converter
Please contact the sales department or your sales representative for latest
information on options and accessories.
Accessories are subject to change without notice.